CN220041065U - Heat radiating device and chassis - Google Patents

Abstract

The utility model provides a heat dissipation device and a case, wherein the heat dissipation device comprises: the cooling device comprises a substrate, a plurality of cooling fins, at least one cooling fan and an air deflector; the plurality of radiating fins are arranged on the base plate at intervals, the plurality of radiating fins are surrounded to form a mounting groove and an air guide groove, and the mounting groove is communicated with the air guide groove; the opening of the mounting groove and the opening of the air guide groove are both away from the substrate, and the cooling fan is fixedly arranged in the mounting groove; the air deflector is positioned in the air guiding groove, and the cooling fan is used for blowing outside air to the substrate, so that the outside air blown to the substrate is guided into gaps between cooling fins positioned outside the mounting groove under the action of the air deflector. The utility model can simultaneously ensure the heat dissipation efficiency of electronic devices in the case and the protection level of the case.

Description

Heat radiating device and chassis

Technical Field

The present utility model relates to the field of electronic devices, and in particular, to a heat dissipation device and a chassis.

Background

With the rapid development of technology, electronic devices are widely used in various industries. However, the existing cabinets of some electronic devices are internally provided with electronic devices that generate heat, such as a processor, a bridge chip, a network chip, a power module, and the like. In order to ensure that the electronic devices normally work, a ventilation opening is usually formed in the surface of the case, and a fan is arranged in the ventilation opening, so that an air channel of the fan can accelerate air flow in the case through the ventilation opening, and the electronic devices in the case are cooled.

Therefore, the protection level of the case is not high, the inside of the case is greatly influenced by the field environment, the reliability is reduced, and the case cannot cover the use scene with severe environment.

Disclosure of Invention

In order to solve the problems, the heat radiating device and the chassis provided by the utility model ensure the heat radiating efficiency of the heat radiating fin and the protection level of the chassis by arranging the heat radiating fan and the air deflector on the heat radiating fin, so that the chassis can be suitable for a scene with severe environment.

In a first aspect, the present utility model provides a heat dissipating device, comprising: the cooling device comprises a substrate, a plurality of cooling fins, at least one cooling fan and an air deflector;

the plurality of radiating fins are arranged on the base plate at intervals, the plurality of radiating fins are surrounded to form a mounting groove and an air guide groove, and the mounting groove is communicated with the air guide groove;

the opening of the mounting groove and the opening of the air guide groove are both away from the substrate, and the cooling fan is fixedly arranged in the mounting groove;

the air deflector is positioned in the air guiding groove, and the cooling fan is used for blowing outside air to the substrate, so that the outside air blown to the substrate is guided into gaps between cooling fins positioned outside the mounting groove under the action of the air deflector.

Optionally, the bottom surface of the air guiding groove is the surface of the substrate, and the bottom surface of the mounting groove is the surface of the substrate.

Optionally, the mounting groove is formed by recessing the heat sink toward the substrate, and a depth of the air guide groove is greater than or equal to a depth of the mounting groove.

Optionally, the air guide groove penetrates through the plurality of cooling fins, and the length direction of the air guide groove intersects with the arrangement direction of the plurality of cooling fins.

Optionally, the number of the cooling fans is multiple, and the multiple cooling fans are respectively located at two sides of the air guide groove.

Optionally, the air deflector comprises: supporting the sub-board and guiding the sub-board;

the guide sub-board is fixed on one side of the support sub-board facing the base plate, the support sub-board is matched with the opening of the air guide groove, and the guide sub-board is fixedly connected with the radiating fin or the base plate.

Optionally, the guiding sub-board and the supporting sub-board form a heat dissipation channel, the heat dissipation channel is provided with an air inlet and an air outlet, the air inlet is communicated with the mounting groove, and the air outlet is communicated with a gap between the radiating fins positioned outside the mounting groove;

the heat radiation fan is used for blowing outside air to the substrate so that the outside air blown to the substrate enters the air inlet under the guidance of the substrate and the heat radiation fins;

the heat dissipation channel is used for sending the external air entering the heat dissipation channel to the gaps between the heat dissipation fins positioned outside the mounting groove through the air outlet.

