CN101266512A - Integral type recirculated water cooling and radiation device suitable for computer interface card chip - Google Patents
Integral type recirculated water cooling and radiation device suitable for computer interface card chip Download PDFInfo
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- CN101266512A CN101266512A CNA2007101359670A CN200710135967A CN101266512A CN 101266512 A CN101266512 A CN 101266512A CN A2007101359670 A CNA2007101359670 A CN A2007101359670A CN 200710135967 A CN200710135967 A CN 200710135967A CN 101266512 A CN101266512 A CN 101266512A
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- cooling
- water
- interface card
- computer interface
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Abstract
The invention is an integration circulating water cooling heat radiating device suitable for computer interface card chip, which is contacted with the processor chip as well as internal memory chip for executing heat radiation to these chips. The heat radiating device includes a heat radiation base, a circulating pump, at least a water cooling heat converter and a heat radiating fun, wherein, the heat radiation base is filled with a cooling liquid, which circularly flows through the water cooling heat converter for executing heat radiation, and the circulating pump and the water cooling heat converter are install on the heat radiation substrate in non pipeline manner, which can avoid the problem of short circuit burning out of chip or other electronic elements caused by water-cooling liquid overflow which is caused by aging and rupturing of conventional rubber or plastic pipe.
Description
Technical field
The present invention refers to a kind of integral type recirculated water cooling and radiation device that is applicable to computer interface card (InterfaceCard) chip especially relevant for a kind of heat abstractor.
Background technology
Along with constantly development of computer industry, central processing unit chip on the computer interface card or graphic process unit chip or the like improve constantly computing clock pulse and number of transistors and make its operation efficiency become stronger day by day, but thing followed problem is high power consumption and high heating power that high number of transistors and high computing clock pulse are caused, therefore, numerous manufacturer computers are released heat sink conception miscellaneous, in the hope of effectively suppressing the operational temperature of chip on the computer interface card, keep it can long-play and be unlikely to overheating failure or burn.
The being seen heat sink conception in market is nothing more than being air-cooled type heat abstractor and water-cooled power converter etc. at present, wherein the air-cooled type heat abstractor is formed with plural fin mostly on a heat dissipation metal piece that contacts with chip, and with a radiator fan to fin air inlet dispel the heat.
Then possessing as for water-cooling type radiator has the heat dissipation metal piece, this radiating block is with an external a gang of Pu of pipeline and a water-cooled fins group, by the group Pu between radiating block and water-cooled fins group the current in the circulation line to reach the water-cooled effect, with regard to usefulness, the heat dissipation of water-cooled power converter is better than the ventilation type heat abstractor, yet water-cooled power converter but has following shortcoming:
1. pipeline bends and configuration though make things convenient for mostly with elastoplast or rubber manufacturing, yet easily because of high temperature ageing, pipeline after aging then can chap, cause water flow inside to overflow, make computer interface card or other electron component short circuit and burn, what is more initiation fire.
2. no matter water-cooled fins group and group Pu are arranged in the host computer casing or are outside, all can take considerable space, in addition, the water-cooled fins group is to be connected with radiating block by pipeline but not directly to be fixed on the chip with the group Pu, therefore the user must additionally take a lot of trouble, be located on the computer chassis internal backplane these elements are glutinous in the illusive glutinous mode of establishing, perhaps be fixed in outside desktop or ground, installation process very bothers.
3. length of pipeline is considerable, except taking up space, squeeze interference mutually with the interface card and the signal winding displacement of computer chassis inside, and seriously disturb the cross-ventilation in the computer chassis, cause the system fan in its casing, descend as the operational paradigm of supply fan with the fan of giving vent to anger.
The inventor improves its not enough and disappearance, and then creates a kind of integral type recirculated water cooling and radiation device that is applicable to computer interface card chip according to having the factor that there is every shortcoming in chip heat radiator now.
Summary of the invention
Fundamental purpose of the present invention is to provide a kind of integral type recirculated water cooling and radiation device that is applicable to computer interface card (Interface Card) chip, this heat abstractor is circulation group Pu and fins group directly are installed on the cooling base and save the plastics or the rubber pipeline of easy breakage, increases safety in utilization thus.
For reaching above-mentioned purpose, the integral type recirculated water cooling and radiation device of computer interface card chip that is applicable to of the present invention includes:
One cooling base is in order to contact chip on the computer interface card to carry out heat conduction, to be filled with a liquid coolant in the cooling base;
One circulation group Pu is to be installed on the cooling base with no pipelined fashion, is connected and is connected with cooling base, bootable coolant flow;
At least one water-cooled heat exchanger is installed on this cooling base, is connected and is connected with cooling base, and cold liquid recycle stream mistake supplies water.
