CN216017254U

CN216017254U - Aluminum substrate with high heat exchange capacity

Info

Publication number: CN216017254U
Application number: CN202122298912.XU
Authority: CN
Inventors: 王洪军
Original assignee: Dongguan Xun Cold And Hot Transmission Technology Co ltd
Current assignee: Dongguan Xun Cold And Hot Transmission Technology Co ltd
Priority date: 2021-09-22
Filing date: 2021-09-22
Publication date: 2022-03-11
Anticipated expiration: 2031-09-22

Abstract

The utility model relates to the technical field of heat dissipation devices, in particular to an aluminum substrate with high heat exchange capacity, which comprises an aluminum substrate, a heat pipe and a water cooling plate, wherein one surface of the aluminum substrate is provided with a groove, and the heat pipe is arranged in the groove; the water cooling plate is welded on one surface of the aluminum substrate with the groove; one surface of the aluminum substrate, which is back to the groove, is attached to the electronic element and used for dissipating heat of the electronic element. The utility model discloses can reduce the interfacial thermal resistance between aluminium base board and the radiator, reduce the diffusion thermal resistance of aluminium base board.

Description

Aluminum substrate with high heat exchange capacity

Technical Field

The utility model relates to a heat abstractor technical field indicates an aluminium base board with high heat transfer ability especially.

Background

With the development of the electronic industry technology, the production and process technology for manufacturing the circuit board is continuously developed, and in some electronic fields with larger heat emission, an aluminum substrate is generally used as a substrate of the circuit, and the aluminum substrate has good heat conduction and heat dissipation performance, so that the temperature of components can be greatly reduced, and the normal operation of the circuit is ensured.

However, the aluminum substrate provided by the prior art is too simple in structure, only carries out radiation heat dissipation through the aluminum substrate, has small heat dissipation area and low heat dissipation efficiency, and cannot dissipate heat in time when the heat generated by the mounted electronic element exceeds a certain amount, so that the normal work of a circuit is influenced; the aluminum substrate needs to be matched with a radiator for use, heat is dissipated through the radiator, contact thermal resistance is increased, and heat dissipation capacity is limited.

SUMMERY OF THE UTILITY MODEL

In order to solve the above problem, the utility model provides an aluminium base board with high heat transfer ability reduces the thermal contact resistance between aluminium base board and the radiator, improves the heat-sinking capability.

In order to achieve the above object, the present invention adopts a technical solution of providing an aluminum substrate with high heat exchange capability, including an aluminum substrate, a heat pipe and a water cooling plate, wherein a groove is formed on one side of the aluminum substrate, and the heat pipe is arranged in the groove; the water cooling plate is welded on one surface of the aluminum substrate with the groove; one surface of the aluminum substrate, which is back to the groove, is attached to the electronic element and dissipates heat to the electronic element.

As a preferable scheme, the heat pipe is a flat heat pipe, and the flat heat pipe is welded in the groove of the aluminum substrate in a low-temperature soldering manner.

Preferably, a protective film is attached to a surface of the aluminum substrate to which the electronic component is attached.

Preferably, a protective film is attached to a surface of the water-cooling plate, which is opposite to the aluminum substrate.

As a preferable scheme, the water cooling plate comprises a base plate and a cover plate, and the base plate is connected with the cover plate in a sealing mode.

As a preferred scheme, a circulating water channel is arranged in the substrate, a water inlet and a water outlet are oppositely arranged on two side faces of the substrate, and the water inlet and the water outlet are respectively communicated with the circulating water channel.

As a preferred scheme, the circulating water channel comprises a first water channel, a second water channel, two first U-shaped channels and two second U-shaped channels, wherein the first U-shaped channels are communicated with the second U-shaped channels; and two ends of the first water channel are respectively communicated with the two second U-shaped channels.

As a preferable scheme, the circulating water channel is of a symmetrical structure, the two first U-shaped channels are arranged in a bilateral symmetry mode, the two second U-shaped channels are arranged in a bilateral symmetry mode, and the first U-shaped channel and the second U-shaped channel on the same side are arranged oppositely; the first water channel and the second water channel are arranged in an up-and-down symmetrical mode.

