CN219592960U

CN219592960U - Audio/video matrix with heat dissipation device

Info

Publication number: CN219592960U
Application number: CN202320742097.8U
Authority: CN
Inventors: 刘香明; 刘靖嵩; 马志鹏
Original assignee: Aixin Environmental Protection Materials Shenzhen Co ltd
Current assignee: Aixin Environmental Protection Materials Shenzhen Co ltd
Priority date: 2023-03-29
Filing date: 2023-03-29
Publication date: 2023-08-25
Anticipated expiration: 2033-03-29

Abstract

The utility model discloses an audio-video matrix with a heat dissipation device, relates to the technical field of heat dissipation devices, and solves the technical problems that the audio-video matrix generally adopts a mode of radiating fins and fans to solve the heat dissipation problem and the heat dissipation efficiency is low. The device comprises an audio-video matrix shell and a heat dissipation structure arranged in the audio-video matrix shell; the heat radiation structure comprises a flow guide shell and a fan, and the fan is arranged at the side edge of the flow guide shell; the two side edges on the audio-video matrix shell are provided with an air inlet and an air outlet in opposite directions, and under the action of a fan, external cold air enters from the air inlet and is discharged through the air outlet by the flow guiding shell. According to the utility model, the heat radiation structure arranged in the audio/video matrix shell can be matched with the air inlet and the air outlet which are oppositely arranged on the audio/video matrix shell to form convection, so that heat generated in the working process of the audio/video matrix can be outwards radiated, the heat radiation efficiency is improved, and the high-power heat radiation requirement is met.

Description

Audio/video matrix with heat dissipation device

Technical Field

The utility model relates to the technical field of heat dissipation devices, in particular to an audio-video matrix with a heat dissipation device.

Background

An audio-video matrix is an electronic device and is generally used in various monitoring occasions. The video matrix refers to an electronic device that outputs m paths of video signals to n paths of monitoring equipment at will by an array switching method, and in general, the input of the matrix is larger than the output, i.e. m > n. Some video matrices, also called audio-video matrices, also have audio switching functions, which enable synchronous switching of video and audio signals.

The information flow required to be processed by the chip of the audio/video matrix is huge, so that the operation capability of the chip is also very high. As the power consumption of the chip increases, the heat generated by the chip also increases, and the heat dissipation problem is particularly important. In the prior art, the heat dissipation problem is generally solved by adopting a mode of radiating fins and fans, and the heat dissipation mode meets the problem that the general audio/video matrix dissipates heat, but the heat dissipation requirement of some audio/video matrixes with relatively high power and relatively high heat generation cannot be met.

In the process of implementing the present utility model, the inventor finds that at least the following problems exist in the prior art:

the existing audio and video matrix generally adopts a mode of radiating fins and fans to solve the radiating problem, but the radiating efficiency is low, and the radiating requirement of certain high power is difficult to meet.

Disclosure of Invention

The utility model aims to provide an audio-video matrix with a heat dissipation device, which solves the technical problems that the existing audio-video matrix in the prior art generally adopts a cooling fin and a fan to solve the heat dissipation problem, but the heat dissipation efficiency is low, and the heat dissipation requirement of certain high power is difficult to meet. The preferred technical solutions of the technical solutions provided by the present utility model can produce a plurality of technical effects described below.

In order to achieve the above purpose, the present utility model provides the following technical solutions:

the utility model provides an audio-video matrix with a heat dissipation device, which comprises an audio-video matrix shell and a heat dissipation structure arranged in the audio-video matrix shell; the heat dissipation structure comprises a flow guide shell and a fan, and the fan is arranged on the side edge of the flow guide shell; the two side edges on the audio-video matrix shell are provided with an air inlet and an air outlet in opposite directions, and under the action of the fan, external cold air enters from the air inlet, and heat in the audio-video matrix shell is discharged through the air outlet through the flow guiding shell.

Preferably, the heat dissipation structure further comprises a heat dissipation module, and the heat dissipation module is arranged inside the diversion shell.

Preferably, the heat dissipation module comprises at least one fin radiator, and the radiating fins of the fin radiator are sequentially arranged in the air flow direction inside the diversion shell.

