CN220603945U - Efficient heat dissipation module - Google Patents
Efficient heat dissipation module Download PDFInfo
- Publication number
- CN220603945U CN220603945U CN202322090583.9U CN202322090583U CN220603945U CN 220603945 U CN220603945 U CN 220603945U CN 202322090583 U CN202322090583 U CN 202322090583U CN 220603945 U CN220603945 U CN 220603945U
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- Prior art keywords
- heat dissipation
- heat
- dissipation module
- module
- shell
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 86
- 230000002457 bidirectional effect Effects 0.000 claims abstract description 5
- 230000005855 radiation Effects 0.000 claims description 23
- 230000000694 effects Effects 0.000 abstract description 5
- 239000000919 ceramic Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Abstract
The utility model relates to the technical field of heat dissipation equipment, in particular to a high-efficiency heat dissipation module, which comprises a heat conduction plate and a shell, wherein mounting holes are formed in two sides of the shell, fans are arranged in the mounting holes, and a heat dissipation assembly matched with the fans is arranged on the heat conduction plate; the first heat dissipation module and the second heat dissipation module are respectively matched with fans on two sides of the shell to form a double air channel, the first heat dissipation module and the second heat dissipation module are respectively matched with fans on two sides of the shell to form front and back air inlets, so that the first heat dissipation module and the second heat dissipation module respectively dissipate heat of half area of the heat conduction plate, the forced convection effect of air inlet quantity is increased in a limited space to increase the heat dissipation effect, the air channel airflow directions of the heat dissipation fins of the first heat dissipation module and the heat dissipation fins of the second heat dissipation module are staggered to form a bidirectional air channel, and the phenomenon of turbulence caused by mutual noninterference of air flow and air outlet is avoided.
Description
Technical Field
The utility model relates to the technical field of heat dissipation equipment, in particular to a high-efficiency heat dissipation module.
Background
Display cards, also known as display adapters, are one of the most basic and important components of computers. Because the display card can generate a large amount of heat in the operation process, a radiator is required to be adopted for radiating the display card in order to ensure the normal operation of the display card.
The existing display card heat dissipation structure generally adopts a heat conduction plate to be in contact with a heating element, and heat dissipation fins are arranged on the heat conduction plate so as to increase the heat dissipation area;
as disclosed in chinese patent publication No. CN217718629U, a "heat radiator assembly for a display card" is disclosed, which absorbs heat energy generated on a main board of the display card through heat radiating fins, and guides the heat energy to the heat radiating fins, and a built-in heat radiating fan is started to accelerate air flow in the ceramic heat radiating plate, so that hot air on the heat radiating fins is discharged from two sides of an air duct, heat radiation of the ceramic heat radiating plate is directly accelerated, and heat radiation efficiency is improved.
Disclosure of Invention
The utility model aims to solve the defects in the prior art and provides a high-efficiency heat dissipation module.
In order to achieve the above purpose, the present utility model adopts the following technical scheme:
the high-efficiency heat radiation module comprises a heat conduction plate and a shell, wherein mounting holes are formed in two sides of the shell, fans are arranged in the mounting holes, the shell is fixedly connected with the heat conduction plate, and a heat radiation assembly matched with the fans is arranged on the heat conduction plate;
the heat dissipation assembly comprises a first heat dissipation module and a second heat dissipation module, the first heat dissipation module and the second heat dissipation module are respectively matched with fans on two sides of the shell to form a double air channel, and a heat dissipation opening matched with the first heat dissipation module and the second heat dissipation module is formed in the shell.
Further, the first heat dissipation module and the second heat dissipation module each comprise a plurality of heat dissipation fins which are obliquely arranged.
Further, the air flow directions of the air channels of the first heat radiation module heat radiation fins and the second heat radiation module heat radiation fins are staggered, so that a bidirectional air channel is formed.
Furthermore, inclined planes are arranged on two sides of the radiating fins, and the cross sections of the radiating fins are in trapezoid structures.
Further, the heat dissipation fins and the heat conduction plate are of an integrated structure.
Furthermore, a groove is formed in the bottom of the heat conducting plate, and a heat pipe is fixedly arranged in the groove.
The efficient heat radiation module provided by the utility model has the beneficial effects that:
in the utility model, the first heat radiation module and the second heat radiation module are respectively matched with the fans at the two sides of the shell to form front and back air inlet, so that the first heat radiation module and the second heat radiation module respectively radiate half area of the heat conduction plate, and the forced convection effect of air is enhanced by increasing the air inlet quantity in a limited space so as to increase the heat radiation effect;
in the utility model, the air flow directions of the air channels of the first heat radiation module heat radiation fins and the second heat radiation module heat radiation fins are staggered to form a bidirectional air channel, so that the air flows are not mutually interfered, and the turbulence phenomenon is avoided.
Drawings
Fig. 1 is a schematic structural diagram of a high-efficiency heat dissipation module according to the present utility model;
fig. 2 is a schematic structural diagram of a heat sink fin according to the present utility model;
FIG. 3 is a schematic view of the structure of the heat-conducting plate of the present utility model.
In the figure: 1. a heat conductive plate; 11. a groove; 2. a housing; 3. a mounting hole; 4. a fan; 5. a heat dissipation assembly; 51. a first heat dissipation module; 52. a second heat dissipation module; 53. a heat radiation fin; 531. an inclined plane; 6. and a heat radiation port.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.
Referring to fig. 1-3, a high-efficiency heat radiation module comprises a heat conduction plate 1 and a shell 2, wherein mounting holes 3 are formed in two sides of the shell 2, fans 4 are arranged in the mounting holes 3, the shell 2 is fixedly connected with the heat conduction plate 1, and a heat radiation component 5 matched with the fans 4 is arranged on the heat conduction plate 1;
the heat dissipation assembly 5 comprises a first heat dissipation module 51 and a second heat dissipation module 52, the first heat dissipation module 51 and the second heat dissipation module 52 are respectively matched with the fans 4 on two sides of the shell 2 to form a double air channel, and the shell 2 is provided with a heat dissipation opening 6 matched with the first heat dissipation module 51 and the second heat dissipation module 52.
In the present utility model, in order to increase the heat dissipation efficiency of the heat dissipation module, the heat conduction plate 1 is provided with the first heat dissipation module 51 and the second heat dissipation module 52 respectively matched with the fans 4 at two sides of the housing 2, so as to dissipate heat of half area of the heat conduction plate 1, and increase the air intake quantity in a limited space to enhance the forced convection effect of air, so as to increase the airflow velocity and the heat dissipation effect, in this embodiment, the heat conduction plate 1 is attached to the heat-generating part of the electronic product such as the display card, in this embodiment, the fans 4 are axial fans, and the housing 2 and the heat conduction plate 1 are made of metal materials.
Further, in the present embodiment, the first heat dissipation module 51 and the second heat dissipation module 52 each include a plurality of heat dissipation fins 53 disposed in an inclined manner, the heat dissipation fins 53 are disposed in an inclined manner, so that the heat dissipation area can be increased, the airflow direction can be changed, the mutual interference can be prevented, the turbulence phenomenon can be avoided, and the heat dissipation fins 53 and the heat conduction plate 1 are made of the same metal material.
Further, in the present embodiment, the air flow directions of the air channels of the heat dissipation fins 53 of the first heat dissipation module 51 and the heat dissipation fins 53 of the second heat dissipation module 52 are staggered, so as to form a bidirectional air channel.
In another embodiment, the two sides of the heat dissipation fins 53 are respectively provided with an inclined plane 531, the cross section of the heat dissipation fins 53 is in a trapezoid structure, and when the fan blows, the heat dissipation fins 53 and the heat conduction plate 1 are taken away by the inclined planes guided to the air channel between the two heat dissipation fins 53 and discharged along the heat dissipation opening 6.
In this embodiment, the heat dissipation fins 53 and the heat conduction plate 1 are integrally formed, so that the heat conduction efficiency between the heat conduction plate 1 and the heat dissipation fins 53 is higher, and the heat dissipation efficiency is improved.
In more detail, in some embodiments, the bottom of the heat conducting plate 1 is provided with a groove 11, and a heat pipe is fixedly arranged in the groove 11, and the heat pipe is preferably in a flat structure and is attached to the heat generating chip, so that the heat dissipation efficiency is further improved.
The working mode is as follows; when the heat conducting plate 1 is in operation, the heat conducting plate is attached to the PCB of the display card to absorb heat and conduct the heat to the radiating fins 53, the fan 4 blows air to the radiating fins 53, the air flow contacts one side of the radiating fins 53 and the inclined plane 531 and is guided to the air channel between the two radiating fins 53 to be finally discharged along the radiating ports 6, the heat of the radiating fins 53 and the heat conducting plate 1 is taken away in the process, in some embodiments, the bottom of the heat conducting plate 1 is provided with the groove 11, the heat pipe is fixedly arranged in the groove 11, and the heat pipe is attached to the chip which generates heat, so that the heat conducting efficiency is improved.
The foregoing is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical scheme of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.
Claims (6)
1. The efficient heat radiation module comprises a heat conduction plate (1) and a shell (2), and is characterized in that mounting holes (3) are formed in two sides of the shell (2), fans (4) are arranged in the mounting holes (3), the shell (2) is fixedly connected with the heat conduction plate (1), and a heat radiation assembly (5) matched with the fans (4) is arranged on the heat conduction plate (1);
the heat dissipation assembly (5) comprises a first heat dissipation module (51) and a second heat dissipation module (52), the first heat dissipation module (51) and the second heat dissipation module (52) are respectively matched with fans (4) on two sides of the shell (2) to form a double air channel, and a heat dissipation opening (6) matched with the first heat dissipation module (51) and the second heat dissipation module (52) is formed in the shell (2).
2. The efficient heat dissipation module as defined in claim 1, wherein: the first heat dissipation module (51) and the second heat dissipation module (52) comprise a plurality of heat dissipation fins (53) which are obliquely arranged.
3. The efficient heat dissipation module as defined in claim 2, wherein: the air flow directions of the air channels of the radiating fins (53) of the first radiating module (51) and the radiating fins (53) of the second radiating module (52) are staggered, so that a bidirectional air channel is formed.
4. The efficient heat dissipation module as defined in claim 2, wherein: inclined planes (531) are arranged on two sides of the radiating fins (53), and the cross section of each radiating fin (53) is of a trapezoid structure.
5. The efficient heat dissipation module as defined in claim 4, wherein: the radiating fins (53) and the heat conducting plate (1) are of an integrated structure.
6. The efficient heat dissipation module as defined in claim 5, wherein: the bottom of the heat conducting plate (1) is provided with a groove (11), and a heat pipe is fixedly arranged in the groove (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322090583.9U CN220603945U (en) | 2023-08-04 | 2023-08-04 | Efficient heat dissipation module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322090583.9U CN220603945U (en) | 2023-08-04 | 2023-08-04 | Efficient heat dissipation module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220603945U true CN220603945U (en) | 2024-03-15 |
Family
ID=90172866
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322090583.9U Active CN220603945U (en) | 2023-08-04 | 2023-08-04 | Efficient heat dissipation module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220603945U (en) |
-
2023
- 2023-08-04 CN CN202322090583.9U patent/CN220603945U/en active Active
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