Optionally, the heat dissipating device further includes: a first heat conduction pipe;

the first heat conduction pipe is located one side of the substrate, which is away from the radiating fins, and the first heat conduction pipe is fixedly connected with the substrate.

Optionally, the first heat conduction pipe includes a plurality of first heat conduction sub-pipes and a plurality of second heat conduction sub-pipes, and a plurality of first heat conduction sub-pipes are arranged along the length direction of fin, and a plurality of second heat conduction sub-pipes arrange the direction unanimous with a plurality of fin arrangement direction.

In a second aspect, the present utility model provides a chassis, comprising: a housing and a heat sink as in any one of the above;

the base plate is fixedly connected with the box body, and the radiating fin is positioned on one side of the base plate, which is away from the box body.

According to the heat dissipation device and the case, the heat dissipation efficiency of the heat dissipation plate is improved by arranging the heat dissipation fan and the air deflector on the heat dissipation plate, so that the heat dissipation requirement of the case can be met without transmitting the transmitted air of the heat dissipation fan to the inside of the case, and meanwhile, the case is not required to be provided with the ventilation opening, so that the protection level of the case is ensured, the case can be suitable for scenes with severe environments and can be used as a vehicle-mounted computer, but the heat dissipation device and the case are not limited to the cases.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments or the conventional techniques of the present utility model, the drawings required for the descriptions of the embodiments or the conventional techniques will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to the drawings without inventive effort for those skilled in the art.

FIG. 1 is a schematic block diagram of a heat dissipating device according to an embodiment of the present utility model;

FIG. 2 is a schematic exploded view of a chassis according to an embodiment of the present utility model;

FIG. 3 is a schematic block diagram of an air deflector according to an embodiment of the present utility model;

FIG. 4 is a schematic block diagram of a heat dissipating device according to an embodiment of the present utility model;

FIG. 5 is a schematic block diagram of a chassis according to an embodiment of the present utility model;

FIG. 6 is a schematic block diagram of a chassis according to an embodiment of the present utility model;

FIG. 7 is a schematic internal block diagram of a chassis according to an embodiment of the present utility model;

FIG. 8 is a schematic internal block diagram of a chassis according to an embodiment of the present utility model;

fig. 9 is a schematic internal structural diagram of a chassis according to an embodiment of the present utility model.

Reference numerals

1. A heat sink; 11. a substrate; 111. a first heat conduction groove; 12. a heat sink; 13. a heat radiation fan; 14. an air deflector; 141. supporting the sub-board; 142. a guide sub-plate; 151. a mounting groove; 152. an air guiding groove; 1521. a first sub-channel; 1522. a second sub-channel; 16. a protective net; 17. a first heat conduction pipe; 171. a first heat conduction sub-tube; 172. a second heat conduction sub-tube; 18. a second heat conduction pipe; 2. a case; 21. a bottom cover heat dissipation assembly; 211. a second heat conduction groove; 22. a left side heat dissipation assembly; 23. a right side heat dissipation assembly; 24. a front panel assembly; 25. a rear panel assembly; 31. a mounting frame; 32. a CPU; 33. a first heat conduction block; 34. a main board; 35. a display card; 36. a second heat conduction block; 37. a power panel; 38. AI acceleration card; 39. and a third heat conduction block.

Detailed Description

In order that the utility model may be readily understood, a more complete description of the utility model will be rendered by reference to the appended drawings. Embodiments of the utility model are illustrated in the accompanying drawings. This utility model may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model.

Spatially relative terms, such as "under", "below", "beneath", "under", "above", "over" and the like, may be used herein to describe one element or feature's relationship to another element or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use and operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements or features described as "under" or "beneath" other elements would then be oriented "on" the other elements or features. Thus, the exemplary terms "below" and "under" may include both an upper and a lower orientation. Furthermore, the device may also include an additional orientation (e.g., rotated 90 degrees or other orientations) and the spatial descriptors used herein interpreted accordingly.

It will be understood that when an element is referred to as being "fixedly connected" to another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" another element, there are no intervening elements present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only.

As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," and/or the like, specify the presence of stated features, integers, steps, operations, elements, components, or groups thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or groups thereof.