Preferably, a first heat conducting piece is arranged above the flow guiding shell, the first heat conducting piece is in contact with the top of the audio/video matrix shell, and part of heat can be discharged outwards from the top of the audio/video matrix shell through the first heat conducting piece.

Preferably, the audio-video matrix further comprises a PCB board and a second heat conducting member, wherein the PCB board is disposed below the heat dissipation structure through the second heat conducting member, and is used for transferring heat on the PCB board to the heat dissipation structure.

Preferably, a third heat conducting piece is arranged at the bottom of the PCB, the PCB is contacted with the bottom of the audio/video matrix shell through the third heat conducting piece, and part of heat can be discharged outwards from the bottom of the audio/video matrix shell.

Preferably, the audio-video matrix shell comprises a top cover structure and a bottom shell structure, a cavity is formed after the top cover structure and the bottom shell structure are connected, and the heat dissipation structure is arranged in the cavity.

Preferably, the top cover structure comprises an upper cover and a first side plate and a second side plate which are symmetrically arranged, and the air inlet and the air outlet are respectively arranged on the first side plate and the second side plate of the top cover structure.

Preferably, a filter screen is arranged on the air inlet of the audio-video matrix shell, and the filter screen can filter impurities in the air.

Preferably, the material of the diversion shell is copper or aluminum.

By implementing one of the technical schemes, the utility model has the following advantages or beneficial effects:

according to the utility model, the heat radiation structure arranged in the audio/video matrix shell can be matched with the air inlet and the air outlet which are oppositely arranged on the audio/video matrix shell to form convection, so that heat generated in the working process of the audio/video matrix can be outwards radiated, the heat radiation efficiency is improved, and the high-power heat radiation requirement is met.

Drawings

For a clearer description of the technical solutions of embodiments of the present utility model, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art, in which:

FIG. 1 is a schematic overall structure of an embodiment of the present utility model;

FIG. 2 is a simplified overall construction split schematic of an embodiment of the present utility model;

FIG. 3 is a schematic diagram illustrating the overall structure of an embodiment of the present utility model.

In the figure: 1. an audio-video matrix housing; 11. a top cover structure; 111. an upper cover; 112. a first side plate; 113. an air inlet; 114. a second side plate; 115. an air outlet; 12. a bottom shell structure; 121. a lower cover; 122. a third side plate; 123. a fourth side plate; 13. a filter screen; 2. a heat dissipation structure; 21. a deflector housing; 22. a fan; 221. an air intake fan; 222. an exhaust fan; 23. a heat dissipation module; 24. a first heat conductive member; 3. a PCB board; 31. a second heat conductive member; 32. and a third heat conductive member.

Detailed Description

For a better understanding of the objects, technical solutions and advantages of the present utility model, reference should be made to the various exemplary embodiments described hereinafter with reference to the accompanying drawings, which form a part hereof, and in which are described various exemplary embodiments which may be employed in practicing the present utility model. The same reference numbers in different drawings identify the same or similar elements unless expressly stated otherwise. The implementations described in the following exemplary examples are not representative of all implementations consistent with the present disclosure. It is to be understood that they are merely examples of processes, methods, apparatuses, etc. that are consistent with certain aspects of the present disclosure as detailed in the appended claims, other embodiments may be utilized, or structural and functional modifications may be made to the embodiments set forth herein without departing from the scope and spirit of the present disclosure.

In the description of the present utility model, it should be understood that the terms "center," "longitudinal," "transverse," and the like are used in an orientation or positional relationship based on that shown in the drawings, and are merely for convenience in describing the present utility model and to simplify the description, rather than to indicate or imply that the elements referred to must have a particular orientation, be constructed and operate in a particular orientation. The terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. The term "plurality" means two or more. The terms "connected," "coupled" and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, integrally connected, mechanically connected, electrically connected, communicatively connected, directly connected, indirectly connected via intermediaries, or may be in communication with each other between two elements or in an interaction relationship between the two elements. The term "and/or" includes any and all combinations of one or more of the associated listed items. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In order to illustrate the technical solutions of the present utility model, the following description is made by specific embodiments, only the portions related to the embodiments of the present utility model are shown.

