CN110265369A - Liquid cooling heat radiator - Google Patents
Liquid cooling heat radiator Download PDFInfo
- Publication number
- CN110265369A CN110265369A CN201910511325.9A CN201910511325A CN110265369A CN 110265369 A CN110265369 A CN 110265369A CN 201910511325 A CN201910511325 A CN 201910511325A CN 110265369 A CN110265369 A CN 110265369A
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- China
- Prior art keywords
- interface
- cover board
- cooling
- main part
- middle layer
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- 238000001816 cooling Methods 0.000 title claims abstract description 183
- 239000007788 liquid Substances 0.000 title claims abstract description 82
- 239000002826 coolant Substances 0.000 claims abstract description 22
- 230000017525 heat dissipation Effects 0.000 claims abstract description 12
- 238000005516 engineering process Methods 0.000 claims description 6
- 238000005242 forging Methods 0.000 claims description 6
- 238000007493 shaping process Methods 0.000 claims description 5
- 235000019628 coolness Nutrition 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- 239000012530 fluid Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 230000005855 radiation Effects 0.000 description 5
- 239000000110 cooling liquid Substances 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
Abstract
The embodiment of the invention provides a kind of liquid cooling heat radiators, including main part, and the main part includes the first radiating surface, has first interface, second interface and at least two the first cooling passages being connected in parallel between the first interface and second interface in the main part；Wherein: at least two first cooling passages are in the spiral shape being disposed adjacent in the border circular areas of the main part, and the first interface is located at the central location of the border circular areas, and the second interface is located at the edge of the border circular areas；At least two first cooling passages are located in the first plane adjacent with first radiating surface, and are the device heat dissipation on first radiating surface.The embodiment of the present invention increases the contact area of coolant liquid and main part, to can effectively reduce the flow resistance and thermal resistance of liquid cooling heat radiator, improves the heat-sinking capability of liquid cooling heat radiator by least two the first cooling passages in parallel.
Description
Technical field
The present embodiments relate to field of radiating, more specifically to a kind of liquid cooling heat radiator.
Background technique
The high-power crimp type device such as thyristor, rectifier diode, diode, generally mostly disc, and support two-sided
The radiator structure of water cooling.The thermal power densities of these high-power crimp type devices are very high, have very to the thermal resistance and flow resistance of water-cooled plate
High requirement, so reasonable radiator flow passage structure has the function of key to the application of these devices.
The size of the more coordination devices of flow passage structure of the radiator of current high-power crimp type device, and there is the double-deck spiral shell
The channel structure of shape is revolved, two layers of water channel is respectively the device heat dissipation for being mounted on two faces of radiator.Currently used spiral water
There are two types of roads: the helical flow path of compartment helical flow path and center inlet type.
As shown in Figure 1, in the radiator of compartment helical flow path, fluid is from the water inlet 11 of disk outer portion along tapered spiral shell
Linear water channel flows to the center of circle, then flows to the water outlet 12 of disk outer portion along flaring scroll water channel from the center of circle, flows in and out
Water channel distribute alternately, and water channel point two layers, to support two-side radiation.If high-power crimp type device heat source is uniform, above-mentioned
Water channel has the advantages that temperature is uniform.But actual high-power crimp type device is often higher in the center point heat density, has upper
Stating the radiator of channel structure, to will lead to high-power crimp type device center of circle temperature higher.As shown in Fig. 2, being compartment spiral flow
The schematic diagram of the temperature of fluid and static pressure everywhere in water channel in the radiator in road；As shown in figure 3, to use above-mentioned compartment spiral
The schematic diagram of the temperature on the surface for the high-power crimp type device that the radiator of runner radiates.
As shown in figure 4, in the helical flow path of center inlet type, fluid flowed into, the water channel that flows out changes, fluid from
Vertically the beeline channel between two layers of water channel flows into circle disk center position to the water inlet 21 of disk outer portion, then shunts from the center point
To upper layer and lower layer water channel, and the water outlet 22 of disk outer portion is flowed to along flaring scroll water channel, what such the center point flowed through is low
Temperature fluid can solve the problems, such as that center heat density is higher.