In a first aspect, an embodiment of the present utility model provides a heat dissipating device 1, see fig. 1 and 2, where the hollow short arrow in fig. 1 is used to indicate the flow direction of the outside air in the air guiding groove. The heat dissipating device 1 includes: a base plate 11, a plurality of heat radiating fins 12, at least one heat radiating fan 13, and an air deflector 14.

Wherein, the plurality of cooling fins 12 are arranged on one surface of the substrate 11 at intervals, the plurality of cooling fins 12 are surrounded to form a mounting groove 151 and an air guide groove 152, and the mounting groove 151 is communicated with the air guide groove 152; the openings of the mounting groove 151 and the air guide groove 152 are both away from the base plate 11, and the heat radiation fan 13 is fixedly disposed in the mounting groove 151.

The air deflection 14 is positioned within the air deflection recess 152. The heat radiation fan 13 is used to blow outside air toward the substrate 11. The air guide plate 14 serves to provide a heat dissipation path so that the external air blown toward the substrate 11 is transferred through the heat dissipation path into the gap between the heat dissipation fins 12 located outside the mounting groove 151.

It should be noted that, the positions of the mounting groove 151 and the heat dissipation fan 13 may be set according to the heat generation power of the electronic device; the air guide grooves 152 penetrate through the plurality of cooling fins 12, and the length direction of the air guide grooves 152 relative to the substrate 11 is intersected with the arrangement direction of the plurality of cooling fins 12; the depth of the air guide groove 152 is greater than or equal to the depth of the installation groove 151.

Wherein the mounting groove 151 and the air guide groove 152 may penetrate the heat sink 12 at the corresponding position in a direction toward the substrate 11, in which state one surface of the substrate 11 is a bottom surface of the mounting groove 151 and the air guide groove 152; meanwhile, the mounting groove 151 and the air guide groove 152 may be formed by recessing the heat sink 12 toward the substrate 11 at corresponding positions in the direction of the substrate 11, and in this state, the heat sink 12 is present between the substrate 11 and both the mounting groove 151 and the air guide groove 152.

Defining the relative depths of the air guide grooves 152 and the mounting grooves 151 enables more air, i.e., outside air, to flow through the air guide plates 14 into the gaps between the fins 12 located outside the mounting grooves 151, to be blown toward the substrate 11, thereby improving the heat dissipation efficiency of the heat dissipation device 1.

In this embodiment, the heat sink 12 is fixedly connected with the substrate 11 in an integrally formed manner, and the surface of the heat sink 12 is a wavy surface, so that the heat dissipation area of the heat sink 12 is increased, and the heat dissipation efficiency of the heat sink 12 is improved; the plurality of heat sinks 12 are arranged on the upper surface of the substrate 11 at intervals along the front-rear direction, the mounting grooves 151 are formed by downwards sinking the heat sinks 12, and the number of the mounting grooves 151 is two; the bottom surface of the air guiding groove 152 is the upper surface of the base plate 11; the air guide groove 152 is a strip-shaped groove, and penetrates through the plurality of cooling fins 12 along the front-rear direction, and the two mounting grooves 151 are respectively positioned at the left side and the right side of the air guide groove 152; the heat dissipation fans 13 are waterproof fans, the number of the two heat dissipation fans 13 is two, and the two heat dissipation fans 13 are respectively positioned at the left side and the right side of the air deflector 14. The air deflectors 14 are respectively positioned on each cooling fan 13 to provide a cooling channel.

Wherein, the right end of the left mounting groove 151 is communicated with the air guiding groove 152, and the left end of the right mounting groove 151 is communicated with the air guiding groove 152; the two mounting grooves 151 and the air guide groove 152 are symmetrical with respect to the central axis of the base plate 11 in the left-right direction and symmetrical with respect to the central axis of the base plate 11 in the up-down direction.

Referring to fig. 3, the air guide plate 14 includes: a support sub-plate 141 and a guide sub-plate 142. The guiding sub-board 142 is fixed on one side of the supporting sub-board 141 facing the substrate 11, the supporting sub-board 141 is adapted to the opening of the air guiding groove 152, and the bottom end of the guiding sub-board 142 is fixedly connected with the heat sink 12 or the substrate 11.

The guide sub-board 142 and the support sub-board 141 form a heat dissipation channel having an air inlet communicating with the mounting groove 151 and an air outlet communicating with a gap between the heat sink 12 located outside the mounting groove 151.