Examples:

as shown in fig. 1-3, the utility model provides an audio-video matrix with a heat dissipation device, which comprises an audio-video matrix shell 1 and a heat dissipation structure 2 arranged inside the audio-video matrix shell 1; the heat dissipation structure 2 comprises a flow guide shell 21 and a fan 22, wherein the fan 22 is arranged on the side edge of the flow guide shell 21 and used for air inlet and air outlet, an air inlet 113 and an air outlet 115 are arranged on the two side edges of the audio-video matrix shell 1 in opposite directions, external cold air enters from the air inlet 113 under the action of the fan 22, heat in the audio-video matrix shell 1 is discharged through the air outlet 115 by the flow guide shell 21, and the air inlet 113 and the air outlet 115 can form convection with the heat dissipation structure 2 arranged in the audio-video matrix shell 1 to discharge the heat. Specifically, the heat dissipation structure 2 is arranged in the audio/video matrix shell 1, and can absorb and dissipate heat generated by a chip on the PCB 3 in the working process; the audio-video matrix shell 1 is provided with an air inlet 113, an air outlet 115 is formed in one opposite side of the air inlet 113, the fan 2 comprises an air inlet fan 221 and an air exhaust fan 222, the air inlet fan 221 is arranged on one side, close to the air inlet 113, of the audio-video matrix shell 1, the air exhaust fan 222 is arranged on one side, close to the air outlet 115, of the audio-video matrix shell 1, and the air inlet 113 and the air outlet 115 can be matched with a heat dissipation structure 2 arranged inside the audio-video matrix shell 1 to dissipate heat generated in the working process of the audio-video matrix. When the audio-video matrix works, cold air enters the audio-video matrix from the air inlet 113 on the audio-video matrix shell 1, under the action of the air inlet fan 221, the cold air enters the guide shell 21 and flows to the air outlet 115 side along the guide shell 21, and finally flows outwards through the air outlet 115 of the audio-video matrix shell 1 by the air exhaust fan 222, and most of heat is carried out in the process by convection. According to the utility model, the air guide shell 21 can enable the cool air carried by the fan 22 to flow in the channel in the air guide shell 21, the wind blown by the fan 22 does not generate turbulent flow, the wind is not distracted, the heat can be carried out to a greater extent, the heat dissipation efficiency is improved, and the higher heat dissipation requirement is met.

As an alternative embodiment, as shown in fig. 2-3, the heat dissipation structure 2 further includes a heat dissipation module 23, and the heat dissipation module 23 is disposed inside the diversion housing 21. Specifically, the heat dissipation structure 2 further includes a heat dissipation module 23 disposed inside the air guiding housing 21, the heat dissipation module 23 includes at least one fin radiator (the number of the fin radiators can be adjusted according to the number of the chips on the PCB board 3), the fin radiators are sequentially arranged in the air flowing direction inside the air guiding housing 21, the fin radiators can absorb heat generated by the chips on the PCB board 3, and the absorbed heat can be dissipated outwards in the air guiding housing 21 along a channel formed by the air inlet 113 and the air outlet 115, so that the normal operation of the chips on the PCB board 3 is ensured by the heat dissipation.

As an alternative embodiment, as shown in fig. 3, a first heat conducting member 24 is disposed above the diversion housing 21, the first heat conducting member 24 is in contact with the top of the audio-video matrix housing 1, and part of heat can be discharged from the top of the audio-video matrix housing 1 through the first heat conducting member 24. The first heat conductive member 24 is a heat conductive silica gel pad. Specifically, the top of the flow guiding shell 21 is connected with the upper cover 111 of the audio/video matrix shell 1 through the first heat conducting piece 24, the flow guiding shell 21 is used for receiving heat and radiating the heat, most of the heat is radiated outwards through the air outlet 115 of the audio/video matrix shell 1, part of the heat in the flow guiding shell 21 can be transmitted to the upper cover 111 of the audio/video matrix shell 1 through the first heat conducting piece 24, and the heat can be radiated outwards in a radiation radiating mode.