However, the water channel of above two radiator all uses the water channel of single tube structure, therefore can only be by increasing helix
Density comes increasing heat radiation area and flow velocity, but this length that will lead to water channel increases, and flow section reduces, so that flow resistance is significant
Increase, and flow when practical application is caused to decline, heat-sinking capability can not be promoted.
Also, as shown in figure 5, the water channel of existing screw type water-cooled radiator is formed using machining mode, i.e., two
Water channel is processed respectively on two surfaces up and down of middle layer 31, and is in symmetrical structure, and water channel uses vacuum brazing after processing is completed
Technique is welded together middle layer 31 and cover board 33 by one layer thin solder 32.But since water channel is located at middle layer 31, welding
The quality of effect will be affected to the heat-sinking capability of radiator.Also, machining mode make radiator processing cost compared with
It is high.
Summary of the invention
The embodiment of the present invention causes water channel length to increase when improving heat-sinking capability, is real for above-mentioned spiral channel radiator
The decline of border flow and mechanical technology process the problem of water channel is at high cost and welding effect influences heat-sinking capability, provide a kind of new
Liquid cooling heat radiator.
The technical solution that the present invention solves above-mentioned technical problem is to provide a kind of liquid cooling heat radiator, including main part, and institute
Stating main part includes the first radiating surface, has first interface, second interface and at least two first coolings in the main part
Liquid channel, and at least two first cooling passages are connected in parallel between the first interface and second interface；Wherein:
At least two first cooling passages in the border circular areas of the main part in the spiral shape that is disposed adjacent, and described the
One interface is located at the central location of the border circular areas, and the second interface is located at the edge of the border circular areas；It is described at least
Two the first cooling passages are located in the first plane adjacent with first radiating surface, and are first radiating surface
On device heat dissipation.
Preferably, the main part includes second radiating surface parallel with first radiating surface, tool in the main part
There are at least two the second cooling passages, at least two article of second cooling passage is connected in the first interface and in parallel
Between two interfaces, and at least two second cooling passages are respectively in the border circular areas in the spiral being disposed adjacent
Shape；At least two second cooling passages are located in the second plane adjacent with second radiating surface, and are institute
State the device heat dissipation on the second radiating surface.
Preferably, with third interface, at least two articles of third cooling passages and at least two article the 4th in the main part
Cooling passage, and the third interface is located at the edge of the border circular areas；
At least two third cooling passages are located in first plane, and at least two thirds are cooling
Liquid channel is connected in parallel between the first interface and third interface；At least two third cooling passages are in the circle
In the spiral shape that is disposed adjacent in shape region, and at least two third cooling passages and at least two first coolings
Liquid channel distributes alternately；
At least two article of the 4th cooling passage is located in second plane, at least two article the 4th cooling
Liquid channel is connected in parallel between the first interface and third interface；At least two article of the 4th cooling passage is in the circle
In the spiral shape that is disposed adjacent in shape region, and at least two article of the 4th cooling passage and at least two article second cooling
Liquid channel distributes alternately.
Preferably, the main part includes the 4th interface, and the 4th interface is located at the edge of the border circular areas；Institute
State the 5th cooling passage having in main part for being connected to the first interface and the 4th interface, and the 5th coolant liquid
Channel is between first plane and the second plane.
Preferably, the main part includes middle layer, the first cover board and the second cover board；
First cover board is welded on the upper surface of the middle layer, and at least two first cooling passages are located at institute
It states between middle layer and the first cover board, and first radiating surface is located at the table backwards to the middle layer of first cover board
Face；
Second cover board is welded on the lower surface of the middle layer, and at least two second cooling passages are located at institute
It states between middle layer and the second cover board, and second radiating surface is located at the table backwards to the middle layer of second cover board
Face.
Preferably, at least two first cooling passages are respectively by first cover board towards the middle layer
The spiral slot on surface constitutes, and at least two second cooling passages are respectively by second cover board towards the centre
The spiral slot on the surface of layer is constituted.
Preferably, the spiral slot on the spiral slot and second cover board on first cover board passes through forging and stamping respectively
Technique machine-shaping.
Preferably, first cover board and second cover board have same thickness, and the thickness of the middle layer is less than
The thickness of first cover board or second cover board.
