CN210325775U - Liquid cooling radiator - Google Patents

Liquid cooling radiator Download PDF

Info

Publication number
CN210325775U
CN210325775U CN201920887677.XU CN201920887677U CN210325775U CN 210325775 U CN210325775 U CN 210325775U CN 201920887677 U CN201920887677 U CN 201920887677U CN 210325775 U CN210325775 U CN 210325775U
Authority
CN
China
Prior art keywords
cover plate
cooling liquid
channels
interface
main body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201920887677.XU
Other languages
Chinese (zh)
Inventor
邓小池
王能飞
李玉相
于定根
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Inovance Technology Co Ltd
Original Assignee
Suzhou Inovance Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzhou Inovance Technology Co Ltd filed Critical Suzhou Inovance Technology Co Ltd
Priority to CN201920887677.XU priority Critical patent/CN210325775U/en
Application granted granted Critical
Publication of CN210325775U publication Critical patent/CN210325775U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Abstract

The embodiment of the utility model provides a liquid cooling radiator, including the main part, and the main part includes first cooling surface, have first interface, second interface and at least two parallel connection in the main part between first interface and the second interface the first coolant liquid passageway; wherein: the at least two first cooling liquid channels are in a spiral shape and are adjacently arranged in a circular area of the main body part, the first interface is located at the center of the circular area, and the second interface is located at the edge of the circular area; the at least two first cooling liquid channels are respectively positioned on a first plane adjacent to the first heat dissipation surface and dissipate heat of devices on the first heat dissipation surface. The embodiment of the utility model provides a through two at least first coolant liquid passageways that connect in parallel, increased the area of contact of coolant liquid with the main part to can effectively reduce the flow resistance and the thermal resistance of liquid cooling radiator, improve the heat-sinking capability of liquid cooling radiator.

