CN218336900U - Heat dissipation device and electronic equipment - Google Patents
Heat dissipation device and electronic equipment Download PDFInfo
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- CN218336900U CN218336900U CN202221924333.XU CN202221924333U CN218336900U CN 218336900 U CN218336900 U CN 218336900U CN 202221924333 U CN202221924333 U CN 202221924333U CN 218336900 U CN218336900 U CN 218336900U
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Abstract
The application provides a heat abstractor and electronic equipment relates to heat dissipation technical field. Wherein, heat abstractor includes: a fan; the radiator is in heat conduction connection with the first heating component and is matched with the fan to form a first radiating channel for radiating the first heating component; the air guide structure is matched with the radiator to form at least one second heat dissipation channel so as to be at least used for dissipating heat of a second heat generating component; wherein the first and second heat generating components are components disposed in different areas of an electronic device, and the first and second heat dissipation channels are at least partially different. First heat-generating component second heat-generating component. The application provides a heat abstractor sets up through fan, radiator and wind-guiding structure and realizes that same heat abstractor dispels the heat simultaneously to first heat-generating component and second heat-generating component, and the problem of excess temperature can not appear in the part on the mainboard.
Description
Technical Field
The application relates to the technical field of heat dissipation, in particular to a heat dissipation device and electronic equipment.
Background
At present, a tower-type heat pipe radiator is a high-efficiency radiator for a CPU, but the structural limitation cannot radiate heat for other components on a mainboard, the space of the mainboard is limited, and other radiators are difficult to mount, so that the overtemperature of other components on the mainboard is caused.
SUMMERY OF THE UTILITY MODEL
The embodiment of the application aims to provide a heat dissipation device and electronic equipment.
In order to solve the above technical problem, an embodiment of the present application provides the following technical solutions:
a first aspect of the present application provides a heat dissipation device, comprising:
a fan;
the radiator is in heat conduction connection with the first heating component and is matched with the fan to form a first radiating channel for radiating the first heating component;
the air guide structure is matched with the radiator to form at least one second heat dissipation channel so as to be at least used for dissipating heat of a second heat generating component;
wherein the first and second heat generating components are components disposed in different areas of an electronic device, and the first and second heat dissipation channels are at least partially different. First heat-generating component second heat-generating component.
In some modified embodiments of the first aspect of the present application, the heat sink further includes:
a heat conduction member connecting the first heat generating member and the heat sink, for conducting heat generated by the first heat generating member to the heat sink;
the radiator comprises a plurality of groups of radiating fins arranged at intervals, the heat conducting piece penetrates through at least part of the plurality of groups of radiating fins, and the direction of airflow generated by the fan is consistent with the extending direction of the space formed among the radiating fins so as to form the first radiating channel.
In some modified embodiments of the first aspect of the present application, the first heat-generating component is provided on a main board of the electronic apparatus;
the plurality of groups of radiating fins are arranged above the mainboard in parallel, and the fan is arranged on one side of the plurality of groups of radiating fins along the direction vertical to the mainboard; or the like, or a combination thereof,
the plurality of groups of radiating fins are vertically arranged above the mainboard, and the fan is arranged on one side of the plurality of groups of radiating fins far away from the mainboard along the direction parallel to the mainboard.
In some modified embodiments of the first aspect of the present application, in a case where the plurality of sets of heat dissipating fins are disposed in parallel above a main board of the electronic device, the air guiding structure is disposed between the main board and the plurality of sets of heat dissipating fins, and is configured to guide an air flow generated by the fan to an area of the main board where the second heat generating component is located.
In some variations of the first aspect of the present application, the air guiding structure includes at least one air inlet and at least one air outlet;
in the case that the fan is a first type fan, the at least one air inlet is directly communicated with the air outlet area of the fan, or the at least one air inlet is communicated with the air outlet area of the fan through the heat dissipation fins, and the at least one air outlet is arranged corresponding to the second heat generating component to form the second heat dissipation channel;
in the case that the fan is a second type fan, the at least one air outlet is directly communicated with the air inlet area of the fan, or the at least one air outlet is communicated with the air inlet area of the fan through the heat dissipation fins, and the at least one air inlet is arranged corresponding to the second heat generation component to form the second heat dissipation channel.