Preferably, at least two first cooling passages are respectively by the middle layer towards first cover board
The spiral slot on surface is constituted, and at least two second cooling passages are respectively by the second cover board of direction of the middle layer
The spiral slot on surface is constituted.
Preferably, the spiral slot difference of the lower surface of the spiral slot of the upper surface of the middle layer and the middle layer
By Forging Technology machine-shaping, and the thickness of the middle layer is greater than the thickness of first cover board and second cover board.
The liquid cooling heat radiator of the embodiment of the present invention increases cooling by least two the first cooling passages in parallel
The contact area of liquid and main part improves dissipating for liquid cooling heat radiator to can effectively reduce the flow resistance and thermal resistance of liquid cooling heat radiator
Thermal energy power.Also, the embodiment of the present invention also by Forging Technology process cooling passage, can substantially reduce liquid cooling heat radiator at
This, improves the application range of high-power crimp type device.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the radiator inner lead of existing compartment helical flow path；
Fig. 2 is the temperature of fluid and the schematic diagram of pressure in the radiator of existing compartment helical flow path；
Fig. 3 is the surface temperature of the high-power crimp type device to be radiated using the radiator of existing compartment helical flow path
The schematic diagram of degree；
Fig. 4 is the structural schematic diagram of the radiator inner lead of existing center inlet type helical flow path；
Fig. 5 is the welding structure schematic diagram of existing radiator；
Fig. 6 is the structural schematic diagram of cooling passage in liquid cooling heat radiator provided in an embodiment of the present invention；
Fig. 7 is the cross section structure schematic diagram of cooling passage in liquid cooling heat radiator provided in an embodiment of the present invention；
Fig. 8 be another embodiment of the present invention provides liquid cooling heat radiator in cooling passage structural schematic diagram；
Fig. 9 is the schematic diagram of the pressure of coolant liquid in liquid cooling heat radiator in Fig. 8；
Figure 10 is the signal of the surface temperature of the high-power crimp type device to be radiated using the liquid cooling heat radiator in Fig. 8
Figure；
Figure 11 is the welding structure schematic diagram of liquid cooling heat radiator provided in an embodiment of the present invention.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
The liquid cooling heat radiator of the embodiment of the present invention can be applied to the heat dissipation of high-power crimp type device, and the liquid cooling heat radiator
Compartment helical flow path or center inlet type helical flow path can be used.
As shown in fig. 6, being the schematic diagram of liquid cooling heat radiator provided in an embodiment of the present invention, the liquid cooling heat radiator is using interval
Formula helical flow path.The liquid cooling heat radiator of the present embodiment includes main part 6, and the main part 6 include the first radiating surface (this first dissipate
Hot face can be located at a side surface of main part 6), and in the main part 6 there is first interface 61, second interface 62, third to connect
64, two the first cooling passages 63 of mouth and two third cooling passages 65.Above-mentioned two the first cooling passages 63 are simultaneously
Connection is connected between first interface 61 and second interface 62, and two third cooling passages 65 are then connected in first interface 61 in parallel
Between third interface 64.And (increase by the first cooling passage 63 to increase the surface area of the first cooling passage 63
The contact area of coolant liquid and main part 6), two the first cooling passages 63 are set in the border circular areas of main part 6 in adjacent
The spiral shape set, similarly, two third cooling passages 65 are also in the spiral being disposed adjacent in the border circular areas of main part 6
Shape, and two the first cooling passages 63 and two third cooling passages 65 distribute alternately.Above-mentioned first interface 61 is located at circle
The central location in shape region, second interface 62 are located at the edge of border circular areas, and third interface 64 also is located at the edge of border circular areas.
Two the first cooling passages 63 (central point of the cross section of axial each position of i.e. every one first cooling passage 63)
And two (centers of the cross section of axial each position of i.e. each third cooling passage 65 of third cooling passage 65
Point) it is located in the first plane, above-mentioned first plane is parallel with the first radiating surface, and first plane and the first radiating surface phase
Neighbour, so that the heat dissipation for being affixed on the high-power crimp type device of the first radiating surface can be realized.