As an alternative embodiment, as shown in fig. 3, the audio-video matrix further includes a PCB board 3 and a second heat conducting member 31, where the PCB board 3 is disposed below the heat dissipating structure 2 through the second heat conducting member 31, and is used to transfer heat on the PCB board 3 to the heat dissipating structure 2. Specifically, be provided with a plurality of chips on the PCB board 3, PCB board 3 sets up in the inside below of audio-video matrix casing 1, and the upper portion of PCB board 3 is connected with heat dissipation module 23, and the bottom and the inferior valve of PCB board 3 are connected. The PCB 3 is connected with the radiating module 23 above through the second heat conducting piece 31, the second heat conducting piece 31 is a heat conducting silica gel pad or heat conducting silicone grease, as is well known, a chip arranged on the PCB 3 can generate a large amount of heat during operation, and the PCB 3 can transfer heat generated by various complicated components and parts on the PCB 3 in the audio/video matrix shell 1 to the radiating module 23 during operation under the action of the second heat conducting piece 31, and the heat is outwards emitted through a radiating structure, so that the normal operation of the PCB is ensured.

As an alternative embodiment, as shown in fig. 3, a third heat conducting member 32 is disposed at the bottom of the PCB board 3, and the PCB board 3 is in contact with the bottom of the audio/video matrix housing 1 through the third heat conducting member 32, and part of heat can be discharged from the bottom of the audio/video matrix housing 1. The third heat conductive member 32 is a heat conductive silica gel pad. Specifically, the bottom of the PCB 3 is connected with the lower shell of the audio/video matrix housing 1 through the third heat conducting member 32, and besides the heat of the chip on the PCB 3 can be dissipated outwards from the heat dissipating module 23 disposed above the PCB 3 through the second heat conducting member 31, the heat generated by part of the chip can be conducted to the lower shell of the audio/video matrix housing 1 through the third heat conducting member 32, and the heat is dissipated in a radiation heat dissipating manner, so that the heat dissipating efficiency is improved.

As an alternative embodiment, as shown in fig. 2-3, the audio-video matrix housing 1 includes a top cover structure 11 and a bottom shell structure 12, where the top cover structure 11 and the bottom shell structure 12 form a cavity after being connected, and the heat dissipation structure 2 is disposed in the cavity. Specifically, the top shell structure includes an upper cover 111, and a first side plate 112 and a second side plate 114 that are symmetrically arranged, and an air inlet 113 and an air outlet 115 are respectively arranged on the first side plate 112 and the second side plate 114 of the top cover structure 11; the bottom case structure 12 includes a lower cover 121 and third and fourth side plates 122 and 123 symmetrically disposed. The top cover structure 11 and the bottom shell structure 12 can be fixedly connected, a cavity is formed inside the top cover structure after the top cover structure and the bottom shell structure are fixedly connected, the internal components of the heat dissipation structure 2 and the audio-video matrix are arranged in the cavity, the internal components of the heat dissipation structure 2 and the audio-video matrix can operate inside the audio-video matrix shell 1, and the heat emitted in the audio-video matrix can be discharged from the air outlet 115 through the heat dissipation structure 2, so that the normal operation of the audio-video matrix is ensured. The air inlet 113 and the air outlet 115 respectively provided on the first side plate 112 and the second side plate 114 can further improve the heat dissipation performance of the heat dissipation structure 2.

As an alternative embodiment, as shown in fig. 2-3, the exhaust fan 222 is disposed at the air outlet 115 of the audio-video matrix housing 1, and the air outlet direction of the exhaust fan 222 is consistent with the air outlet direction of the air inlet fan 221 at the air inlet 113. Specifically, the exhaust fan 222 and the air inlet fan 221 are respectively arranged at two side edges of the guide shell 21 and are respectively arranged at positions corresponding to the air inlet 113 and the air outlet 115, so that heat generated by the audio-video matrix can be better convected inside the guide shell 21, the heat generated inside the guide shell is emitted outwards to a greater extent, the normal operation of the audio-video matrix is ensured, and the service life of the audio-video matrix can be prolonged to a certain extent. It should be noted that, the air outlet directions of the air inlet fan 221 and the air outlet fan 222 correspondingly disposed at the positions of the air inlet 113 and the air outlet 115 are consistent, and the air outlet fan 222 of the air outlet 115 is added to increase the air volume and improve the heat dissipation performance.

As an alternative embodiment, as shown in fig. 3, a filter screen 13 is disposed on the air inlet 113 of the audio-video matrix housing 1, and the filter screen 13 can filter impurities in the air. Specifically, the filter screen 13 is arranged at the air inlet 113 of the audio-video matrix shell 1, and when the audio-video matrix is in actual working process, the air inlet fan 221 is used for conveying the wind direction in the guide shell 21, in order to avoid impurities from entering the environment affecting the inside of the audio-video, the filter screen 13 is used for isolating the external impurities, so that the heat dissipation effect is ensured, and meanwhile, the inside environment of the audio-video can be ensured.

As an alternative embodiment, the diversion housing 21 is made of copper, aluminum or alloy thereof, so that heat can be absorbed and dissipated better.

The embodiment is a specific example only and does not suggest one such implementation of the utility model.

The foregoing is only illustrative of the preferred embodiments of the utility model, and it will be appreciated by those skilled in the art that various changes in the features and embodiments may be made and equivalents may be substituted without departing from the spirit and scope of the utility model. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the utility model without departing from the essential scope thereof. Therefore, it is intended that the utility model not be limited to the particular embodiment disclosed, but that the utility model will include all embodiments falling within the scope of the appended claims.

Claims

1. The audio-video matrix with the heat dissipation device is characterized by comprising an audio-video matrix shell (1) and a heat dissipation structure (2) arranged inside the audio-video matrix shell (1); the heat dissipation structure (2) comprises a flow guiding shell (21) and at least one fan (22), wherein at least one fan (22) is arranged at one end of the flow guiding shell (21);

the two opposite sides of the audio/video matrix shell (1) are provided with an air inlet (113) and an air outlet (115), external cold air enters from the air inlet (113) under the action of the fan (22), and the heat in the audio/video matrix shell (1) is discharged through the air outlet (115) through the flow guiding shell (21).

2. An audio-video matrix with a heat sink according to claim 1, characterized in that the heat dissipation structure (2) further comprises a heat dissipation module (23), the heat dissipation module (23) being arranged inside the guiding shell (21).

3. An audio-visual matrix with heat sink according to claim 2, characterized in that the heat sink module (23) comprises at least one fin radiator, the fins of which are arranged in sequence inside the guiding housing (21) in the direction of air flow.

4. An audio-video matrix with a heat dissipating device according to claim 1, characterized in that a first heat conducting member (24) is arranged above the guiding housing (21), the first heat conducting member (24) is in contact with the top of the audio-video matrix housing (1), and part of the heat can be discharged outwards from the top of the audio-video matrix housing (1) through the first heat conducting member (24).

5. An audio-video matrix with a heat dissipating device according to claim 1, further comprising a PCB board (3) and a second heat conducting member (31), wherein the PCB board (3) is arranged below the heat dissipating structure (2) by the second heat conducting member (31) for transferring heat on the PCB board (3) to the heat dissipating structure (2).

6. An audio-video matrix with a heat dissipation device according to claim 5, characterized in that a third heat conducting member (32) is arranged at the bottom of the PCB board (3), the PCB board (3) is in contact with the bottom of the audio-video matrix housing (1) through the third heat conducting member (32), and part of the heat can be discharged outwards from the bottom of the audio-video matrix housing (1).

7. An audio-video matrix with a heat dissipating device according to claim 1, wherein the audio-video matrix housing (1) comprises a top cover structure (11) and a bottom shell structure (12), the top cover structure (11) and the bottom shell structure (12) are connected to form a cavity, and the heat dissipating structure (2) is disposed in the cavity.

8. The audio-video matrix with the heat dissipating device according to claim 7, wherein the top cover structure (11) comprises an upper cover (111) and a first side plate (112) and a second side plate (114) which are symmetrically arranged, and the air inlet (113) and the air outlet (115) are respectively arranged on the first side plate (112) and the second side plate (114) of the top cover structure (11).

9. An audio-video matrix with a heat dissipation device according to claim 1, characterized in that a filter screen (13) is arranged on an air inlet (113) of the audio-video matrix shell (1), and the filter screen (13) can filter impurities in the air.

10. An audio-visual matrix with a heat sink according to claim 1, characterized in that the material of the guiding shell (21) is copper or aluminum.