CN218006870U - PCB circuit board structure capable of improving heat dissipation - Google Patents
PCB circuit board structure capable of improving heat dissipation Download PDFInfo
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- CN218006870U CN218006870U CN202222119746.7U CN202222119746U CN218006870U CN 218006870 U CN218006870 U CN 218006870U CN 202222119746 U CN202222119746 U CN 202222119746U CN 218006870 U CN218006870 U CN 218006870U
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- side wall
- connecting rod
- circuit board
- sliding groove
- base
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Abstract
The utility model discloses a promote radiating PCB circuit board structure, including the base, its characterized in that: the base is of a net structure and allows airflow to pass through, a right motor is installed at the center of the base, the output end of the motor is connected with a right fan, a left side wall and a right side wall are symmetrically installed at the top of the base, four grid plates are installed between the left side wall and the right side wall, four limiting areas are formed between the grid plates and the left side wall and between the grid plates and the right side wall, a left sliding groove and a right sliding groove are formed in the left side wall and the right side wall respectively, a left connecting rod and a right connecting rod are arranged in the left sliding groove and the right sliding groove in a sliding mode respectively, one end of the left connecting rod and one end of the right connecting rod are connected with a buffer spring, the other end of the left connecting rod and the other end of the right connecting rod are attached to the bottom of a bolt, heat generated when the circuit board works is conducted to the grid plates, the grid-shaped structure improves the contact area, improves the efficiency of the heat taken away by the airflow, improves the heat dissipation capacity, and has a wide application prospect.
Description
Technical Field
The utility model relates to a circuit board heat dissipation technical field specifically is a promote radiating PCB circuit board structure.
Background
The circuit board is a product of the development of electronic technology towards high speed, multiple functions, large capacity and small volume, however, along with the gradual increase of electronic elements on the circuit board, the electronic elements can emit certain heat while working normally, and the circuit board is provided with a large number of electronic elements which can emit a large amount of heat when working together, but the circuit board has poor heat dissipation performance and narrow space, and the electronic elements are densely distributed, so that the heat is difficult to be emitted, and the circuit board is heated rapidly; when the temperature reaches a certain degree, the work of some electronic elements can be influenced, and even the electronic elements and the circuit board can be burnt seriously, so that a PCB circuit board structure for improving heat dissipation is provided.
Disclosure of Invention
Solves the technical problem
Not enough to prior art, the utility model provides a promote radiating PCB circuit board structure helps promoting the radiating effect.
Technical scheme
In order to realize the advantages, the utility model provides a following technical scheme: the utility model provides a promote radiating PCB circuit board structure, includes the base, its characterized in that: the base is of a net structure and allows airflow to pass through, a right motor is installed at the center of the base, the output end of the motor is connected with a right fan, a left side wall and a right side wall are symmetrically installed at the top of the base, four grid plates are installed between the left side wall and the right side wall, four limiting areas are formed between the grid plates and the left side wall and between the grid plates and the right side wall, a left sliding groove and a right sliding groove are formed in the left side wall and the right side wall respectively, a left connecting rod and a right connecting rod are arranged in the left sliding groove and the right sliding groove in a sliding mode respectively, one end of the left connecting rod and one end of the right connecting rod are connected with a buffer spring, and the other end of the left connecting rod and the other end of the right connecting rod are attached to the bottom of a bolt.
Preferably, one side of the left connecting rod, which is close to the right connecting rod, is connected with four first connecting rods respectively, and the bottom of each of the eight first connecting rods is connected with a second connecting rod. The eight second connecting rods respectively penetrate through the left side wall and the right side wall and extend into the limiting area, and a cushion pad is installed at one end extending into the limiting area.
Preferably, the bolt passes through the outer walls of the left side wall and the right side wall and enters the left sliding groove and the right sliding groove to be attached to one ends of the left connecting rod and the right connecting rod, and the bolt is in threaded connection with the left side wall and the right side wall.
Preferably, one end of the buffer spring is connected with the left connecting rod and the right connecting rod, and the other end of the buffer spring is connected with the inner walls of the left sliding groove and the right sliding groove.
Preferably, one side of the grid plate is a smooth plane, the other side of the grid plate is in a strip grid shape, the limiting area can allow the circuit board to be inserted, the heat conducting plate layer of the circuit board is attached to the smooth side of the grid plate during insertion, and the bottom of the heat conducting plate layer is coated with a heat conducting coating to enhance heat conductivity.
Advantageous effects
Compared with the prior art, the utility model provides a promote radiating PCB circuit board structure possesses following beneficial effect:
1. this promote radiating PCB circuit board structure, through with the heat conduction that the circuit board during operation produced to the grid plate on, the grid-like structure has improved area of contact, has improved the air current and has taken away thermal efficiency, has promoted the heat-sinking capability.
Drawings
FIG. 1 is a top sectional view of the present invention;
FIG. 2 is a schematic diagram of the circuit board structure of the present invention;
fig. 3 is a front view of the present invention.
In the figure: 1 left side wall, 2 right side walls, 3 left connecting rods, 4 right connecting rods, 5 grid plates, 6 limiting areas, 7 cushion pads, 8 first connecting rods, 9 second connecting rods, 10 buffer springs, 11 bolts, 12 copper foil routing layers, 13 substrates, 14 heat-conducting columns, 15 heat-conducting plate layers, 16 fans, 17 motors, 18 bases, 21 left chutes and 22 right chutes.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.
