CN210899817U - Circuit board module with high-efficiency heat dissipation - Google Patents

Circuit board module with high-efficiency heat dissipation Download PDF

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Publication number
CN210899817U
CN210899817U CN201922090033.0U CN201922090033U CN210899817U CN 210899817 U CN210899817 U CN 210899817U CN 201922090033 U CN201922090033 U CN 201922090033U CN 210899817 U CN210899817 U CN 210899817U
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China
Prior art keywords
circuit board
heat dissipation
heat
supporting seat
cavity
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CN201922090033.0U
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Chinese (zh)
Inventor
申鹏弘
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Shenzhen Youchuangxin Electronic Co ltd
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Shenzhen Youchuangxin Electronic Co ltd
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Abstract

The utility model discloses a circuit board module with high-efficiency heat dissipation, which comprises a supporting seat and a circuit board body, wherein the top of the supporting seat is provided with a clamping groove, the circuit board body is arranged in the clamping groove, the circuit board body is internally provided with second heat conducting bars with equal distance, both ends of the second heat conducting bars are respectively positioned in the same vertical plane with the corresponding two side walls of the circuit board body, the circuit board body is internally provided with through holes with vertical directions with equal distance outside the second heat conducting bars, the through holes are internally clamped with first heat conducting bars, the top and the bottom of the first heat conducting bars are respectively flushed with the top and the bottom of the circuit board body, the supporting seat is internally provided with a cavity, a heat dissipation mechanism is arranged in the cavity, the bottom of the circuit board body is fixedly provided with a heat dissipation fin, the whole body of the heat dissipation fin is in an L-shaped structure, one end of the, realize circulation efficient heat dissipation, be convenient for the protection circuit board.

Description

Circuit board module with high-efficiency heat dissipation
Technical Field
The utility model relates to a circuit board technical field specifically is a high-efficient radiating circuit board module.
Background
The circuit board is a product of the development of the electronic technology towards high speed, multifunction, large capacity and small volume, along with the continuous development of the electronic technology, especially the wide and deep application of large-scale and super-large scale integrated circuits, the circuit board is rapidly developing towards the direction of high density, high precision and high numeralization, and meanwhile, a plurality of circuit boards are integrated with a plurality of additional components to form a modular structure, so that the performance is improved, and the circuit board is convenient to disassemble and assemble.
The existing circuit board has poor heat dissipation effect, the space on the circuit board is narrow and small, electronic elements are distributed densely, most of heat is difficult to dissipate in time, the heat accumulation inside the circuit board is too much, the service life of the circuit board is greatly shortened due to burnout, and therefore, the circuit board module capable of dissipating heat efficiently is provided.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a high-efficient radiating circuit board module to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a high-efficient radiating circuit board module, includes supporting seat and circuit plate body, the draw-in groove has been seted up at the supporting seat top, and installs the circuit plate body in the draw-in groove, the second heat conduction stick is installed to the internal equidistance of circuit board, and the both ends of second heat conduction stick are located same vertical face with the corresponding both sides wall of circuit plate body respectively, the through-hole of vertical direction is seted up to the internal second heat conduction stick outside equidistance of circuit board, and the joint has first heat conduction stick in the through-hole, the top and the bottom of first heat conduction stick flush with the top and the bottom of circuit plate body respectively, seted up the cavity in the supporting seat, and.
Preferably, the bottom fixed mounting of circuit plate body has the fin, and the whole L shape structure that becomes of fin, the one end of first heat conduction stick and second heat conduction stick all is connected with the fin surface, the fin is located the cavity, the inside one end fixed mounting of cavity has radiator fan, the gas vent has been seted up to one side that the supporting seat is located radiator fan, the air inlet has been seted up to the bottom equidistance of cavity.
Preferably, the inner walls of the air inlet and the air outlet are fixedly connected with dust screens.
Preferably, the circuit board body corresponds both sides wall symmetry fixedly connected with blotter, the circuit board body passes through the blotter joint in the draw-in groove at supporting seat top.
Preferably, the bottom that the supporting seat corresponds the both sides wall all is provided with the flange, and the flange sets up to integral type structure with the supporting seat, the mounting hole of vertical direction is seted up to the top symmetry of flange.
Preferably, two corresponding side walls on the outer side of the cooling fan are in fit connection with two corresponding inner walls of the cavity, and the top and the bottom of the cooling fan are respectively in fit connection with the bottom and the top of the inner wall of the cavity.
Preferably, a heat dissipation port is formed in one side, away from the heat dissipation fan, of the support seat, and the end portion of the second heat conduction rod on one side wall of the circuit board body is communicated with the outside through the heat dissipation port.
Preferably, the diameter of the first heat conduction rod is smaller than that of the second heat conduction rod.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the utility model discloses a set up first heat conduction stick and second heat conduction stick inside the circuit board body, the inside first heat conduction stick and the second heat conduction stick of circuit board body are in the vertically state, the both ends of first heat conduction stick pass the both sides wall of circuit board body, the top and the bottom of first heat conduction stick also pass circuit board body and external intercommunication, and the intensive electronic component of distribution contacts with first heat conduction stick on the circuit board body, first heat conduction stick can be with heat transfer to fin on the one hand, on the other hand can be with heat conduction to second heat conduction stick department, again by second heat conduction stick with heat conduction to fin department, can high-efficiently quick dispel the heat of circuit board body inside, the protection circuit board of being convenient for.
2. The utility model discloses a fixed mounting to the supporting seat can be realized to the mounting hole, can carry out the heat dissipation of certain degree through the thermovent, through control radiator fan work, in the radiator fan work takes out external cold wind to the cavity through the air inlet, the continuous flow of cold wind realizes the quick heat dissipation to the fin, and radiator fan work passes through the gas vent with the inside hot-blast discharge that passes through of cavity, realizes the high-efficient radiating effect of circulation.
Drawings
FIG. 1 is a schematic structural view of the overall cross-sectional view of the present invention;
fig. 2 is a schematic structural diagram of a cross-sectional view of a top view of the circuit board body according to the present invention.
In the figure: 1. a supporting seat; 2. a circuit board body; 3. a first thermally conductive rod; 4. a second thermally conductive rod; 5. a cushion pad; 6. a heat sink; 7. a heat radiation fan; 8. a convex plate; 9. a heat dissipation port; 10. a cavity; 11. an exhaust port; 12. an air inlet; 13. a dust screen; 14. mounting holes; 15. a heat dissipation mechanism.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-2, the present invention provides a technical solution: the utility model provides a high-efficient radiating circuit board module, includes supporting seat 1 and circuit plate body 2, the draw-in groove has been seted up at 1 top of supporting seat, and installs circuit plate body 2 in the draw-in groove, second heat conduction stick 4 is installed to the equidistance in the circuit plate body 2, and the both ends of second heat conduction stick 4 are located same vertical face with the corresponding both sides wall of circuit plate body 2 respectively, the through-hole of vertical direction is seted up to 4 outside equidistance of second heat conduction stick in the circuit plate body 2, and the joint has first heat conduction stick 3 in the through-hole, the top and the bottom of first heat conduction stick 3 flush with the top and the bottom of circuit plate body 2 respectively, cavity 10 has been seted up in the supporting seat 1, and is provided with.
The bottom fixed mounting of circuit plate body 2 has fin 6, and the whole L shape structure that becomes of fin 6, the one end of first heat conduction stick 3 and second heat conduction stick 4 all with fin 6 surface connection, fin 6 is located cavity 10, the inside one end fixed mounting of cavity 10 has radiator fan 7, gas vent 11 has been seted up to one side that supporting seat 1 is located radiator fan 7, air inlet 12 has been seted up to the bottom equidistance of cavity 10, when dispelling the heat, controls radiator fan 7 work through the control system who sets up, makes external wind get into cavity 10 through air inlet 12 in, makes the inside steam of cavity 10 discharge through gas vent 11, realizes the radiating effect of circulation.
The inner walls of the air inlet 12 and the air outlet 11 are fixedly connected with dust screens 13 to prevent dust from entering the cavity 10.
The equal symmetry fixedly connected with blotter 5 of both sides wall is corresponded to circuit plate body 2, circuit plate body 2 plays better buffering effect in the draw-in groove at supporting seat 1 top through 5 joints of blotter, is convenient for protect circuit plate body 2.
The bottom that supporting seat 1 corresponds the both sides wall all is provided with flange 8, and flange 8 sets up to the integral type structure with supporting seat 1, the mounting hole 14 of vertical direction is seted up to the top symmetry of flange 8, is convenient for realize fixing supporting seat 1 through the fixed screw.
The two corresponding side walls on the outer side of the cooling fan 7 are attached to the two corresponding inner walls of the cavity 10, the top and the bottom of the cooling fan 7 are respectively attached to the bottom and the top of the inner wall of the cavity 10, air can be sucked into the cavity 10 through the air inlet 12 in the working process of the cooling fan 7, heat dissipation of the cooling fins 6 can be achieved through wind energy entering the cavity 10, and then hot air is exhausted to the outside through the air outlet 11, so that good heat dissipation is achieved.
A heat dissipation port 9 is formed in one side, away from the heat dissipation fan 7, of the supporting seat 1, and the end portion of the second heat conduction rod 4 on one side wall of the circuit board body 2 is communicated with the outside through the heat dissipation port 9, so that heat dissipation is facilitated.
The diameter of the first heat conduction rod 3 is smaller than that of the second heat conduction rod 4, so that the first heat conduction rod 3 is connected with the second heat conduction rod 4 conveniently.
The working principle is as follows: the circuit board body 2 is internally provided with a first heat conduction rod 3 and a second heat conduction rod 4, the first heat conduction rod 3 and the second heat conduction rod 4 in the circuit board body 2 are in a vertical state, two ends of the first heat conduction rod 3 penetrate through two side walls of the circuit board body 2, the top and the bottom of the first heat conduction rod 3 also penetrate through the circuit board body 2 to be communicated with the outside, electronic elements densely distributed on the circuit board body 2 are contacted with the first heat conduction rod 3, the first heat conduction rod 3 can transmit heat to the radiating fin 6 on one hand, the heat can be transmitted to the second heat conduction rod 4 on the other hand, the heat is transmitted to the radiating fin 6 by the second heat conduction rod 4, a radiating port 9 can carry out heat radiation to a certain degree, the radiating fan 7 is controlled to work, external cool air is pumped into the cavity 10 through the air inlet 12 during the work of the radiating fan 7, and the continuous flow of the cool air realizes the quick heat radiation of the radiating fin, the heat radiation fan 7 operates to discharge the hot air inside the cavity 10 through the exhaust port 11.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (8)

1. The utility model provides a high-efficient radiating circuit board module, includes supporting seat (1) and circuit board body (2), its characterized in that: the draw-in groove has been seted up at supporting seat (1) top, and installs circuit plate body (2) in the draw-in groove, second heat conduction stick (4) are installed to equidistance in circuit plate body (2), and the both ends of second heat conduction stick (4) are located same vertical face with the corresponding both sides wall of circuit plate body (2) respectively, the through-hole of vertical direction is seted up to the equidistance in second heat conduction stick (4) outside in circuit plate body (2), and the joint has first heat conduction stick (3) in the through-hole, the top and the bottom of first heat conduction stick (3) flush with the top and the bottom of circuit plate body (2) respectively, cavity (10) have been seted up in supporting seat (1), and be provided with heat dissipation mechanism (15) in cavity (10).
2. The circuit board module with high heat dissipation efficiency as recited in claim 1, wherein: the circuit board comprises a circuit board body (2), wherein a radiating fin (6) is fixedly mounted at the bottom of the circuit board body (2), the whole radiating fin (6) is of an L-shaped structure, one ends of a first heat conducting rod (3) and a second heat conducting rod (4) are connected with the surface of the radiating fin (6), the radiating fin (6) is located in a cavity (10), a radiating fan (7) is fixedly mounted at one end of the inner portion of the cavity (10), an exhaust port (11) is formed in one side, located on the radiating fan (7), of a supporting seat (1), and an air inlet (12) is formed in the bottom of the cavity (10) at equal.
3. The circuit board module with high heat dissipation efficiency as set forth in claim 2, wherein: and the inner walls of the air inlet (12) and the air outlet (11) are fixedly connected with dust screens (13).
4. The circuit board module with high heat dissipation efficiency as recited in claim 1, wherein: the circuit board body (2) corresponds equal symmetry fixedly connected with blotter (5) of both sides wall, circuit board body (2) pass through blotter (5) joint in the draw-in groove at supporting seat (1) top.
5. The circuit board module with high heat dissipation efficiency as recited in claim 1, wherein: the bottom that supporting seat (1) corresponds the both sides wall all is provided with flange (8), and flange (8) set up formula structure as an organic whole with supporting seat (1), mounting hole (14) of vertical direction are seted up to the top symmetry of flange (8).
6. The circuit board module with high heat dissipation efficiency as set forth in claim 2, wherein: two corresponding side walls on the outer side of the heat dissipation fan (7) are attached to two corresponding inner walls of the cavity (10), and the top and the bottom of the heat dissipation fan (7) are respectively attached to the bottom and the top of the inner wall of the cavity (10).
7. The circuit board module with high heat dissipation efficiency as recited in claim 1, wherein: a heat dissipation opening (9) is formed in one side, away from the heat dissipation fan (7), of the supporting seat (1), and the end portion of the second heat conduction rod (4) on one side wall of the circuit board body (2) is communicated with the outside through the heat dissipation opening (9).
8. The circuit board module with high heat dissipation efficiency as recited in claim 1, wherein: the diameter of the first heat-conducting rod (3) is smaller than that of the second heat-conducting rod (4).
CN201922090033.0U 2019-11-28 2019-11-28 Circuit board module with high-efficiency heat dissipation Active CN210899817U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201922090033.0U CN210899817U (en) 2019-11-28 2019-11-28 Circuit board module with high-efficiency heat dissipation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201922090033.0U CN210899817U (en) 2019-11-28 2019-11-28 Circuit board module with high-efficiency heat dissipation

Publications (1)

Publication Number Publication Date
CN210899817U true CN210899817U (en) 2020-06-30

Family

ID=71317169

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201922090033.0U Active CN210899817U (en) 2019-11-28 2019-11-28 Circuit board module with high-efficiency heat dissipation

Country Status (1)

Country Link
CN (1) CN210899817U (en)

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