Further, the heat dissipation fan 13 is used for blowing external air to the substrate 11, so that the external air blown to the substrate 11 enters the air inlet under the guidance of the substrate 11 and the heat dissipation fins 12; the heat dissipation path serves to send outside air entering the heat dissipation path into gaps between the heat dissipation fins 12 located outside the mounting groove 151 through the air outlet.

In this embodiment, the supporting sub-board 141 is a board placed horizontally, the guiding sub-board 142 is perpendicular to the supporting sub-board 141, the supporting sub-board 141 and the guiding sub-board 142 are integrally formed, and the material is aluminum. The support sub-board 141 is used for closing the opening of the air guiding groove 152, and the guide sub-board 142 is used for dividing the air guiding groove 152 into two heat dissipation channels, namely a first sub-channel 1521 and a second sub-channel 1522.

Specifically, the first sub-channel 1521 is located on the right side of the guiding sub-board 142, and the air inlet of the first sub-channel 1521 is communicated with the right side mounting groove 151, and the air outlet of the first sub-channel 1521 is communicated with the gaps between the near-area cooling fins on the front and rear sides of the right side mounting groove 151; the second sub-channel 1522 is located at the left side of the guide sub-board 142, and the air inlet of the second sub-channel 1522 is communicated with the left side mounting groove 151, and the air outlet of the second sub-channel 1522 is communicated with the gaps between the far-zone cooling fins respectively located at the front side and the rear side of the right side mounting groove 151. Wherein the near-area radiating fins are the front N radiating fins 12 closest to the mounting groove 151 in the front and rear radiating fins 12 of the mounting groove 151, N is a positive integer greater than or equal to 2, and the far-area radiating fins are the radiating fins 12 except the near-area radiating fins in the front and rear radiating fins 12 of the mounting groove 151.

By arranging the air deflector 14, the heat radiation efficiency of the heat radiation fins 12 can be improved, and meanwhile, the guide sub-boards 142 can separate the air channels of the heat radiation fans 13 at two sides, so that the influence of convection of the air channels is avoided.

In an alternative embodiment, the air inlet of the cooling fan 13 is fixedly provided with a protection net 16. Referring to fig. 4, the heat dissipating device 1 further includes: a first heat pipe 17. The first heat conduction pipe 17 is located at one side of the substrate 11 away from the cooling fins 12, and the first heat conduction pipe 17 is fixedly connected with the substrate 11 and is attached to the lower surface of the substrate 11. By providing the first heat pipe 17, the heat dissipation efficiency of the heat dissipation device 1 to the electronic device in the chassis can be further improved.

In this alternative embodiment, the side of the substrate 11 facing away from the heat sink 12 is provided with a first heat conducting groove 111. The first heat conduction groove 111 is adapted to the first heat conduction pipe 17. By providing the first heat conduction groove 111, the contact area between the first heat conduction pipe 17 and the substrate 11 can be increased, and the heat dissipation efficiency of the electronic device can be improved.

Further, the first heat conductive pipe 17 includes a plurality of first heat conductive sub-pipes 171 and a plurality of second heat conductive sub-pipes 172. The plurality of first heat conductive sub-pipes 171 are arranged along the length direction of the heat sink 12, and the arrangement direction of the plurality of second heat conductive sub-pipes 172 is identical to the arrangement direction of the plurality of heat sink 12. The longitudinal direction of the fin 12 is the left-right direction.

In this alternative embodiment, the first heat conduction sub-tube 171 is a straight short first heat conduction tube 17, the second heat conduction sub-tube 172 is a C-shaped first heat conduction tube 17, and the number of the first heat conduction tubes 17 is six, and the number of the second heat conduction sub-tubes 172 is two. Each second heat conduction sub-tube 172 surrounds three first heat conduction sub-tubes 171, and the openings of the two second first heat conduction sub-tubes 17 are opposite, and the first heat conduction sub-tubes 171 and the second heat conduction sub-tubes 172 are symmetrically distributed along the central axis of the left-right direction of the substrate 11.

By limiting the distribution positions of the first heat conduction sub-tubes 171 and the second heat conduction sub-tubes 172, the heat in the middle of the lower portion of the substrate 11 can be quickly conducted to the edge portion of the substrate 11, and the electronic devices located in the middle area right below the substrate 11 can be more fully cooled.

The heat dissipation device 1 provided by the utility model has a simple structure and reasonable space layout, and the heat dissipation efficiency of the heat dissipation fins 12 is improved by arranging the heat dissipation fans 13 and the air deflectors 14 on the heat dissipation fins 12, so that the heat dissipation requirements of a case can be met without conveying the air conveyed by the heat dissipation fans 13 into the case 2, and meanwhile, the case 2 is not required to be provided with a vent, so that the protection level of the case 2 is ensured, and the case can be suitable for scenes with severe environments.

In a second aspect, an embodiment of the present utility model provides a chassis, referring to fig. 2, 5 and 6, the chassis including: a case 2 and a heat dissipating device 1 as in the first aspect. The base plate 11 is fixedly connected with the box body 2, and the radiating fins 12 are positioned on one side of the base plate 11, which is away from the box body 2.

In this embodiment, the chassis has a hexahedral structure, where the chassis is configured. The opening of the case 2 faces upward, and the base plate 11 is adapted to the opening of the case 2 facing upward and serves as a top cover of the case.

Further, the case 2 is composed of a bottom cover heat dissipating assembly 21, a left side heat dissipating assembly 22, a right side heat dissipating assembly 23, a front panel assembly 24, and a rear panel assembly 25, and detachable connection is achieved between the bottom cover heat dissipating assembly 21, the left side heat dissipating assembly 22, the right side heat dissipating assembly 23, the front panel assembly 24, and the rear panel assembly 25 by screws. The bottom cover heat dissipation assembly 21, the left side heat dissipation assembly 22 and the right side heat dissipation assembly 23 are each composed of a panel and a plurality of fins, and the fins are located on the outer side of the panel.

The upper surface of the panel in the bottom cover heat dissipation assembly 21 is provided with a second heat conduction groove 211, and the second heat conduction groove 211 is internally fixedly provided with a second heat conduction pipe 18. In this embodiment, the second heat conduction pipe 18 has the same structure as the first heat conduction pipe 17, and is a heat conduction copper pipe; the second heat conductive groove 211 has the same structure as the first heat conductive groove 111.

Referring to fig. 7, 8 and 9, the chassis further includes: the display device comprises a mounting frame 31, a CPU32 (processor), a first heat conducting block 33, a main board 34, a display card 35, a second heat conducting block 36, a power board 37, an AI (artificial intelligence) accelerator card and a third heat conducting block 39.

The mounting frame 31 is located at the left and right sides of the case 2 and is fixedly connected with the left side heat dissipation assembly 22 and the right side heat dissipation assembly 23 through screws respectively. The CPU32 is disposed on the bottom surface of the motherboard 34, and the first heat conductive block 33 is disposed between the CPU32 and the second heat conductive pipe 18 and contacts the CPU32 and the second heat conductive pipe 18, respectively. So that the CPU32 can cause most of the heat generated by itself to the second heat conductive pipe 18 through the first heat conductive block 33 and dissipate the heat through the bottom cover heat dissipation assembly 21. The high-performance display card 35 is placed on the front surface of the main board 34, and most of heat generated by the display card is dissipated through the heat dissipating device 1 by the second heat conducting block 36 above. Therefore, a fan used by the display card 35 does not need to be arranged in the box body 2 independently, so that the inside of the whole machine has good sealing performance.

In the present embodiment, the graphic card 35 and the second heat conduction block 36 are located on the right side of the air guide plate 14. So can make display card 35 make full use of the advantage that heat abstractor 1 right side radiating efficiency is relatively higher to dispel the heat.

The power panel 37 is plugged and connected with the main board 34 through the golden finger slot. The heating device on the right side of the power panel 37 is connected with the right side heat dissipation assembly 23 through a heat conduction pad, and the heat is conducted out of the chassis by means of the right side heat dissipation assembly 23. AI accelerator card 38 is mounted in a slot on the front side of motherboard 34 and is connected to left side heat sink assembly 22 by a third heat block 39, and conducts heat out of the chassis through left side heat sink assembly 22.

The utility model realizes the modular design of the power panel 37 and the AI accelerator card 38 by respectively connecting the power panel 37 and the AI accelerator card 38 with the main board 34 in a slot mode, and simultaneously realizes the rapid maintenance and replacement of the power panel 37 and the AI accelerator card 38 by arranging the left side radiating component 22 and the right side radiating component 23.

The chassis has reasonable space layout and meets the use requirements of high power consumption, high reliability and small volume. The heat dissipation fan 13 is arranged externally, so that the reliability of the whole machine is improved, meanwhile, the heat dissipation requirement of electronic devices in the machine case is guaranteed, in addition, the high-power dissipation requirement is further guaranteed through side heat dissipation and the heat conduction pipe, and the space utilization rate of the machine case is improved; the modularized design of the electronic device in the case realizes independent heat dissipation of the electronic device, and the spatial positions among the modules are not affected, so that the electronic device is convenient to maintain and replace.

In the description of the present specification, reference to the terms "some embodiments," "other embodiments," "desired embodiments," and the like, means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, schematic descriptions of the above terms do not necessarily refer to the same embodiment or example.

The technical features of the above embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The foregoing examples illustrate only a few embodiments of the utility model and are described in detail herein without thereby limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.

Claims (10)

1. A heat sink, comprising: the cooling device comprises a substrate, a plurality of cooling fins, at least one cooling fan and an air deflector;

the plurality of radiating fins are arranged on the substrate at intervals, the plurality of radiating fins are surrounded to form a mounting groove and an air guide groove, and the mounting groove is communicated with the air guide groove;

the opening of the mounting groove and the opening of the air guide groove are both away from the substrate, and the cooling fan is fixedly arranged in the mounting groove;

the air deflector is positioned in the air guiding groove, and the cooling fan is used for blowing outside air to the base plate, so that the outside air blown to the base plate is guided into gaps between the cooling fins positioned outside the mounting groove under the action of the air deflector.

2. The heat dissipating device of claim 1, wherein a bottom surface of the air guiding groove is a surface of the substrate, and a bottom surface of the mounting groove is the surface of the substrate.

3. The heat dissipating device of claim 1, wherein the mounting groove is formed by recessing the heat sink toward the substrate, and the depth of the air guiding groove is greater than or equal to the depth of the mounting groove.

4. The heat dissipating device of claim 1, wherein the air guiding groove penetrates through a plurality of the heat dissipating fins, and a length direction of the air guiding groove intersects with an arrangement direction of the plurality of the heat dissipating fins.

5. The heat dissipating device of claim 1, wherein the number of the heat dissipating fans is plural, and the plural heat dissipating fans are located at two sides of the air guiding groove, respectively.

6. The heat sink of claim 1, wherein the air deflector comprises: supporting the sub-board and guiding the sub-board;

the guide sub-board is fixed on one side of the support sub-board, which faces the base plate, the support sub-board is matched with the opening of the air guide groove, and the guide sub-board is fixedly connected with the radiating fin or the base plate.

7. The heat dissipating device of claim 6, wherein the guide sub-plate and the support sub-plate form a heat dissipating channel having an air inlet communicating with the mounting groove and an air outlet communicating with a gap between the heat dissipating fins located outside the mounting groove;

the heat radiation fan is used for blowing outside air to the substrate so that the outside air blown to the substrate enters the air inlet under the guidance of the substrate and the heat radiation fins;

the heat dissipation channel is used for sending outside air entering the heat dissipation channel to gaps between the heat dissipation fins located outside the mounting groove through the air outlet.

8. The heat dissipating device of any one of claims 1 to 7, further comprising: a first heat conduction pipe;

the first heat conduction pipe is located on one side, away from the radiating fins, of the substrate, and the first heat conduction pipe is fixedly connected with the substrate.

9. The heat dissipating device of claim 8, wherein the first heat conducting tube comprises a plurality of first heat conducting sub-tubes and a plurality of second heat conducting sub-tubes, the plurality of first heat conducting sub-tubes being arranged along a length direction of the heat sink, the plurality of second heat conducting sub-tubes being arranged in a direction consistent with the plurality of heat sink arranging directions.

10. A chassis, comprising: a case and a heat dissipating device as defined in any one of claims 1 to 9;

the base plate is fixedly connected with the box body, and the radiating fin is positioned on one side of the base plate, which is away from the box body.