CN217655513U - Radiator for notebook computer - Google Patents
Radiator for notebook computer Download PDFInfo
- Publication number
- CN217655513U CN217655513U CN202121843642.XU CN202121843642U CN217655513U CN 217655513 U CN217655513 U CN 217655513U CN 202121843642 U CN202121843642 U CN 202121843642U CN 217655513 U CN217655513 U CN 217655513U
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- China
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- heat pipe
- substrate body
- flat heat
- notebook computer
- copper block
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a radiator for notebook computer, including flat heat pipe, the heat absorption module of being connected the radiating fin group of being connected with flat heat pipe one end and being connected with the flat heat pipe other end, have a plurality of parallel arrangement's wind channel a radiator fan is installed to the air intake side of radiating fin group, and the heat absorption module further includes: the upper surface of the copper block is exposed from the through hole and is in welded connection with the flat heat pipe located above the substrate body, the lower surface of the copper block is used for being in contact with a heating element, pits are arranged at intervals in the area, located below the flat heat pipe, of the upper surface of the substrate body, so that a welding area with certain roughness is formed on the substrate body, and the welding area is connected with the flat heat pipe through soldering tin. The utility model provides high welded flatness, prevent local warpage, and then guarantee hot-conducting efficiency and stability.
Description
Technical Field
The utility model relates to an electronic product heat dissipation field especially relates to a radiator for notebook computer.
Background
The notebook computer is also called as a portable computer, and has the biggest characteristic of small and exquisite body, is a small and portable personal computer compared with a PC, and has the current development trend of smaller and smaller volume, lighter and lighter weight and more powerful functions.
The radiator can be used for radiating heat-generating components such as a processor and a display card in the notebook computer. The existing notebook computer has low heat dissipation efficiency, the low heat discharge rate directly affects the working efficiency of a processing area and a display card, and even the situation that devices are burnt out due to overhigh temperature can be caused.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a radiator for notebook computer, this radiator for notebook computer has both improved the welding performance between the backup pad of different materials and the heat pipe, can guarantee the homogeneity that the soldering paste distributes again, improves welded plane degree, prevents local warpage, and then guarantees hot-conducting efficiency and stability.
In order to achieve the above purpose, the utility model adopts the technical scheme that: a radiator for a notebook computer comprises a flat heat pipe, a radiating fin group connected with one end of the flat heat pipe and a heat absorption module connected with the other end of the flat heat pipe, wherein a radiating fan is arranged on the air inlet side of the radiating fin group with a plurality of air channels arranged in parallel;
the heat sink module further includes: the heat pipe comprises a substrate body and a copper block arranged below the substrate body, wherein a through hole is formed in the middle area of the substrate body, the upper surface of the copper block is exposed out of the through hole and is in welded connection with a flat heat pipe positioned above the substrate body, and the lower surface of the copper block is used for being in contact with a heating element;
the upper surface of the substrate body is provided with pits arranged at intervals in an area below the flat heat pipe, so that a welding area with certain roughness is formed on the substrate body, and the welding area is connected with the flat heat pipe through soldering tin.
The further improved scheme in the technical scheme is as follows:
1. in the above scheme, the surfaces of the flat heat pipe and the radiating fin group, which are far away from each other, are provided with flexible gaskets.
2. In the above scheme, the pits on the substrate body are obtained by an embossing process.
3. In the above scheme, 2 of the lands are located outside both ends of the through-hole, respectively.
4. In the scheme, the edges of the two sides of the copper block are connected with the substrate body through riveting.
Because of the application of the technical scheme, compared with the prior art, the utility model have following advantage and effect:
the utility model discloses radiator for notebook computer, its heat absorption module includes the base plate body and sets up in the copper billet of base plate body below, the upper surface of copper billet expose and with the flat heat pipe welded connection who is located base plate body top in the through-hole on the base plate body, the lower surface of copper billet is used for contacting with heating element, the base plate body upper surface is provided with the pit of interval arrangement in the region that is located flat heat pipe below, thereby form the weld zone that has certain roughness on the base plate body, be connected through soldering tin between weld zone and the flat heat pipe, the welding performance between the backup pad of different materials and the heat pipe has both been improved, can guarantee the homogeneity that the soldering paste distributes again, improve welded plane degree, prevent local warpage, and then guarantee hot-conducting efficiency and stability.
Drawings
Fig. 1 is a schematic view of the overall structure of the heat sink for notebook computer of the present invention;
fig. 2 is an exploded view of a part of the heat sink for a notebook computer according to the present invention;
fig. 3 is an enlarged view of fig. 2 at a.
In the drawings above: 1. a flat heat pipe; 2. a heat-dissipating fin group; 21. an air duct; 3. a heat absorption module; 4. a heat radiation fan; 5. a substrate body; 6. a copper block; 7. a through hole; 8. a pit; 9. a welding zone; 10. a flexible gasket.
Detailed Description
In the description of this patent, it is noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, merely for convenience of description and simplification of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, as they may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The meaning of the above terms in this patent may be specifically understood by those of ordinary skill in the art.
