CN214046141U - Quick radiating multilayer HDI circuit board - Google Patents
Quick radiating multilayer HDI circuit board Download PDFInfo
- Publication number
- CN214046141U CN214046141U CN202120161913.7U CN202120161913U CN214046141U CN 214046141 U CN214046141 U CN 214046141U CN 202120161913 U CN202120161913 U CN 202120161913U CN 214046141 U CN214046141 U CN 214046141U
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- circuit board
- hdi circuit
- hdi
- fixed mounting
- fixed
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- 230000002146 bilateral effect Effects 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 abstract description 16
- 238000009434 installation Methods 0.000 abstract description 3
- 238000005192 partition Methods 0.000 description 12
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000003044 adaptive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
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Abstract
The utility model discloses a quick radiating multilayer HDI circuit board, including first HDI circuit board and second HDI circuit board, fixed mounting has the insulating layer between first HDI circuit board and the second HDI circuit board, first HDI circuit board and second HDI circuit board are with insulating layer center upper and lower symmetric distribution, first HDI circuit board lower extreme fixed mounting has heat abstractor, the equal fixed mounting in first HDI circuit board and second HDI circuit board upper end has work component, the equal fixed mounting of first HDI circuit board and second HDI circuit board left end and right-hand member has connecting device, two heat abstractor is installed to the common interlude of connecting device upper end. A quick radiating multilayer HDI circuit board, carry out multiple heat dissipation to two HDI circuit boards through heat abstractor and heat sink to improved the life of circuit board, not only protected the HDI circuit board through connecting device and still made things convenient for its installation and dismantlement.
Description
Technical Field
The utility model relates to a HDI circuit board field, in particular to quick radiating multilayer HDI circuit board.
Background
HDI is a technique for producing printed circuit boards, and a circuit board having a relatively high line distribution density using micro-blind buried via technology. The HDI is specially designed for small-capacity users, a compact product is designed in a modularized parallel connection mode, the capacity of one module is 1000VA (height is 1U), the product is naturally cooled, 6 modules can be connected in parallel maximally, the HDI circuit board also has full-range adaptive load capacity and strong short-time overload capacity, and load power factors and peak factors can not be considered, so that the HDI circuit board has a higher position in electronic products. 1. The conventional multilayer HDI circuit board mostly depends on a radiating fin or a radiating plate for radiating heat during working, and because the HDI circuit board is installed in a narrow space, the radiating fin has a poor radiating effect, and the HDI circuit board cannot radiate heat quickly, internal working elements can be burnt out, and the service life of the HDI circuit board is shortened; 2. when the existing multilayer HDI circuit board is used, the element is exposed and is easy to damage, and the multilayer HDI circuit board is inconvenient to fix and install.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a main aim at provides a quick radiating multilayer HDI circuit board, can effectively solve the problem in the background art.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a quick radiating multilayer HDI circuit board, includes first HDI circuit board and second HDI circuit board, fixed mounting has the insulating layer between first HDI circuit board and the second HDI circuit board, first HDI circuit board and second HDI circuit board are with insulating layer central longitudinal symmetry distribution, first HDI circuit board lower extreme fixed mounting has heat abstractor, the equal fixed mounting in first HDI circuit board and second HDI circuit board upper end has working element, the equal fixed mounting of first HDI circuit board and second HDI circuit board left end and right-hand member has connecting device, two heat abstractor is installed to the common interlude of connecting device upper end.
Preferably, the heat dissipation device comprises a partition plate and two fans, wherein fixed connectors are respectively arranged at the left part and the right part of the upper end of the partition plate, two fixed columns are respectively and fixedly mounted at the left part and the right part of the lower end of the partition plate, two fans are respectively and fixedly mounted at the left end and the right end of each fan, fixed blocks are respectively and fixedly mounted at the left end and the right end of each fan, the two fans are alternately mounted at the upper end of the partition plate through the fixed connectors, and the partition plate is fixedly mounted at the upper ends of the two connecting devices through the four fixed columns.
Preferably, connecting device includes L type connecting plate, fixed screw is all installed in the interlude of L type connecting plate lower extreme front portion and lower extreme rear portion, the spread groove has all been opened to L type connecting plate upper end front portion and upper end rear portion, L type connecting plate left end upper portion and left end lower part have all been opened the circuit board fixed slot, L type connecting plate fixed mounting is at the right-hand member of first HDI circuit board and second HDI circuit board.
Preferably, the heat sink includes the fixed plate, the fin is installed to the interlude of fixed plate upper end, open the fin upper end has a plurality of louvre, fixed plate fixed mounting is at first HDI circuit board lower extreme.
Preferably, the size of the four fixing columns is consistent with that of the four connecting grooves, and the positions of the four fixing columns are up-down corresponding to those of the four connecting grooves.
Preferably, the two connecting devices are distributed in bilateral symmetry by taking the first HDI circuit board as a center.
Compared with the prior art, the utility model discloses following beneficial effect has:
1. the utility model relates to a quick radiating multilayer HDI circuit board carries out the physics heat dissipation when first HDI circuit board and second HDI circuit board are hotter through two fans on the heat abstractor, and the fin on the heat sink of second HDI circuit board lower extreme installation dispels the heat simultaneously moreover to effectual first HDI circuit board and second HDI circuit board are cooled down, thereby have improved the life of circuit board.
2. The utility model relates to a quick radiating multilayer HDI circuit board passes through the spread groove on the connecting device and is connected with the fixed column interlude of baffle lower extreme, makes the baffle protect the circuit board, and L type connecting plate on the connecting device not only fixes first HDI circuit board and second HDI circuit board simultaneously, has also made things convenient for the installation through the fixed screw moreover.
Drawings
Fig. 1 is a schematic view of the overall structure of a multilayer HDI circuit board with rapid heat dissipation according to the present invention;
fig. 2 is a schematic view of the overall structure of the heat dissipation device for a multilayer HDI circuit board with rapid heat dissipation according to the present invention;
fig. 3 is a schematic view of the overall structure of the connecting device of the multilayer HDI circuit board with rapid heat dissipation according to the present invention;
figure 4 is the utility model relates to a quick radiating multilayer HDI circuit board's heat sink's overall structure schematic diagram.
In the figure: 1. a first HDI circuit board; 2. a second HDI circuit board; 3. a heat sink; 4. a connecting device; 5. a heat sink; 6. an insulating layer; 7. a working element; 30. a partition plate; 31. a fan; 32. a fixed block; 33. a fixed connector; 34. fixing a column; 40. an L-shaped connecting plate; 41. fixing screws; 42. connecting grooves; 43. a circuit board fixing groove; 50. a fixing plate; 51. a heat sink; 52. and (4) heat dissipation holes.
Detailed Description
In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, and for example, "connected" may be either fixedly connected or detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
As shown in fig. 1-4, a quick radiating multilayer HDI circuit board, including first HDI circuit board 1 and second HDI circuit board 2, fixed mounting has insulating layer 6 between first HDI circuit board 1 and the second HDI circuit board 2, first HDI circuit board 1 and second HDI circuit board 2 are with insulating layer 6 central upper and lower symmetric distribution, 1 lower extreme fixed mounting of first HDI circuit board has heat sink 5, the equal fixed mounting in first HDI circuit board 1 and the 2 upper ends of second HDI circuit board has working element 7, the equal fixed mounting in first HDI circuit board 1 and the 2 left ends of second HDI circuit board and right-hand member has connecting device 4, heat abstractor 3 is installed to two connecting device 4 upper ends interlude jointly.
The heat dissipation device 3 comprises a partition board 30 and two fans 31, fixed connectors 33 are respectively arranged at the left part of the upper end and the right part of the upper end of the partition board 30, two fixed columns 34 are respectively fixedly arranged at the left part of the lower end and the right part of the lower end of the partition board 30, two fans 31 are respectively and fixedly arranged at the left end and the right end of each fan 31, the two fans 31 are respectively and fixedly arranged at the upper end of the partition board 30 in an inserting manner through the fixed connectors 33, the partition board 30 is fixedly arranged at the upper ends of the two connection devices 4 through the four fixed columns 34, the partition board 30 is fixedly arranged above the circuit board through the four fixed columns 34, and then the two fans 31 blow air to perform physical heat dissipation on the circuit board; the connecting device 4 comprises an L-shaped connecting plate 40, fixing screws 41 are respectively inserted and installed at the front part of the lower end and the rear part of the lower end of the L-shaped connecting plate 40, connecting grooves 42 are respectively formed in the front part of the upper end and the rear part of the upper end of the L-shaped connecting plate 40, circuit board fixing grooves 43 are respectively formed in the upper part of the left end and the lower part of the left end of the L-shaped connecting plate 40, the L-shaped connecting plate 40 is fixedly installed at the right ends of the first HDI circuit board 1 and the second HDI circuit board 2, the two circuit boards are clamped through the connecting grooves 42, and then the fixing screws 41 are used for fixing and installing; the heat sink 5 comprises a fixing plate 50, a heat sink 51 is inserted and installed at the upper end of the fixing plate 50, a plurality of heat dissipation holes 52 are formed at the upper end of the heat sink 51, the fixing plate 50 is fixedly installed at the lower end of the first HDI circuit board 1, and the heat sink 51 is fixedly installed at the lower end of the first HDI circuit board 1 and dissipates heat through the heat dissipation holes 52 thereon; the sizes of the four fixed columns 34 are consistent with the sizes of the four connecting grooves 42, and the positions of the four fixed columns are up-down corresponding to those of the four connecting grooves; the two connecting devices 4 are symmetrically distributed with the first HDI circuit board 1 as the center.
It should be noted that the utility model relates to a multilayer HDI circuit board capable of fast heat dissipation, firstly, the first HDI circuit board 1 and the second HDI circuit board 2 are fixedly connected by the circuit board fixing groove 43 opened on the L-shaped connecting board 40 on the two connecting devices 4, then the first HDI circuit board 1 and the second HDI circuit board 2 are fixedly installed by the fixing screw 41 on the L-shaped connecting board 40, then the clapboard 30 on the heat dissipation device 3 is inserted and connected with the connecting groove 42 through the fixing column 34 at the lower end, thereby the clapboard 30 protects the circuit board, the circuit board is prevented from being exposed, the working element 7 can be collided, when the first HDI circuit board 1 and the second HDI circuit board 2 are hot, the air is blown by the two fans 31 inserted and installed on the clapboard 30, so as to dissipate the heat of the circuit board, meanwhile, the radiating fins 51 on the heat absorption device 5 are fixedly installed at the lower end of the first HDI circuit board 1 and dissipate the heat through the radiating holes 52 on the first HDI circuit board, the circuit board is subjected to multiple heat dissipation and cooling through the heat dissipation device 3 and the heat absorption device 5, so that the service life of the circuit board is prolonged.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
1. The utility model provides a quick radiating multilayer HDI circuit board, includes first HDI circuit board (1) and second HDI circuit board (2), its characterized in that: fixed mounting has insulating layer (6) between first HDI circuit board (1) and the second HDI circuit board (2), first HDI circuit board (1) and second HDI circuit board (2) are with insulating layer (6) central longitudinal symmetry distribution, first HDI circuit board (1) lower extreme fixed mounting has heat sink (5), first HDI circuit board (1) and second HDI circuit board (2) upper end equal fixed mounting has working element (7), first HDI circuit board (1) and second HDI circuit board (2) left end and the equal fixed mounting of right-hand member have connecting device (4), two heat abstractor (3) are installed to common interlude in connecting device (4) upper end.
2. A multilayer HDI circuit board for dissipating heat quickly according to claim 1 wherein: heat abstractor (3) includes baffle (30) and fan (31), baffle (30) upper end left part and upper end right part all open fixed connector (33), baffle (30) lower extreme left part and the equal fixed mounting of lower extreme right part have two fixed column (34), fan (31) are equipped with two, two fan (31) left end and the equal fixed mounting of right-hand member have fixed block (32), two fan (31) alternate through fixed connector (33) and install the upper end at baffle (30), baffle (30) are through the upper end of four fixed column (34) fixed mounting at two connecting device (4).
3. A multilayer HDI circuit board for dissipating heat quickly according to claim 1 wherein: connecting device (4) include L type connecting plate (40), set screw (41) are all installed to L type connecting plate (40) lower extreme front portion and lower extreme rear portion interlude, spread groove (42) have all been opened to L type connecting plate (40) upper end front portion and upper end rear portion, circuit board fixed slot (43) have all been opened to L type connecting plate (40) left end upper portion and left end lower part, L type connecting plate (40) fixed mounting is at the right-hand member of first HDI circuit board (1) and second HDI circuit board (2).
4. A multilayer HDI circuit board for dissipating heat quickly according to claim 1 wherein: heat sink (5) are including fixed plate (50), fin (51) are installed to fixed plate (50) upper end interlude, fin (51) upper end is opened has a plurality of louvre (52), fixed plate (50) fixed mounting is at first HDI circuit board (1) lower extreme.
5. A multilayer HDI circuit board for dissipating heat quickly according to claim 2 wherein: the sizes of the four fixing columns (34) are consistent with those of the four connecting grooves (42), and the positions of the four fixing columns are up-down corresponding to those of the four connecting grooves.
6. A multilayer HDI circuit board for dissipating heat quickly according to claim 1 wherein: the two connecting devices (4) are distributed in a bilateral symmetry mode by taking the first HDI circuit board (1) as a center.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120161913.7U CN214046141U (en) | 2021-01-21 | 2021-01-21 | Quick radiating multilayer HDI circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120161913.7U CN214046141U (en) | 2021-01-21 | 2021-01-21 | Quick radiating multilayer HDI circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214046141U true CN214046141U (en) | 2021-08-24 |
Family
ID=77347598
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120161913.7U Active CN214046141U (en) | 2021-01-21 | 2021-01-21 | Quick radiating multilayer HDI circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214046141U (en) |
-
2021
- 2021-01-21 CN CN202120161913.7U patent/CN214046141U/en active Active
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