CN216413045U

CN216413045U - Dual in-line package tube shell for communication electronic device

Info

Publication number: CN216413045U
Application number: CN202123180126.6U
Authority: CN
Inventors: 肖璐; 汪华
Original assignee: Shenzhen Jingyixin Machinery Technology Co ltd
Current assignee: Shenzhen Jingyixin Machinery Technology Co ltd
Priority date: 2021-12-17
Filing date: 2021-12-17
Publication date: 2022-04-29
Anticipated expiration: 2031-12-17

Abstract

The utility model discloses a double-row in-line packaging tube shell for a communication electronic device, which comprises a first packaging tube shell, wherein a second packaging tube shell is movably arranged above the first packaging tube shell, bolts are movably embedded and installed on the upper surface of the second packaging tube shell close to four corners, an insulating heat conduction frame is movably embedded and installed on the upper surface of the first packaging tube shell, a chip is movably embedded and installed on the inner side of the insulating heat conduction frame, a radiating fin is movably embedded and installed on the lower surface of the first packaging tube shell, mounting grooves are formed in the upper surface of the first packaging tube shell and the lower surface of the second packaging tube shell, and pins are fixedly installed on the surfaces of two sides of the chip. The dual in-line package tube shell for the communication electronic device can change the heat conduction path of the chip in the package, and simultaneously leads the heat generated by the pin out of the outside, thereby improving the heat dissipation rate of the chip, changing the package mode and facilitating the maintenance and replacement of the broken pin.

Description

Dual in-line package tube shell for communication electronic device

Technical Field

The utility model relates to the field of packaging, in particular to a dual in-line package tube shell for a communication electronic device.

Background

The integrated circuit is a miniature electronic device or part, adopt certain craft, interconnect elements such as transistor, resistance, electric capacity and inductance that a circuit needs together with the routing, make on a small or several small semiconductor wafers or medium substrates, then encapsulate in a tube, become the microstructure with necessary circuit function, wherein all elements have already made up a whole structurally, make the electronic component step forward towards microminiaturization, low-power consumption, intellectuality and high reliability;

the notice number is: CN212010936U, a dual in-line integrated circuit package casing, which comprises a casing and a plurality of pins, wherein the pins are disposed on two sides of the casing, and is characterized in that at least two pins are connected together by a connector to form a combined pin. Connect the pin through the connecting piece, can form the pin structure of multiple different forms, there is further promotion to integrated circuit heat dissipation function, a new integrated circuit packaging shell structure is provided simultaneously, great development prospect is possessed, certain drawback still exists when using, the inside chip of encapsulation is derived the heat through the pin, but pin itself has the electric current to pass through, its self will produce the heat, the rate of heat dissipation of chip is not high, and the encapsulation is the integration encapsulation, be not convenient for maintain the change after the pin fracture.

SUMMERY OF THE UTILITY MODEL

The utility model mainly aims to provide a dual in-line package tube shell for a communication electronic device, which can effectively solve the problems in the background technology.

In order to achieve the purpose, the utility model adopts the technical scheme that:

the utility model provides a biserial in-line package tube for communication electron device, includes a package tube, a package tube top movable mounting has No. two package tubes, No. two package tube upper surfaces are close the equal movable embedding in four corners department and are installed the bolt, package tube upper surface movable embedding is installed and is insulated heat conduction frame, the chip is installed to the inboard movable embedding of insulated heat conduction frame, package tube lower surface movable embedding installs the fin.

Preferably, mounting grooves are formed in the upper surface of the first packaging tube shell and the lower surface of the second packaging tube shell, and pins are fixedly mounted on the surfaces of the two sides of the chip.

Preferably, a square groove is formed in the lower surface of the first packaging tube shell, the square groove is movably connected with the mounting groove, and the radiating fin is movably connected with the first packaging tube shell through the square groove.

Preferably, the insulating heat conduction frame is movably connected with the first packaging tube shell through the mounting groove, and the chip is movably connected with the second packaging tube shell through the mounting groove.