Example 1: a radiator for a notebook computer comprises a flat heat pipe 1, a radiating fin group 2 connected with one end of the flat heat pipe 1 and a heat absorption module 3 connected with the other end of the flat heat pipe 1, wherein a radiating fan 4 is arranged at the air inlet side of the radiating fin group 2 with a plurality of air channels 21 arranged in parallel;
the heat absorption module 3 further includes: the heat pipe comprises a substrate body 5 and a copper block 6 arranged below the substrate body 5, wherein a through hole 7 is formed in the middle area of the substrate body 5, the upper surface of the copper block 6 is exposed out of the through hole 7 and is connected with a flat heat pipe 1 positioned above the substrate body 5 in a welding mode, and the lower surface of the copper block 6 is used for being in contact with a heating element;
The pits 8 on the substrate body 5 are obtained by an embossing process.
2 of the lands 9 are located outside both ends of the through-hole 7, respectively.
Example 2: a radiator for a notebook computer comprises a flat heat pipe 1, a radiating fin group 2 connected with one end of the flat heat pipe 1 and a heat absorption module 3 connected with the other end of the flat heat pipe 1, wherein a radiating fan 4 is arranged at the air inlet side of the radiating fin group 2 with a plurality of air channels 21 arranged in parallel;
the heat absorption module 3 further includes: the heat pipe comprises a substrate body 5 and a copper block 6 arranged below the substrate body 5, wherein a through hole 7 is formed in the middle area of the substrate body 5, the upper surface of the copper block 6 is exposed out of the through hole 7 and is connected with a flat heat pipe 1 positioned above the substrate body 5 in a welding mode, and the lower surface of the copper block 6 is used for being in contact with a heating element;
The edges of the two sides of the copper block 6 are connected with the base plate body 5 through riveting.
2 of the lands 9 are located outside both ends of the through-hole 7, respectively.
The surfaces of the flat heat pipe 1 and the radiating fin group 2, which are far away from each other, are provided with the flexible gaskets 10, so that the situation that heat on the heat pipe or the radiating fin group 2 is conducted to the equipment shell, the heat cannot be effectively conducted to the air, and the radiating efficiency is reduced is avoided.
When the radiator for the notebook computer is adopted, the upper surface of the copper block is exposed from the through hole and is connected with the flat heat pipe above the substrate body in a welding mode, the lower surface of the copper block is used for being in contact with a heating element, pits which are distributed at intervals are arranged in the area, below the flat heat pipe, of the upper surface of the substrate body, therefore, a welding area with certain roughness is formed on the substrate body, the welding area and the flat heat pipe are connected through soldering tin, the welding performance between the supporting plate and the heat pipe made of different materials is improved, the uniformity of soldering paste distribution can be guaranteed, the welding flatness is improved, local warping is prevented, and the heat conduction efficiency and stability are further guaranteed.
The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose of the embodiments is to enable people skilled in the art to understand the contents of the present invention and to implement the present invention, which cannot limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered by the protection scope of the present invention.
Claims (5)
1. A radiator for notebook computer which characterized in that: the heat pipe heat sink comprises a flat heat pipe (1), a heat radiating fin group (2) connected with one end of the flat heat pipe (1) and a heat absorbing module (3) connected with the other end of the flat heat pipe (1), wherein a heat radiating fan (4) is installed on the air inlet side of the heat radiating fin group (2) with a plurality of air channels (21) arranged in parallel;
the heat absorption module (3) further comprises: the heat pipe comprises a substrate body (5) and a copper block (6) arranged below the substrate body (5), wherein a through hole (7) is formed in the middle area of the substrate body (5), the upper surface of the copper block (6) is exposed from the through hole (7) and is connected with a flat heat pipe (1) positioned above the substrate body (5) in a welding mode, and the lower surface of the copper block (6) is used for being in contact with a heating element;
pits (8) which are distributed at intervals are arranged in the area, located below the flat heat pipe (1), of the upper surface of the substrate body (5), so that a welding area (9) with certain roughness is formed on the substrate body (5), and the welding area (9) is connected with the flat heat pipe (1) through soldering tin.
2. The heat sink for the notebook computer as claimed in claim 1, wherein: and flexible gaskets (10) are arranged on the surfaces of the flat heat pipe (1) and the radiating fin group (2) which are far away from each other.
3. The heat sink for the notebook computer according to claim 1 or 2, wherein: the pits (8) on the substrate body (5) are obtained by an embossing process.
4. The heat sink for the notebook computer according to claim 1 or 2, wherein: the 2 welding areas (9) are respectively positioned at the outer sides of the two ends of the through hole (7).
5. The heat sink for the notebook computer according to claim 1 or 2, wherein: the edges of the two sides of the copper block (6) are connected with the substrate body (5) through riveting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121843642.XU CN217655513U (en) | 2021-08-09 | 2021-08-09 | Radiator for notebook computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121843642.XU CN217655513U (en) | 2021-08-09 | 2021-08-09 | Radiator for notebook computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217655513U true CN217655513U (en) | 2022-10-25 |
Family
ID=83659584
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121843642.XU Active CN217655513U (en) | 2021-08-09 | 2021-08-09 | Radiator for notebook computer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217655513U (en) |
-
2021
- 2021-08-09 CN CN202121843642.XU patent/CN217655513U/en active Active
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