CN118139381A - Radiating assembly and electronic equipment - Google Patents
Radiating assembly and electronic equipment Download PDFInfo
- Publication number
- CN118139381A CN118139381A CN202410382434.6A CN202410382434A CN118139381A CN 118139381 A CN118139381 A CN 118139381A CN 202410382434 A CN202410382434 A CN 202410382434A CN 118139381 A CN118139381 A CN 118139381A
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- heat
- heating element
- heat dissipation
- heat pipe
- pipe
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 77
- 238000010438 heat treatment Methods 0.000 claims abstract description 61
- 239000000758 substrate Substances 0.000 claims abstract description 32
- 230000005855 radiation Effects 0.000 claims abstract description 27
- 238000007664 blowing Methods 0.000 claims abstract description 18
- 238000004891 communication Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 8
- 238000005516 engineering process Methods 0.000 abstract description 6
- 230000000191 radiation effect Effects 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The embodiment of the invention discloses a heat radiation assembly and electronic equipment, which are used for solving the technical problem that the heat radiation effect is poor because the chip-related heating element in the existing electronic equipment with an in-band blowing heat radiation technology can not effectively radiate heat. The heat dissipation component is used for dissipating heat of the heating element and comprises a fan module, a heat pipe and a heat conduction substrate used for being in contact with the heating element; the heat conducting substrate is connected with the heat pipe, an air outlet of the fan module is arranged towards the heat pipe, and a heat radiation fin module is arranged on the top surface of the heat pipe at a position corresponding to the heating element. Through the design, the fan module is used for directly radiating the heating element through the radiating fin module when the heat pipe is blown, so that the radiating effect of the heating element is effectively improved, the working temperature of the heating element is effectively controlled, and the heating element can work normally.
Description
Technical Field
The present disclosure relates to heat dissipation assemblies, and particularly to a heat dissipation assembly and an electronic device.
Background
The future of the current electronic equipment tends to be an internal blowing heat dissipation technology, and the internal blowing heat dissipation technology specifically means that a fan module and a related heat pipe assembly are arranged inside the electronic equipment, and the fan module drives air flow to flow outside the electronic equipment inside the electronic equipment, so that the purpose of internal heat dissipation of the electronic equipment is achieved.
Taking a notebook computer as an example, a plurality of heating elements such as a CPU chip, a GPU chip and the like are arranged in the notebook computer, and the internal blowing heat dissipation technology can effectively solve the problem that the temperature of a shell of the notebook computer is too high, so that a user has better experience, meanwhile, the air quantity of the temperature of the heating elements such as the CPU chip, the GPU chip and the like becomes smaller, which definitely causes that the heat emitted by the heating elements such as the CPU chip, the GPU chip and the like cannot be effectively discharged, and the heating elements always work at a higher temperature, so that the normal work and the service life of the CPU chip and the GPU chip are seriously influenced.
Therefore, it is an important subject to be studied by those skilled in the art to find a solution to the above-mentioned problems.
Disclosure of Invention
The embodiment of the invention discloses a heat radiation assembly and electronic equipment, which are used for solving the technical problem that the heat radiation effect is poor because the chip-related heating element in the existing electronic equipment with an in-band blowing heat radiation technology can not effectively radiate heat.
The embodiment of the invention provides a heat dissipation assembly, which is used for dissipating heat of a heating element and comprises a fan module, a heat pipe and a heat conduction substrate used for being in contact with the heating element;
The heat conducting substrate is connected with the heat pipe, an air outlet of the fan module is arranged towards the heat pipe, and a heat radiation fin module is arranged on the top surface of the heat pipe at a position corresponding to the heating element.
Optionally, the projected area of the heat radiation fin module on the heating element is larger than the area of the heating element.
Optionally, the heat dissipation fin module includes a plurality of heat dissipation fins disposed adjacently.
Optionally, the heat dissipation fin has a side panel extending along a length direction thereof, the side panel is located between a top surface of the heat dissipation fin and a bottom surface of the heat dissipation fin, the side panel is provided with a plurality of heat dissipation through holes, and the plurality of heat dissipation through holes are arranged at intervals along the length direction of the heat dissipation fin. .
Optionally, the length of the heat dissipation through hole is greater than 2mm, and the total area of the plurality of heat dissipation through holes accounts for not more than 40% of the surface area of the heat dissipation fins.
Optionally, the cross section of the radiating fin is in a C-shaped structure, and the radiating fin is provided with a radiating channel along the axis direction of the radiating fin.
Optionally, the heat dissipation channel and the heat dissipation through hole intercommunication are set up, when the fan module bloies, the air current of blowing flows from heat dissipation channel and heat dissipation through hole.