Description

Liquid cooling radiator
Technical Field
The embodiment of the utility model provides a relate to the heat dissipation field, more specifically say, relate to a liquid cooling radiator.
Background
High-power compression-joint type devices such as thyristors, rectifier diodes, diodes and the like are generally disc-shaped and support a double-sided water-cooled heat dissipation structure. The high-power compression joint type devices have high thermal power density and have high requirements on the thermal resistance and the flow resistance of the water cooling plate, so the reasonable radiator flow passage structure has a key effect on the application of the devices.
The flow channel structure of the radiator of the current high-power compression joint type device is more matched with the size of the device and is provided with a double-layer spiral water channel structure, and the two layers of water channels are used for radiating the heat of the devices arranged on two surfaces of the radiator respectively. There are two types of spiral water channels commonly used at present: the flow channel comprises an interval spiral flow channel and a central water inlet type spiral flow channel.
As shown in figure 1, in the radiator with the spaced spiral flow channels, fluid flows from a water inlet 11 outside the disc to the center of the circle along the gradually-reduced spiral water channel and then flows from the center of the circle to a water outlet 12 outside the disc along the gradually-expanded spiral water channel, the water channels flowing in and out are distributed at intervals, and the water channels are divided into two layers, so that double-sided heat radiation is supported. If the heat source of the high-power compression-joint device is uniform, the water channel has the advantage of uniform temperature. However, the actual high-power crimping device is often high in heat density at the center of the circle, and the radiator with the water channel structure causes the temperature of the center of the circle of the high-power crimping device to be high. FIG. 2 is a schematic diagram of the temperature and static pressure of the fluid in each place of the water channel in a radiator with spaced spiral channels; fig. 3 is a schematic diagram showing the surface temperature of the high power compression-type device that uses the heat sink with the spaced spiral flow channel to dissipate heat.
As shown in fig. 4, in the central water inlet type spiral flow passage, the flow passages of the fluid flowing in and out are changed, the fluid flows into the center of the circle of the disc from the water inlet 21 outside the disc along the linear passage between the upper and lower water passages, then is distributed to the upper and lower water passages from the center of the circle, and flows to the water outlet 22 outside the disc along the gradually expanding spiral water passage, so that the low-temperature fluid flows through the center of the circle, and the problem of high central heat density can be solved.
However, the water channels of the two radiators adopt the water channel with the single-tube structure, so that the heat radiation area and the flow rate can be increased only by increasing the spiral density, but the length of the water channel is increased, the flow passing section is reduced, the flow resistance is obviously increased, the flow rate is reduced in practical application, and the heat radiation capacity cannot be improved.
As shown in fig. 5, the water channels of the conventional spiral water-cooled radiator are formed by machining, that is, two water channels are respectively machined on the upper and lower surfaces of the middle layer 31 and have a symmetrical structure, and after the water channels are machined, the middle layer 31 and the cover plate 33 are welded together by a layer of thin brazing filler metal 32 through a vacuum brazing process. However, since the water channel is located in the intermediate layer 31, the welding effect will have a large influence on the heat dissipation capability of the radiator. Moreover, the machining mode causes the machining cost of the radiator to be higher.
SUMMERY OF THE UTILITY MODEL
The embodiment of the utility model provides a to above-mentioned spiral water course radiator lead to water course length to increase, actual flow descends when improving the heat-sinking capability to and the problem that machining water course is with high costs and welding effect influences the heat-sinking capability, provide a new liquid cooling radiator.
The technical solution of the present invention to solve the above technical problems is to provide a liquid-cooled heat sink, which includes a main body portion, wherein the main body portion includes a first heat dissipation surface, the main body portion has a first interface, a second interface and at least two first cooling liquid channels, and the at least two first cooling liquid channels are connected in parallel between the first interface and the second interface; wherein: the at least two first cooling liquid channels are in a spiral shape and are adjacently arranged in a circular area of the main body part, the first interface is located at the center of the circular area, and the second interface is located at the edge of the circular area; the at least two first cooling liquid channels are respectively positioned on a first plane adjacent to the first heat dissipation surface and dissipate heat of devices on the first heat dissipation surface.
Preferably, the main body portion includes a second heat dissipation surface parallel to the first heat dissipation surface, at least two second cooling liquid channels are provided in the main body portion, the at least two second cooling liquid channels are connected in parallel between the first interface and the second interface, and the at least two second cooling liquid channels are respectively in a spiral shape adjacently arranged in the circular region; the at least two second cooling liquid channels are respectively positioned on a second plane adjacent to the second heat dissipation surface and dissipate heat of devices on the second heat dissipation surface.
Preferably, the main body part is internally provided with a third interface, at least two third cooling liquid channels and at least two fourth cooling liquid channels, and the third interface is positioned at the edge of the circular area;
the at least two third cooling liquid channels are respectively positioned on the first plane, and the at least two third cooling liquid channels are connected between the first interface and the third interface in parallel; the at least two third cooling liquid channels are in a spiral shape which is adjacently arranged in the circular area, and the at least two third cooling liquid channels and the at least two first cooling liquid channels are distributed at intervals;