When in use, external water inlet pipe can be connected to third interface 64, outlet pipe is connected to second interface 62, thus by
The coolant liquid that external water inlet pipe flows into can be flowed into two third cooling passages 65 via third interface 64, and it is cold to flow through third
But first interface 61 is reached behind liquid channel 65, at first interface 61, coolant liquid enters two the first cooling passages 63, so
Outlet pipe is flowed out to by by two the first cooling passages 63 and second interface 62.Above-mentioned liquid cooling heat radiator passes through in parallel the
One cooling passage 63 and third cooling passage 65 can be relative to the radiator of existing compartment single tube spiral runner
While not increasing cooling passage length, so that coolant liquid and the contact area of main part 6 double, to be greatly improved
The heat-sinking capability of liquid cooling heat radiator.Since the length of the first cooling passage 63 and third cooling passage 65 is constant, i.e., originally
The liquid cooling heat radiator of embodiment can guarantee that flow resistance of the coolant liquid in main part 6 is constant, improve the heat radiation energy of liquid cooling heat radiator
Power.
Certainly, in practical applications, above-mentioned first cooling passage 63, third cooling passage 65 quantity can basis
The power density of high-power crimp type device increases, for example, the first cooling passage 63 quantity can be three or three with
On, the quantity of third cooling passage 65 can be three or three or more.
In another embodiment of the invention, two-side radiation may be implemented in liquid cooling heat radiator, i.e., main part 6 is in addition to being located at one
It further include the second radiating surface positioned at another side surface of the main part 6 outside first radiating surface of side surface, and second heat dissipation
Face is parallel with the first radiating surface.Correspondingly, as shown in fig. 7, in addition to two article of first cooling passage 63 and two articles the in main part 6
Outside three cooling passages 65, also there is at least two article of second cooling passage 67 and at least two article of the 4th cooling passage 66, and
Above-mentioned at least two article of second cooling passage 67 and at least two article of the 4th (i.e. every one second cooling passage 67 of cooling passage 66
With the central point of the cross section of axial each position of every one the 4th cooling passage 66) it is located at the second plane, and should
Second plane is parallel with the second radiating surface and is disposed adjacent, so as to pass through at least two the second cooling passages 67 and at least two
Article the 4th cooling passage 66 is the high-power crimp type device heat dissipation for being affixed on the second radiating surface.
Above-mentioned at least two the second cooling passages 67 are connected in parallel between first interface 61 and second interface 62, at least
Two article of the 4th cooling passage 66 is connected in parallel between first interface 61 and third interface 64, and at least two article of the 4th coolant liquid
The setting alternate at least two the second cooling passages 67 of channel 66.It is logical to increase the second cooling passage 67 and the 4th coolant liquid
The surface area in road 66, above-mentioned at least two the second cooling passages 67 can be in be disposed adjacent in the border circular areas of main part 6
Spiral shape, similarly, at least two article of the 4th cooling passage 66 can also be in the border circular areas of main part 6 in the spiral shell being disposed adjacent
Revolve shape.
Center inlet type helical flow path also can be used in the liquid cooling heat radiator of the embodiment of the present invention, as shown in Figure 8.The present embodiment
Liquid cooling heat radiator include main part 7, and the main part 7 includes that (first radiating surface can be located at main part 7 to the first radiating surface
One side surface), and there is first interface 71,74, two articles of second interface 72, the 4th interface first coolant liquids in the main part 7
Channel 73 and one article of the 5th cooling passage.Above-mentioned two article of first cooling passage 73 is connected in first interface 71 and in parallel
Between two interfaces 72, the 5th cooling passage is then connected between first interface 71 and the 4th interface 74.Also, two first cold
But in the spiral shape being disposed adjacent in the border circular areas of main part 7, the 5th cooling passage is then of a straight line type in liquid channel 73.The
One interface 71 is located at the central location of border circular areas, and second interface 72 is located at the edge of border circular areas, and the 4th interface 74 also is located at
The edge of border circular areas.Two the first cooling passages 73 be (axial each position of i.e. every one first cooling passage 73
The central point of cross section) it is located in the first plane, the 5th cooling passage is then located at separate first radiating surface of the first plane
Side, above-mentioned first plane is parallel with the first radiating surface, and the first plane is adjacent with the first radiating surface, is affixed on to can realize
The heat dissipation of the high-power crimp type device of one radiating surface.