Be formed with one first liquid room and one second liquid room in this cooling base, this first liquid room has one first Port and at least one first through hole, this second liquid room has one second Port and at least one second through hole, and this water-cooled liquid is filled among first and second liquid room;
This circulation helps Pu and cooling base interior first Port and second Port to be connected and to be connected, and liquid coolant can be imported the second liquid room by the circulation of the first liquid room, or direct coolant flows in the opposite direction;
This water-cooled heat exchanger is connected and is connected with first through hole and second through hole of cooling base;
This integral type recirculated water cooling and radiation device further comprises a radiator fan, and this radiator fan is connected with this water-cooled heat exchanger, can or bleed so that reach heat radiation to water-cooled heat exchanger to the water-cooled heat exchanger air inlet.
This water-cooled heat exchanger includes plural heat sink and plural fins group, these heat sinks are folded mutually to be established, be formed with a water-cooling channel in each heat sink respectively, these water-cooling channels are interconnected and are connected with first through hole and second through hole of cooling base, and each fins group is installed in respectively between the adjacent heat sink.
This cooling base further includes a backboard and a front shroud, this backboard is with the metal manufacturing, in order to contact the chip on this computer interface card, this front shroud is installed on the backboard, this the first liquid room and the second liquid room are formed between front shroud and the backboard, and this first Port, second Port, first through hole and second through hole run through and be formed on the front shroud.
This circulation group Pu includes a base, one impeller, one wheel blade lid, an and outer cover, this base is installed on the cooling base, on base, run through and be formed with first perforate and second perforate that is connected and is communicated with second Port that is connected and is communicated with first Port, this impeller is to be arranged on the base with rotary way, and has a center flow channels, this wheel blade lid is installed on the base and hides this second perforate and impeller, cover at wheel blade and to run through the perforation that is formed with at least one corresponding center flow channels, this outer cover is installed on the base and hides this first perforate and this wheel blade lid, on outer cover, run through and be formed with an inlet, be provided with a sealing bolt with removably on this inlet.
Among this water-cooled heat exchanger, except outermost heat sink, run through before and after respectively on all the other each heat sinks and be formed with one first perforation and one second perforation, first perforation is connected with water-cooling channel with second perforation, two first perforation of each adjacent heat sink are connected and are communicated with, two second perforation of each adjacent heat sink are connected and are communicated with, in addition, only run through rear wall on this most external heat sink and be formed with one first guide hole and one second guide hole, water-cooling channel in this first guide hole and second guide hole and this most external heat sink is connected, this first guide hole is connected with first perforation of adjacent heat sink and is communicated with, and this second guide hole is connected with second perforation of adjacent heat sink and is communicated with.
The water-cooling channel of this each heat sink is the bending of continuous S-shaped.
First number of openings of the first liquid room of this cooling base is two, and be distributed in the cooling base both sides respectively, second number of openings of this second liquid room is two, and be distributed in the cooling base both sides respectively, the quantity of this water-cooled heat exchanger is two, be separately positioned on the both sides of cooling base, and connect corresponding first through hole and second through hole.
Further include a wind scooper, on this wind scooper setting and this cooling base, cover these water-cooled heat exchangers and radiator fan, be formed with the gas outlet in corresponding each water-cooled heat exchanger outside in the wind scooper both sides respectively, run through the air intake opening that is formed with a corresponding radiator fan on the wind scooper.
The back veneer material of this cooling base is selected from the wherein a kind of of copper and aluminium.
Be formed with on the backboard of this cooling base and wear groove, be installed with a sealing this wears the master chip contact plate of groove at the backboard back side, is installed with on this master chip contact plate front that plural number passes groove and the chip fin that stretches into the second liquid room.
The backboard back side of this cooling base is installed with a companion chip contact plate.
This master chip contact plate and companion chip contact plate material are selected from the wherein a kind of of copper and aluminium.
This each fins group includes at least the first fin, is being provided with at least one second fin on the front shroud of cooling base and between the adjacent heat sink.
