/η 五、新型說明： 【新型所屬之技術領域】 本創作係有關-種均溫板結構改良，尤指一種增加散轨 流體之流速及能有效μ，俾使達魏好均溫性及散執性I 均溫板。 ' 【先前技術】 …按’現=時代進步神速科技發展快速於X*技術不 斷精進’在尚性能、高效率的訴求下，其所代表的意義不只 是工作速度的提昇，所以現今電子設備而言採用了多種電子 凡件:其單位體積所含之電子元件相對的增加，而該電子突 件於操作中即產生熱源，在性能不斷提昇的過程中，盆發執 量戶:造成的問題日妓重，且在電子元件發熱量日益増加的 同时口電子元件效能設計的不同，使得發熱的電子元件表 面之^通量分佈不均，也因局部溫度不同，而會在表面上^ 成所谓的熱點（hot spot)，造成局部溫度過高的現象，而電 子元件的操作溫度又與其可靠度、使用壽命等息息相關。 再者，現今電子設備更追求操作快速及附有多功能等需 求下，CPU或其他零件的發熱量越來越大，故如何提高熱能 的傳遞’進而增加熱能散溢之效果為顯其重要。 【新型内容】 有锻於此，本創作之目的係提供一種均溫板結構，藉由 支撐柱體其階級部及熱擴槽道之結構，由階級部抵接於底座 3 -M399977 及蓋件間而更具有效定位。同時，散熱流體藉由熱擴槽道其 流速更為迅速順暢，以提升均溫板散熱之效果。 爲達上述之目的，本創作之均溫板結構改良，係由一底 座及一蓋件形成一真空密閉容置空間之腔室，該腔室内填充 有散熱流體。其重點在於：該支撐柱體分別抵接於底座及蓋 件間，並由階級部抵接以固定，且該支撐柱體凸設有複數米 型體並構成熱擴槽道，俾使該散熱流體藉由該熱擴槽道其流^ 速更為流暢，而提升均溫板散熱之效果，同時亦使支撐柱體-藉由階級部抵接底座及蓋件而更具有效定位。 馨 【實施方式】 為能使貴審查委員清楚本創作之組成，以及實施方 式，茲配合圖式說明如下： 本創作「均溫板結構改良」如第一圖所示，該均溫板10 係由一底座11以及一蓋件12所構成，而本創作均溫板10之 底座11以及蓋件12係由銅材或鋁材或銀材或其他高導熱性 材質所構成，並形成一真空密閉容置空間之腔室13，而該均 籲 溫板設有一注口 14，以使散熱流體由該注口 14以填注而佈 於腔室13内，本實施例中之散熱流體係為純水，而後再進行 抽真空（或稱除氣作業）。 據以實施，如第二圖至第四圖所示係本創作第一實施 例，腔室13内設置有複數支撐柱體20，且該支撐柱體20分 別抵持於底座11及蓋件12間，該支撐柱體20係為一具有外 環部211之柱體21，柱體21 —側設有階級部22，而底座11 設有複數第一定位槽111供階級部22抵接以固定支撐柱體 4 M399977 20，並於支撐柱體20相對底座11抵接一蓋件12，且該外環 部211凸設有複數米型體212而構成熱擴槽道213，該熱擴 槽道213有助於散熱流體之流動更為迅速順暢，俾使均溫板 10提升散熱之效果，同時亦讓支撐柱體20藉由階級部22而 更達到有效定位。 如第五圖至第七圖所示係本創作第二實施例，腔室13内 ，設置有複數支撐柱體20，且該支撐柱體20分別抵持於底座 .11及蓋件12間，該支撐柱體20係為一具有外環部211之柱 修體21，柱體21兩側設有階級部22，而底座11設有複數第一 定位槽111供階級部22抵接以固定支撐柱體20，並於支撐 柱體20相對底座11抵接一蓋件12，該蓋件12並藉由第二 定位槽121供階級部22抵接，其益於支撐柱體20更有效定 位，再加以結合該底座11與蓋件12，其結合方式可為燒結 結合或擴散結合等，進一步填充注入散熱流體於腔室13内， 再加以進行抽真空作業，即完成均溫板10之整體結構。而該 支撐柱體20外環部211凸設有複數米型體212而構成熱擴槽 #道213，該熱擴槽道213有助於散熱流體之流動更為迅速順 '暢，俾使均溫板10提升散熱之效果。 再者，如第八圖所示係本創作第三實施例，該支撐柱體 20係可由底座11 一側作一體延伸之結構體，該支撐柱體20 一側具有階級部22，並於支撐柱體20另側相對底座11抵接 一蓋件12，而蓋件12設有複數第二定位槽121供階級部22 抵接以固定支撐柱體20，並加以結合該底座11與蓋件12。 如上所述，本創作均溫板結構改良，爰依法提呈新型專 利之申請；惟，以上之實施說明及圖式所示，係本創作較佳 5 M399977 實施例者，並非以此侷限本創作，是以，舉 造由特徵等近似'㈣者’均應屬本創作之創 及申请專利範圍之内。 【圖式簡單說明】 本創作之均溫板之外觀結構示意圖。 弟二圖係為本創作之支稽柱體結構示意圖。 創作之第一實施例之結構分解圖。 第四圖係為本創作之第之 創作之另一支撑柱體結構示意圖 ㈡=ί創作之第二實施例之結構分解圖。 第八圖係為本之第二實施例之結構組合剖視圖 1之第三實施例之結構組合剖視圖 【主要元件符號說明】 米型體212 熱擴槽道213 階級部22 均溫板1 〇 底座11 第一定位槽111 蓋件12 第一定位槽121 腔室13 注口 14 支撐柱體20 柱體21 外環部211/η V. New description: [New technical field] This creation is related to the improvement of the uniform temperature plate structure, especially the increase of the flow velocity of the scattered-rail fluid and the effective μ, which makes the Wei Wei uniform temperature and the stagnation I is a uniform temperature plate. '[Previous technology] ... According to the 'current = era progress, rapid development of technology, rapid development of X* technology, 'in the performance and high efficiency of the demand, its representative meaning is not only the improvement of work speed, so today's electronic equipment The use of a variety of electronic parts: the relative increase of the electronic components contained in the unit volume, and the electronic protrusions generate heat in the operation, in the process of continuous improvement in performance, the basin issued the volume: the problem caused The weight of the electronic components is increasing, and the efficiency of the design of the electronic components is different, so that the surface of the hot electronic components is unevenly distributed, and the local temperature is different, but the surface is so-called The hot spot causes the local temperature to be too high, and the operating temperature of the electronic component is closely related to its reliability and service life. Moreover, today's electronic devices are more demanding for quick operation and multi-functional requirements. The heat generated by CPUs or other parts is getting larger and larger, so how to improve the transmission of heat energy and increase the effect of heat energy spillage is important. [New content] For the purpose of this, the purpose of this creation is to provide a uniform temperature plate structure. By supporting the structure of the column body and the thermal expansion channel, the class part abuts against the base 3 -M399977 and the cover piece. More effective positioning. At the same time, the heat dissipation fluid is more quickly and smoothly flown by the heat expansion channel to improve the heat dissipation effect of the temperature equalization plate. In order to achieve the above purpose, the uniform temperature plate structure of the present invention is improved by forming a chamber of a vacuum sealed accommodating space by a bottom seat and a cover member, and the chamber is filled with a heat dissipating fluid. The main point is that the support column abuts between the base and the cover member, and is fixed by the step portion, and the support column protrudes from the plurality of meters and constitutes a thermal expansion channel, so that the heat dissipation The flow of the fluid through the thermal expansion channel is smoother, and the heat dissipation effect of the temperature equalization plate is improved, and the support cylinder body is more effectively positioned by abutting the base portion and the cover member. Xin [Embodiment] In order to enable the reviewing committee to understand the composition of the creation and the implementation method, the following is a description of the following: The "mean temperature plate structure improvement" of this creation is shown in the first figure, the temperature equalization plate 10 series The base 11 and the cover member 12 of the present temperature equalizing plate 10 are made of copper or aluminum or silver or other high thermal conductive material, and form a vacuum sealing. The chamber 13 is provided with a space, and the heat-dissipating plate is provided with a nozzle 14 for the heat-dissipating fluid to be filled in the chamber 13 by filling the nozzle 14. The heat dissipation flow system in this embodiment is pure. Water, and then vacuuming (or degassing). According to the first embodiment of the present invention, as shown in the second to fourth embodiments, a plurality of support columns 20 are disposed in the chamber 13, and the support columns 20 are respectively abutted against the base 11 and the cover member 12 The support cylinder 20 is a cylinder 21 having an outer ring portion 211. The column body 21 is provided with a step portion 22 on the side, and the base 11 is provided with a plurality of first positioning grooves 111 for the class portion 22 to abut to fix The support cylinder 4 M399977 20, and a support member 12 abuts against the base 11 at the support cylinder 20, and the outer ring portion 211 protrudes from the plurality of meters 212 to form a thermal expansion channel 213, the thermal expansion channel 213 helps the flow of the heat-dissipating fluid to be more rapid and smooth, so that the temperature equalizing plate 10 enhances the heat dissipation effect, and at the same time, the support