CN219202275U - Radiator module - Google Patents

Abstract

The application provides a radiator module, which comprises a radiator assembly, wherein the radiator assembly comprises a plurality of radiating fins which are arranged in a stacked manner, the radiator assembly is provided with a first air channel which penetrates through the radiating fins along a first direction, a second air channel which extends at least along a second direction is defined between two adjacent radiating fins, the first air channel is communicated with the second air channel, and the first direction is intersected with the second direction; the radiator module further comprises a cover plate, wherein the cover plate is arranged on one side of the radiating component and used for slowing down the trend of air flow discharged along the first direction directly through the first air duct. Through the mode, the air-avoiding design is carried out on the partial area of the radiating fins, the air quantity is increased, the flow resistance of the radiator is reduced, and the cover plate is further arranged to prevent the radiating assembly from leaking air.

Description

Radiator module

Technical Field

The application relates to the technical field of radiators, in particular to a radiator module.

Background

At present, many heat sinks applied to computer equipment adopt a combination structure of heat dissipation fins and heat pipes to dissipate heat of computer hardware. However, in order to improve the heat dissipation efficiency of the heat sink, most heat dissipation fins of the heat sink are designed into a complete plate structure, which has a larger area size, so that on one hand, the manufacturing cost is increased, and on the other hand, the weight of the whole heat sink is larger, and on the other hand, the wind resistance of the whole heat sink is larger, and the heat dissipation effect of the heat sink is adversely affected due to the temperature gradient between the heat dissipation fins arranged in a stacked manner.

Chinese patent CN215725361U discloses a high heat conductivity radiator, which comprises a plurality of heat dissipation fins stacked and arranged, and a plurality of heat pipe fins, wherein the plurality of heat pipe fins are arranged in parallel and are spliced with the plurality of heat dissipation fins, at least two groups of first heat dissipation holes for splicing the heat pipe fins are arranged on the heat dissipation fins, and a plurality of second heat dissipation holes are arranged between the two groups of first heat dissipation holes. The radiator lightens the dead weight of the radiator through the second radiating holes arranged on the radiating fins, and the ventilation and heat dissipation channels are formed in the middle of the radiating fins to improve the heat dissipation efficiency of the radiator, however, the air outlet of the ventilation and heat dissipation channels of the radiator is not sealed, so that the problem of air leakage can occur, and the original heat dissipation and circulation air channel in the chassis is affected.

How to solve the above-mentioned problems, it is needed to consider by those skilled in the art to provide a radiator module with low cost, good heat dissipation effect and no air leakage.

Disclosure of Invention

The embodiment of the application provides a radiator module, which comprises a radiator assembly, wherein the radiator assembly comprises a plurality of radiating fins which are arranged in a stacked mode, the radiator assembly is provided with a first air channel which penetrates through a plurality of the radiating fins along a first direction, a second air channel which extends at least along a second direction is defined between two adjacent radiating fins, the first air channel is communicated with the second air channel, and the first direction is intersected with the second direction; the radiator module further comprises a cover plate, the cover plate is arranged on one side of the radiating component, and the cover plate is used for slowing down the trend of air flow discharged in the first direction through the first air duct.

Further, the first direction is perpendicular to the second direction, and the first air duct is communicated with the second air duct of each layer.

Further, the first direction is set to be directed from the heated end of the heat dissipating component to the heat dissipating end of the heat dissipating component.

Further, the second direction is arranged to be directed from a windward side of the heat dissipating assembly to a leeward side of the heat dissipating assembly.

Further, the heat dissipation fins are provided with openings, and the first air duct is formed by the openings of the plurality of heat dissipation fins.

Further, at least one opening is formed in each heat dissipation fin, so that at least one first air channel is formed.

Further, a gap is arranged between two adjacent radiating fins so as to form the second air duct.

Further, the cover plate is arranged on one side of the heat dissipation assembly, which is close to the air outlet end of the first air duct, and the cover plate is arranged in parallel with the heat dissipation fins.