By above-mentioned technological means, after liquid coolant in the cooling base absorbs heat from computer interface card chip by cooling base, pump and flow through in regular turn circulation group Pu, water-cooled heat exchanger via circulation group Pu, reflux again at last and reach water-cooled liquid circulation in heat-radiating substrate, during liquid coolant and water-cooled heat exchanger the fins group heat interchange and lower the temperature to reach the radiating effect of chip; Because circulation group Pu and water-cooled heat exchanger are directly to be installed on the cooling base but not to be connected with rubber or plastic lined piping, therefore can make the structure of heat abstractor more tight, volume more dwindles, and can avoid causing water-cooled liquid to leak because the pipeline aging cracking is damaged, the accident that causes other electron component short circuits such as computer interface card or motherboard to be burnt takes place.
Description of drawings
Fig. 1: stereo appearance figure of the present invention.
Fig. 2: the present invention is installed on the enforcement constitutional diagram of a computer interface card.
Fig. 3: the three-dimensional exploded view of the present invention and computer interface card.
Fig. 4: three-dimensional exploded view of the present invention.
Fig. 5: the three-dimensional exploded view of cooling base of the present invention.
Fig. 6: another three-dimensional exploded view of cooling base of the present invention.
Fig. 7: the present invention circulates and helps the three-dimensional exploded view at Pu.
Fig. 8: the three-dimensional exploded view of water-cooled heat exchanger of the present invention.
Fig. 9: another three-dimensional exploded view of water-cooled heat exchanger of the present invention.
Figure 10: lateral plan of the present invention.
Figure 11: side sectional view of the present invention.
Drawing reference numeral:
10 cooling bases, 11 backboards
110 wear groove 111 master chip contact plates
1111 chip fins, 113 companion chip contact plates
15 front shrouds, 16 first liquid rooms
161 first Ports, 163 first through holes
18 second liquid rooms, 181 second Ports
183 second through holes, 19 liquid coolants
20 circulation group Pu 21 bases
211 first perforates, 213 second perforates
22 impellers, 23 wheel blades lid
231 perforation, 25 outer covers
251 inlets, 252 sealing bolts
30 water-cooled heat exchangers, 31 heat sinks
31a heat sink 32 preceding half shells
Preceding half shell of 32a 33 later half shells
341 first perforation of 34 water-cooling channels
343 second perforation of 341a first guide hole
343a second guide hole 37 fins group
371 first fins, 38 second fins
40 radiator fans, 50 wind scoopers
51 gas outlets, 53 air intake openings
90 computer interface cards, 91 processor chips
92 memory chips
Embodiment
Please refer to Fig. 1 to Fig. 3, the present invention is applicable to that the integral type recirculated water cooling and radiation device of computer interface card (Interface Card) chip can be arranged on a computer interface card 90, this computer interface card 90 can be display card, and includes processor chips 91 and a plurality of memory chip 92.
Please refer to Fig. 3 and Fig. 4, integral type recirculated water cooling and radiation device is to contact with processor chips 91 and memory chip 92, these chips are dispelled the heat, and include: a cooling base 10, a circulation group Pu 20, two water-cooled heat exchangers 30, a radiator fan 40 and a wind scooper 50.
Please refer to Fig. 5 and Fig. 6, this cooling base 10 is in order to contacting chip 91,92 on this computer interface card 90 carrying out heat conduction, and has a backboard 11 and a front shroud 15; This backboard 11 is with metal manufacturings such as copper, aluminium, in order to contact this chip 91,92, on backboard 11, be formed with and wear groove 110, this wears the master chip contact plate 111 of groove 110 to be installed with a sealing at backboard 11 back sides, this master chip contact plate 111 is in order to contact processor chips 91, with copper or aluminium manufacturing, and be installed with the chip fin 1111 that plural number passes groove 111 on the front; Backboard 11 back sides are installed with a companion chip contact plate 113 with copper or aluminium manufacturing in addition, contact this memory chip 92 thus; This front shroud 15 is installed on the backboard 15, metal manufacturing such as can thermal diffusivity good copper, aluminium, also nonmetal manufacturings such as plastics that can be cheap, plastic-steel.
In addition, be formed with one first liquid room 16 and one second liquid room 18 in the cooling base 10 in addition, this first liquid room 16 is between front shroud 15 and backboard 11 and have one first Port 161 and 2 first through holes 163, this second liquid room 18 is between front shroud 15 and backboard 11, the chip fin 1111 that holds master chip contact plate 111, and have one second Port 181 and 2 second through holes 183, this first Port 161 wherein, second Port 181, first through hole 163 and second through hole 183 are to run through to be formed on the front shroud 15, in addition, first and second liquid room 16, be filled with a liquid coolant 19 in 18, as shown in figure 11.
Please refer to Fig. 4 and Fig. 7, this circulation group Pu 20 is to be installed on the cooling base 10 with no pipelined fashion, be connected and be connected with cooling base 10, be connected and be connected with first Port 161 and second Port 181, liquid coolant can be imported the second liquid room 18 by 16 circulations of the first liquid room, perhaps direct coolant flows in the opposite direction, and this circulation group Pu 20 includes a base 21, an impeller (Impeller) 22, wheel blade lid 23, reaches an outer cover 25; This base 21 is installed on the cooling base 10, runs through to be formed with first perforate 211 and second perforate 213 that is connected and is communicated with second Port 181 that is connected and is communicated with first Port 161 on base 21; This impeller 22 is to be arranged on the base 21 with rotary way, and has a center flow channels; This wheel blade lid 23 is installed on the base 21 and hides this second perforate 213 and impeller 22, runs through the perforation 231 that is formed with at least one corresponding center flow channels on wheel blade lid 23; This outer cover 25 is installed on the base 21 and hides this first perforate 211 and this wheel blade lid 231, runs through to be formed with an inlet 251 on outer cover 25, is provided with a sealing bolt 252 with removably on this inlet 251; When Pu 20 runnings of circulation group, impeller 22 rotates to make liquid coolants 19 in the first liquid room 16 flow through in regular turn first Port 161, base 21 first perforates 211,23 perforation 231 of wheel blade lid, impeller 22 center flow channels, second perforate 213 and second Port 181, injects the second liquid room 18 at last.
Please refer to Fig. 8 to Figure 11, these water-cooled heat exchangers 30 are installed on this cooling base 10, be connected and be connected with cooling base 10, and each water-cooled heat exchanger 30 includes plural heat sink 31,31a and plural fins group 37 and at least one second fin 38 respectively; These heat sinks 31,31a are folded mutually to be established, each heat sink 31,31a are combined with later half shell 33 by preceding half shell 32,32a respectively and form, in addition, be formed with one in each heat sink 31, the 31a respectively between preceding half shell 32,32a and later half shell 33 and be the forniciform water-cooling channel 34 of continuous S-shaped, these water-cooling channels 34 are interconnected and are connected with corresponding first through hole 163 and second through hole 183 of cooling base 10; In each water-cooled heat exchanger, except outermost heat sink 31a, run through before and after respectively on all the other each heat sinks 31 and be formed with one first perforation, 341 and 1 second perforation 343, first perforation 341 and second is bored a hole and 343 to be connected with water-cooling channel 34, two first perforation 341 of each adjacent heat sink 31 are connected and are communicated with, two second perforation 343 of each adjacent heat sink 31 are connected and are communicated with, in addition, only run through rear wall on this most external heat sink 31a and be formed with one first guide hole 341a and one second guide hole 343a, water-cooling channel 34 in this first guide hole 341a and the second guide hole 343a and this most external heat sink 31a is connected, this first guide hole 341a is connected with first perforation 341 of adjacent heat sink 31 and is communicated with, and this second guide hole 343a is connected with second perforation 343 of adjacent heat sink 31 and is communicated with; Each fins group 37 is installed between adjacent heat sink 31, the 31a respectively and includes at least one first fin 371; This second fin 38 is arranged on cooling base 10 front shrouds 15 and between the adjacent heat sink 31.
This radiator fan 40 is connected with these water-cooled heat exchangers 30, can or bleed so that reach water-cooled heat exchanger 30 heat radiations to water-cooled heat exchanger 30 air inlets.
Referring again to Fig. 2 and Fig. 4, this wind scooper 50 is arranged on this cooling base 10, cover these water-cooled heat exchangers 30 and radiator fan 40, be formed with the gas outlet 51 in corresponding each water-cooled heat exchanger 30 outside respectively in wind scooper 50 both sides, in addition, run through the air intake opening 53 that is formed with a corresponding radiator fan 40 on the wind scooper 50, when radiator fan 40 antiports, then opposite with the airflow direction of gas outlet 51 by air intake opening 53.
By above-mentioned technological means, the liquid coolant 19 of the first liquid room 16 absorbs from computer interface card 90 chips 91 by cooling base 10 in the cooling base 10, behind 92 the heat, pump and first Port 161 of flowing through in regular turn via circulation group Pu 20, circulation group Pu 20, second Port 181, the second liquid room 18, second through hole 343, the second pod apertures 343a, heat sink 31,31a water-cooling channel 34, the first pod apertures 341a, first through hole 341, reflux again at last and reach water-cooled liquid circulation in the first liquid room 16, during liquid coolant 19 lower the temperature to reach chip 91 with fins group 37 heat interchange, 92 radiating effect; Because circulation group Pu 20 and water-cooled heat exchanger 30 are directly to be installed on the cooling base 10 but not to be connected with rubber or plastic lined piping, therefore can make the structure of heat abstractor more tight, volume more dwindles, avoid interference circuits such as the inner winding displacement of computer chassis, and can avoid causing water-cooled liquid to leak because the pipeline aging cracking is damaged, the accident that causes other electron component short circuits such as computer interface card or motherboard to be burnt takes place.
Claims (14)
1. integral type recirculated water cooling and radiation device that is applicable to computer interface card chip is characterized in that this heat abstractor includes:
One cooling base in order to contact chip on the computer interface card to carry out heat conduction, is filled with a liquid coolant in the cooling base;
One circulation group Pu is to be installed on the cooling base with no pipelined fashion, is connected and is connected with cooling base, and direct coolant flows;
At least one water-cooled heat exchanger is installed on this cooling base, is connected and is connected with cooling base, and cold liquid recycle stream mistake supplies water.
2. the integral type recirculated water cooling and radiation device that is applicable to computer interface card chip as claimed in claim 1 is characterized in that:
Be formed with one first liquid room and one second liquid room in this cooling base, this first liquid room has one first Port and at least one first through hole, this second liquid room has one second Port and at least one second through hole, and this water-cooled liquid is filled among first and second liquid room;
This circulation helps Pu and cooling base interior first Port and second Port to be connected and to be connected, and liquid coolant can be imported the second liquid room by the circulation of the first liquid room, or direct coolant flows in the opposite direction;
This water-cooled heat exchanger is connected and is connected with first through hole and second through hole of cooling base;
This integral type recirculated water cooling and radiation device further comprises a radiator fan, and this radiator fan is connected with this water-cooled heat exchanger, can or bleed so that reach heat radiation to water-cooled heat exchanger to the water-cooled heat exchanger air inlet.
3. the integral type recirculated water cooling and radiation device that is applicable to computer interface card chip as claimed in claim 2, it is characterized in that: this water-cooled heat exchanger includes plural heat sink and plural fins group, these heat sinks are folded mutually to be established, be formed with a water-cooling channel in each heat sink respectively, these water-cooling channels are interconnected and are connected with first through hole and second through hole of cooling base, and each fins group is installed in respectively between the adjacent heat sink.
4. the integral type recirculated water cooling and radiation device that is applicable to computer interface card chip as claimed in claim 3, it is characterized in that: this cooling base further includes a backboard and a front shroud, this backboard is with the metal manufacturing, in order to contact the chip on this computer interface card, this front shroud is installed on the backboard, this the first liquid room and the second liquid room are formed between front shroud and the backboard, and this first Port, second Port, first through hole and second through hole run through and be formed on the front shroud.
5. the integral type recirculated water cooling and radiation device that is applicable to computer interface card chip as claimed in claim 4, it is characterized in that: this circulation group Pu includes a base, one impeller, one wheel blade lid, an and outer cover, this base is installed on the cooling base, on base, run through and be formed with first perforate and second perforate that is connected and is communicated with second Port that is connected and is communicated with first Port, this impeller is to be arranged on the base with rotary way, and has a center flow channels, this wheel blade lid is installed on the base and hides this second perforate and impeller, cover at wheel blade and to run through the perforation that is formed with at least one corresponding center flow channels, this outer cover is installed on the base and hides this first perforate and this wheel blade lid, on outer cover, run through and be formed with an inlet, be provided with a sealing bolt with removably on this inlet.
6. the integral type recirculated water cooling and radiation device that is applicable to computer interface card chip as claimed in claim 5, it is characterized in that: among this water-cooled heat exchanger, except outermost heat sink, run through before and after respectively on all the other each heat sinks and be formed with one first perforation and one second perforation, first perforation is connected with water-cooling channel with second perforation, two first perforation of each adjacent heat sink are connected and are communicated with, two second perforation of each adjacent heat sink are connected and are communicated with, in addition, only run through rear wall on this most external heat sink and be formed with one first guide hole and one second guide hole, water-cooling channel in this first guide hole and second guide hole and this most external heat sink is connected, this first guide hole is connected with first perforation of adjacent heat sink and is communicated with, and this second guide hole is connected with second perforation of adjacent heat sink and is communicated with.
7. the integral type recirculated water cooling and radiation device that is applicable to computer interface card chip as claimed in claim 6 is characterized in that: the water-cooling channel of this each heat sink is the bending of continuous S-shaped.
8. the integral type recirculated water cooling and radiation device that is applicable to computer interface card chip as claimed in claim 7, it is characterized in that: first number of openings of the first liquid room of this cooling base is two, and be distributed in the cooling base both sides respectively, second number of openings of this second liquid room is two, and be distributed in the cooling base both sides respectively, the quantity of this water-cooled heat exchanger is two, is separately positioned on the both sides of cooling base, and connects corresponding first through hole and second through hole.
9. the integral type recirculated water cooling and radiation device that is applicable to computer interface card chip as claimed in claim 8, it is characterized in that: further include a wind scooper, on this wind scooper setting and this cooling base, cover these water-cooled heat exchangers and radiator fan, be formed with the gas outlet in corresponding each water-cooled heat exchanger outside in the wind scooper both sides respectively, run through the air intake opening that is formed with a corresponding radiator fan on the wind scooper.
10. the integral type recirculated water cooling and radiation device that is applicable to computer interface card chip as claimed in claim 9 is characterized in that: the back veneer material of this cooling base is selected from the wherein a kind of of copper and aluminium.
11. the integral type recirculated water cooling and radiation device that is applicable to computer interface card chip as claimed in claim 10, it is characterized in that: be formed with on the backboard of this cooling base and wear groove, be installed with a sealing this wears the master chip contact plate of groove at the backboard back side, is installed with on this master chip contact plate front that plural number passes groove and the chip fin that stretches into the second liquid room.
12. the integral type recirculated water cooling and radiation device that is applicable to computer interface card chip as claimed in claim 11 is characterized in that: the backboard back side of this cooling base is installed with a companion chip contact plate.
13. the integral type recirculated water cooling and radiation device that is applicable to computer interface card chip as claimed in claim 12 is characterized in that: this master chip contact plate and companion chip contact plate material are selected from the wherein a kind of of copper and aluminium.
14. the integral type recirculated water cooling and radiation device that is applicable to computer interface card chip as claimed in claim 13, it is characterized in that: this each fins group includes at least the first fin, is being provided with at least one second fin on the front shroud of cooling base and between the adjacent heat sink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101359670A CN101266512A (en) | 2007-03-14 | 2007-03-14 | Integral type recirculated water cooling and radiation device suitable for computer interface card chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101359670A CN101266512A (en) | 2007-03-14 | 2007-03-14 | Integral type recirculated water cooling and radiation device suitable for computer interface card chip |
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| Publication Number | Publication Date |
|---|---|
| CN101266512A true CN101266512A (en) | 2008-09-17 |
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|---|---|---|---|
| CNA2007101359670A Pending CN101266512A (en) | 2007-03-14 | 2007-03-14 | Integral type recirculated water cooling and radiation device suitable for computer interface card chip |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102467202A (en) * | 2010-11-12 | 2012-05-23 | 英业达股份有限公司 | Cooling system of server and method for cooling electronic device |
| WO2013078828A1 (en) * | 2011-11-30 | 2013-06-06 | 华为技术有限公司 | Memory liquid-cooling heat dissipation method, device and system |
| CN102056452B (en) * | 2009-10-30 | 2013-06-19 | 长春藤控股有限公司 | Heat radiator device and module using same |
| CN104375593A (en) * | 2014-10-30 | 2015-02-25 | 成都聚智工业设计有限公司 | Computer case |
| CN106332517A (en) * | 2015-07-08 | 2017-01-11 | 超众科技股份有限公司 | Thin heat dissipating device |
-
2007
- 2007-03-14 CN CNA2007101359670A patent/CN101266512A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102056452B (en) * | 2009-10-30 | 2013-06-19 | 长春藤控股有限公司 | Heat radiator device and module using same |
| CN102467202A (en) * | 2010-11-12 | 2012-05-23 | 英业达股份有限公司 | Cooling system of server and method for cooling electronic device |
| WO2013078828A1 (en) * | 2011-11-30 | 2013-06-06 | 华为技术有限公司 | Memory liquid-cooling heat dissipation method, device and system |
| CN104375593A (en) * | 2014-10-30 | 2015-02-25 | 成都聚智工业设计有限公司 | Computer case |
| CN106332517A (en) * | 2015-07-08 | 2017-01-11 | 超众科技股份有限公司 | Thin heat dissipating device |
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