When in use, external water inlet pipe can be connected to the 4th interface 74, outlet pipe is connected to second interface 72, thus by
The coolant liquid that external water inlet pipe flows into can be flowed into the 5th cooling passage via the 4th interface 74, and it is logical to flow through the 5th coolant liquid
Behind road 75 reach first interface 71, at first interface 71, coolant liquid enters two the first cooling passages 73, then via
Two the first cooling passages 73 and second interface 72 flow out to outlet pipe.In the embodiment, since external coolant liquid is through straight line
5th cooling passage of type is fed directly to the first interface 71 of main part central location, then the spiral shape first through extending out
Cooling passage 73 flows out, and can solve the problems, such as that high-power crimp type device center heat density is higher on the first radiating surface.
Certainly, in practical applications, above-mentioned first cooling passage, 73 quantity can be according to high-power crimp type device
Power density increases, such as the quantity of the first cooling passage 73 can be three or three or more.
With Fig. 6,7 embodiment similarly, the above-mentioned liquid cooling heat radiator liquid using center inlet type helical flow path can be realized
Two-side radiation.At this point, main part 7 in addition to include the first radiating surface, other than the first cooling passage 73, further include the second radiating surface and
At least two third cooling passages 77 being connected in parallel between first interface 71 and second interface 72, and two thirds are cooling
Liquid channel 77 (central point of the cross section of axial each position of i.e. each third cooling passage 77) is located at second
In plane (second plane is parallel to the second radiating surface, and is disposed adjacent with the second radiating surface), at least two thirds are cooling for this
Liquid channel 73 is in the border circular areas of main part 7 in the spiral shape being disposed adjacent.5th cooling passage be located at the first plane and
Between second plane.
As shown in figs. 9-10, the above-mentioned liquid cooling heat radiator using center inlet type helical flow path, compared between existing use
Every the radiator of formula single tube spiral runner, runner thermal resistance reduces about 20%.
In one embodiment of the invention, the main part 6,7 of liquid cooling heat radiator includes middle layer 601, the first cover board 602
And second cover board 603, above-mentioned middle layer 601, the first cover board 602 and the second cover board 603 are respectively by with high thermal conductivity
Material (such as aluminum or aluminum alloy) constitute, and the first cover board 602 is welded on middle layer 601 by the first solder layer 604
Upper surface, at least two the first cooling passages are located between middle layer 601 and the first cover board 602 (when liquid cooling heat radiator uses
When compartment helical flow path, at least two third cooling passages also are located between middle layer 601 and the first cover board 602；Work as liquid
When cold heat sink uses center inlet type helical flow path, the 5th cooling passage is located at middle layer 601), and the first radiating surface position
In the surface backwards to the middle layer 601 of the first cover board 602；Similarly, the second cover board 603 is welded by the second solder layer 605
Connect in the lower surface of middle layer 601, at least two the second cooling passages be located between middle layer 601 and the second cover board 603 (when
When liquid cooling heat radiator uses compartment helical flow path, at least two article of the 4th cooling passage also is located at middle layer 601 and the second lid
Between plate 603), and the second radiating surface is located at the surface backwards to middle layer 601 of the second cover board 603.Certainly, in practical application
In, the first cover board 602 and the second cover board 603 can also be welded in middle layer 601 by other materials.
It is specifically, above-mentioned that at least two the first cooling passages can be respectively by the layer towards the middle 601 of the first cover board 602
The spiral slot on surface constitute (when liquid cooling heat radiator uses compartment helical flow path, at least two third cooling passages
It is made of the spiral slot on the surface of the layer towards the middle 601 of the first cover board 602；When liquid cooling heat radiator uses center inlet type spiral shell
When eddy flow road, the 5th cooling passage is located between the spiral slot of the two sides of middle layer 601), at least two the second coolant liquids
Channel is then made of the spiral slot on the surface of the layer towards the middle 601 of the second cover board 603 respectively (when between liquid cooling heat radiator use
When formula helical flow path, at least two article of the 4th cooling passage is also by the spiral shell on the surface of the layer towards the middle 601 of the second cover board 603
It revolves shape slot to constitute).At this point, middle layer 601 is mainly used for isolating the first cooling passage and the second cooling passage, therefore should
The thickness of middle layer 601 is smaller than the thickness of the first cover board 602 or the second cover board 603.