Further, the cover plate and the radiating fins have the same shape, and the cover plate covers one end, which is close to the cover plate and is away from the radiating assembly, of the radiating fins.

Further, the heat dissipation fins are provided with an open area and a non-open area, the opening is arranged in the non-open area, and the open area is provided with a plurality of perforations for the heat conduction pipe to pass through.

Compared with the prior art, the radiator module has the advantages that the openings are formed in the radiating fins, and the openings of the radiating fins jointly form the first air channel, so that partial air flow can sequentially flow through the radiating fins through the first air channel from one end, close to a heat source, of the radiator module, the air quantity is increased, and the flow resistance of the radiator module is reduced. In addition, the air outlet end cover of the first air channel is provided with a cover plate, so that air leakage can be avoided, air flow is prevented from being directly discharged from the air outlet end of the first air channel, more air flow flows through each radiating fin through the second air channel, and therefore the radiating efficiency of the whole radiator module is improved, and the utilization rate of wind power is also higher.

Drawings

Fig. 1 is a schematic structural diagram of a radiator module according to an embodiment of the disclosure.

Fig. 2 is a schematic diagram of the positions of a first air duct and a second air duct of the radiator module according to an embodiment of the present application.

Fig. 3 is an exploded view of a radiator module according to an embodiment of the present application.

Fig. 4 is a schematic structural diagram of a base assembly of the heat sink module in an embodiment of the present application.

Description of main reference numerals:

radiator module 100

First direction 1

Second direction 2

First air duct 3

Second air duct 4

Side air flow 5

Hot gas flow 6

Heat dissipation assembly 10

Cover plate 11

Receiving hole 110

Second bending structure 111

Radiating fin 12

Gap 13

Perforations 120

First bending structure 121

Raised structures 122

Opening 123

Open area 124

Non-perforated area 125

Base assembly 20

Substrate 21

Base body 22

Copper plate 23

Heat pipe 30

The following detailed description will further illustrate the application in conjunction with the above-described figures.

Detailed Description

The following description will refer to the accompanying drawings in order to more fully describe the present application. Exemplary embodiments of the present application are illustrated in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the exemplary embodiments set forth herein. These exemplary embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the application to those skilled in the art. Like reference numerals designate identical or similar components.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. Furthermore, as used herein, "comprises" and/or "comprising" and/or "having," integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, regions, integers, steps, operations, elements, and/or groups thereof.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. Furthermore, unless the context clearly defines otherwise, terms such as those defined in a general dictionary should be construed to have meanings consistent with their meanings in the relevant art and the present application, and should not be construed as idealized or overly formal meanings.

The following detailed description of specific embodiments of the present application refers to the accompanying drawings.

Referring to fig. 1 and 2, the radiator module 100 includes a radiator assembly 10, the radiator assembly 10 includes a plurality of stacked radiator fins 12, the radiator assembly 10 is provided with a first air channel 3 penetrating through the plurality of radiator fins 12 along a first direction 1, a second air channel 4 extending at least along a second direction 2 is defined between two adjacent radiator fins 12, the first air channel 3 is communicated with the second air channel 4, and the first direction 1 intersects with the second direction 2. The radiator module 100 further includes a cover plate 11, where the cover plate 11 is disposed on one side of the radiator assembly 10, and the cover plate 11 is used for reducing the tendency of the airflow to be directly discharged along the first direction 1 through the first air duct 3. The heat dissipation fins 12 have the same structure and are arranged in parallel, the heat dissipation assembly 10 is formed by stacking the heat dissipation fins 12 along a certain direction, and gaps 13 are arranged between two adjacent heat dissipation fins 12 for heat exchange with the heat dissipation fins 12 after lateral incoming wind arranged on the heat dissipation assembly 10 flows through the heat dissipation fins 12.

Referring to fig. 3 again, the heat dissipation fins 12 are provided with openings 123, and the openings 123 of the plurality of heat dissipation fins 12 form the first air channel 3. The first direction 1 is arranged to be directed from the heated end of the heat sink 10 to the heat dissipating end of the heat sink 10. In an embodiment, an opening 123 is formed on the single heat dissipating fin 12, and the opening 123 can form an air passage on the heat dissipating fin 12 passing through the heat dissipating fin 12, thereby reducing the flow resistance of the heat dissipating fin 12 and increasing the air quantity flowing through the heat dissipating fin 12. At the same time, the design of the openings 123 also reduces the amount of consumables of the fin 12, reduces the cost and reduces the weight of the device. The openings 123 of the heat dissipation fins 12 have the same shape and size, and the inner diameter of the first air duct 3 formed by the openings is kept unchanged along the first direction 1. The heat dissipation assembly 10 is used for dissipating heat of hardware such as a CPU, and one end of the heat dissipation assembly, which is close to the hardware such as the CPU, is set as a heat receiving end, and one end of the heat dissipation assembly, which is far away from the hardware such as the CPU, is set as a heat dissipation end. The first air duct 3 is arranged along the first direction 1, that is, the air inlet end of the first air duct 3 is opposite to the heat receiving end of the heat dissipation assembly 10. When a large amount of heat is accumulated at the heated end of the heat dissipation assembly 10, the temperature of the surrounding air flow is increased, and the high-temperature air flow has a tendency to flow towards the low-temperature air flow, so that the hot air flow 6 at the heated end of the heat dissipation assembly 10 flows from the first air duct 3 to the heat dissipation end of the heat dissipation assembly 10 along the first direction 1, the heat dissipation of hardware such as a CPU (Central processing Unit) can be accelerated, and the heat dissipation efficiency of the whole device is improved.

By arranging the openings 123 on the radiating fins 12 and forming the first air duct 3 together by the openings 123 of the radiating fins 12, partial air flow can sequentially flow through the radiating fins 12 from one end of the radiator module close to the heat source through the first air duct 3, so that the air quantity is increased, and the flow resistance of the radiator module is reduced.

Further, at least one opening 123 is formed in the single heat dissipation fin 12 to form at least one first air channel 3. As will be appreciated by those skilled in the art, the number of the openings 123 formed in the individual heat sink fins 12 may be two or three, and the number and size of the openings 123 may be designed according to practical needs, such as the surface area of the individual heat sink fins 12 and the size of the non-penetrating area of the individual heat sink fins 12.

In other embodiments, the openings 123 of the heat dissipation fins 12 have the same shape, but gradually decrease in size along the first direction 1, so that the formed first air duct 3 is a tapered air duct along the first direction 1, which can greatly increase the flow speed of the hot air flow 6 passing through the first air duct 3.

Referring to fig. 1 and 2 again, a gap 13 is disposed between two adjacent heat dissipation fins 12 to form a second air duct 4. The second direction 2 is arranged to be directed from the windward side of the heat sink 10 to the leeward side of the heat sink 10. In an embodiment, when the lateral wind of the heat dissipating component 10 blows toward the heat dissipating fins 12, the lateral wind passes through the second air duct 4 to exchange heat with the two heat dissipating fins 12 forming the second air duct 4, so as to take away the heat on the heat dissipating fins 12. The second direction 2 is a direction from the side to the heat radiation fins 12, which is parallel to the surface of the heat radiation fins 12.

Further, the first direction 1 is perpendicular to the second direction 2, and the first air duct 3 is communicated with the second air ducts 4 of each layer. In an embodiment, the first direction 1 is perpendicular to the heat dissipation fins 12, and the second direction 2 is parallel to the heat dissipation fins 12, so that the first air duct 3 and the second air duct 4 are disposed in a cross-shaped structure and are communicated with each other. When the hot air flow 6 flows along the first direction 1 through the first air duct 3, the lateral air flow 5 generated by the lateral incoming air flows along the second direction 2 through the second air duct 4, and when the lateral air flow 5 and the hot air flow 6 meet, a lateral thrust is generated, so that part of the hot air flow 6 enters the air outside the heat dissipation assembly 10 along with the flow of the lateral air flow 5 along the second direction 2, and the heat dissipation efficiency of the whole heat dissipation assembly 10 is reduced due to the fact that a large amount of hot air flow 6 gathers in the heat dissipation assembly 10 for too long time.

Referring to fig. 3 again, the heat dissipation fins 12 are provided with an open area 124 and a non-open area 125, the openings 123 are disposed in the non-open area 125, and the open area 124 is provided with a plurality of through holes 120 for the heat conduction tubes 30 to pass through. In an embodiment, two open areas 124 are provided and are disposed on two sides of the surface of the heat sink 12 along the length direction of the heat sink 12, and a non-open area 125 is disposed between the two open areas 124, so that the idle section between the two open areas 124 is designed to avoid air, and the dead weight of the whole heat sink 12 is reduced.

The perforated area 124 is provided with a plurality of perforations 120 through which the plurality of heat pipes 30 pass, and the heat pipes 30 are arranged in a "U" structure, and are in direct or indirect contact with hardware such as a CPU, so as to form a heat exchange channel. The two ends of the heat conducting pipe 30 pass through the through holes 120 arranged on the two open hole areas 124 and are inserted into the whole heat radiating assembly 10, so that the heat conducted by the heat conducting pipe 30 from hardware such as a CPU (Central processing Unit) is transferred to each heat radiating fin 12, and the heat on the heat radiating fins 12 is taken away by the lateral airflow 5 and then radiated to the heat radiating fins 12.

Further, a plurality of protruding structures 122 are disposed at one end of the heat sink fin 12 facing the first direction 1, and the plurality of protruding structures 122 are disposed at the plurality of through holes 120 respectively, and the through holes 120 penetrate through the protruding structures 122. The two long sides of the radiating fins 12 are bent towards one side away from the first direction 1 to form a first bending structure 121, and the heights of the first bending structure 121 and the protruding structure 122 are the same, so that each radiating fin 12 is more compact when stacked.

Referring to fig. 2 and fig. 3 again, the cover 11 is disposed on a side of the heat dissipation assembly 10 near the air outlet end of the first air duct 3, and the cover 11 is disposed parallel to the heat dissipation fins 12. In an embodiment, the cover plate 11 can prevent the hot air flow 6 entering the first air duct 3 from being directly discharged from the air outlet end of the first air duct 3 to the outside of the heat dissipation assembly 10, so that the hot air flow 6 flowing out of the first air duct 3 enters the second air duct 4 after being blocked by the cover plate 11, and is discharged from the heat dissipation assembly 10 through the second air duct 4, and no additional air duct is needed in the chassis to discharge the hot air flow 6 from the inside of the chassis to the outside of the chassis after the hot air flow 6 is directly discharged from the first air duct 3. Therefore, the arrangement of the cover plate 11 prevents the air duct inside the case from being damaged due to air leakage, thereby affecting the heat dissipation cycle inside the whole case, and prevents the hot air flow 6 from being retained inside the case and being unable to be rapidly discharged outside the case. Meanwhile, the hot air flow 6 flows to the cover plate 11 along the first direction 1, and the hot air flow 6 is diffused to the periphery in the second air duct 4 after being blocked by the cover plate 11, so that the lateral air flow 5 in the first air duct 3 forms turbulent flow, thereby enhancing the heat exchange between the lateral air flow 5 and the radiating fins 12 and improving the radiating efficiency of the radiating fins 12.

Referring to fig. 3 again, the cover 11 and the heat dissipation fins 12 have the same shape, and the cover 11 covers the end of the heat dissipation fins 12 close to the cover, which is far away from the heat dissipation assembly 10. In an embodiment, the cover 11 is provided with the receiving hole 110 for receiving the tail end of the heat pipe 30, the end face of the heat pipe 30 is flush with the end face of the cover 11 away from the heat dissipation fins 12, which improves the aesthetic property of the whole heat dissipation assembly 10, and the cover 11 is made of the same material as the heat dissipation fins 12, so that the tail end of the heat pipe 30 is in complete contact with the cover 11, and the cover 11 can rapidly dissipate heat from the tail end of the heat pipe 30.

Further, the two long sides of the cover plate 11 are bent towards one side away from the first direction 1 to form a second bent structure 111, and the height of the second bent structure 111 is the same as that of the protruding structure 122, so that the cover plate 11 directly abuts against the protruding structure 122 closest to the second bent structure, and the cover plate 11 can adopt the same process as that of the heat dissipation fins 12 when being connected with the heat dissipation fins 12, thereby simplifying the whole production process. Meanwhile, the cover plate 11 has the same shape as the radiator fins 12, and the plate of the cover plate 11 can be manufactured by the same process as that for manufacturing the plate of the radiator fins 12, except for the difference of the subsequent openings.

Referring to fig. 4, the heat sink module 100 further includes a base assembly 20. The base assembly 20 includes a base body 22, a base plate 21 and a copper plate 23, both of which are disposed parallel to the radiator fins 12, and a section of the heat pipe 30 near the base body 22 is sandwiched between the base plate 21 and the copper plate 23. The copper plate 23 is used for contacting with hardware such as a CPU, and the copper plate 23 transfers heat generated by the hardware such as the CPU to the heat conduction pipe 30, and the heat conduction pipe 30 transfers the heat to each heat radiation fin 12, and finally, the heat radiation fin 12 is radiated by a fan or the like.

Hereinabove, the specific embodiments of the present application are described with reference to the accompanying drawings. However, those of ordinary skill in the art will appreciate that various modifications and substitutions can be made to the specific embodiments of the present application without departing from the scope thereof. Such modifications and substitutions are intended to be within the scope of the present application.

Claims (10)

1. The radiator module comprises a radiator assembly, wherein the radiator assembly comprises a plurality of radiating fins which are arranged in a stacked mode, and is characterized in that a first air channel penetrating through a plurality of the radiating fins along a first direction is formed in the radiator assembly, a second air channel extending at least along a second direction is defined between two adjacent radiating fins, the first air channel is communicated with the second air channel, and the first direction is intersected with the second direction; the radiator module further comprises a cover plate, the cover plate is arranged on one side of the radiating component, and the cover plate is used for slowing down the trend of air flow discharged in the first direction through the first air duct.

2. The heat sink module of claim 1, wherein the first direction is perpendicular to the second direction, and the first air duct communicates with each layer of the second air duct.

3. The heat sink module of claim 1, wherein the first direction is disposed from a heated end of the heat sink assembly toward a heat dissipating end of the heat sink assembly.

4. The heat sink module of claim 1, wherein the second direction is disposed to be directed from a windward side of the heat sink assembly to a leeward side of the heat sink assembly.

5. The heat sink module of claim 1, wherein the heat sink fins are provided with openings, and wherein the openings of the plurality of heat sink fins form the first air channel.

6. The heat sink module of claim 5, wherein at least one opening is provided in a single fin to form at least one first air channel.

7. The heat sink module of claim 1, wherein a gap is provided between two adjacent heat fins to form the second air duct.

8. The heat sink module of claim 1, wherein the cover plate is disposed on a side of the heat sink assembly near the air outlet end of the first air duct, and the cover plate is disposed parallel to the heat sink fins.

9. The heat sink module of claim 8, wherein the cover plate has the same shape as the heat sink fins, and the cover plate covers the end of the heat sink fins close to the cover plate, which is away from the heat sink assembly.

10. The heat sink module of claim 5, wherein the heat sink fins are provided with an open area and a non-open area, the opening is disposed in the non-open area, and the open area is provided with a plurality of perforations for the heat pipe to pass through.

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