the at least two fourth cooling liquid channels are respectively positioned on the second plane and are connected between the first interface and the third interface in parallel; the at least two fourth cooling liquid channels are in a spiral shape which is adjacently arranged in the circular area, and the at least two fourth cooling liquid channels and the at least two second cooling liquid channels are distributed at intervals.
Preferably, the main body portion comprises a fourth interface, and the fourth interface is located at the edge of the circular area; the main body part is internally provided with a fifth cooling liquid channel which is used for communicating the first interface and the fourth interface, and the fifth cooling liquid channel is positioned between the first plane and the second plane.
Preferably, the main body portion includes an intermediate layer, a first cover plate, and a second cover plate;
the first cover plate is welded on the upper surface of the middle layer, the at least two first cooling liquid channels are positioned between the middle layer and the first cover plate, and the first heat dissipation surface is positioned on the surface of the first cover plate, which faces away from the middle layer;
the second cover plate is welded on the lower surface of the middle layer, the at least two second cooling liquid channels are located between the middle layer and the second cover plate, and the second heat dissipation surface is located on the surface, facing away from the middle layer, of the second cover plate.
Preferably, the at least two first coolant passages are each formed by a spiral groove of the surface of the first cover plate facing the intermediate layer, and the at least two second coolant passages are each formed by a spiral groove of the surface of the second cover plate facing the intermediate layer.
Preferably, the spiral groove on the first cover plate and the spiral groove on the second cover plate are respectively formed by a forging process.
Preferably, the first cover plate and the second cover plate have the same thickness, and the thickness of the intermediate layer is smaller than that of the first cover plate or the second cover plate.
Preferably, the at least two first coolant channels are each formed by a helical groove of the surface of the intermediate layer facing the first cover plate, and the at least two second coolant channels are each formed by a helical groove of the surface of the intermediate layer facing the second cover plate.
Preferably, the spiral groove on the upper surface of the intermediate layer and the spiral groove on the lower surface of the intermediate layer are respectively formed by a forging process, and the thickness of the intermediate layer is greater than the thicknesses of the first cover plate and the second cover plate.
The utility model discloses liquid cooling radiator through two at least first coolant liquid passageways that connect in parallel, has increased the area of contact of coolant liquid with the main part to can effectively reduce the flow resistance and the thermal resistance of liquid cooling radiator, improve the heat-sinking capability of liquid cooling radiator. And, the embodiment of the utility model provides a still process the coolant liquid passageway through forging and pressing technology, but the cost of greatly reduced liquid cooling radiator has improved the range of application of high-power crimping type device.
Drawings
FIG. 1 is a schematic diagram of a water channel in a radiator with a conventional spaced-apart spiral flow channel;
FIG. 2 is a schematic diagram of the temperature and pressure of the fluid in a conventional spaced-apart spiral flow channel heat sink;
FIG. 3 is a schematic of the surface temperature of a high power compression molded device using a prior art spaced spiral flow channel heat sink for heat dissipation;
FIG. 4 is a schematic diagram of a conventional central water-inlet spiral channel radiator internal water channel;
FIG. 5 is a schematic view of a prior art soldering structure of a heat sink;
fig. 6 is a schematic structural diagram of a cooling liquid passage in a liquid-cooled radiator according to an embodiment of the present invention;
fig. 7 is a schematic cross-sectional structure view of a cooling liquid channel in a liquid-cooled heat sink according to an embodiment of the present invention;
fig. 8 is a schematic structural view of a cooling fluid passage in a liquid-cooled heat sink according to another embodiment of the present invention;
FIG. 9 is a schematic illustration of the pressure of the cooling fluid in the liquid-cooled heat sink of FIG. 8;
FIG. 10 is a schematic illustration of the surface temperature of a high power compression device using the liquid cooled heat sink of FIG. 8 for heat dissipation;
fig. 11 is a schematic view of a welding structure of a liquid cooling radiator according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The utility model discloses liquid cooling radiator can be applied to the heat dissipation of high-power crimping type device, and this liquid cooling radiator can adopt spaced spiral runner or central formula spiral runner of intaking.
As shown in fig. 6, the embodiment of the present invention provides a schematic diagram of a liquid cooling radiator, and the liquid cooling radiator adopts an interval spiral flow channel. The liquid-cooled heat sink of the present embodiment includes a main body portion 6, and the main body portion 6 includes a first heat dissipation surface (the first heat dissipation surface may be located on a side surface of the main body portion 6), and the main body portion 6 has a first interface 61, a second interface 62, a third interface 64, two first cooling liquid channels 63, and two third cooling liquid channels 65 therein. The two first coolant passages 63 are connected in parallel between the first connection 61 and the second connection 62, and the two third coolant passages 65 are connected in parallel between the first connection 61 and the third connection 64. In order to increase the surface area of the first coolant passage 63 (i.e., increase the contact area between the coolant of the first coolant passage 63 and the main body 6), two first coolant passages 63 are formed in a spiral shape that is adjacently disposed in the circular region of the main body 6, and similarly, two third coolant passages 65 are formed in a spiral shape that is adjacently disposed in the circular region of the main body 6, and the two first coolant passages 63 and the two third coolant passages 65 are alternately distributed. The first port 61 is located at the center of the circular area, the second port 62 is located at the edge of the circular area, and the third port 64 is also located at the edge of the circular area. The two first cooling liquid channels 63 (i.e., the center points of the cross sections of the axial positions of each first cooling liquid channel 63) and the two third cooling liquid channels 65 (i.e., the center points of the cross sections of the axial positions of each third cooling liquid channel 65) are respectively located on a first plane, the first plane is parallel to the first heat dissipation surface, and the first plane is adjacent to the first heat dissipation surface, so that the heat dissipation of the high-power compression-type device attached to the first heat dissipation surface can be realized.