Referring to fig. 1-3, a PCB circuit board structure for improving heat dissipation includes a base 18, and is characterized in that: the base 18 is of a net structure and allows airflow to pass through, a right motor 17 is installed at the center of the base 18, the output end of the motor 17 is connected with a right fan 16, a left side wall 1 and a right side wall 2 are symmetrically installed at the top of the base 18, four grid plates 5 are installed between the left side wall 1 and the right side wall 2, four limiting areas 6 are formed between the grid plates 5 and the left side wall 1 and the right side wall 2, a left sliding groove 21 and a right sliding groove 22 are respectively formed in the left side wall 1 and the right side wall 2, a left connecting rod 3 and a right connecting rod 4 are respectively arranged in the left sliding groove 21 and the right sliding groove 22 in a sliding mode, one end of each of the left connecting rod 3 and one end of each right connecting rod 4 are connected with a buffer spring 10, and the other end of each left connecting rod 3 and the other end of each right connecting rod are attached to the bottom of a bolt 11.
One side that left connecting rod 3 and right connecting rod 4 are close to each other is connected with four first connecting rods 8 respectively, eight first connecting rod 8 bottom is connected with second connecting rod 9. The eight second connecting rods 9 respectively penetrate through the left side wall 1 and the right side wall 2 and extend into the limiting area 6, and one end extending into the limiting area 6 is provided with a cushion pad 7.
One end of the buffer spring 10 is connected with the left connecting rod 3 and the right connecting rod 4, and the other end is connected with the inner walls of the left sliding chute 21 and the right sliding chute 22.
One side of the grid plate 5 is a smooth plane, the other side of the grid plate is in a strip grid shape, the limiting area 6 can allow a circuit board to be inserted, a heat conducting plate layer 15 of the circuit board is attached to the smooth side of the grid plate 5 during insertion, and the bottom of the heat conducting plate layer 15 is coated with a heat conducting coating to enhance heat conductivity.
This device is when using, insert spacing district 6 towards grid plate 5's smooth surface with the heat conduction board layer 15 of circuit board, twist bolt 11 and make left connecting rod 3 and right connecting rod 4 displacement downwards, first connecting rod 8 and second connecting rod 9 follow left connecting rod 3 and right connecting rod 4 displacement downwards, and press from both sides the circuit board tightly, make the rigidity of circuit board, the circuit board begins work after the installation, the produced heat of circuit board circular telegram work guides leading-in grid plate 5 behind heat conduction board layer 15 through heat conduction post 14, starter motor 17 makes 16 rotations of fan produce the air current and dispel the heat.
The orientations and positional relationships shown in the drawings are for convenience in describing the invention and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be construed as limiting the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (5)
1. A promote radiating PCB circuit board structure, includes base (18), its characterized in that: the base (18) is of a net structure and allows airflow to pass through, a right motor (17) is installed at the center of the base (18), the output end of the motor (17) is connected with a right fan (16), a left side wall (1) and a right side wall (2) are symmetrically installed at the top of the base (18), four grid plates (5) are installed between the left side wall (1) and the right side wall (2) and four limiting areas (6) are formed between the grid plates (5) and the left side wall (1) and between the grid plates and the right side wall (2), a left sliding groove (21) and a right sliding groove (22) are respectively formed in the left side wall (1) and the right side wall (2), a left connecting rod (3) and a right connecting rod (4) are respectively arranged in the left sliding groove (21) and the right sliding groove (22) in a sliding mode, one end of the left connecting rod (3) and one end of the right connecting rod (4) are connected with a buffer spring (10), and the other end of the left connecting rod is attached to the bottom of a bolt (11).
2. The PCB circuit board structure for improving heat dissipation of claim 1, wherein: one side that left side connecting rod (3) and right connecting rod (4) are close to each other is connected with four first connecting rods (8) respectively, eight first connecting rod (8) bottom is connected with second connecting rod (9), eight second connecting rod (9) run through left side wall (1) and right side wall (2) respectively and extend to in spacing district (6), and extend into the one end in spacing district (6) and install blotter (7).
3. The PCB circuit board structure for improving heat dissipation of claim 1, wherein: bolt (11) pass left side wall (1) and right side wall (2) the outer wall get into in left spout (21) and right spout (22) with the one end laminating of left connecting rod (3) and right connecting rod (4), bolt (11) and left side wall (1) and right side wall (2) spiro union.
4. The PCB circuit board structure for improving heat dissipation of claim 1, wherein: one end of the buffer spring (10) is connected with the left connecting rod (3) and the right connecting rod (4), and the other end of the buffer spring is connected with the inner walls of the left sliding chute (21) and the right sliding chute (22).
5. The PCB circuit board structure for improving heat dissipation of claim 1, wherein: one side of the grid plate (5) is a smooth plane, the other side of the grid plate is in a strip grid shape, the limiting area (6) can allow a circuit board to be inserted, a heat conducting plate layer (15) of the circuit board is attached to the smooth side of the grid plate (5) during insertion, and a heat conducting coating is coated at the bottom of the heat conducting plate layer (15) to enhance heat conductivity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222119746.7U CN218006870U (en) | 2022-08-12 | 2022-08-12 | PCB circuit board structure capable of improving heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222119746.7U CN218006870U (en) | 2022-08-12 | 2022-08-12 | PCB circuit board structure capable of improving heat dissipation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218006870U true CN218006870U (en) | 2022-12-09 |
Family
ID=84321256
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222119746.7U Active CN218006870U (en) | 2022-08-12 | 2022-08-12 | PCB circuit board structure capable of improving heat dissipation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218006870U (en) |
-
2022
- 2022-08-12 CN CN202222119746.7U patent/CN218006870U/en active Active
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