Optionally, the number of the fan modules is two, the two fan modules are respectively located at two opposite ends of the heat pipe, and air outlets of the two fan modules are all arranged towards the heat pipe.
The embodiment of the invention provides electronic equipment, which comprises a main board, a heating element and the heat dissipation assembly;
The heat dissipation assembly comprises a fan module, a heat pipe and a heat conduction substrate used for being in contact with the heating element;
The fan module, the heating element and the heat conducting substrate are all installed on the main board, the heat conducting substrate is connected with the heat pipe, an air outlet of the fan module faces the heat pipe, and a heat radiation fin module is arranged on the top surface of the heat pipe and at the position corresponding to the heating element.
Optionally, the heating element includes a CPU chip and a GPU chip; the heat conducting substrate comprises a CPU heat conducting substrate used for being contacted with the CPU chip and a heat conducting substrate used for being contacted with the GPU of the GPU chip;
The CPU heat conducting substrate and the GPU heat conducting substrate are connected with the heat pipe;
The heat pipe is provided with a heat radiation fin module, wherein the heat radiation fin module is arranged at the position of the top surface of the heat pipe corresponding to the CPU chip and the position of the top surface of the heat pipe corresponding to the GPU chip.
From the above technical solutions, the embodiment of the present invention has the following advantages:
In the heat dissipation assembly of the embodiment, a heat dissipation fin module is disposed at a position corresponding to the heating element on the top surface of the heat pipe. Through the design, the fan module is used for directly radiating the heating element through the radiating fin module when the heat pipe is blown, so that the radiating effect of the heating element is effectively improved, the working temperature of the heating element is effectively controlled, and the heating element can work normally.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the invention, and that other drawings can be obtained from these drawings without inventive faculty for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a heat dissipating assembly according to an embodiment of the present invention;
FIG. 2 is an enlarged view of a portion of a heat dissipating assembly according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a heat dissipation fin module in a heat dissipation assembly according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a heat dissipation fin in a heat dissipation assembly according to an embodiment of the present invention;
Fig. 5 is a front view of a heat dissipating fin in a heat dissipating assembly according to an embodiment of the present invention.
Illustration of: a main board 1; a fan module 2; an air blowing port 201; a heat pipe 3; a heat conductive substrate 4; a heat radiation fin module 5; a heat sink fin 501; a heat radiation passage 5011; a heat dissipation through hole 5012; a heating element 6;
The height a of the radiating fin; the length b of the heat dissipation through hole; the thickness c of the heat radiation fin; and the distance d between the projected edge of the radiating fin module on the heating element and the edge of the heating element.
Detailed Description
The embodiment of the invention discloses a heat radiation assembly and electronic equipment, which are used for solving the technical problem that the heat radiation effect is poor because the chip-related heating element in the existing electronic equipment with an in-band blowing heat radiation technology can not effectively radiate heat.
In order to better understand the aspects of the present invention, the present invention will be described in further detail with reference to the accompanying drawings and detailed description. It will be apparent that the described embodiments are only some, but not all, embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1 to 5, a heat dissipation assembly provided in an embodiment of the invention is used for dissipating heat from a heating element 6, and mainly includes a fan module 2, a heat pipe 3, and a heat conducting substrate 4 for contacting with the heating element 6;
The heat conducting substrate 4 is connected with the heat pipe 3, the air outlet 201 of the fan module 2 is arranged towards the heat pipe 3, and the heat radiating fin module 5 is arranged at a position corresponding to the heating element 6 on the top surface of the heat pipe 3.
Preferably, the heat radiation fin module 5 is fixed on the top surface of the heat pipe by welding.
In the heat dissipation assembly of the present embodiment, the heat dissipation fin module 5 is disposed at a position corresponding to the heating element 6 on the top surface of the heat pipe 3. Through the design, the fan module 2 can directly radiate the heat of the heating element 6 through the radiating fin module 5 in the process of blowing the heat pipe 3, so that the radiating effect of the heating element 6 is effectively improved, the working temperature of the heating element 6 is effectively controlled, and the heating element 6 can work normally.
Further, the projected area of the heat sink fin module 5 on the heat generating element 6 in the present embodiment is larger than the area of the heat generating element 6, specifically, the distance from the projected edge of the heat sink fin module 5 on the heat generating element 6 to the edge of the heat generating element 6 is not less than 3mm.
Through the design, the heat radiation fin module 5 can be ensured to completely cover the whole heating element 6, and the heat radiation effect of the heating element 6 is ensured.
Further, the heat radiation fin module 5 in this embodiment specifically includes a plurality of heat radiation fins 501 disposed adjacently, a distance between two adjacent heat radiation fins 501 is 1.5mm to 3mm, and a thickness of the heat radiation fins 501 is 0.1mm to 0.2mm.