Preferably, the surfaces of two sides of the insulating heat conduction frame are provided with clamping grooves, two ends of each radiating fin are fixedly connected with the insulating heat conduction frame, and the pins are movably connected with the insulating heat conduction frame through the clamping grooves.

Preferably, the pins are tightly attached to the radiating fins, nuts are fixedly embedded into the lower surface of the first packaging tube shell close to the four corners, through holes are formed in the upper surfaces of the first packaging tube shell and the second packaging tube shell close to the four corners, the bolts are movably inserted into the through holes, and the bolts penetrate through the through holes and are movably connected with the nuts.

Compared with the prior art, the utility model has the following beneficial effects:

according to the utility model, a chip is clamped into an insulating heat conduction frame, pins are clamped into a clamping groove, then a second packaging tube shell cover is arranged above a first packaging tube shell, a mounting groove is matched with the chip, then a bolt penetrates through a through hole and is screwed into a nut, so that the second packaging tube shell and the first packaging tube shell are fixed, the insulating heat conduction frame transfers heat emitted by the chip to a radiating fin, the pins also transfer self heat to the radiating fin, the radiating area is increased through the radiating fin, the heat is led out of the outside, the heat conduction path of the chip in the packaging is changed, meanwhile, the heat generated by the pins is led out of the outside, the radiating rate of the chip is improved, the packaging mode is changed, and the pins are convenient to maintain and replace after being broken.

Drawings

FIG. 1 is a schematic view of the overall structure of a dual in-line package for communication electronics according to the present invention;

FIG. 2 is a disassembled view of the whole structure of a dual in-line package for communication electronics according to the present invention;

FIG. 3 is a side cross-sectional view of a dual in-line package housing for a communications electronics device in accordance with the present invention;

fig. 4 is a vertical cross-sectional view of a dual in-line package housing for communications electronics in accordance with the present invention.

In the figure: 1. packaging a tube shell; 101. packaging the tube shell; 102. a through hole; 103. a bolt; 104. a nut; 105. mounting grooves; 2. an insulating heat-conducting frame; 201. a heat sink; 202. a card slot; 203. a square groove; 3. a chip; 301. and (7) a pin.

Detailed Description

In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the utility model easy to understand, the utility model is further described with the specific embodiments.

The first embodiment is as follows:

as shown in fig. 1-4, a dual in-line package tube shell for communication electronic devices comprises a first package tube shell 1, a second package tube shell 101 is movably installed above the first package tube shell 1, bolts 103 are movably embedded and installed on the upper surface of the second package tube shell 101 close to four corners, an insulating heat conduction frame 2 is movably embedded and installed on the upper surface of the first package tube shell 1, a chip 3 is movably embedded and installed on the inner side of the insulating heat conduction frame 2, and a radiating fin 201 is movably embedded and installed on the lower surface of the first package tube shell 1;

mounting grooves 105 are formed in the upper surface of the first packaging tube shell 1 and the lower surface of the second packaging tube shell 101, and pins 301 are fixedly mounted on the surfaces of the two sides of the chip 3; the lower surface of the first packaging tube shell 1 is provided with a square groove 203, the square groove 203 is movably connected with the mounting groove 105, and the radiating fin 201 is movably connected with the first packaging tube shell 1 through the square groove 203; the insulating heat conduction frame 2 is movably connected with the first packaging tube shell 1 through a mounting groove 105, and the chip 3 is movably connected with the second packaging tube shell 101 through the mounting groove 105; clamping grooves 202 are formed in the surfaces of the two sides of the insulating heat-conducting frame 2, the two ends of each radiating fin 201 are fixedly connected with the insulating heat-conducting frame 2, and the pins 301 are movably connected with the insulating heat-conducting frame 2 through the clamping grooves 202; the pins 301 are tightly attached to the heat sink 201, nuts 104 are fixedly embedded in the lower surface of the first packaging tube 1 near four corners, through holes 102 are formed in the upper surfaces of the first packaging tube 1 and the second packaging tube 101 near four corners, bolts 103 are movably inserted into the through holes 102, the bolts 103 penetrate through the through holes 102 and are movably connected with the nuts 104, the bolts 103 penetrate through the through holes 102 and are screwed into the nuts 104, the second packaging tube 101 and the first packaging tube 1 are fixed, the insulating heat-conducting frame 2 transfers heat emitted by the chip 3 to the heat sink 201, the pins 301 also transfer self heat to the heat sink 201, the heat-radiating area is enlarged through the heat sink 201, so that the heat is led out of the outside, the heat-conducting path of the chip 3 in the packaging is changed, meanwhile, the heat generated by the pins 301 is led out of the outside, the heat-radiating rate of the chip 3 is improved, and the packaging mode is changed, the pins 301 are broken to facilitate repair and replacement.

Example two:

it should be noted that, the utility model is a dual in-line package tube shell for communication electronic device, when in use, the chip 3 is clamped into the insulating heat conducting frame 2, the pin 301 is clamped into the clamping groove 202, then the second package tube shell 101 is covered on the first package tube shell 1, the mounting groove 105 is matched with the chip, then the bolt 103 is threaded into the nut 104 after passing through the through hole 102, thereby fixing the second package tube shell 101 and the first package tube shell 1, the insulating heat conducting frame 2 transfers the heat emitted by the chip 3 to the heat sink 201, the pin 301 also transfers the heat of itself to the heat sink 201, the heat sink 201 enlarges the heat dissipation area, thereby the heat is led out of the outside, thereby changing the heat conducting path of the chip 3 in the package, meanwhile, the heat generated by the pin 301 is led out of the outside, increasing the heat dissipation rate of the chip 3, and changing the package mode, the pins 301 are broken to facilitate repair and replacement.

The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims

1. A dual in-line package tube shell for communication electronic device is characterized in that: including a packaging tube (1), a packaging tube (1) top movable mounting has No. two packaging tube (101), No. two packaging tube (101) upper surfaces are close the equal activity embedding in four corners department and install bolt (103), a packaging tube (1) upper surface activity embedding installs insulating heat conduction frame (2), chip (3) are installed in the inboard activity embedding of insulating heat conduction frame (2), cooling fin (201) are installed in the embedding of a packaging tube (1) lower surface activity.

2. The package of claim 1, wherein: mounting groove (105) have all been seted up to a encapsulation tube (1) upper surface with No. two encapsulation tube (101) lower surfaces, chip (3) both sides surface fixed mounting has pin (301).

3. The package of claim 2, wherein: a square groove (203) is formed in the lower surface of the first packaging tube shell (1), the square groove (203) is movably connected with the mounting groove (105), and the radiating fin (201) is movably connected with the first packaging tube shell (1) through the square groove (203).

4. A dual inline package for communication electronics as in claim 3, wherein: the insulating heat conduction frame (2) is movably connected with the first packaging tube shell (1) through the mounting groove (105), and the chip (3) is movably connected with the second packaging tube shell (101) through the mounting groove (105).

5. The package of claim 4, wherein: clamping grooves (202) are formed in the surfaces of the two sides of the insulating heat conduction frame (2), the two ends of each radiating fin (201) are fixedly connected with the insulating heat conduction frame (2), and the pins (301) are movably connected with the insulating heat conduction frame (2) through the clamping grooves (202).

6. The package of claim 5, wherein: the pin (301) with the fin (201) closely laminates, equal fixed embedding of No. one encapsulation tube shell (1) lower surface near four corners department installs nut (104), No. one encapsulation tube shell (1) with No. two encapsulation tube shell (101) upper surface is close four corners department and has all seted up through-hole (102), bolt (103) activity alternate in inside through-hole (102), bolt (103) run through-hole (102) with nut (104) swing joint.