CN215006544U

CN215006544U - Server heat abstractor

Info

Publication number: CN215006544U
Application number: CN202120485033.5U
Authority: CN
Inventors: 王青; 张宇川
Original assignee: Shandong Yingxin Computer Technology Co Ltd
Current assignee: Shandong Yingxin Computer Technology Co Ltd
Priority date: 2021-03-05
Filing date: 2021-03-05
Publication date: 2021-12-03
Anticipated expiration: 2031-03-05

Abstract

The utility model provides a server heat dissipation device, which comprises an air guide cover, wherein the air guide cover comprises a main air inlet, and two sides of the main air inlet are respectively provided with a side air inlet; the two side air inlets respectively correspond to the two front side air outlets and the two rear side air outlets; the main air inlet corresponds to the front air outlet and the rear air outlet; wherein the front air outlet is over against the front radiator, and the rear air outlet is over against the rear radiator; the front side air outlet is over against the front memory bank placing area, and the rear side air outlet is over against the rear memory bank placing area; the front radiator is a sunflower radiator. The utility model discloses optimized quick-witted incasement portion heat dissipation space, effectively solved rear high-power consumption radiating element's heat dissipation problem.

Description

Server heat abstractor

Technical Field

The utility model belongs to the technical field of the server heat dissipation, concretely relates to server heat abstractor.

Background

The high-performance server is often provided with front and rear multi-path CPUs or high-power-consumption CPUs and high-power-consumption heat dissipation elements such as GPUs and the like, and the preheating of the front high-power-consumption CPU can increase the air inlet temperature of rear components, so that the heat dissipation difficulty of the rear components is increased, and the high-power-consumption CPU is one of important factors limiting the system layout.

The traditional heat dissipation method aims at the condition that the front end and the rear end are provided with high-power dissipation elements, and generally adopts the methods of reducing the environment temperature, increasing the air guide cover, increasing the T-shaped heat radiator at the rear part and the like, so that the heat dissipation cost is increased, and the heat dissipation effect is not obvious.

SUMMERY OF THE UTILITY MODEL

The above-mentioned not enough to prior art, the utility model provides a server heat abstractor to solve above-mentioned technical problem.

The utility model provides a server heat dissipation device, which comprises an air guide cover, wherein the air guide cover comprises a main air inlet, and two sides of the main air inlet are respectively provided with a side air inlet; the two side air inlets respectively correspond to the two front side air outlets and the two rear side air outlets; the main air inlet corresponds to the front air outlet and the rear air outlet; wherein the front air outlet is over against the front radiator, and the rear air outlet is over against the rear radiator; the front side air outlet is over against the front memory bank placing area, and the rear side air outlet is over against the rear memory bank placing area; the front radiator is a sunflower radiator.

Furthermore, the edge of the side air inlet is provided with a side baffle plate extending backwards; the top surface of the main air inlet is connected with a rectangular connecting baffle, and the main air inlet and the connecting baffle enclose a front air outlet with a downward opening; the rear end of the connecting baffle is connected with a rear air inlet, and a rear air duct is surrounded by the baffle behind the rear air inlet; a rear air outlet without a baffle is arranged below the rear air duct, and air outlets are arranged above and behind the rear air duct; two sides of the rear air inlet are respectively provided with an inclined baffle; the lower edge of the inclined baffle is connected with the rear side baffle to form a semi-funnel-shaped rear side air duct, and the lower part of the rear side air duct is an open rear side air outlet.

Furthermore, the side air inlet is of an inclined baffle plate structure with an opening.

Furthermore, the main air inlet and the side air inlet are both over against the server system fan.

Furthermore, the sunflower radiator comprises an annular radiating substrate, and radiating fins which are uniformly arranged are arranged in a ring of the annular radiating substrate; the top surface and the two side surfaces of the annular radiating substrate are provided with radiating fins which are uniformly arranged; the bottom of the annular heat dissipation substrate is tightly attached to the high-power-consumption heat dissipation component.

Furthermore, an active cooling fan is arranged in the ring of the annular cooling substrate, the wind direction of the active cooling fan faces the rear high-power-consumption cooling part, and the fan terminal is arranged on the main board near the sunflower radiator.

The utility model has the advantages that,

the utility model provides a server heat abstractor, wind scooper and sunflower radiator through having a plurality of air outlet structures have realized having corresponding heat dissipation to high-power dissipation radiating element, and surplus wind dispels the heat to components such as memory. The utility model discloses optimized quick-witted incasement portion heat dissipation space, effectively solved rear high-power consumption radiating element's heat dissipation problem.

Furthermore, the utility model relates to a principle is reliable, and simple structure has very extensive application prospect.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic structural view of an air guiding cover of a server heat dissipation device according to an embodiment of the present application;

FIG. 2 is a schematic view of a sunflower heat sink of the server heat sink apparatus according to an embodiment of the present application;

wherein, 1, a main air inlet; 2. a side air inlet; 3. a front air outlet; 4. connecting a baffle plate; 5. an inclined baffle plate; 6. a rear air outlet; 7. a rear side air outlet; 8. a front side air outlet; 9. a rear air duct; 10. a rear lateral air duct; 11. an annular heat dissipation substrate; 12. heat dissipation fins; 13. an active cooling fan; 14. and (4) memory banks.

Detailed Description

In order to make the technical solutions in the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, but not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts shall belong to the protection scope of the present invention.

It should be noted that, in the present invention, the embodiments and features of the embodiments may be combined with each other without conflict.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.

The present invention will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.