It should be noted that, through the above design, the air flow resistance can be effectively reduced, and the heat dissipation fin module 5 is ensured to have enough heat dissipation area, so as to further improve the heat dissipation effect. In addition, the design can save the production cost.
Further, the heat dissipating fin 501 in this embodiment has a side panel extending along a length direction thereof, the side panel is located between a top surface of the heat dissipating fin 501 and a bottom surface of the heat dissipating fin 501, the side panel is provided with a plurality of heat dissipating through holes 5012, and the plurality of heat dissipating through holes 5012 are arranged at intervals along the length direction of the heat dissipating fin 501.
It should be noted that, by providing the heat dissipation through holes 5012 in the heat dissipation fins 501, the ventilation of the air flow is smooth, the resistance of the air flow is effectively reduced, and the heat dissipation utilization rate of the heat dissipation fins 501 is further improved. In addition, the design of the heat dissipating through holes 5012 is also beneficial to reduce the weight of the whole heat dissipating assembly.
Specifically, to ensure that the heat dissipation fins 501 have a sufficient heat dissipation area, the length of the heat dissipation through holes 5012 is greater than 2mm, and the total area of the plurality of heat dissipation through holes 5012 occupies not more than 40% of the surface area of the heat dissipation fins 501.
Further, the cross section of the heat dissipation fin 501 in the present embodiment is a C-shaped structure, and the heat dissipation fin 501 is provided with a heat dissipation channel 5011 along the axis direction thereof.
It should be noted that, through the above design, the air flow of blowing can pass through the heat dissipation channel 5011, so that the air resistance is effectively reduced, and meanwhile, the air flow can fully contact with the inner and outer surfaces of the heat dissipation fins 501, which is favorable for blowing to take away the heat on the heat dissipation fins 501, and effectively improves the heat dissipation effect.
Further, the heat dissipation channel 5011 in this embodiment is disposed in communication with the heat dissipation through hole 5012, and when the fan module 2 blows air, the blowing air flows out from the heat dissipation channel 5011 and the heat dissipation through hole 5012. It should be noted that, through the above design, when the heat dissipating fins 501 are in the air blowing area, the position of the heat dissipating fins (501) may be not limited, and the air flow of the air blowing may be smoothly blown out through the heat dissipating through holes 5012 and the heat dissipating channels 5012, so as to ensure the heat dissipating effect.
Further, the height of the heat radiation fins 501 in the present embodiment is not higher than 2mm.
It should be noted that, through the above design, the heat dissipation assembly in this embodiment can adapt to the design of the light and thin electronic device, so as to avoid occupying excessive thickness space of the electronic device.
Further, in this embodiment, the number of the fan modules 2 is two, the two fan modules 2 are respectively located at two opposite ends of the heat pipe 3, and the air outlets 201 of the two fan modules 2 are all disposed towards the heat pipe 3.
It should be noted that, through the above design, the strength of blowing and the area of blowing can be effectively increased, which is beneficial to improving the heat dissipation effect of the heating element 6.
Referring to fig. 1 to 5, an electronic device provided in an embodiment of the present invention specifically includes a motherboard 1, a heating element 6, and the above-mentioned heat dissipation assembly;
the heat dissipation assembly comprises a fan module 2, a heat pipe 3 and a heat conduction substrate 4 used for being in contact with the heating element 6;
The fan module 2, the heating element 6 and the heat conducting substrate 4 are all installed on the main board 1, the heat conducting substrate 4 is connected with the heat pipe 3, an air outlet 201 of the fan module 2 is arranged towards the heat pipe 3, and a heat radiation fin module 5 is arranged at a position, corresponding to the heating element 6, of the top surface of the heat pipe 3.
In addition, the heat radiation fin group 5, the heat pipe 3, and the heat conductive substrate 4 in the present embodiment are welded together and fixed to the main board 1 by means of screw fixation.
It should be noted that, in the electronic device of this embodiment, the heat dissipation fin module 5 is disposed at a position corresponding to the heating element 6 on the top surface of the heat pipe 3. Through the design, the fan module 2 can directly radiate the heat of the heating element 6 through the radiating fin module 5 in the process of blowing the heat pipe 3, so that the radiating effect of the heating element 6 is effectively improved, the working temperature of the heating element 6 is effectively controlled, and the heating element 6 can work normally.