As a preferable scheme, the first U-shaped channel comprises a first curved channel and a first straight channel connected to two ends of the first curved channel; the second U-shaped channel comprises a second curved channel and a second straight channel connected to two ends of the second curved channel; the two first straight paths are communicated with the second curved path; one of the second straight channels is communicated with the first water channel, and the other second straight channel is communicated with the second water channel.

The beneficial effects of the utility model reside in that:

the heat pipe, the water cooling plate and the aluminum substrate are combined, the diffusion thermal resistance of the aluminum substrate can be well reduced through the heat pipe, the flow resistance and the heat exchange effect can be well considered through the water cooling plate, and the power density of a product is improved to a great extent; because the heat pipe and the aluminum substrate are embedded, the whole structure is only the thickness of the two-layer structure of the aluminum substrate and the water cooling plate, and the structure is lighter and thinner.

Drawings

Fig. 1 is an explosion diagram of the aluminum substrate with high heat exchange capacity of the present invention.

Fig. 2 is a schematic cross-sectional view of the aluminum substrate with high heat exchange capacity of the present invention during operation.

Fig. 3 is a schematic cross-sectional view of the water cooling plate through circulation water channel of the present invention.

The reference numbers illustrate: 10-aluminum substrate; 11-a groove; 20-a heat pipe; 30-a water-cooling plate; 31-a circulating water channel; 32-a water inlet; 33-water outlet; 34-a first U-shaped channel; 35-a second U-shaped channel; 36-a first raceway; 37-a second raceway; 40-electronic components.

Detailed Description

The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it should be noted that, unless otherwise explicitly stated or limited, the terms "mounted," "connected" and "connected" are to be interpreted broadly, and may be, for example, fixedly connected, detachably connected, integrally connected, mechanically connected, electrically connected, directly connected, indirectly connected through an intermediate medium, or connected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Referring to fig. 1 to 3, the present invention relates to an aluminum substrate 10 with high heat exchange capability, including an aluminum substrate 10, a heat pipe 20 and a water cooling plate 30, wherein a groove 11 is formed on one side of the aluminum substrate 10, and the heat pipe 20 is disposed in the groove 11; the water cooling plate 30 is welded on one surface of the aluminum substrate 10 with the groove 11; the surface of the aluminum substrate 10 facing away from the groove 11 is attached to the electronic component 40, and dissipates heat to the electronic component 40.

The utility model combines the heat pipe 20 and the water cooling plate 30 with the aluminum substrate 10, the heat pipe 20 can well reduce the diffusion thermal resistance of the aluminum substrate 10, and then the water cooling plate 30 can well take account of the flow resistance and the heat exchange effect, thereby greatly improving the power density of the product; because the heat pipe 20 and the aluminum substrate 10 are embedded, the whole structure is only the thickness of the two-layer structure of the aluminum substrate 10 and the water cooling plate 30, and the structure is thinner.

Further, the heat pipe 20 is a flat heat pipe 20, and the flat heat pipe 20 is welded in the groove 11 of the aluminum substrate 10 by low temperature soldering, so that the flat heat pipe 20 can reduce the diffusion thermal resistance of the aluminum substrate 10 well, and can be connected with the aluminum substrate 10 more closely. The water-cooling plate 30 is welded with the aluminum substrate 10 with the heat pipe 20 by low-temperature soldering.

In this embodiment, the aluminum substrate 10, the water-cooling plate 30 and the heat pipe 20 are combined into an assembly, and a protective film is attached to the surface of the assembly, specifically: a protective film is attached to the surface of the aluminum substrate 10 that is opposite to the electronic component 40, and a protective film is attached to the surface of the water-cooling plate 30 that is opposite to the aluminum substrate 10. The assembly of the utility model can adopt the processing technique of the common aluminum substrate 10 to print the circuit board on the assembly of the water cooling plate 30 and the aluminum plate.

As shown in fig. 2, the bottom surface of the aluminum substrate 10 is connected to an electronic component 40 (such as a PCB), wherein the heat pipe 20 is embedded in the groove 11 of the top surface of the aluminum substrate 10, and the water cooling plate 30 is disposed on the top surface of the aluminum substrate 10. The heat generated by the electronic component 40 is quickly transferred to the water-cooling plate 30 through the aluminum substrate 10 and the heat pipe 20, the heat pipe 20 can well reduce the diffusion thermal resistance of the aluminum substrate 10, and the water-cooling plate 30 can well give consideration to both the flow resistance and the heat exchange effect.