In use, the external inlet pipe may be connected to the third port 64, and the outlet pipe may be connected to the second port 62, so that the cooling liquid flowing from the external inlet pipe may flow into the two third cooling liquid channels 65 through the third port 64, and flow through the third cooling liquid channels 65 to reach the first port 61, and at the first port 61, the cooling liquid may flow into the two first cooling liquid channels 63, and then flow out to the outlet pipe through the two first cooling liquid channels 63 and the second port 62. Compared with the existing radiator with the interval type single-pipe spiral flow channel, the liquid cooling radiator has the advantages that the length of the cooling liquid channel is not increased, meanwhile, the contact area of the cooling liquid and the main body part 6 is doubled, and accordingly the heat dissipation capacity of the liquid cooling radiator is greatly improved. Since the lengths of the first cooling liquid channel 63 and the third cooling liquid channel 65 are not changed, that is, the liquid-cooled heat sink of the present embodiment can ensure that the flow resistance of the cooling liquid in the main body portion 6 is not changed, and the heat dissipation capability of the liquid-cooled heat sink is improved.
Of course, in practical applications, the number of the first cooling liquid channels 63 and the third cooling liquid channels 65 may be increased according to the power density of the high power compression-type device, for example, the number of the first cooling liquid channels 63 may be three or more, and the number of the third cooling liquid channels 65 may be three or more.
In another embodiment of the present invention, the liquid cooling heat sink can realize double-sided heat dissipation, that is, the main body portion 6 further includes a second heat dissipating surface located on the other side surface of the main body portion 6 besides the first heat dissipating surface located on one side surface, and the second heat dissipating surface is parallel to the first heat dissipating surface. Accordingly, as shown in fig. 7, the main body portion 6 has at least two second cooling liquid channels 67 and at least two fourth cooling liquid channels 66 in addition to the two first cooling liquid channels 63 and the two third cooling liquid channels 65, and the at least two second cooling liquid channels 67 and the at least two fourth cooling liquid channels 66 (i.e., the center points of the cross sections of the respective axial positions of each second cooling liquid channel 67 and each fourth cooling liquid channel 66) are respectively located on a second plane, and the second plane is parallel to and adjacent to the second heat dissipation surface, so that the high power press-fit type device attached to the second heat dissipation surface can be dissipated through the at least two second cooling liquid channels 67 and the at least two fourth cooling liquid channels 66.
The at least two second cooling liquid channels 67 are connected in parallel between the first connector 61 and the second connector 62, the at least two fourth cooling liquid channels 66 are connected in parallel between the first connector 61 and the third connector 64, and the at least two fourth cooling liquid channels 66 and the at least two second cooling liquid channels 67 are arranged at intervals. In order to increase the surface area of the second coolant passage 67 and the fourth coolant passage 66, the at least two second coolant passages 67 may be formed in a spiral shape adjacently in the circular region of the body portion 6, and similarly, the at least two fourth coolant passages 66 may be formed in a spiral shape adjacently in the circular region of the body portion 6.
The liquid cooling radiator of the embodiment of the utility model also can adopt a central water inlet type spiral flow passage, as shown in figure 8. The liquid-cooled heat sink of the present embodiment includes a main body 7, and the main body 7 includes a first heat dissipation surface (the first heat dissipation surface may be located on a side surface of the main body 7), and the main body 7 has a first interface 71, a second interface 72, a fourth interface 74, two first cooling liquid channels 73, and a fifth cooling liquid channel therein. The two first coolant passages 73 are connected in parallel between the first port 71 and the second port 72, and the fifth coolant passage is connected between the first port 71 and the fourth port 74. The two first coolant passages 73 are formed in a spiral shape adjacently in the circular region of the main body 7, and the fifth coolant passage is formed in a straight line shape. The first port 71 is located at the center of the circular area, the second port 72 is located at the edge of the circular area, and the fourth port 74 is also located at the edge of the circular area. The two first cooling liquid channels 73 (i.e. the central points of the cross sections of the axial positions of each first cooling liquid channel 73) are located on a first plane, and the fifth cooling liquid channel is located on one side of the first plane far away from the first heat dissipation surface, wherein the first plane is parallel to the first heat dissipation surface, and the first plane is adjacent to the first heat dissipation surface, so that the heat dissipation of the high-power compression-joint type device attached to the first heat dissipation surface can be realized.
In use, the external inlet pipe may be connected to the fourth port 74, and the outlet pipe may be connected to the second port 72, so that the cooling liquid flowing from the external inlet pipe may flow into the fifth cooling liquid channel via the fourth port 74, and flow through the fifth cooling liquid channel 75 to reach the first port 71, where the cooling liquid enters the two first cooling liquid channels 73 at the first port 71, and then flows out to the outlet pipe via the two first cooling liquid channels 73 and the second port 72. In this embodiment, since the external coolant directly flows into the first port 71 at the center of the main body through the linear fifth coolant channel and then flows out through the outward-extending spiral first coolant channel 73, the problem of high heat density at the center of the high-power press-connection type device on the first heat dissipation surface can be solved.
Of course, in practical applications, the number of the first cooling liquid channels 73 may be increased according to the power density of the high power compression-type device, for example, the number of the first cooling liquid channels 73 may be three or more.
Similar to the embodiments of fig. 6 and 7, the liquid-cooled radiator liquid using the central water-feeding spiral flow passage can realize double-sided heat dissipation. At this time, the main body portion 7 includes, in addition to the first heat dissipation surface and the first coolant passage 73, a second heat dissipation surface and at least two third coolant passages 77 connected in parallel between the first connector 71 and the second connector 72, and the two third coolant passages 77 (i.e., central points of cross sections of respective axial positions of each third coolant passage 77) are respectively located on a second plane (the second plane is parallel to the second heat dissipation surface and is disposed adjacent to the second heat dissipation surface), and the at least two third coolant passages 73 are in a spiral shape adjacently disposed in a circular region of the main body portion 7. The fifth coolant channel is located between the first plane and the second plane.
As shown in fig. 9-10, compared to the conventional radiator using the spaced single-tube spiral flow channel, the thermal resistance of the liquid-cooled radiator using the central water-feeding spiral flow channel is reduced by about 20%.
In an embodiment of the present invention, the main body 6, 7 of the liquid cooling radiator includes an intermediate layer 601, a first cover plate 602 and a second cover plate 603, the intermediate layer 601, the first cover plate 602 and the second cover plate 603 are respectively made of a material (e.g. aluminum or aluminum alloy) with a high thermal conductivity, and the first cover plate 602 is welded on the upper surface of the intermediate layer 601 through a first solder layer 604, at least two first cooling liquid channels are located between the intermediate layer 601 and the first cover plate 602 (when the liquid cooling radiator adopts a spaced spiral flow channel, at least two third cooling liquid channels are also located between the intermediate layer 601 and the first cover plate 602; when the liquid cooling radiator adopts a central water-inlet spiral flow channel, a fifth cooling liquid channel is located in the intermediate layer 601), and the first heat dissipation surface is located on the surface of the first cover plate 602, which faces away from the intermediate layer 601; similarly, a second cover plate 603 is welded to the lower surface of the intermediate layer 601 through a second solder layer 605, at least two second coolant channels are located between the intermediate layer 601 and the second cover plate 603 (when the liquid-cooled heat sink employs spaced-apart spiral channels, at least two fourth coolant channels are also located between the intermediate layer 601 and the second cover plate 603), and a second heat dissipation surface is located on the surface of the second cover plate 603 facing away from the intermediate layer 601. Of course, in practical applications, the first cover plate 602 and the second cover plate 603 may be welded to the intermediate layer 601 through other materials.
Specifically, the at least two first coolant channels may be respectively formed by spiral grooves on the surface of the first cover plate 602 facing the intermediate layer 601 (when the liquid-cooled heat sink employs spaced-apart spiral channels, at least two third coolant channels are also formed by spiral grooves on the surface of the first cover plate 602 facing the intermediate layer 601; when the liquid-cooled heat sink employs central water-feeding spiral channels, the fifth coolant channel is located between the spiral grooves on both sides of the intermediate layer 601), and the at least two second coolant channels are respectively formed by spiral grooves on the surface of the second cover plate 603 facing the intermediate layer 601 (when the liquid-cooled heat sink employs spaced-apart spiral channels, at least two fourth coolant channels are also formed by spiral grooves on the surface of the second cover plate 603 facing the intermediate layer 601). At this time, the intermediate layer 601 mainly serves to isolate the first coolant passage from the second coolant passage, and thus the thickness of the intermediate layer 601 may be smaller than that of the first cover plate 602 or the second cover plate 603.
Of course, in practical applications, at least two first coolant channels may be respectively formed by spiral grooves on the surface of the intermediate layer 601 facing the first cover plate 602 (when the liquid-cooled heat sink employs spaced-apart spiral channels, at least two third coolant channels are also formed by spiral grooves on the surface of the intermediate layer 601 facing the first cover plate 602), and at least two second coolant channels may be respectively formed by spiral grooves on the surface of the second cover plate 603 facing the intermediate layer 601 (when the liquid-cooled heat sink employs spaced-apart spiral channels, at least two fourth coolant channels are also formed by spiral grooves on the surface of the intermediate layer 601 facing the second cover plate 603). At this time, the thicknesses of the first and second cover plates 602 and 603 are smaller than the thickness of the intermediate layer 601. Of course, the heat dissipation effect of the structure is relatively poor.
In addition, to reduce the manufacturing cost, the spiral grooves on the first cover plate 602, the second cover plate 603, or the intermediate layer 601 may be formed by a forging process. Of course, in practical applications, the spiral grooves on the first cover plate 602, the second cover plate 603, or the middle layer 601 may also be machined, but the machining cost is relatively high.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention should be covered by the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims (10)

