CN218976912U - Capacitor circuit board with ladder structure - Google Patents

Abstract

The utility model relates to the technical field of capacitor circuit boards and discloses a capacitor circuit board with a stepped structure, which comprises a first substrate, wherein a second substrate is pressed on the top side of the first substrate, a first stepped groove is formed in the top side of the second substrate, a capacitor element is arranged on the inner side of the first stepped groove, a third substrate is connected on the top side of the second substrate through pressing, and a second stepped groove is formed in the top side of the third substrate. This ladder structure's electric capacity circuit board carries the discharge through conducting strip one, conducting bar, conducting strip two with the heat conduction on the circuit board to radiating fin on, forms the convection current through two fans simultaneously for the wind direction flows from left to right, carries the discharge to the waste heat on electronic component and the circuit board, and ladder structure installs base plate one, base plate two, base plate three are favorable to the layering erection joint to electronic component, make the level clear between the electronic component, increase the radiating effect.

Description

Capacitor circuit board with ladder structure

Technical Field

The utility model relates to the technical field of capacitor circuit boards, in particular to a capacitor circuit board with a ladder structure.

Background

The names of the circuit boards are: ceramic circuit boards, alumina ceramic circuit boards, aluminum nitride ceramic circuit boards, PCB boards, aluminum substrates, high frequency boards, thick copper plates, impedance boards, PCB, ultra-thin circuit boards, printed circuit boards, and the like.

In the process of using the capacitor circuit board, the electronic component easily generates a large amount of heat, if the electronic component is not timely cooled, the circuit board and the electronic component are easily damaged by temperature influence, short circuit, poor contact and the like are generated, and meanwhile, the electronic component on the circuit board is more, the phenomenon that the heat dissipation is blocked and the complete heat dissipation cannot be realized is easily caused after the electronic component is installed.

The prior art scheme (Chinese patent publication No. CN 201620740572.8) discloses a novel circuit board structure capable of radiating heat in multiple directions, and the heat absorption sheet can absorb heat generated when the circuit board works; the heat conducting sheets are arranged on two sides of the heat absorbing sheet, and the heat absorbed by the heat conducting sheets can be conducted; the heat dissipation device has the advantages that the heat dissipation device is characterized in that the heat dissipation device is provided with the heat dissipation devices on the two sides of the heat conduction fins, heat dissipation of conduction of the heat conduction fins is achieved through the heat dissipation devices, the heat dissipation efficiency is high, the heat dissipation effect is good, and compared with the prior art, the heat dissipation device has the advantages that the heat dissipation effect is good, but due to the fact that the circuit board is provided with more electronic components, disorder is easily caused, heat dissipation is hindered, and the heat dissipation devices are independently conducted through the heat absorption fins and the heat dissipation devices, so that part of electronic components cannot be completely dissipated, and the circuit board is easily damaged.

Disclosure of Invention

The utility model aims to provide a capacitor circuit board with a ladder structure, which solves the problems that in the prior art, a large amount of heat is easily generated by an electronic element in the process of using the capacitor circuit board, the circuit board and the electronic element are easily damaged by temperature influence, short circuit, poor contact and the like caused by untimely heat dissipation, and meanwhile, the heat dissipation is easily blocked after the installation because of more electronic elements on the circuit board, and the phenomenon of incomplete heat dissipation cannot be solved.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a capacitor circuit board of ladder structure, includes base plate one, there is base plate two base plate one the topside of base plate one through the pressfitting, step groove one has been seted up to base plate two the topside, step groove one's inboard is provided with capacitive element, base plate two the topside is connected with base plate three through the pressfitting, step groove two has been seted up to base plate three the topside, step groove two's inboard is provided with the chip, step hole has been seted up to base plate one's bottom side, base plate three's left side is provided with the insulating piece, insulating piece's inboard is provided with the conducting strip one, conducting strip one's bottom side fixed mounting has the heat conduction post, base plate two's right side fixed mounting has the limiting plate, base plate one's bottom side is connected with the heating panel through card heating panel, free radiating fin is established to the inboard of radiating fin, radiating fin's right side fixed mounting has the conducting strip two, and conducting strip, conducting strip two are with the heat on the circuit board to the radiating fin carries out the discharge through two fans, form the convection current for the base plate one to carrying the electronic device, the electronic device is connected to the electronic device through the layer, and the electronic device is connected to the electronic device is clearly to the side of the electronic device.

Preferably, the top side of the second substrate is provided with a plurality of first stepped grooves, the top side of the second substrate is provided with a plurality of stepped holes, and the two stepped holes are used as a group, so that the electronic components can be mounted through the first stepped grooves, and meanwhile, the electronic components can be connected through the stepped holes.