Further, the water-cooled plate 30 includes a base plate (not shown) and a cover plate (not shown), and the base plate is hermetically connected with the cover plate; the inside of the base plate is provided with a circulating water channel 31 through opening the mould, two side surfaces of the base plate are oppositely provided with a water inlet 32 and a water outlet 33, and the water inlet 32 and the water outlet 33 are respectively communicated with the circulating water channel 31. The water cooling plate 30 is provided with the circulating water channel 31, so that the flow resistance and the heat exchange effect can be well considered, and the power density of the product is improved to a great extent.

As shown in fig. 3, the circulating water channel 31 adopts a series-parallel combination mode, which can improve the power density of the product. The circulating water channel 31 includes a first water channel 36, a second water channel 37, two first U-shaped channels 34 and two second U-shaped channels 35; the circulating water channel 31 is of a symmetrical structure, the two first U-shaped channels 34 are arranged in a bilateral symmetry mode, the two second U-shaped channels 35 are arranged in a bilateral symmetry mode, and the first U-shaped channel 34 and the second U-shaped channel 35 on the same side are arranged oppositely; the first water passage 36 and the second water passage 37 are arranged symmetrically up and down. Specifically, the first U-shaped track 34 includes a first curved track and a first straight track connected to both ends of the first curved track; the second U-shaped path 35 includes a second curved path and a second straight path connected to both ends of the second curved path; the two first straight paths are communicated with the second curved path; one of the second straight channels communicates with the first water channel 36, and the other second straight channel communicates with the second water channel 37; the inlet 32 communicates with the first bend of one first U-shaped channel 34 and the outlet 33 communicates with the first bend of the other first U-shaped channel 34.

The above embodiments are only for describing the preferred embodiments of the present invention, and are not intended to limit the scope of the present invention, and various modifications and improvements made by the technical solution of the present invention by those skilled in the art are all within the scope of the present invention as defined by the claims.

Claims

1. An aluminium base board with high heat exchange capacity is characterized in that: the aluminum base plate is provided with a groove on one surface, and the heat pipe is arranged in the groove; the water cooling plate is welded on one surface of the aluminum substrate with the groove; one surface of the aluminum substrate, which is back to the groove, is attached to the electronic element and dissipates heat to the electronic element.

2. The aluminum substrate with high heat exchange capacity of claim 1, wherein: the heat pipe is a flat heat pipe, and the flat heat pipe is welded in the groove of the aluminum substrate in a low-temperature soldering mode.

3. The aluminum substrate with high heat exchange capacity of claim 1, wherein: and a protective film is pasted on one side of the aluminum substrate, which is pasted with the electronic element.

4. The aluminum substrate with high heat exchange capacity of claim 1, wherein: and a protective film is pasted on one surface of the water-cooling plate, which is opposite to the aluminum substrate.

5. The aluminum substrate with high heat exchange capacity of claim 1, wherein: the water-cooling plate comprises a base plate and a cover plate, and the base plate is connected with the cover plate in a sealing mode.

6. The aluminum substrate with high heat exchange capacity of claim 5, wherein: the water inlet and the water outlet are respectively communicated with the circulating water channel.

7. The aluminum substrate with high heat exchange capacity of claim 6, wherein: the circulating water channel comprises a first water channel, a second water channel, two first U-shaped channels and two second U-shaped channels, and the first U-shaped channels are communicated with the second U-shaped channels; and two ends of the first water channel are respectively communicated with the two second U-shaped channels.

8. The aluminum substrate with high heat exchange capacity of claim 7, wherein: the circulating water channel is of a symmetrical structure, the two first U-shaped channels are arranged in a bilateral symmetry mode, the two second U-shaped channels are arranged in a bilateral symmetry mode, and the first U-shaped channel and the second U-shaped channel on the same side are arranged oppositely; the first water channel and the second water channel are arranged in an up-and-down symmetrical mode.

9. The aluminum substrate with high heat exchange capacity of claim 8, wherein: the first U-shaped channel comprises a first curved channel and a first straight channel connected to two ends of the first curved channel; the second U-shaped channel comprises a second curved channel and a second straight channel connected to two ends of the second curved channel; the two first straight paths are communicated with the second curved path; one of the second straight channels is communicated with the first water channel, and the other second straight channel is communicated with the second water channel.