Example 1

The present embodiment provides a server heat dissipation apparatus, the apparatus includes an air guiding cover, and a structure of the air guiding cover is as shown in fig. 1:

the wind scooper comprises a main air inlet 1, two sides of the main air inlet 1 are respectively provided with a side air inlet 2, and the side air inlets 2 are of an inclined baffle 5 structure with openings. The edge of the side air inlet 2 is provided with a side baffle plate extending backwards, and a front side air outlet 8 is formed behind the side baffle plate. The top surface of the main air inlet 1 is connected with a rectangular connecting baffle 4, and the main air inlet 1 and the connecting baffle 4 enclose a front air outlet 3 with a downward opening. The rear end of the connecting baffle plate 4 is connected with a rear air inlet, a rear air duct 9 is enclosed by the baffle plate at the rear of the rear air inlet, a rear air outlet 6 without the baffle plate is arranged below the rear air duct 9, and air outlets are arranged above and behind the rear air duct 9. Two sides of the rear air inlet are respectively provided with an inclined baffle 5; the lower edge of the inclined baffle 5 is connected with the rear side baffle to form a semi-funnel-shaped rear side air duct 10, and the lower part of the rear side air duct 10 is an open rear side air outlet 7.

Wherein the front air outlet 3 is opposite to the front radiator, and the rear air outlet 6 is opposite to the rear radiator; the front side air outlet 8 is opposite to the front memory bank 14 placing area, and the rear side air outlet 7 is opposite to the rear memory bank 14 placing area. The front radiator is a sunflower radiator which has a self-radiating function.

The system fan is connected with the air guide cover, cold air of the system fan mainly enters from the main air inlet 1, part of the cold air enters from the side air inlets 2 on two sides, part of the cold air entering from the main air inlet 1 blows from the front air outlet 3 to the radiator of the front high-power-consumption radiating part, part of the cold air blows from the rear air outlet 6 to the rear high-power-consumption radiating part, and the other part of the cold air blows from the other air outlets of the rear air duct 9 to other server parts. A part of the cool air entering from the side air inlet 2 is blown from the front side air outlet 8 to the front memory bank 14 (or other secondary components) placement area, and a part of the cool air is guided into the rear side air duct 10 by the inclined baffle on the side surface of the rear air inlet and is blown from the rear side air outlet to the rear memory bank 14 placement area.

Example 2

In the heat dissipation device for a server provided in this embodiment, the structure of the sunflower heat sink is shown in fig. 2:

the material of the sunflower radiator can be copper, aluminum, 3DVC and other materials with strong heat dissipation performance, and the radiator base can contain a heat pipe besides the 3DVC material. The sunflower radiator comprises an annular radiating substrate 11, and radiating fins 12 are uniformly distributed inside and outside the annular radiating substrate 11. The fin heat dissipation areas on the left and right sides of the annular heat dissipation substrate 11 are above the memory in front of the main board. The fin radiating area above the annular radiating base 11 is flush with the 2U standard radiator in height. The bottom of the annular heat dissipation substrate 11 is closely attached to a high power dissipation heat dissipation part (such as a CPU). An 4056/4028 active heat dissipation fan 13 is distributed in the middle of the annular heat dissipation substrate 11, and a fan terminal is arranged on the main board in front of or behind the sunflower heat sink. The fin heat dissipation area between the inside of the annular heat dissipation substrate 11 and the fan is surrounded into a circle, a cool air area is formed in the center, and the cool air area can cool the rear high-power-consumption heat dissipation part and is used as the auxiliary of the system fan.

Although the present invention has been described in detail by referring to the drawings in conjunction with the preferred embodiments, the present invention is not limited thereto. Various equivalent modifications or substitutions can be made on the embodiments of the present invention by those skilled in the art without departing from the spirit and substance of the present invention, and these modifications or substitutions are intended to be within the scope of the present invention/any person skilled in the art can easily conceive of changes or substitutions within the technical scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. A server heat dissipation device is characterized by comprising an air guide cover, wherein the air guide cover comprises a main air inlet, and side air inlets are respectively arranged at two sides of the main air inlet; the two side air inlets respectively correspond to the two front side air outlets and the two rear side air outlets; the main air inlet corresponds to the front air outlet and the rear air outlet; wherein the front air outlet is over against the front radiator, and the rear air outlet is over against the rear radiator; the front side air outlet is over against the front memory bank placing area, the rear side air outlet is over against the rear memory bank placing area, and the front radiator is a sunflower-shaped radiator.

2. The device of claim 1, wherein the edge of the side air inlet is provided with a side baffle extending backwards; the top surface of the main air inlet is connected with a rectangular connecting baffle, and the main air inlet and the connecting baffle enclose a front air outlet with a downward opening; the rear end of the connecting baffle is connected with a rear air inlet, and a rear air duct is surrounded by the baffle behind the rear air inlet; a rear air outlet without a baffle is arranged below the rear air duct, and air outlets are arranged above and behind the rear air duct; two sides of the rear air inlet are respectively provided with an inclined baffle; the lower edge of the inclined baffle is connected with the rear side baffle to form a semi-funnel-shaped rear side air duct, and the lower part of the rear side air duct is an open rear side air outlet.

3. The apparatus of claim 2, wherein the side intake vent is an angled baffle structure having an opening.

4. The apparatus of claim 1, wherein the primary air intake and the side air intake are each directly opposite a server system fan.

5. The apparatus of claim 1, wherein the front heat sink comprises an annular heat sink base having a uniform array of heat sink fins disposed within an annulus of the base; the top surface and the two side surfaces of the annular radiating substrate are provided with radiating fins which are uniformly arranged; the bottom of the annular heat dissipation substrate is tightly attached to the high-power-consumption heat dissipation component.

6. The apparatus of claim 5, wherein the ring-shaped heat-dissipating substrate is provided with an active heat-dissipating fan inside the ring, the active heat-dissipating fan is directed toward the rear high-power heat-dissipating component, and the fan terminal is provided on the main board near the front heat sink.