In some modified embodiments of the first aspect of the present application, the air guiding structure includes an air inlet and an air outlet, and the cross-sectional areas of the air inlet and the air outlet are the same or different.
In some modified embodiments of the first aspect of the present application, the air guiding structure is a cavity structure disposed between the plurality of sets of heat dissipating fins and the main board, and cross-sectional areas of openings of the cavity structure are the same or different.
In some variations of the first aspect of the present application, the air guiding structure is formed by bending at least one set of heat dissipation fins towards the main board.
In some modified embodiments of the first aspect of the present application, the air outlet of the air guiding structure is disposed in a negative pressure region formed by the fan and the heat dissipating fins, and the air inlet of the air guiding structure is disposed corresponding to the second heat generating component to form a second heat dissipating channel different from the first heat dissipating channel.
A second aspect of the present application provides an electronic device, which includes the heat dissipation apparatus as described above, and therefore includes all the technical features and advantageous technical effects of the heat dissipation apparatus as described above, which are not described herein again.
Compared with the prior art, the heat dissipation device provided in the first aspect of the present application includes a fan, a heat sink, and an air guiding structure, where the fan is used for exhausting air, and the heat dissipation device is used for absorbing heat of an electronic device, where the electronic device includes a first heat-generating component and a second heat-generating component, the first heat-generating component and the second heat-generating component are components in different areas of the electronic device, the heat sink is in heat conduction connection with the first heat-generating component, and the heat sink and the fan are matched to form a first heat dissipation channel, so that the first heat dissipation channel is used for dissipating heat of the first heat-generating component in heat conduction connection with the heat sink, the air guiding structure and the heat sink are matched to form at least one second heat dissipation channel, an air inlet or an air outlet of the second heat dissipation channel faces the second heat-generating component, so as to at least be used for dissipating heat of the second heat-generating component, and the first heat dissipation channel and the second heat dissipation channel are at least partially different, preferably, so that the first heat dissipation channel and the second heat dissipation channel are not interfered with each other. The application provides a heat abstractor sets up through fan, radiator and wind-guiding structure and realizes that same heat abstractor dispels the heat simultaneously to first heat-generating component and second heat-generating component, and the problem of excess temperature can not appear in the part on the mainboard.
Drawings
The above and other objects, features and advantages of exemplary embodiments of the present application will become readily apparent from the following detailed description read in conjunction with the accompanying drawings. Several embodiments of the present application are illustrated by way of example and not by way of limitation in the figures of the accompanying drawings and in which like reference numerals refer to similar or corresponding parts and in which:
fig. 1 schematically illustrates a structural diagram of a first heat dissipation device provided in the present application;
fig. 2 schematically illustrates a structural diagram of a second heat dissipation device provided in the present application;
fig. 3 schematically illustrates a structural view of a third heat dissipation device provided in the present application;
fig. 4 schematically illustrates a structural view of a third heat dissipation device provided in the present application;
fig. 5 schematically illustrates a structure of a third heat dissipation device provided in the present application;
the reference numbers indicate:
the heat dissipation device comprises a heat dissipation device 1, a fan 11, a radiator 12, an air guide structure 13 and a heat conducting piece 14.
Detailed Description
Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
As shown in fig. 1 to 5, the present application provides a heat dissipating device 1, including:
a fan 11;
the radiator 12 is in heat conduction connection with the first heating component and is matched with the fan 11 to form a first heat dissipation channel for dissipating heat of the first heating component;
the air guiding structure 13 is matched with the radiator 12 to form at least one second heat dissipation channel so as to be at least used for dissipating heat of a second heat generating component;
wherein the first heat-generating component and the second heat-generating component are components disposed in different regions in an electronic device, and the first heat-dissipating channel and the second heat-dissipating channel are at least partially different.
The heat dissipation device provided by the embodiment of the application comprises a fan 11, a radiator 12 and an air guide structure 13, wherein the fan 11 is used for exhausting air, the heat dissipation device is used for absorbing heat of electronic equipment, the electronic equipment comprises a first heat generation component and a second heat generation component, the first heat generation component and the second heat generation component are components in different areas of the electronic equipment, the radiator 12 is in heat conduction connection with the first heat generation component, and a first heat dissipation channel is formed by matching the radiator 12 and the fan 11, so that the first heat dissipation channel is used for dissipating heat of the first heat generation component in heat conduction connection with the radiator 12, the air guide structure 13 is matched with the radiator 12 to form at least one second heat dissipation channel, an air inlet or an air outlet of the second heat dissipation channel faces the second heat generation component, so that the first heat dissipation channel and the second heat dissipation channel are at least used for dissipating heat of the second heat generation component, the first heat dissipation channel and the second heat dissipation channel are at least partially different, preferably, the first heat dissipation channel and the second heat dissipation channel are completely different, so that the first heat dissipation channel and the second heat dissipation channel are not interfered with each other, and the same heat generation component can not be over-warmed at the same time.
In the embodiment of the present application, the heat dissipation apparatus 1 further includes:
as shown in fig. 3 to 5, a heat conductive member 14 connecting the first heat generating component and the heat sink 12 for conducting heat generated by the first heat generating component to the heat sink 12;
the heat sink 12 includes a plurality of sets of heat dissipating fins arranged at intervals, the heat conducting member 14 penetrates at least a portion of the plurality of sets of heat dissipating fins, and a direction of an air flow generated by the fan 11 is identical to an extending direction of a space formed between the heat dissipating fins to form the first heat dissipating channel.
In this embodiment, the heat dissipation device 1 includes a fan 11, a heat sink 12, a flow guiding channel, and a heat conducting member 14, two ends of the heat conducting member 14 are respectively connected to the first heat generating component and the heat sink 12, so as to conduct heat generated by the first heat generating component to the heat sink 12, the heat sink 12 includes multiple sets of heat dissipating fins arranged at intervals, one surface of the multiple sets of heat dissipating fins is provided with the fan 11, an airflow direction generated by the fan 11 is consistent with an extending direction of a space formed by the heat dissipating fin members, so as to form a first heat dissipating channel, so that when the heat conducting member 14 conducts heat generated by the first heat generating component to the multiple sets of heat dissipating fins, the fan 11 is turned on, and the airflow of the fan 11 blows the heat dissipating fins along the direction of the space formed between the heat dissipating fins, so as to discharge heat of the first heat generating component conducted by the heat conducting member 14 absorbed by the heat dissipating fins, thereby achieving heat dissipation of the heat of the first heat generating component, so as to achieve cooling of the first heat generating component.
Optionally, the plurality of groups of heat dissipation fins have a predetermined included angle with the fan 11, the plurality of groups of heat dissipation fins are parallel to each other, the direction of the airflow generated by the fan 11 is perpendicular to the fan 11, and a certain included angle is formed between the direction of the airflow and the extending direction of the space formed between the heat dissipation fins.
Optionally, a plurality of groups of heat dissipation fins have a predetermined included angle with the fan 11, the heat dissipation fins are arranged spirally, the plurality of groups of heat dissipation fins are parallel to each other, the direction of the airflow generated by the fan 11 is perpendicular to the fan 11, and a certain included angle is formed between the direction of the airflow and the extending direction of the space formed between the heat dissipation fins.
Alternatively, a plurality of sets of heat dissipation fins are disposed perpendicular to the fan 11, the plurality of sets of heat dissipation fins are parallel to each other, and the direction of the airflow generated by the fan 11 is disposed perpendicular to the fan 11 and parallel to the extending direction of the space formed between the heat dissipation fins.
As shown in fig. 1 to 5, in the embodiment of the present application, the first heat-generating component is disposed on a main board of the electronic device;
the plurality of groups of heat dissipation fins are arranged above the main board in parallel, and the fan 11 is arranged on one side of the plurality of groups of heat dissipation fins along a direction perpendicular to the main board; or the like, or a combination thereof,
the plurality of sets of heat dissipation fins are vertically disposed above the motherboard, and the fan 11 is disposed on a side of the plurality of sets of heat dissipation fins away from the motherboard along a direction parallel to the motherboard.
In this embodiment, multiple sets of heat dissipation fins may be disposed above the motherboard in parallel, the multiple sets of heat dissipation fins are disposed at intervals, the fan 11 is disposed at one side of the multiple sets of heat dissipation fins along a direction perpendicular to the motherboard, so that heat of the first heat generation component on the motherboard is absorbed by the multiple sets of heat dissipation fins, airflow blown out by the fan 11 circulates along the first heat dissipation channel formed between adjacent heat dissipation fins, and wind absorbed by the multiple sets of heat dissipation fins is discharged through the airflow of the fan 11, thereby achieving heat dissipation, and further dissipating heat for the first heat generation component disposed on the motherboard of the electronic device, so as to reduce the temperature of the first heat generation component.
In this embodiment, the plurality of sets of heat dissipation fins are disposed vertically above the motherboard, the fan 11 is disposed on one side of the plurality of heat dissipation fins away from the motherboard along a direction parallel to the motherboard, that is, the two ends of the plurality of sets of heat dissipation fins are respectively the motherboard and the fan 11, so that heat of the first heat generation component on the motherboard is absorbed by the plurality of sets of heat dissipation fins, and then the fan 11 blows towards an extending direction of a space formed between the heat dissipation fins after being turned on, so that the wind absorbed by the plurality of sets of heat dissipation fins is discharged through airflow of the fan 11, thereby achieving heat dissipation, and further dissipating heat for the first heat generation component disposed on the motherboard of the electronic device, so as to reduce the temperature of the first heat generation component.
In the embodiment of the present application, under the condition that the plurality of groups of heat dissipation fins are disposed above the main board of the electronic device in parallel, the air guiding structure 13 is disposed between the main board and the plurality of groups of heat dissipation fins, and is used for guiding the airflow generated by the fan 11 to the area of the main board where the second heat generation component is located.
In this embodiment, when multiple sets of heat dissipation fins are disposed in parallel above a main board of an electronic device, the multiple sets of heat dissipation fins are disposed at intervals, the fan 11 is disposed on one side of the multiple sets of heat dissipation fins or on a side of the multiple sets of heat dissipation fins away from the main board, so that an airflow generated by the fan 11 flows towards the multiple sets of heat dissipation fins, the air guiding structure 13 is disposed between the main board and the multiple sets of heat dissipation fins, so that the heat guiding structure cooperates with the multiple sets of heat dissipation fins to form at least one second heat dissipation channel, one end of the heat guiding structure is connected to the multiple sets of heat dissipation fins in a heat conducting manner, and the other end of the heat guiding structure faces an area of a second heat generating component on the main board, so that the heat dissipation fins, after receiving the airflow from the fan 11, are conducted to the area where the second heat generating component is located through the air guiding structure 13, thereby dissipating heat for reducing the temperature of the second heat generating component.
Preferably, the air guiding structure 13 is disposed at about 1/4 of the side of the plurality of sets of heat dissipating fins close to the main board.
As shown in fig. 1 to fig. 5, in the embodiment of the present application, the air guiding structure 13 includes at least one air inlet and at least one air outlet;
in the case that the fan 11 is the first type fan 11, the at least one air inlet is directly communicated with the air outlet area of the fan 11, or the at least one air inlet is communicated with the air outlet area of the fan 11 through the heat dissipation fins, and the at least one air outlet is arranged corresponding to the second heat generation component to form the second heat dissipation channel;
in the case that the fan 11 is a second type fan 11, the at least one air outlet is directly communicated with the air inlet area of the fan 11, or the at least one air outlet is communicated with the air inlet area of the fan 11 through the heat dissipation fins, and the at least one air inlet is disposed corresponding to the second heat generation component to form the second heat dissipation channel.
In this embodiment, the air guiding structure 13 includes at least one air inlet and at least one air outlet, when the fan 11 is the first type fan 11, the air inlet of the air guiding structure 13 is directly communicated with the air outlet area of the fan 11, the air outlet of the air guiding structure is disposed corresponding to an area of a second heat generating component of the motherboard, so as to form a second heat dissipation channel, and the air of the fan 11 is conducted from the air outlet area to the second heat generating area along the second heat dissipation channel, so as to dissipate heat and cool the second heat generating component; or the fan 11 is a first type fan 11, at least one air inlet of the heat conduction structure is communicated with the air outlet area of the fan 11 through the heat dissipation fins, and the air outlet of the air conduction structure is arranged corresponding to the second heat generating component of the main board, so as to form a second heat dissipation channel, and the air of the fan 11 enters the heat dissipation fins from the air outlet area and then is conducted to the second heat generating area along the second heat dissipation channel, so as to dissipate heat and cool the second heat generating component.
In this embodiment, in the case that the fan 11 is the second type fan 11, at least one air outlet of the air guiding structure 13 is directly communicated with an air inlet of the fan 11, and the air inlet of the air guiding structure 13 is disposed corresponding to the second heat generating component, so as to form a second heat dissipation channel, so that heat generated by the second heat generating component is conducted to the air inlet of the fan 11 through the second heat dissipation channel, so that the fan 11 dissipates the heat, thereby reducing the temperature of the second heat generating component; or the fan 11 is a second type fan 11, at least one air outlet of the heat conducting structure is communicated with the air inlet area of the fan 11 through the heat dissipating fins, the air outlet of the heat conducting structure corresponds to the second heat generating component, so as to form a second heat dissipating channel, the heat generated by the second heat generating component is conducted to the air inlet area of the fan 11 through the plurality of second heat dissipating channels and the heat dissipating fins, so that the fan 11 dissipates the heat, and the temperature of the second heat generating component is reduced.
Wherein the first type of fan 11 directly generates wind and the second type of fan 11 is capable of cooling the received heat.
As shown in fig. 1 and fig. 2, in the embodiment of the present application, the air guiding structure 13 includes an air inlet and an air outlet, and the cross-sectional areas of the air inlet and the air outlet are the same or different.
In this embodiment, as shown in fig. 1, the air guiding structure 13 includes an air inlet and an air outlet, the cross-sectional area of the air inlet may be the same as that of the air outlet, and the air guiding structure 13 may be a columnar structure, so that the air inlet speed and the air outlet speed are the same, when a heat-generating component is radiated, the speed of heat or air flow entering the air guiding structure 13 is the same as the speed of heat or air flow exiting the air guiding structure 13, so that the heat radiation is not interrupted, and the heat radiation of the heat-generating component is ensured; or as shown in fig. 2, the air intake of air guide structure 13 is different from the cross sectional area of air outlet, and the cross sectional area of air guide structure 13 air intake is greater than the cross sectional area of air outlet, and air guide structure 13 can be for leaking hopper-shaped structure to the air inlet speed of air intake is greater than the air-out speed of air outlet, has guaranteed the air output of fan 11 or the thermal volume that the part that generates heat sent, makes the wind energy of fan 11 can continuously dispel the heat for the part that generates heat.
As shown in fig. 3 to 5, in the embodiment of the present application, the air guiding structure 13 is a cavity structure disposed between the plurality of sets of heat dissipating fins and the main board, and cross-sectional areas of openings of the cavity structure are the same or different.
In this embodiment, a main board is disposed on one side of the plurality of sets of heat dissipation fins, a first heat generation component and a second heat generation component are disposed in different areas of the main board, the air guiding structure 13 includes a cavity structure, an air outlet of the cavity structure faces the second heat generation component, the cavity structure is disposed between the plurality of sets of heat dissipation fins and the main board, so as to form a second heat dissipation channel, the cavity structure may have various shapes, as shown in fig. 1, cross-sectional areas of an air inlet and an air outlet of the cavity structure are the same, and the cavity structure is a regular quadrangular prism structure; as shown in fig. 2, the cross-sectional areas of the air inlet and the air outlet of the cavity structure are different, and the cross-sectional area of the side of the cavity structure facing the main board is larger than the cross-sectional area of the side of the cavity structure facing the multiple groups of heat dissipation fins, so that the multiple groups of heat dissipation fins can dissipate heat and cool the second heat generating component on the main board through the formation of the second heat dissipation channel of the cavity structure.
As shown in fig. 3 to 5, in the embodiment of the present invention, the air guiding structure 13 is formed by bending at least one set of heat dissipating fins toward the main board.
In this embodiment, the first heat-generating component and the second heat-generating component are respectively disposed on different areas of the motherboard, the plurality of sets of heat-dissipating fins are disposed above the motherboard in parallel, the fan 11 is disposed on one side of the plurality of sets of heat-dissipating fins along a direction perpendicular to the motherboard, the air guiding structure 13 is composed of at least one set of heat-dissipating fins, an air inlet or an air outlet formed by at least one set of heat-dissipating fins is connected with an air outlet area or an air inlet area of the fan 11 and extends for a certain distance along a direction parallel to the motherboard, and then is bent toward the motherboard direction, so that the air outlet or the air inlet formed by at least one set of heat-dissipating fins corresponds to the second heat-generating component, thereby forming a second heat-dissipating channel to transmit the wind generated by the fan 11 to the second heat-generating component, thereby dissipating heat from the second heat-generating component; or, the air inlets or air inlets formed by at least one set of heat dissipation fins are connected with a plurality of sets of heat dissipation fins of the heat dissipation device 1 parallel to the main board, and then bent toward the main board, so that the air outlets or air inlets formed by at least one set of heat dissipation fins correspond to the second heat generating component, thereby forming a second heat dissipation channel, so as to conduct the air generated by the fan 11 to the second heat generating component, thereby dissipating heat from the second heat generating component.
In the embodiment of the present application, the air outlet of the air guiding structure 13 is disposed in the negative pressure region formed by the fan 11 and the heat dissipating fins, and the air inlet of the air guiding structure 13 is disposed corresponding to the second heat generating component to form a second heat dissipating channel different from the first heat dissipating channel.
In this embodiment, the air guiding structure 13 has an air inlet and an air outlet, the air inlet is disposed corresponding to the second heat generating component, and the air outlet is disposed in the negative pressure region formed by the fan 11 and the heat dissipating fins, so that the air guiding structure 13 can transmit the heat generated by the second heat generating component to the negative pressure region formed by the fan 11 and the heat dissipating fins, thereby forming a second heat dissipating channel different from the first heat dissipating channel, and then dissipate the heat transmitted by the fan 11 and the heat dissipating fins, thereby achieving heat dissipation and temperature reduction of the second heat dissipating component.
Preferably, the first heat generating component is a CPU and the second heat generating component is another heat sink 12 component on the motherboard.
On the other hand, the present application further provides an electronic device, which includes the heat dissipation apparatus 1 as described above, and therefore includes all technical features and beneficial technical effects of the heat dissipation apparatus 1 as described above, which are not described herein again.
The application provides a heat dissipation device and electronic equipment, wherein, the heat dissipation device includes a fan, a radiator and an air guide structure, the fan is used for air-out, the heat dissipation device is used for absorbing the heat of the electronic equipment, the electronic equipment includes a first heat-generating component and a second heat-generating component, the first heat-generating component and the second heat-generating component are components in different regions of the electronic equipment, the radiator is in heat conduction connection with the first heat-generating component, and the radiator and the fan are matched to form a first heat dissipation channel, so that the first heat dissipation channel is used for dissipating the heat of the first heat-generating component in heat conduction connection with the radiator, the air guide structure and the radiator are matched to form at least one second heat dissipation channel, an air inlet or an air outlet of the second heat dissipation channel faces the second heat-generating component, so as to be at least used for dissipating the heat of the second heat-generating component, the first heat dissipation channel and the second heat dissipation channel are at least partially different, preferably, the first heat dissipation channel and the second heat dissipation channel are completely different, so that the first heat dissipation channel and the second heat dissipation channel are not interfered with each other. The application provides a heat abstractor sets up through fan, radiator and wind-guiding structure and realizes that same heat abstractor dispels the heat simultaneously to first heat-generating component and second heat-generating component, and the problem of overtemperature can not appear in the part on the mainboard.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (10)
1. A heat dissipating device, comprising:
a fan;
the radiator is in heat conduction connection with the first heating component and is matched with the fan to form a first radiating channel for radiating the first heating component;
the air guide structure is matched with the radiator to form at least one second heat dissipation channel so as to be at least used for dissipating heat of a second heating component;
wherein the first and second heat generating components are components disposed in different areas of an electronic device, and the first and second heat dissipation channels are at least partially different.