1. A liquid cooling radiator comprises a main body part, wherein the main body part comprises a first radiating surface, and is characterized in that a first interface, a second interface and at least two first cooling liquid channels are arranged in the main body part, and the at least two first cooling liquid channels are connected between the first interface and the second interface in parallel; wherein: the at least two first cooling liquid channels are in a spiral shape and are adjacently arranged in a circular area of the main body part, the first interface is located at the center of the circular area, and the second interface is located at the edge of the circular area; the at least two first cooling liquid channels are respectively positioned on a first plane adjacent to the first heat dissipation surface and dissipate heat of devices on the first heat dissipation surface.
2. The liquid-cooled heat sink of claim 1, wherein the main body portion includes a second heat dissipating surface parallel to the first heat dissipating surface, the main body portion having at least two second coolant channels therein, the at least two second coolant channels being connected in parallel between the first and second ports, and the at least two second coolant channels each having a spiral shape in the circular region and being disposed adjacent to each other; the at least two second cooling liquid channels are respectively positioned on a second plane adjacent to the second heat dissipation surface and dissipate heat of devices on the second heat dissipation surface.
3. The liquid-cooled heat sink of claim 2, wherein said main body portion has a third port, at least two third coolant channels, and at least two fourth coolant channels therein, and wherein said third port is located at an edge of said circular region;
the at least two third cooling liquid channels are respectively positioned on the first plane, and the at least two third cooling liquid channels are connected between the first interface and the third interface in parallel; the at least two third cooling liquid channels are in a spiral shape which is adjacently arranged in the circular area, and the at least two third cooling liquid channels and the at least two first cooling liquid channels are distributed at intervals;
the at least two fourth cooling liquid channels are respectively positioned on the second plane and are connected between the first interface and the third interface in parallel; the at least two fourth cooling liquid channels are in a spiral shape which is adjacently arranged in the circular area, and the at least two fourth cooling liquid channels and the at least two second cooling liquid channels are distributed at intervals.
4. The liquid-cooled heat sink of claim 2, wherein the body portion includes a fourth port, and wherein the fourth port is located at an edge of the circular region; the main body part is internally provided with a fifth cooling liquid channel which is used for communicating the first interface and the fourth interface, and the fifth cooling liquid channel is positioned between the first plane and the second plane.
5. The liquid cooled heat sink of any of claims 2-4, wherein the main body portion comprises an intermediate layer, a first cover plate, and a second cover plate;
the first cover plate is welded on the upper surface of the middle layer, the at least two first cooling liquid channels are positioned between the middle layer and the first cover plate, and the first heat dissipation surface is positioned on the surface of the first cover plate, which faces away from the middle layer;
the second cover plate is welded on the lower surface of the middle layer, the at least two second cooling liquid channels are located between the middle layer and the second cover plate, and the second heat dissipation surface is located on the surface, facing away from the middle layer, of the second cover plate.
6. The liquid-cooled heat sink of claim 5, wherein the at least two first coolant passages are each formed by a helical groove in a surface of the first cover plate facing the intermediate layer, and wherein the at least two second coolant passages are each formed by a helical groove in a surface of the second cover plate facing the intermediate layer.
7. The liquid-cooled heat sink of claim 6, wherein the helical groove in the first cover plate and the helical groove in the second cover plate are each formed by a forging process.
8. The liquid-cooled heat sink of claim 6, wherein the first cover plate and the second cover plate have the same thickness, and the intermediate layer has a thickness less than the thickness of the first cover plate or the second cover plate.
9. The liquid-cooled heat sink of claim 5, wherein the at least two first coolant passages are each formed by a helical groove in the surface of the intermediate layer facing the first cover plate, and wherein the at least two second coolant passages are each formed by a helical groove in the surface of the intermediate layer facing the second cover plate.
10. The liquid-cooled heat sink of claim 9, wherein the spiral groove in the upper surface of the intermediate layer and the spiral groove in the lower surface of the intermediate layer are formed by a forging process, respectively, and the thickness of the intermediate layer is greater than the thickness of the first cover plate and the second cover plate.
CN201920887677.XU 2019-06-13 2019-06-13 Liquid cooling radiator Active CN210325775U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201920887677.XU CN210325775U (en) 2019-06-13 2019-06-13 Liquid cooling radiator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201920887677.XU CN210325775U (en) 2019-06-13 2019-06-13 Liquid cooling radiator