Further, the heating element 6 of the electronic device in the present embodiment includes a CPU chip and a GPU chip; the heat conducting substrate 4 comprises a CPU heat conducting substrate used for being contacted with the CPU chip and a GPU heat conducting substrate used for being contacted with the GPU chip;
the CPU heat conducting substrate and the GPU heat conducting substrate are connected with the heat pipe 3;
the heat pipe 3 has a top surface corresponding to the CPU chip and a top surface corresponding to the GPU chip, and the heat pipe 3 has a heat sink fin module 5.
It should be noted that, through the above design, the heat dissipation can be directly performed on the CPU chip and the GPU chip through the heat dissipation fin module 5, so as to ensure that the CPU chip and the GPU chip maintain to work at a proper working temperature, and effectively solve the technical problem of life reduction caused by high temperature.
While the foregoing describes a heat dissipating device and an electronic apparatus provided by the present invention in detail, those skilled in the art will appreciate that the present invention is not limited to the specific embodiments and the application range according to the concepts of the embodiments of the present invention.
Claims (10)
1. A heat radiation assembly for radiating heat of a heating element (6), characterized by comprising a fan module (2), a heat pipe (3) and a heat conducting substrate (4) for contacting the heating element (6);
The heat conducting substrate (4) is connected with the heat pipe (3), an air outlet (201) of the fan module (2) is arranged towards the heat pipe (3), and a heat radiation fin module (5) is arranged at a position, corresponding to the heating element (6), of the top surface of the heat pipe (3).
2. The heat sink assembly according to claim 1, characterized in that the projected area of the heat sink fin module (5) on the heat generating element (6) is larger than the area of the heat generating element (6).
3. The heat sink assembly according to claim 1, wherein the heat sink fin module (5) comprises a plurality of adjacently arranged heat sink fins (501).
4. A heat dissipating assembly according to claim 3, wherein the heat dissipating fins (501) have side panels extending along a length direction thereof, the side panels being located between a top surface of the heat dissipating fins (501) and a bottom surface of the heat dissipating fins (501), the side panels being provided with a plurality of heat dissipating through holes (5012), the plurality of heat dissipating through holes (5012) being arranged at intervals along the length direction of the heat dissipating fins (501).
5. The heat dissipating assembly of claim 4, wherein the heat dissipating through holes (5012) have a length of greater than 2mm, and wherein a total area of the plurality of heat dissipating through holes (5012) is not greater than 40% of a surface area of the heat dissipating fins (501).
6. The heat dissipation assembly according to claim 4, wherein the cross section of the heat dissipation fins (501) is of a C-shaped structure, and the heat dissipation fins (501) are provided with heat dissipation channels (5011) along the axial direction thereof.
7. The heat dissipation assembly according to claim 6, wherein the heat dissipation channel (5011) is disposed in communication with the heat dissipation through hole (5012), and when the fan module (2) blows air, the blowing air flows out from the heat dissipation channel (5011) and the heat dissipation through hole (5012).
8. The heat dissipation assembly according to claim 1, wherein the number of the fan modules (2) is two, the two fan modules (2) are respectively located at two opposite ends of the heat pipe (3), and air outlets (201) of the two fan modules (2) are both arranged towards the heat pipe (3).
9. An electronic device, characterized by comprising a motherboard (1), a heating element (6) and a heat dissipating assembly according to any of claims 1 to 8;
The heat dissipation assembly comprises a fan module (2), a heat pipe (3) and a heat conduction substrate (4) used for being in contact with the heating element (6);
The fan module (2), the heating element (6) and the heat conduction base plate (4) are all installed on the mainboard (1), the heat conduction base plate (4) with heat pipe (3) are connected, air outlet (201) of fan module (2) are towards heat pipe (3) setting, the top surface of heat pipe (3) with the position that heating element (6) corresponds is provided with radiator fin module (5).
10. The electronic device according to claim 9, characterized in that the heating element (6) comprises a CPU chip and a GPU chip; the heat conducting substrate (4) comprises a CPU heat conducting substrate used for being contacted with the CPU chip and a GPU heat conducting substrate used for being contacted with the GPU chip;
the CPU heat conducting substrate and the GPU heat conducting substrate are connected with the heat pipe (3);
The heat pipe (3) is provided with the heat radiation fin module (5) at the position corresponding to the CPU chip and the position corresponding to the GPU chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410382434.6A CN118139381A (en) | 2024-03-29 | 2024-03-29 | Radiating assembly and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410382434.6A CN118139381A (en) | 2024-03-29 | 2024-03-29 | Radiating assembly and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN118139381A true CN118139381A (en) | 2024-06-04 |
Family
ID=91237705
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410382434.6A Pending CN118139381A (en) | 2024-03-29 | 2024-03-29 | Radiating assembly and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN118139381A (en) |
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2024
- 2024-03-29 CN CN202410382434.6A patent/CN118139381A/en active Pending
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