CN217694098U - Light and thin heat dissipation device - Google Patents
Light and thin heat dissipation device Download PDFInfo
- Publication number
- CN217694098U CN217694098U CN202121844104.2U CN202121844104U CN217694098U CN 217694098 U CN217694098 U CN 217694098U CN 202121844104 U CN202121844104 U CN 202121844104U CN 217694098 U CN217694098 U CN 217694098U
- Authority
- CN
- China
- Prior art keywords
- heat
- heat pipe
- bending
- substrate body
- sides
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The utility model discloses a frivolous heat abstractor, including flat heat pipe, the heat radiation fin group of being connected with flat heat pipe one end and the heat absorption module of being connected with the flat heat pipe other end, have a plurality of parallel arrangement's wind channel a radiator fan is installed to heat radiation fin group's air intake side, heat absorption module further includes: the lower surface of the copper block is used for contacting with a heating element, a strip bending part is respectively arranged on two sides of the flat heat pipe on the through hole, and the lower surface of the strip bending part is higher than the upper surface of the substrate body, so that a step groove is respectively formed between the lower surface of the substrate body and 2 strip bending parts. The utility model discloses the direction that provides for copper billet and heat pipe simultaneously is with spacing, guarantees the effect and the stability of heat conduction.
Description
Technical Field
The utility model relates to an electronic product heat dissipation field especially relates to a frivolous type heat abstractor.
Background
With the development of electronic industry technology, the transistor density of various chips is increasing day by day, and although the data processing speed is faster and faster, the heat generated by the consumed power meter is also increasing day by day, and in order to make the cpu operate stably, a high-efficiency heat sink is an inevitable requirement at present. The heat conducted to the fan blades by the heat conducting section of the existing heat dissipation device is limited, so that the heat taken away by the airflow is limited, the heat dissipation efficiency is low, and the use of the heat dissipation device is influenced.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a frivolous heat abstractor, this frivolous heat abstractor both can guarantee the position precision of copper billet and heat pipe in the production process, can avoid heat pipe or copper billet to take place the skew in the use again, guarantees heat absorption module and heat radiation fin group between hot-conducting efficiency and stability.
In order to achieve the purpose, the utility model adopts the technical proposal that: a light and thin heat dissipation device comprises a flat heat pipe, a heat dissipation fin group connected with one end of the flat heat pipe and a heat absorption module connected with the other end of the flat heat pipe, wherein a heat dissipation fan is arranged on the air inlet side of the heat dissipation fin group with a plurality of air channels arranged in parallel;
the heat absorption module further comprises: the heat pipe comprises a substrate body and a copper block arranged below the substrate body, wherein a through hole is formed in the middle area of the substrate body, the upper surface of the copper block is exposed out of the through hole and is in welded connection with a flat heat pipe positioned above the substrate body, and the lower surface of the copper block is used for being in contact with a heating element;
lie in flat heat pipe both sides on the through-hole and respectively be provided with a bar portion of bending, the lower surface that this bar portion of bending is higher than the upper surface of base plate body to respectively form a ladder groove between the lower surface of base plate body and 2 bar portions of bending, copper billet both sides imbed a ladder inslot separately and are connected with the bar portion of bending that corresponds, and 2 bar portions of bending's respective side end face sets up with the face-to-face neighbouring of the both sides surface of flat heat pipe.
The further improved scheme in the technical scheme is as follows:
1. in the above scheme, the surfaces of the flat heat pipe and the radiating fin group which are far away from each other are provided with flexible gaskets.
2. In the above scheme, the substrate body is a galvanized iron plate.
3. In the scheme, the edges of the two sides of the copper block are connected with the substrate body through riveting.
4. In the scheme, the edges of two sides of the copper block are connected with the strip-shaped bending part through riveting.
Because of the application of the technical scheme, compared with the prior art, the utility model have following advantage and effect:
the utility model discloses frivolous type heat abstractor, its base plate body with set up in the copper billet of base plate body below, open in the base plate body middle zone has a through-hole, the upper surface of copper billet expose from this through-hole and with the flat heat pipe welded connection who is located base plate body top, the lower surface of copper billet is used for contacting with heating element, the copper billet both sides imbed a ladder inslot separately and are connected with the bar portion of bending that corresponds, and 2 the respective side end face of the portion of bending of bar is adjacent with the both sides surface face-to-face of flat heat pipe and is set up, and the direction and spacing that provide for copper billet and heat pipe simultaneously both can guarantee the position accuracy of copper billet and heat pipe in the production process, can avoid heat pipe or copper billet to take place the skew again in the use, guarantee heating element and heat absorption module, heat conduction efficiency and the stability between heat absorption module and the radiating fin group.
Drawings
Fig. 1 is a schematic view of the overall structure of the light and thin heat dissipation device of the present invention;
fig. 2 is an exploded view of the light and thin heat dissipation device of the present invention;
fig. 3 is a bottom view of the thin and light heat dissipating device according to the present invention.
In the above drawings: 1. a flat heat pipe; 2. a heat radiation fin group; 21. an air duct; 3. a heat absorption module; 4. a heat radiation fan; 5. a substrate body; 6. a copper block; 7. a through hole; 8. a strip-shaped bending part; 9. a stepped groove; 10. a flexible gasket.
Detailed Description
In the description of this patent, it is noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, as they may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The meaning of the above terms in this patent may be specifically understood by those of ordinary skill in the art.
Example 1: a light and thin heat dissipation device comprises a flat heat pipe 1, a heat dissipation fin group 2 connected with one end of the flat heat pipe 1 and a heat absorption module 3 connected with the other end of the flat heat pipe 1, wherein a heat dissipation fan 4 is installed on the air inlet side of the heat dissipation fin group 2 with a plurality of air channels 21 arranged in parallel;
the heat absorption module 3 further includes: the heat pipe comprises a substrate body 5 and a copper block 6 arranged below the substrate body 5, wherein a through hole 7 is formed in the middle area of the substrate body 5, the upper surface of the copper block 6 is exposed out of the through hole 7 and is connected with a flat heat pipe 1 positioned above the substrate body 5 in a welding mode, and the lower surface of the copper block 6 is used for being in contact with a heating element;
lie in flat heat pipe 1 both sides respectively on through-hole 7 and be provided with a bar 8 of bending, this bar 8 of bending's lower surface is higher than the upper surface of base plate body 5 to respectively form a ladder groove 9 between base plate body 5's lower surface and 2 bars 8 of bending, 6 both sides of copper billet imbed in a ladder groove 9 separately and are connected with the bar 8 of bending that corresponds, and 2 bars 8 of bending's respective side end face and the face-to-face adjacent setting of the both sides surface of flat heat pipe 1.
The substrate body 5 is a galvanized iron plate;
the edges of the two sides of the copper block 6 are connected with the substrate body 5 through riveting;
the edges of the two sides of the copper block 6 are connected with the strip-shaped bending part 8 through riveting.
Example 2: a light and thin heat dissipation device comprises a flat heat pipe 1, a heat dissipation fin group 2 connected with one end of the flat heat pipe 1 and a heat absorption module 3 connected with the other end of the flat heat pipe 1, wherein a heat dissipation fan 4 is installed on the air inlet side of the heat dissipation fin group 2 with a plurality of air channels 21 arranged in parallel;
the heat absorption module 3 further includes: the heat pipe comprises a substrate body 5 and a copper block 6 arranged below the substrate body 5, wherein a through hole 7 is formed in the middle area of the substrate body 5, the upper surface of the copper block 6 is exposed out of the through hole 7 and is connected with a flat heat pipe 1 positioned above the substrate body 5 in a welding mode, and the lower surface of the copper block 6 is used for being in contact with a heating element;
lie in flat heat pipe 1 both sides respectively on through-hole 7 and be provided with a bar 8 of bending, this bar 8 of bending's lower surface is higher than the upper surface of base plate body 5 to respectively form a ladder groove 9 between base plate body 5's lower surface and 2 bars 8 of bending, 6 both sides of copper billet imbed in a ladder groove 9 separately and are connected with the bar 8 of bending that corresponds, and 2 bars 8 of bending's respective side end face and the face-to-face adjacent setting of the both sides surface of flat heat pipe 1.
The edges of the two sides of the copper block 6 are connected with the strip-shaped bending part 8 through riveting;
the surfaces of the flat heat pipe 1 and the heat radiating fin group 2, which are far away from each other, are provided with the flexible gaskets 10, so that the situation that heat on the heat pipe or the heat radiating fin group is conducted to an equipment shell, the heat cannot be effectively conducted to the air, and the heat radiating efficiency is reduced is avoided.
When adopting above-mentioned frivolous heat abstractor, it the utility model discloses frivolous heat abstractor, its base plate body with set up in the copper billet of base plate body below, open in base plate body middle zone has a through-hole, the upper surface of copper billet expose from this through-hole and with the flat heat pipe welded connection who is located base plate body top, the lower surface of copper billet is used for contacting with heating element, the copper billet both sides imbed a ladder inslot separately and are connected with the portion of bending of corresponding bar, and 2 individual side end face of the portion of bending of bar is adjacent to the setting face-to-face with the both sides surface of flat heat pipe, and the direction that provides for copper billet and heat pipe simultaneously is spacing, both can guarantee the position precision of copper billet and heat pipe in the production process, can avoid heat pipe or copper billet to take place the skew again in the use, guarantee heating element and heat absorption module, heat-conduction efficiency and stability between heat-sinking fin group.
The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose of the embodiments is to enable people skilled in the art to understand the contents of the present invention and to implement the present invention, which cannot limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered in the protection scope of the present invention.
Claims (5)
1. A light and thin heat dissipation device is characterized in that: the heat-radiating device comprises a flat heat pipe (1), a heat-radiating fin group (2) connected with one end of the flat heat pipe (1) and a heat-absorbing module (3) connected with the other end of the flat heat pipe (1), wherein a heat-radiating fan (4) is arranged on the air inlet side of the heat-radiating fin group (2) with a plurality of air channels (21) arranged in parallel;
the heat absorption module (3) further comprises: the heat pipe comprises a substrate body (5) and a copper block (6) arranged below the substrate body (5), wherein a through hole (7) is formed in the middle area of the substrate body (5), the upper surface of the copper block (6) is exposed from the through hole (7) and is connected with a flat heat pipe (1) positioned above the substrate body (5) in a welding mode, and the lower surface of the copper block (6) is used for being in contact with a heating element;
lie in flat heat pipe (1) both sides on through-hole (7) and respectively be provided with a bar portion of bending (8), the lower surface that this bar portion of bending (8) is higher than the upper surface of base plate body (5) to respectively form one step groove (9) between the lower surface of base plate body (5) and 2 bar portions of bending (8), copper billet (6) both sides imbed in one step groove (9) respectively and are connected with the bar portion of bending (8) that corresponds, and 2 individual bar portions of bending (8) respective side end face and the face-to-face neighbouring setting of both sides surface of flat heat pipe (1).
2. The thin and light heat dissipation device according to claim 1, wherein: and flexible gaskets (10) are arranged on the surfaces of the flat heat pipe (1) and the radiating fin group (2) which are far away from each other.
3. The thin and light heat dissipating device according to claim 1 or 2, wherein: the substrate body (5) is a galvanized iron plate.
4. The thin and light heat dissipating device according to claim 1 or 2, wherein: the edges of the two sides of the copper block (6) are connected with the base plate body (5) through riveting.
5. The thin and light heat dissipating device according to claim 1 or 2, wherein: the edges of the two sides of the copper block (6) are connected with the strip-shaped bending part (8) through riveting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121844104.2U CN217694098U (en) | 2021-08-09 | 2021-08-09 | Light and thin heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121844104.2U CN217694098U (en) | 2021-08-09 | 2021-08-09 | Light and thin heat dissipation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217694098U true CN217694098U (en) | 2022-10-28 |
Family
ID=83701444
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121844104.2U Active CN217694098U (en) | 2021-08-09 | 2021-08-09 | Light and thin heat dissipation device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217694098U (en) |
-
2021
- 2021-08-09 CN CN202121844104.2U patent/CN217694098U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101370370B (en) | Heat radiation module | |
| US7957143B2 (en) | Motor controller | |
| KR101731337B1 (en) | Battery pack having all-in-one cooling tube and heat sink | |
| CN217694098U (en) | Light and thin heat dissipation device | |
| CN107105605B (en) | A kind of radiating water cooling board and preparation method thereof | |
| TWI334529B (en) | Heat dissipation device | |
| CN210534699U (en) | Heat dissipation module structure for server | |
| CN108633238B (en) | Heat dissipation device for two oppositely-inserted printed boards | |
| CN216775336U (en) | Integral type multi-structure aluminum alloy ex-trusions radiator | |
| CN211578734U (en) | Heat conducting device for electronic device | |
| CN210804276U (en) | Novel blowing plate type heat dissipation module for server | |
| CN217655513U (en) | Radiator for notebook computer | |
| CN219042315U (en) | Heat dissipation structure | |
| JP3146030U (en) | Heat dissipation fin structure and heat dissipation module using the heat dissipation fin | |
| CN219536653U (en) | Liquid cooling assembly, power module and power conversion equipment | |
| CN218548419U (en) | Heat radiation assembly | |
| CN216017254U (en) | Aluminum substrate with high heat exchange capacity | |
| CN218162382U (en) | Thermal diffusivity photovoltaic module | |
| CN217283828U (en) | Radiating fin with improved structure | |
| CN217932631U (en) | Heat dissipation device and server | |
| CN211909490U (en) | High-efficiency heat dissipation device | |
| CN212390895U (en) | Novel vortex and turbulent flow fin structure | |
| CN214316011U (en) | Heat sink and electronic apparatus | |
| CN214502170U (en) | Plate radiator of high-efficient heat conduction | |
| CN219372937U (en) | Radiator and electronic device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |