CN218896340U - Liquid cooling heat radiation structure of server - Google Patents
Liquid cooling heat radiation structure of server Download PDFInfo
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- CN218896340U CN218896340U CN202223596983.9U CN202223596983U CN218896340U CN 218896340 U CN218896340 U CN 218896340U CN 202223596983 U CN202223596983 U CN 202223596983U CN 218896340 U CN218896340 U CN 218896340U
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- server
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- liquid cooling
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- 238000001816 cooling Methods 0.000 title claims abstract description 70
- 239000007788 liquid Substances 0.000 title claims abstract description 41
- 230000005855 radiation Effects 0.000 title claims description 11
- 230000017525 heat dissipation Effects 0.000 claims abstract description 77
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 49
- 239000011229 interlayer Substances 0.000 claims abstract description 20
- 239000010410 layer Substances 0.000 claims description 5
- 238000012545 processing Methods 0.000 abstract description 4
- 239000012530 fluid Substances 0.000 description 7
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
The utility model discloses a server liquid cooling heat dissipation structure, which belongs to the technical field of server heat dissipation and comprises a server shell, a server upper cover arranged at the upper part of the server shell and a water cooling plate capable of being attached and installed on a CPU (central processing unit), wherein the server upper cover is of a sandwich structure, a heat dissipation pipeline is arranged in a sandwich space of the server upper cover, one end of the heat dissipation pipeline is connected with a water pump, and the other end of the heat dissipation pipeline and the water pump are respectively connected with the water cooling plate; the cooling fan module can blow and dissipate heat on the upper surface and the lower surface of the upper cover of the server. The heat dissipation pipeline arranged in the interlayer space of the upper cover of the server replaces a heat dissipation row with a larger volume, so that the internal space of the server can be effectively saved, more external plug-in cards are supported, the expandability of the inside of the server is improved, the heat dissipation is efficient, reliable, stable and balanced, the running reliability of the system is effectively improved, the wind resistance is reduced, and the power consumption of the heat dissipation fan module is saved.
Description
Technical Field
The utility model belongs to the technical field of server heat dissipation, and particularly relates to a server liquid cooling heat dissipation structure.
Background
The server CPU is also called a central processing unit, and is an operation core and a control core of a server. Is the electronic circuitry of the server that executes instructions of the server program by performing specified basic arithmetic, logic, control, and input and output operations. In short, the CPU is equivalent to the heart of the server, the capacity of the CPU directly influences the running speed of the whole server, and most programs need to be operated by the CPU. The main functions of the CPU are as follows: processing instructions, performing operations, controlling time, and processing data. With the continuous improvement of the CPU performance of the server, the running power of the CPU is continuously increased, the heat dissipation requirement of the server cannot be met by a single air-cooled heat dissipation system, and the heat dissipation system is developing towards water-cooled heat dissipation, liquid-cooled heat dissipation and air-cooled water-cooled mixed heat dissipation.
In the water cooling mode for the server, the water cooling module mainly comprises a water cooling plate (cold plate), a water Pump (Pump), a heat radiation row (Radiator) and a Fan (Fan), wherein the operation mode is that a CPU chip is in contact with the water cooling plate, heat generated by the CPU chip and working fluid are subjected to heat exchange, the water Pump pushes the heated working fluid to enter the heat radiation row, a large-area heat radiation fin is arranged in the heat radiation row, the working fluid is cooled by the Fan, and the working fluid flows back to the water cooling plate to form a heat radiation cycle.
For the above conventional water cooling heat dissipation manner of the server, there are the following drawbacks: in order to ensure reliable heat dissipation performance, the heat dissipation row is large in volume design, occupies a large space in the server, can influence the arrangement of components in the server, and is poor in machine extensibility; the heat dissipation exhaust impedance is overlarge, so that the system wind flow is influenced, and the power consumption of the fan is increased; the liquid cooling pipeline layout is complicated.
Disclosure of Invention
In order to solve the problems, the utility model provides a liquid cooling heat dissipation structure of a server, which can effectively save the internal space of the server, support more external plug-in cards, improve the expandability of the inside of the server, effectively improve the running reliability of a system, reduce wind resistance and save the power consumption of a cooling fan module by using heat dissipation pipelines distributed in the interlayer space of the upper cover of the server to replace a larger heat dissipation row.
The utility model is realized by the following technical scheme:
the server liquid cooling heat dissipation structure comprises a server shell, a server upper cover arranged at the upper part of the server shell and a water cooling plate capable of being attached to a CPU, wherein the server upper cover is of a sandwich structure, a heat dissipation pipeline is arranged in a sandwich space of the server upper cover, one end of the heat dissipation pipeline is connected with a water pump, and the other end of the heat dissipation pipeline and the water pump are respectively connected with the water cooling plate; the cooling fan module can blow and dissipate heat on the upper surface and the lower surface of the upper cover of the server.
The utility model further improves that the heat dissipation pipeline is circularly distributed in an S shape.
The utility model further improves that the heat dissipation pipeline is attached to the upper wall and the lower wall in the interlayer space of the upper cover of the server.
The utility model further improves that the section of the radiating pipe is of a rectangular structure.
The utility model further improves that the water pump is arranged in the interlayer space of the upper cover of the server.
The utility model further improves that the heat dissipation pipeline and the water pump are respectively connected with the water cooling plate through the liquid outlet connecting pipe and the liquid inlet connecting pipe.
The utility model further improves that a window through which the liquid outlet connecting pipe and the liquid inlet connecting pipe can pass is arranged on the lower wall of the interlayer space of the upper cover of the server.
The utility model further improves that a cover plate corresponding to the window is arranged on the upper wall of the interlayer space of the upper cover of the server.
In addition, the utility model further improves that the radiating fan module is arranged at one end of the server shell and the height of the radiating fan module is higher than that of the upper cover of the server.
The utility model further improves that the end of the upper cover of the server, which is close to the cooling fan module, is provided with a > -shaped air deflector.
From the technical scheme, the beneficial effects of the utility model are as follows:
the liquid cooling circulation loop of the server is formed through the water cooling plate, the heat dissipation pipeline and the water pump, working fluid in the water cooling plate absorbs heat generated by the CPU, circulation power is provided through the water pump, the heat dissipation pipeline is laid in the interlayer space of the upper cover of the server, the upper wall and the lower wall of the upper cover of the server are blown to dissipate heat through the heat dissipation fan module, and efficient heat exchange of the heat dissipation pipeline is guaranteed. The heat dissipation pipeline arranged in the interlayer space of the upper cover of the server replaces a heat dissipation row with a larger volume, so that the internal space of the server can be effectively saved, more external plug-in cards are supported, the expandability of the inside of the server is improved, the heat dissipation is efficient, reliable, stable and balanced, the running reliability of the system is effectively improved, the wind resistance is reduced, and the power consumption of the heat dissipation fan module is saved. The whole structure is simple, the realization is easy, and the practicality is good.
Drawings
In order to more clearly illustrate the technical solutions of the present utility model, the drawings that are needed in the description will be briefly introduced below, it being obvious that the drawings in the following description are only some embodiments of the present utility model, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of an embodiment of the present utility model.
Fig. 2 is a schematic diagram of a heat dissipation pipeline layout according to an embodiment of the utility model.
Fig. 3 is a schematic view illustrating a use state of an embodiment of the present utility model.
In the accompanying drawings: 1. the server comprises a server shell, 2, a server upper cover, 21, a cover plate, 22, a window, 3, a heat dissipation pipeline, 31, a liquid outlet connecting pipe, 32, a liquid inlet connecting pipe, 33, a water pump, 34, a water cooling plate, 4, a heat dissipation fan module, 5 and an air deflector.
Detailed Description
In order to make the objects, features and advantages of the present utility model more obvious and understandable, the technical solutions of the present utility model will be clearly and completely described below with reference to the drawings in this specific embodiment, and it is apparent that the embodiments described below are only some embodiments of the present utility model, but not all embodiments of the present utility model. All other embodiments, based on the embodiments in this patent, which would be within the purview of one of ordinary skill in the art without the particular effort to make the utility model are intended to be within the scope of the patent protection.
As shown in fig. 1-3, the utility model discloses a server liquid cooling heat dissipation structure, which comprises a server shell 1, a server upper cover 2 arranged at the upper part of the server shell 1, and a water cooling plate 34 capable of being attached and installed on a CPU (installed in the server shell 1), wherein the server upper cover 2 is of a sandwich structure, a heat dissipation pipeline 3 is arranged in a sandwich space of the server upper cover 2, one end of the heat dissipation pipeline 3 is connected with a water pump 33, and the other end of the heat dissipation pipeline 3 and the water pump 33 are respectively connected with the water cooling plate 34; the server also comprises a cooling fan module 4 which can blow and dissipate heat on the upper surface and the lower surface of the server upper cover 2.
The liquid cooling circulation loop of the server is formed through the water cooling plate 34, the heat dissipation pipeline 3 and the water pump 33, the working fluid in the water cooling plate 34 absorbs heat generated by the CPU, circulating power is provided through the water pump 33, the heat dissipation pipeline 3 is paved in the interlayer space of the upper cover 2 of the server, and the upper wall and the lower wall of the upper cover 2 of the server are blown to dissipate heat through the heat dissipation fan module 4, so that efficient heat exchange of the heat dissipation pipeline 3 is ensured. The heat dissipation pipeline 3 distributed in the interlayer space of the upper cover 2 of the server replaces a heat dissipation row with a larger volume, so that the internal space of the server can be effectively saved, more external plug-in cards are supported, the expandability of the inside of the server is improved, the heat dissipation is efficient, reliable, stable and balanced, the running reliability of the system is effectively improved, the wind resistance is reduced, and the power consumption of the heat dissipation fan module 4 is saved. The whole structure is simple, the realization is easy, and the practicality is good.
As shown in fig. 2, in order to improve the bonding area between the heat dissipation pipeline 3 and the upper and lower walls of the interlayer space of the server upper cover 2, the heat dissipation pipeline 3 is guaranteed to dissipate heat efficiently, so that the design volume and wind resistance are smaller, the heat dissipation pipeline 3 is bonded to the upper and lower walls of the interlayer space of the server upper cover 2, the heat dissipation pipeline 3 is circularly arranged in an S shape, and the section of the heat dissipation pipeline 3 is in a rectangular structure.
The water pump 33 is disposed in the interlayer space of the server upper cover 2, and is disposed at the end toward which the cooling air flows. The water pump 33 is effectively prevented from blocking the heat dissipation air flow, and the air resistance is reduced, so that the power consumption of the heat dissipation fan module 4 is reduced.
Wherein, the heat dissipation pipeline 3 and the water pump 33 are respectively connected with the water cooling plate 34 through the liquid outlet connecting pipe 31 and the liquid inlet connecting pipe 32. The liquid outlet connecting pipe 31 and the liquid inlet connecting pipe 32 are respectively connected with the water cooling plate 34 through quick connectors. The lower wall of the interlayer space of the upper cover 2 of the server is provided with a window 22 through which the liquid outlet connecting pipe 31 and the liquid inlet connecting pipe 32 can pass. The liquid outlet connecting pipe 31 and the liquid inlet connecting pipe 32 are led out downwards through the window 22 and are connected with the water cooling plate 34 through the quick connector, so that the convenient disassembly and assembly of the heat dissipation pipeline 3 and the water pump 33 and the water cooling plate 34 respectively are ensured, and the convenience of assembly and maintenance is improved.
Wherein, the upper wall of the interlayer space of the server upper cover 2 is provided with a cover plate 21 corresponding to the window 22. The liquid outlet connecting pipe 31 and the liquid inlet connecting pipe 32 are respectively and conveniently assembled and disassembled with the water cooling plate 34 through the detachable cover plate 21, so that convenience in assembly and maintenance is realized.
As shown in fig. 3, the cooling fan module 4 is disposed at one end of the server housing 1, and has a height higher than that of the server top cover 2. When the server is installed, a gap is reserved between the server upper cover 2 of the next layer and the server shell 1 of the last layer, and when the cooling fan module 4 blows and dissipates heat, the upper wall and the lower wall of the server upper cover 2 can be respectively blown and dissipates heat, heat is carried away by the cooling pipeline 3 quickly, and the efficient cooling effect is guaranteed.
Wherein, the end of the upper cover 2 close to the cooling fan module 4 is provided with a > -shaped air deflector 5. The air flow blown out by the cooling fan module 4 is guided through the air deflector 5, so that the resistance of the server upper cover 2 to the cooling air flow due to the thickness of the server upper cover is greatly reduced, the efficient cooling is ensured, and the power consumption of the cooling fan module 4 is reduced.
This server liquid cooling heat radiation structure forms the liquid cooling circulation loop of server through water-cooling plate 34, cooling pipeline 3 and water pump 33, and the working fluid in the water-cooling plate 34 absorbs the heat of CPU output, provides circulating power through water pump 33, and cooling pipeline 3 lays in the intermediate layer space of server upper cover 2, and through cooling fan module 4 to the upper and lower wall blast heat dissipation of server upper cover 2, guarantees the high-efficient heat transfer to cooling pipeline 3. The heat dissipation pipeline 3 distributed in the interlayer space of the upper cover 2 of the server replaces a heat dissipation row with a larger volume, so that the internal space of the server can be effectively saved, more external plug-in cards are supported, the expandability of the inside of the server is improved, the heat dissipation is efficient, reliable, stable and balanced, the running reliability of the system is effectively improved, the wind resistance is reduced, and the power consumption of the heat dissipation fan module 4 is saved. The whole structure is simple, the realization is easy, and the practicality is good.
In the present specification, each embodiment is described in a progressive manner, and each embodiment focuses on the difference from other embodiments, and the same and similar parts between the embodiments are only required to be referred to each other.
The terms "upper", "lower", "outside", "inside", and the like in the description and in the claims of the present utility model and in the above drawings, if any, are used for distinguishing between relative relationships in position and not necessarily for giving qualitative sense. It is to be understood that the data so used may be interchanged where appropriate such that the embodiments of the utility model described herein may be implemented in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprise" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present utility model. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the utility model. Thus, the present utility model is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. The utility model provides a server liquid cooling heat radiation structure, including server casing (1), set up server upper cover (2) and can attach the water-cooling board (34) of installing on CPU in server casing (1) upper portion, its characterized in that, server upper cover (2) are the intermediate layer formula structure, have laid radiating pipeline (3) in its intermediate layer space, radiating pipeline (3) one end is connected with water pump (33), radiating pipeline (3) other end and water pump (33) are connected with water-cooling board (34) respectively; the server also comprises a cooling fan module (4) which can blow and dissipate heat on the upper surface and the lower surface of the server upper cover (2).
2. The server liquid cooling heat dissipation structure according to claim 1, wherein the heat dissipation pipeline (3) is circularly arranged in an S shape.
3. The server liquid cooling heat dissipation structure according to claim 1, wherein the heat dissipation pipeline (3) is attached to the upper and lower walls in the interlayer space of the server upper cover (2).
4. A server liquid-cooled heat sink according to claim 3, characterized in that the heat dissipation pipe (3) has a rectangular cross-section.
5. The server liquid cooling heat dissipation structure according to claim 1, wherein the water pump (33) is disposed in the interlayer space of the server upper cover (2).
6. The server liquid cooling heat radiation structure according to claim 1, characterized in that the heat radiation pipeline (3) and the water pump (33) are connected with the water cooling plate (34) through the liquid outlet connecting pipe (31) and the liquid inlet connecting pipe (32), respectively.
7. The server liquid cooling heat dissipation structure according to claim 6, wherein a window (22) through which the liquid outlet connecting pipe (31) and the liquid inlet connecting pipe (32) can pass is formed in the lower wall of the interlayer space of the server upper cover (2).
8. The server liquid cooling heat dissipating structure according to claim 7, wherein a cover plate (21) corresponding to the window (22) is installed on an upper wall of the interlayer space of the server upper cover (2).
9. The server liquid cooling structure according to claim 1, wherein the cooling fan module (4) is disposed at one end of the server housing (1) and has a height higher than that of the server upper cover (2).
10. The server liquid cooling heat dissipation structure according to claim 1, wherein a ">" shaped air deflector (5) is provided at one end of the server upper cover (2) close to the heat dissipation fan module (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223596983.9U CN218896340U (en) | 2022-12-30 | 2022-12-30 | Liquid cooling heat radiation structure of server |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223596983.9U CN218896340U (en) | 2022-12-30 | 2022-12-30 | Liquid cooling heat radiation structure of server |
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| Publication Number | Publication Date |
|---|---|
| CN218896340U true CN218896340U (en) | 2023-04-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223596983.9U Active CN218896340U (en) | 2022-12-30 | 2022-12-30 | Liquid cooling heat radiation structure of server |
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| CN (1) | CN218896340U (en) |
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- 2022-12-30 CN CN202223596983.9U patent/CN218896340U/en active Active
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