2. The heat dissipating device of claim 1, further comprising:
a heat conductive member connecting the first heat generating part and the heat sink, for conducting heat generated by the first heat generating part to the heat sink;
the radiator comprises a plurality of groups of radiating fins arranged at intervals, the heat conducting piece penetrates through at least part of the plurality of groups of radiating fins, and the direction of airflow generated by the fan is consistent with the extending direction of the space formed among the radiating fins so as to form the first radiating channel.
3. The heat dissipating device according to claim 2, wherein the first heat generating component is disposed on a main board of the electronic apparatus;
the plurality of groups of radiating fins are arranged above the mainboard in parallel, and the fan is arranged on one side of the plurality of groups of radiating fins along the direction vertical to the mainboard; or the like, or, alternatively,
the plurality of groups of radiating fins are vertically arranged above the mainboard, and the fan is arranged on one side of the plurality of groups of radiating fins far away from the mainboard along the direction parallel to the mainboard.
4. The heat dissipating device according to claim 2 or 3, wherein in a case where the plurality of sets of heat dissipating fins are disposed in parallel above a main board of the electronic apparatus, the air guiding structure is disposed between the main board and the plurality of sets of heat dissipating fins, and is configured to guide the airflow generated by the fan to an area of the main board where the second heat generating component is located.
5. The heat dissipating device as claimed in claim 4, wherein the air guiding structure comprises at least one air inlet and at least one air outlet;
in the case that the fan is a first type fan, the at least one air inlet is directly communicated with the air outlet area of the fan, or the at least one air inlet is communicated with the air outlet area of the fan through the heat dissipation fins, and the at least one air outlet is arranged corresponding to the second heat generating component to form the second heat dissipation channel;
in the case that the fan is a second type fan, the at least one air outlet is directly communicated with the air inlet area of the fan, or the at least one air outlet is communicated with the air inlet area of the fan through the heat dissipation fins, and the at least one air inlet is arranged corresponding to the second heat generation component to form the second heat dissipation channel.
6. The heat dissipating device of claim 5, wherein the air guiding structure comprises an air inlet and an air outlet, and the cross-sectional areas of the air inlet and the air outlet are the same or different.
7. The heat dissipating device of claim 5,
the air guide structure is a cavity structure arranged between the plurality of groups of radiating fins and the main board, and the cross-sectional areas of the air inlet and the air outlet of the cavity structure are the same or different.
8. The heat dissipating device as claimed in claim 5, wherein the air guiding structure is formed by bending at least one set of heat dissipating fins toward the main board.
9. The heat dissipating device as claimed in claim 1, wherein the air outlet of the air guiding structure is disposed in a negative pressure region formed by the fan and the heat dissipating fins, and the air inlet of the air guiding structure is disposed corresponding to the second heat generating component to form a second heat dissipating channel different from the first heat dissipating channel.
10. An electronic device characterized by comprising the heat dissipating apparatus according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221924333.XU CN218336900U (en) | 2022-07-25 | 2022-07-25 | Heat dissipation device and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221924333.XU CN218336900U (en) | 2022-07-25 | 2022-07-25 | Heat dissipation device and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218336900U true CN218336900U (en) | 2023-01-17 |
Family
ID=84872097
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221924333.XU Active CN218336900U (en) | 2022-07-25 | 2022-07-25 | Heat dissipation device and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218336900U (en) |
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2022
- 2022-07-25 CN CN202221924333.XU patent/CN218336900U/en active Active
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