Certainly, in practical applications, at least two the first cooling passages can be covered by the direction first of middle layer 601 respectively
The spiral slot on the surface of plate 602 constitute (when liquid cooling heat radiator uses compartment helical flow path, at least two third coolant liquids
Channel is also made of the spiral slot on the surface of the first cover board 602 of direction of middle layer 601), at least two the second coolant liquids are logical
Road is then made of the spiral slot on the surface of the layer towards the middle 601 of the second cover board 603 respectively (when liquid cooling heat radiator is using interval
When formula helical flow path, at least two article of the 4th cooling passage is also by the spiral on the surface of the second cover board 603 of direction of middle layer 601
Shape slot is constituted).At this point, the thickness of the first cover board 602 and the second cover board 603 is less than the thickness of middle layer 601.Certainly, the structure
Heat dissipation effect it is relatively poor.
In addition, the spiral shape to reduce processing cost, in above-mentioned first cover board 602, the second cover board 603 or middle layer 601
Slot can pass through Forging Technology machine-shaping.Certainly, in practical applications, above-mentioned first cover board 602, the second cover board 603 or centre
Machining mode can also be used in spiral slot on layer 601, but its processing cost is relatively high.
The foregoing is only a preferred embodiment of the present invention, but scope of protection of the present invention is not limited thereto,
In the technical scope disclosed by the present invention, any changes or substitutions that can be easily thought of by anyone skilled in the art,
It should be covered by the protection scope of the present invention.Therefore, protection scope of the present invention should be with scope of protection of the claims
Subject to.
Claims (10)
1. a kind of liquid cooling heat radiator, including main part, and the main part includes the first radiating surface, which is characterized in that the master
There is first interface, second interface and at least two the first cooling passages, and at least two first coolings in body portion
Liquid channel is connected in parallel between the first interface and second interface；Wherein: at least two first cooling passages exist
In the spiral shape being disposed adjacent in the border circular areas of the main part, and the first interface is located at the center of the border circular areas
Position, the second interface are located at the edge of the border circular areas；At least two first cooling passages be located at
It in the first adjacent plane of first radiating surface, and is the device heat dissipation on first radiating surface.
2. liquid cooling heat radiator according to claim 1, which is characterized in that the main part includes and first radiating surface
The second parallel radiating surface, the main part is interior to have at least two the second cooling passages, at least two second coolings
Liquid channel is connected in parallel between the first interface and second interface, and at least two second cooling passages exist respectively
In the spiral shape being disposed adjacent in the border circular areas；At least two second cooling passages are located at and described second
It in the second adjacent plane of radiating surface, and is the device heat dissipation on second radiating surface.
3. liquid cooling heat radiator according to claim 2, which is characterized in that have third interface, at least in the main part
Two articles of third cooling passages and at least two article of the 4th cooling passage, and the third interface is located at the side of the border circular areas
Edge；
At least two third cooling passages are located in first plane, and at least two third coolant liquids are logical
Road is connected in parallel between the first interface and third interface；At least two third cooling passages are in the circle
In the spiral shape being disposed adjacent in domain, and at least two third cooling passages and at least two first coolant liquids are logical
Road distributes alternately；
At least two article of the 4th cooling passage is located in second plane, and at least two article of the 4th coolant liquid is logical
Road is connected in parallel between the first interface and third interface；At least two article of the 4th cooling passage is in the circle
In the spiral shape being disposed adjacent in domain, and at least two article of the 4th cooling passage and at least two article of second coolant liquid are logical
Road distributes alternately.
4. liquid cooling heat radiator according to claim 2, which is characterized in that the main part includes the 4th interface, and described
4th interface is located at the edge of the border circular areas；Have in the main part for being connected to the first interface and the 4th interface
The 5th cooling passage, and the 5th cooling passage is between first plane and the second plane.
5. the liquid cooling heat radiator according to any one of claim 2-4, which is characterized in that the main part includes centre
Layer, the first cover board and the second cover board；
First cover board is welded on the upper surface of the middle layer, and at least two first cooling passages are located in described
Between interbed and the first cover board, and first radiating surface is located at the surface backwards to the middle layer of first cover board；
Second cover board is welded on the lower surface of the middle layer, and at least two second cooling passages are located in described
Between interbed and the second cover board, and second radiating surface is located at the surface backwards to the middle layer of second cover board.
6. liquid cooling heat radiator according to claim 5, which is characterized in that at least two the first cooling passage difference
It is made of the spiral slot on the surface towards the middle layer of first cover board, at least two second cooling passages
It is made of respectively the spiral slot on the surface towards the middle layer of second cover board.
7. liquid cooling heat radiator according to claim 6, which is characterized in that spiral slot on first cover board and described
Spiral slot on second cover board passes through Forging Technology machine-shaping respectively.
8. liquid cooling heat radiator according to claim 6, which is characterized in that first cover board and second cover board have
Same thickness, and the thickness of the middle layer is less than the thickness of first cover board or second cover board.
9. liquid cooling heat radiator according to claim 5, which is characterized in that at least two the first cooling passage difference
It is made of the spiral slot on the surface towards first cover board of the middle layer, at least two second cooling passages
It is made of respectively the spiral slot on the surface of the second cover board of direction of the middle layer.
10. liquid cooling heat radiator according to claim 9, which is characterized in that the spiral slot of the upper surface of the middle layer
Pass through Forging Technology machine-shaping respectively with the spiral slot of the lower surface of the middle layer, and the thickness of the middle layer is greater than
The thickness of first cover board and second cover board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910511325.9A CN110265369A (en) | 2019-06-13 | 2019-06-13 | Liquid cooling heat radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110701924A (en) * | 2019-10-18 | 2020-01-17 | 宁波江丰电子材料股份有限公司 | Cooling plate body |
| CN110828938A (en) * | 2019-11-25 | 2020-02-21 | 江苏理工学院 | Double-layer runner power battery liquid cooling plate control system and control method thereof |
| CN112672616A (en) * | 2020-12-31 | 2021-04-16 | 爱美达（上海）热能系统有限公司 | Double-sided heat dissipation liquid cooling plate |
| CN113075257A (en) * | 2021-04-25 | 2021-07-06 | 无锡江南计算技术研究所 | Method and device for testing cooling performance of liquid cooling cold plate |
| CN113437035A (en) * | 2021-05-27 | 2021-09-24 | 天津电气科学研究院有限公司 | High-efficient two-sided crimping type water-cooling radiator |
| CN113629025A (en) * | 2021-07-09 | 2021-11-09 | 佛山华智新材料有限公司 | Heat sink, electronic device and application |
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| US20170133244A1 (en) * | 2015-11-11 | 2017-05-11 | Applied Materials, Inc. | Cooling base with spiral channels for esc |
| CN210325775U (en) * | 2019-06-13 | 2020-04-14 | 苏州汇川技术有限公司 | Liquid cooling radiator |
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| US20070030655A1 (en) * | 2005-08-04 | 2007-02-08 | Bhatti Mohinder S | Impingement cooled heat sink with uniformly spaced curved channels |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110701924A (en) * | 2019-10-18 | 2020-01-17 | 宁波江丰电子材料股份有限公司 | Cooling plate body |
| CN110828938A (en) * | 2019-11-25 | 2020-02-21 | 江苏理工学院 | Double-layer runner power battery liquid cooling plate control system and control method thereof |
| CN112672616A (en) * | 2020-12-31 | 2021-04-16 | 爱美达（上海）热能系统有限公司 | Double-sided heat dissipation liquid cooling plate |
| CN113075257A (en) * | 2021-04-25 | 2021-07-06 | 无锡江南计算技术研究所 | Method and device for testing cooling performance of liquid cooling cold plate |
| CN113437035A (en) * | 2021-05-27 | 2021-09-24 | 天津电气科学研究院有限公司 | High-efficient two-sided crimping type water-cooling radiator |
| CN113629025A (en) * | 2021-07-09 | 2021-11-09 | 佛山华智新材料有限公司 | Heat sink, electronic device and application |
| CN113629025B (en) * | 2021-07-09 | 2022-06-14 | 佛山华智新材料有限公司 | Heat sink, electronic device and application |
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