CN210781511U - Heat dissipation type LED circuit board - Google Patents
Heat dissipation type LED circuit board Download PDFInfo
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- CN210781511U CN210781511U CN201921565614.9U CN201921565614U CN210781511U CN 210781511 U CN210781511 U CN 210781511U CN 201921565614 U CN201921565614 U CN 201921565614U CN 210781511 U CN210781511 U CN 210781511U
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- circuit board
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- dissipation type
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Abstract
The utility model discloses a heat dissipation type LED circuit board, include: upper circuit board, lower floor's circuit board and set up the intermediate layer heating panel between upper and lower layer circuit board, the top surface of upper circuit board is provided with the electronic component, upper circuit board, lower floor's circuit board are through the baffle welding of both sides one integrated into one structure, the block is connected between intermediate layer heating panel and upper circuit board, the lower floor's circuit board, the intermediate layer heating panel is including setting up in the upper heat sink of upper circuit board below, setting up in the lower fin of lower floor's circuit board top and setting up a plurality of heat dissipation posts between upper and lower fin perpendicularly. The utility model discloses form hollow structure between upper circuit board, the lower floor's circuit board, for the LED circuit board provides a heat dissipation channel, the radiating effect of LED circuit board has been improved in the setting of intermediate layer heating panel.
Description
Technical Field
The utility model relates to a technical field of circuit board especially relates to a heat dissipation type LED circuit board.
Background
The circuit board comprises a ceramic circuit board, an alumina ceramic circuit board, an aluminum nitride ceramic circuit board, a PCB board, an aluminum substrate, a high-frequency board, a thick copper board, an impedance board, a PCB, an ultrathin circuit board, a printed (copper etching technology) circuit board and the like. The circuit board enables the circuit to be miniaturized and visualized, and plays an important role in batch production of fixed circuits and optimization of electric appliance layout. The circuit board with the FPC characteristic and the PCB characteristic is formed by combining the procedures of pressing and the like according to the relevant process requirements.
Because the circuit board of the LED lamp has a small volume, it is impossible to mount large heat dissipation equipment for heat dissipation, and therefore, an LED circuit board with good heat dissipation performance needs to be provided.
SUMMERY OF THE UTILITY MODEL
The utility model discloses the main technical problem who solves provides a heat dissipation type LED circuit board to solve the problem that proposes in the above-mentioned background art.
In order to solve the technical problem, the utility model discloses a technical scheme be: a heat dissipating LED circuit board, comprising: upper circuit board, lower floor's circuit board and set up the intermediate layer heating panel between upper and lower layer circuit board, the top surface of upper circuit board is provided with electronic component, upper circuit board, lower floor's circuit board are through the baffle welding of both sides one integrated into one structure, the block is connected between intermediate layer heating panel and upper circuit board, the lower floor's circuit board, the intermediate layer heating panel is including setting up in the upper heat sink of upper circuit board below, setting up in the lower fin of lower floor's circuit board top and setting up a plurality of heat dissipation posts between upper and lower fin perpendicularly.
In a preferred embodiment of the present invention, horizontal sliding grooves are respectively formed on the baffles on both sides, and both ends of the interlayer heat dissipation plate protrude outwards to form snap joints, which are engaged with the horizontal sliding grooves.
In a preferred embodiment of the present invention, the horizontal sliding groove is disposed at a middle position of the baffle, and a first distance between the upper heat sink and the upper layer circuit board is substantially equal to a second distance between the lower heat sink and the lower layer circuit board.
In a preferred embodiment of the present invention, the upper circuit board and the lower circuit board are provided with heat dissipation holes.
In a preferred embodiment of the present invention, the heat dissipation holes on the upper circuit board are disposed between the electronic components.
In a preferred embodiment of the present invention, the heat dissipation holes are circular through holes or oval through holes.
In a preferred embodiment of the present invention, the outer peripheries of the upper layer circuit board and the lower layer circuit board are sleeved with rubber protective sleeves.
In a preferred embodiment of the present invention, a plurality of heat dissipation fins are uniformly arranged on the protective cover.
In a preferred embodiment of the present invention, the electronic component is connected to the upper surface of the upper circuit board by soldering.
In a preferred embodiment of the present invention, the upper heat sink, the lower heat sink and the heat-dissipating stud are welded together.
The utility model has the advantages that: a hollow structure is formed between the upper layer circuit board and the lower layer circuit board, a heat dissipation channel is provided for the LED circuit board, and a plurality of heat dissipation holes are formed in the upper layer circuit board and the lower layer circuit board, so that the heat dissipation performance is good; the arrangement of the interlayer heat dissipation plate improves the heat dissipation effect of the whole LED circuit board; in addition, heat generated by the work of the circuit board can be dissipated through the radiating fins arranged on the peripheries of the upper layer circuit board and the lower layer circuit board, and the radiating efficiency is accelerated.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained without inventive work, wherein:
fig. 1 is a schematic structural diagram of a heat dissipation type LED circuit board of the present invention;
fig. 2 is a top view of the heat dissipation type LED circuit board of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely below, and it should be apparent that the described embodiments are only some embodiments of the present invention, but not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
Referring to fig. 1-2, the present invention provides a heat dissipation type LED circuit board, including: the circuit board comprises an upper circuit board 1, a lower circuit board 2 and an interlayer heat dissipation plate 3 arranged between the upper circuit board and the lower circuit board, wherein the top surface of the upper circuit board 1 is provided with an electronic element 4, the upper circuit board and the lower circuit board are welded into an integral structure through baffles 5 at two sides, the interlayer heat dissipation plate is clamped and connected with the upper circuit board and the lower circuit board, in particular, the interlayer heat dissipation plate 3 comprises an upper heat dissipation plate 31 arranged below the upper circuit board, a lower heat dissipation plate 32 arranged above the lower circuit board and a plurality of heat dissipation columns 33 vertically arranged between the upper heat dissipation plate and the lower heat dissipation plate, when the circuit board works, heat generated by the electronic element can be dissipated through heat dissipation holes, in addition, the peripheral sleeves of the upper circuit board and the lower circuit board are provided with rubber protective sleeves 6, the circuit board can be prevented from being scratched carelessly, damage and, a plurality of radiating fins 7 are uniformly distributed on the protective sleeve 6, so that the radiating efficiency is improved.
Specifically, both sides the baffle on be provided with horizontal spout 8 respectively, horizontal spout sets up in the middle part position of plate washer 5, and first interval between last fin and the upper circuit board is roughly equal with the second interval between lower fin and the lower floor's circuit board, forms hollow structure 9 between upper circuit board, lower floor's circuit board and the intermediate layer heating panel, is linked together with the louvre, provides a heat dissipation channel for the LED circuit board, the outside protruding joint 34 that forms in both ends of intermediate layer heating panel, the joint cooperatees with horizontal spout, and the intermediate layer heating panel can make a round trip to slide in horizontal spout, and the dismouting is all very convenient.
Specifically, for better heat dissipation effect, a plurality of heat dissipation holes 10 are formed in the upper circuit board and the lower circuit board in a penetrating manner, the heat dissipation holes in the upper circuit board are formed between the electronic components, and preferably, the heat dissipation holes are circular through holes or oval through holes.
Specifically, the electronic component is connected with the upper surface of the upper circuit board by welding, and the upper heat sink, the lower heat sink and the heat dissipation column are connected by welding.
The utility model relates to a heat dissipation type LED circuit board's beneficial effect is:
1. a hollow structure is formed between the upper layer circuit board and the lower layer circuit board, a heat dissipation channel is provided for the LED circuit board, and a plurality of heat dissipation holes are formed in the upper layer circuit board and the lower layer circuit board, so that the heat dissipation performance is good;
2. the arrangement of the interlayer heat dissipation plate improves the heat dissipation effect of the whole LED circuit board;
3. in addition, heat generated by the work of the circuit board can be dissipated through the radiating fins arranged on the peripheries of the upper layer circuit board and the lower layer circuit board, and the radiating efficiency is accelerated.
The above only is the embodiment of the present invention, not limiting the patent scope of the present invention, all of which utilize the equivalent structure or equivalent flow transformation made by the content of the specification of the present invention, or directly or indirectly applied to other related technical fields, all included in the same way in the patent protection scope of the present invention.
Claims (10)
1. A heat dissipation type LED circuit board characterized by comprising: upper circuit board, lower floor's circuit board and set up the intermediate layer heating panel between upper and lower layer circuit board, the top surface of upper circuit board is provided with electronic component, upper circuit board, lower floor's circuit board are through the baffle welding of both sides one integrated into one structure, the block is connected between intermediate layer heating panel and upper circuit board, the lower floor's circuit board, the intermediate layer heating panel is including setting up in the upper heat sink of upper circuit board below, setting up in the lower fin of lower floor's circuit board top and setting up a plurality of heat dissipation posts between upper and lower fin perpendicularly.
2. The heat dissipation type LED circuit board according to claim 1, wherein horizontal sliding grooves are respectively formed in the baffles on the two sides, two ends of the interlayer heat dissipation plate protrude outwards to form clamping joints, and the clamping joints are matched with the horizontal sliding grooves.
3. The circuit board of claim 2, wherein the horizontal sliding slot is disposed at a middle position of the baffle, and a first distance between the upper heat sink and the upper circuit board is substantially equal to a second distance between the lower heat sink and the lower circuit board.
4. The heat dissipation type LED circuit board according to claim 1, wherein heat dissipation holes are formed through the upper layer circuit board and the lower layer circuit board.
5. The heat dissipation type LED circuit board of claim 4, wherein the heat dissipation holes on the upper circuit board are disposed between the electronic components.
6. The heat dissipation type LED circuit board of claim 4, wherein the heat dissipation holes are circular through holes or oval through holes.
7. The heat dissipation type LED circuit board according to claim 1, wherein the outer peripheries of the upper layer circuit board and the lower layer circuit board are sleeved with rubber protective sleeves.
8. The heat dissipation type LED circuit board according to claim 7, wherein a plurality of heat dissipation fins are uniformly arranged on the protective sleeve.
9. The heat dissipation type LED circuit board according to claim 1, wherein the electronic component is soldered to the upper surface of the upper circuit board.
10. The heat dissipation type LED circuit board of claim 1, wherein the upper heat sink, the lower heat sink and the heat dissipation post are connected by soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921565614.9U CN210781511U (en) | 2019-09-20 | 2019-09-20 | Heat dissipation type LED circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921565614.9U CN210781511U (en) | 2019-09-20 | 2019-09-20 | Heat dissipation type LED circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210781511U true CN210781511U (en) | 2020-06-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921565614.9U Active CN210781511U (en) | 2019-09-20 | 2019-09-20 | Heat dissipation type LED circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210781511U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111885814A (en) * | 2020-07-31 | 2020-11-03 | 深圳市兴达线路板有限公司 | Composite heat-conducting PCB |
-
2019
- 2019-09-20 CN CN201921565614.9U patent/CN210781511U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111885814A (en) * | 2020-07-31 | 2020-11-03 | 深圳市兴达线路板有限公司 | Composite heat-conducting PCB |
| CN111885814B (en) * | 2020-07-31 | 2024-03-22 | 深圳市盈辉达光电有限公司 | Composite heat conduction PCB circuit board |
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