Preferably, the insulating block is always provided with two insulating blocks, and is respectively installed on the left side and the right side of the substrate III, and the insulating block is of an inclined structure, so that insulation is facilitated, and wind direction flowing is facilitated.

Preferably, the heat conducting fin is provided with two groups in total, and two heat conducting columns are fixedly arranged at the bottom side of each heat conducting fin, so that heat conduction is facilitated.

Preferably, the overhead side of heating panel has seted up the spread groove, four have always been seted up to the spread groove, and size shape and heat conduction post phase-match are favorable to carrying out spacingly to the heat conduction post.

Preferably, the limiting groove is formed in the top side of the heat dissipation plate, the size of the limiting groove is matched with that of the limiting plate, a fan is arranged in the top side of the heat dissipation plate, and the fans are always arranged in two ways, so that heat is taken out by airflow.

Compared with the prior art, the utility model has the beneficial effects that: this ladder structure's electric capacity circuit board carries the discharge through conducting strip one, conducting rod, conducting strip two conduct the heat on the circuit board to radiating fin on, simultaneously, form the convection current through two fans for the wind direction flows from left to right, carries the discharge to the waste heat on electronic component and the circuit board, and the base plate one, base plate two, the base plate three of installing through ladder structure are favorable to installing the connection to electronic component layering simultaneously for the level is clear between the electronic component, increases the radiating effect.

Drawings

In order to more clearly illustrate the technical solutions of the inventive embodiments of the present utility model, the drawings that are needed in the embodiments will be briefly described below, it being obvious that the drawings in the following description are only examples of the inventive embodiments of the present utility model, and that other drawings can be obtained according to these drawings without the need of inventive effort for a person skilled in the art.

FIG. 1 is a schematic perspective view of an embodiment of the present utility model;

FIG. 2 is a schematic cross-sectional elevation view of an embodiment of the present utility model;

FIG. 3 is a schematic bottom view of a substrate according to an embodiment of the utility model;

fig. 4 is a schematic right-side sectional view of an embodiment of the present utility model.

In the figure: 1. a first substrate; 2. a second substrate; 3. step groove I; 4. a capacitive element; 6. A third substrate; 7. step groove II; 8. a chip; 9. a stepped hole; 10. an insulating block; 11. a first heat conductive sheet; 12. a heat conducting column; 13. a limiting plate; 14. a heat dissipation plate; 15. a heat radiation fin; 16. a second heat conducting sheet; 1401. a connecting groove; 1402. a limit groove; 1403. a blower.

Description of the embodiments

In order to make the objects, technical solutions and advantages of the inventive embodiments of the present utility model more apparent, the inventive implementation routine will be described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the present utility model.

In the description of the inventive embodiments, it should be understood that the directions or positional relationships indicated by the terms "upper", "lower", "front", "rear", "inner", "outer", etc., are based on the directions or positional relationships shown in the drawings, are merely for convenience in describing the inventive embodiments and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the inventive embodiments.

In describing embodiments of the present utility model, it should be noted that, unless explicitly stated and limited otherwise, the terms "mounted," "connected," and "coupled" should be construed broadly, and may be, for example, fixedly coupled, integrally coupled, or detachably coupled; may be a communication between the interiors of two elements; either directly or indirectly through intermediaries, the specific meaning of the terms in the inventive embodiments of the present utility model will be understood by those skilled in the art in the specific case.

Referring to fig. 1-4, a capacitor circuit board with a stepped structure according to the embodiment of the utility model includes a first substrate 1, a second substrate 2 is pressed on the top side of the first substrate 1, a first stepped groove 3 is formed on the top side of the second substrate 2, a capacitor element 4 is disposed on the inner side of the first stepped groove 3, a third substrate 6 is connected on the top side of the second substrate 2, a second stepped groove 7 is formed on the top side of the third substrate 6, a chip 8 is disposed on the inner side of the second stepped groove 7, a stepped hole 9 is formed on the bottom side of the first substrate 1, an insulating block 10 is disposed on the left side of the third substrate 6, a first heat conducting fin 11 is disposed on the inner side of the insulating block 10, a heat conducting post 12 is fixedly mounted on the bottom side of the first heat conducting fin 11, a limiting plate 13 is fixedly mounted on the right side of the second substrate 2, a heat radiating plate 14 is connected on the bottom side of the first substrate 1 through a clip, a free heat radiating fin 15 is disposed on the inner side of the heat radiating plate 14, a second heat conducting fin 16 is fixedly mounted on the right side of the heat radiating fin 15, and a heat conducting fin 6 is mounted on the bottom of the electronic element in a layered connection mode, thereby improving the heat radiating effect between electronic elements.

A plurality of first ladder grooves 3 are formed in the top side of the second substrate 2, a plurality of first ladder holes 9 are formed in the top side of the second substrate 2, two ladder holes 9 are formed in the top side of the second substrate, two insulating blocks 10 are arranged in a group, the insulating blocks 10 are respectively arranged on the left side and the right side of the third substrate 6, the insulating blocks 10 are of inclined structures, two groups of heat conducting fins 11 are respectively arranged in a group, two heat conducting columns 12 are fixedly arranged on the bottom side of each heat conducting fin 11, and heat on a circuit board is conducted to the heat radiating fins 15 through the heat conducting fins 11 by the heat conducting columns 12 and the heat conducting fins 16 to be discharged and radiated.

The spread groove 1401 has been seted up to the top side of heating panel 14, four have always been seted up to the spread groove 1401, and size shape and heat conduction post 12 phase-match, the spacing groove 1402 has been seted up to the top side of heating panel 14, and the size of spacing groove 1402 agrees with limiting plate 13, the top side of heating panel 14 is provided with fan 1403, and fan 1403 always is provided with two, form the convection current through two fans 1403 for the wind direction flows from left to right, carries the discharge to the waste heat on electronic component and the circuit board.

During installation, the capacitor element 4 and the chip 8 are installed in the first step groove 3 and the second step groove 7, then the capacitor circuit board is formed by connecting the capacitor element and the chip through the step holes 9, then the circuit board is clamped on the heat dissipation plate 14 by holding the limiting plate 13, and the heat conduction column 12 is aligned with the connecting groove 1401 in the clamping process and then inserted.

In the in-process of using, when circuit board and electronic component heat production, through conducting strip one 11, heat conduction post 12, conducting strip two 16 conduct the heat on the circuit board to radiating fin 15 on carry out the discharge heat dissipation, simultaneously, form the convection current through two fans 1403 for the wind direction flows from left to right, carries the discharge to the waste heat on electronic component and the circuit board, and the base plate one that installs through the ladder structure 1, base plate two 2, base plate three 6 simultaneously is favorable to connecting electronic component layering installation for the level is clear between the electronic component, increases the radiating effect.

While the basic principles of the present utility model have been shown and described, the foregoing is provided by way of illustration of a preferred embodiment of the utility model, and not by way of limitation, the foregoing embodiment and description are merely illustrative of the principles of the utility model, and any modifications, equivalents, improvements or modifications not within the spirit and scope of the utility model should be included within the scope of the utility model.

Claims (6)

1. The utility model provides a capacitive circuit board of ladder structure, includes base plate one (1), its characterized in that: the heat conducting plate comprises a first substrate (1), a second substrate (2) and a third substrate (6), wherein the first substrate (2) is pressed on the top side of the first substrate (1), the first substrate (3) is provided with a first stepped groove (3) on the top side of the first stepped groove (3), the third substrate (6) is connected on the top side of the second substrate (2) through pressing, the second stepped groove (7) is formed on the top side of the third substrate (6), a chip (8) is arranged on the inner side of the second stepped groove (7), a stepped hole (9) is formed on the bottom side of the first substrate (1), an insulating block (10) is arranged on the left side of the third substrate (6), a first heat conducting fin (11) is arranged on the inner side of the insulating block (10), a heat conducting column (12) is fixedly arranged on the bottom side of the first heat conducting fin (11), a limiting plate (13) is fixedly arranged on the right side of the second substrate (2), the bottom side of the first substrate (1) is connected with a heat radiating plate (14) through a clamp, a free radiating fin (15) is arranged on the inner side of the second heat radiating plate (16).

2. The capacitive circuit board of claim 1, wherein: a plurality of first stepped grooves (3) are formed in the top side of the second substrate (2), a plurality of stepped holes (9) are formed in the top side of the second substrate (2), and the number of the stepped holes (9) is two.

3. The capacitive circuit board of claim 2, wherein: the insulating blocks (10) are always arranged in two, are respectively arranged on the left side and the right side of the substrate III (6), and are of an inclined structure.

4. A capacitive circuit board of stepped configuration according to claim 3, characterized in that: the first heat conducting fins (11) are always provided with two groups, and two heat conducting columns (12) are fixedly arranged on the bottom side of each first heat conducting fin (11).

5. The capacitive circuit board of claim 4, wherein: the top side of heating panel (14) has seted up spread groove (1401), four have always been seted up to spread groove (1401), and size shape and heat conduction post (12) phase-match.

6. The capacitive circuit board of claim 5, wherein: limiting grooves (1402) are formed in the top side of the radiating plate (14), the size of the limiting grooves (1402) is matched with that of the limiting plates (13), fans (1403) are arranged on the top side of the radiating plate (14), and the fans (1403) are always two.

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