cylinder 20 is more effectively positioned by the class portion 22. As shown in the fifth to seventh embodiments, in the second embodiment of the present invention, a plurality of support columns 20 are disposed in the chamber 13, and the support columns 20 are respectively abutted between the base 11 and the cover member 12, The support cylinder 20 is a column repair body 21 having an outer ring portion 211. The column body 21 is provided with a step portion 22 on both sides thereof, and the base 11 is provided with a plurality of first positioning grooves 111 for the class portion 22 to abut for fixed support. The pillar 20 is abutted against the base 11 with a cover member 12, and the cover member 12 is abutted by the second positioning groove 121 for the step portion 22, which is beneficial for the support cylinder 20 to be more effectively positioned. The base 11 and the cover member 12 are combined, and the combination thereof may be a sintered bond or a diffusion bond, etc., and further filled with the heat-dissipating fluid in the chamber 13, and then subjected to vacuuming operation, that is, the overall structure of the temperature equalization plate 10 is completed. . The outer ring portion 211 of the support cylinder 20 protrudes from the plurality of meters 212 to form a heat expansion groove #213. The heat expansion channel 213 helps the flow of the heat dissipation fluid to be more rapid and smooth. The warm plate 10 enhances the effect of heat dissipation. Furthermore, as shown in the eighth embodiment, in the third embodiment of the present invention, the support cylinder 20 is a structural body integrally extended from one side of the base 11, and the support cylinder 20 has a step portion 22 on one side and is supported. The other side of the cylinder 20 abuts a cover member 12 opposite to the base 11 , and the cover member 12 is provided with a plurality of second positioning slots 121 for abutting the step portion 22 to fix the support cylinder 20 and combining the base 11 and the cover member 12 . . As mentioned above, the creation of the uniform temperature plate structure is improved, and the application for new patents is submitted according to law; however, the above implementation descriptions and drawings show that the creation of the preferred 5 M399977 embodiment is not limited to this creation. Therefore, the approximation of the characteristics of the '(four)' should be within the scope of this creation and the scope of the patent application. [Simple description of the drawing] Schematic diagram of the appearance of the uniform temperature plate of this creation. The second picture of the brother is a schematic diagram of the structure of the column of the creation. An exploded view of the first embodiment of the creation. The fourth figure is a schematic diagram of another supporting column structure of the creation of the first creation of the creation (2) = an exploded view of the second embodiment of the creation. 8 is a structural sectional view of a third embodiment of a structural sectional view of a second embodiment of the present invention. [Main component symbol description] Rice body 212 Thermal expansion channel 213 Class portion 22 Temperature plate 1 〇 Base 11 First positioning groove 111 cover member 12 first positioning groove 121 chamber 13 injection port 14 support column 20 cylinder 21 outer ring portion 211