Publications (1)

Publication Number Publication Date
CN210325775U true CN210325775U (en) 2020-04-14

Family

ID=70143670

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201920887677.XU Active CN210325775U (en) 2019-06-13 2019-06-13 Liquid cooling radiator

Country Status (1)

Country Link
CN (1) CN210325775U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110265369A (en) * 2019-06-13 2019-09-20 苏州汇川技术有限公司 Liquid cooling heat radiator

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110265369A (en) * 2019-06-13 2019-09-20 苏州汇川技术有限公司 Liquid cooling heat radiator

Similar Documents

Publication Publication Date Title
CN101840914B (en) There is the power model of the double-sided cooled of power overlay
US20180308780A1 (en) Thermally superconducting heat dissipation device and manufacturing method thereof
JP2001035981A (en) Cooler for semiconductor element and power-converting device using it
CN110265369A (en) Liquid cooling heat radiator
CN215418156U (en) Microchannel copper-aluminum composite relieving liquid cooling radiator
JP4015060B2 (en) Direct water-cooled power semiconductor module structure
CN104577707A (en) Stacked-array liquid refrigeration type high-power semiconductor laser
CN112928082A (en) Liquid cooling plate and power module
CN210325775U (en) Liquid cooling radiator
JP2001284513A (en) Power semiconductor device
CN210325774U (en) Liquid cooling radiator
CN204349207U (en) Stack-up array liquid refrigeration type high-power semiconductor laser
WO2017036292A1 (en) Heat exchange device for circulation cooling system and manufacturing method thereof
CN115084058B (en) Power semiconductor device packaging structure
CN115346939A (en) Heterogeneous embedded pin fin micro-channel radiator
CN105810805A (en) Liquid cooling heat sink
CN205542899U (en) Semiconductor refrigeration components
CN211788984U (en) Liquid cooling heat radiation structure suitable for flat-plate substrate power semiconductor module
CN210224020U (en) Final-stage power amplifier heat dissipation structure of integrated micro-channel
CN104538836B (en) A kind of liquid refrigerating chip for high-power semiconductor laser
WO2017049867A1 (en) Heat dissipation device and heat dissipation plate thereof
CN113035805A (en) Liquid cooling plate and power module
CN111970908A (en) Active and passive dual-purpose liquid cooling radiator and manufacturing method thereof
CN204858267U (en) Fin passageway fusiformis radiator that declines
CN206525069U (en) Radiator for power electronic devices

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant