CN212786452U - Heat dissipation shell structure for high-power switch - Google Patents
Heat dissipation shell structure for high-power switch Download PDFInfo
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- CN212786452U CN212786452U CN202022115093.6U CN202022115093U CN212786452U CN 212786452 U CN212786452 U CN 212786452U CN 202022115093 U CN202022115093 U CN 202022115093U CN 212786452 U CN212786452 U CN 212786452U
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 37
- 238000009434 installation Methods 0.000 claims abstract description 33
- 238000001816 cooling Methods 0.000 claims abstract description 15
- 230000000149 penetrating effect Effects 0.000 claims abstract description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 230000005540 biological transmission Effects 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 238000003780 insertion Methods 0.000 claims description 2
- 230000037431 insertion Effects 0.000 claims description 2
- 239000006185 dispersion Substances 0.000 abstract description 2
- 238000013461 design Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000000835 fiber Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
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Abstract
The utility model relates to a heat dissipation shell structure for a high-power exchanger, which comprises a shell and an exchanger main body encapsulated in the shell, a first pipeline installation groove is arranged in the bottom plate of the shell and is of a continuous annular structure, a second pipeline installation groove is arranged in the top plate of the shell and is of a continuous U-shaped groove structure, the second pipeline installation groove is arranged along the length direction of the top plate and comprises a first pipeline installation area with a groove interval of L and a second pipeline installation area with a groove interval of L, wherein L is not less than 1/2L and not more than 2/3L, an inserting plate is arranged on the top plate corresponding to the second pipeline mounting area and horizontally arranged, and a cooling fin is inserted into the inserting plate, wherein the first pipeline mounting groove and the second pipeline mounting groove are respectively provided with a water-cooling pipe in a penetrating way. This application can improve the heat dispersion of switch, and whole volume can not be too big, and has scalability, satisfies different operating mode demands.
Description
Technical Field
The utility model relates to a heat dissipation shell structure for high power switch.
Background
A switch is a network device for electrical (optical) signal forwarding that provides an exclusive electrical signal path for any two network nodes accessing the switch. The most common switch is an ethernet switch. Other common are telephone voice switches, fiber switches, and the like. The core switch generates a large amount of heat in the process of processing data due to the strong data processing capacity of the core switch, and if the heat is not radiated, circuits and electrical components inside the core switch are damaged to a certain extent, so that the service life of the core switch is influenced due to the fact that wires and electrical components are aged due to long-time heating.
Therefore, how to realize the effective heat dissipation of the core switch with high power is a technical problem which needs to be solved urgently at present.
Disclosure of Invention
The utility model aims at providing a heat dissipation shell structure for high power switch can improve the heat dispersion of switch, and whole volume can not be too big, and has scalability, satisfies different operating mode demands.
In order to achieve the above purpose, the utility model adopts the technical scheme that:
the utility model provides a heat dissipation shell structure for a high-power exchanger, which comprises a shell and an exchanger main body encapsulated in the shell, a first pipeline installation groove is arranged in the bottom plate of the shell and is of a continuous annular structure, a second pipeline installation groove is arranged in the top plate of the shell and is of a continuous U-shaped groove structure, the second pipeline installation groove is arranged along the length direction of the top plate and comprises a first pipeline installation area with a groove interval of L and a second pipeline installation area with a groove interval of L, wherein L is not less than 1/2L and not more than 2/3L, an inserting plate is arranged on the top plate corresponding to the second pipeline mounting area and horizontally arranged, and a cooling fin is inserted into the inserting plate, wherein the first pipeline mounting groove and the second pipeline mounting groove are respectively provided with a water-cooling pipe in a penetrating way.
For the above technical solution, the applicant has further optimization measures.
Optionally, the picture peg includes first limiting plate and the second limiting plate that sets up along roof width direction, the cross-section of first limiting plate and second limiting plate is the L shape of invering, constitute between first limiting plate and the roof and be used for inserting and establish the first slot of fin, constitute between second limiting plate and the roof and be used for inserting and establish the second slot of fin, the both sides of fin are blocked respectively and are established in first slot and the second slot.
Optionally, the inserting plate further comprises a baffle plate, and the baffle plate is perpendicular to the first limiting plate and the second limiting plate and used for limiting the radiating fins.
Optionally, the whole of the radiating fin is flat, the radiating fin is attached to the top plate, the top plate is inserted into the plugboard, heat conducting glue is filled between the bottom of the radiating fin and the top plate, and the surface of the radiating fin is provided with a plurality of radiating fins.
Optionally, the water-cooled tube is connected with an externally arranged radiator through a transmission pipeline to form a radiating loop.
Because of the application of the technical scheme, compared with the prior art, the utility model has the following advantages:
the utility model discloses a heat dissipation shell structure for high power switch can derive the produced heat of high power switch, realizes that expandable's structural design improves the heat dissipation function to realize different heat dissipation purposes under the prerequisite of control that the cost varies, accord with different users, the different heat dissipation requirements under the different work condition.
Drawings
Some specific embodiments of the present invention will be described in detail hereinafter, by way of illustration and not by way of limitation, with reference to the accompanying drawings. The same reference numbers in the drawings identify the same or similar elements or components. Those skilled in the art will appreciate that the drawings are not necessarily drawn to scale. In the drawings:
fig. 1 is a schematic structural diagram of a heat dissipation housing structure for a high power switch according to an embodiment of the present invention;
FIG. 2 is a schematic view of the heat dissipating housing structure of FIG. 1 at the top plate, without the heat sink;
fig. 3 is a schematic structural diagram of the heat dissipation housing structure shown in fig. 1 at the bottom plate.
Wherein the reference numerals are as follows:
1. the heat dissipation structure comprises a shell, 2, a bottom plate, 21, a first pipeline installation groove, 3, a top plate, 31, a second pipeline installation groove, 4, an insertion plate, 41, a first limiting plate, 42, a second limiting plate, 43, a baffle plate, 5, a cooling fin, 51 and a cooling fin.
Detailed Description
The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
Furthermore, the technical features mentioned in the different embodiments of the invention described below can be combined with each other as long as they do not conflict with each other.
The utility model provides a heat dissipation shell structure for high power switch, as shown in figures 1 to 3, including a shell 1 and a switch main body packaged in the shell 1, a first pipeline installation groove 21 is provided in a bottom plate 2 of the shell 1, the first pipeline installation groove 21 is a continuous annular structure, a second pipeline installation groove 31 is provided in a top plate 3 of the shell 1, the second pipeline installation groove 31 is a continuous U-shaped groove structure, the second pipeline installation groove 31 is arranged along the length direction of the top plate 3, the second pipeline installation groove 31 comprises a first pipeline installation area with a groove spacing of L and a second pipeline installation area with a groove spacing of L, and 1/2L is not less than L2/3L, a plug board 4 is provided at a position corresponding to the second pipeline installation area on the top plate 3, the plug board 4 is horizontally arranged, a heat dissipation fin 5 is inserted in the plug board 4, wherein, the first pipeline installation groove 21 and the second pipeline installation groove 31 are respectively provided with a water cooling pipe. The water cooling pipe is directly embedded in the pipeline installation groove, and a PE pipe, a plastic pipe or other heat-resistant and bendable pipes can be adopted, so that the structure in the pipeline installation groove is shown conveniently, the water cooling pipe is not shown in the figure, and the understanding of the technology is not influenced.
In general, duct installation grooves are formed in the top plate 3 and the bottom plate 2 of the housing 1 that supports the switch main body, and water-cooling pipes are further formed in the duct installation grooves, so that heat generated by the switch main body can be efficiently guided out of the housing 1, thereby effectively improving heat dissipation efficiency. In addition, the water-cooling pipe can also be connected with an externally arranged radiator through a transmission pipeline to form a radiating loop, so that the efficient radiating is realized, and the water-cooling pipe can be selectively installed according to the requirements of users.
The heat dissipation plate 5 is detachably arranged, that is, an expandable structural design is adopted, so that a user can select whether to arrange the heat dissipation plate 5 on the top plate 3 according to the requirements of working conditions or the working mode of the interactive machine, and more optimal choices are provided for the user, so that different requirements of the user are met.
As for the structure of the inserting plate 4, specifically, the inserting plate 4 includes a first limiting plate 41 and a second limiting plate 42 arranged along the width direction of the top plate 3, the cross sections of the first limiting plate 41 and the second limiting plate 42 are both inverted L-shaped, a first slot for inserting the heat sink 5 is formed between the first limiting plate 41 and the top plate 3, a second slot for inserting the heat sink 5 is formed between the second limiting plate 42 and the top plate 3, and two sides of the heat sink 5 are respectively clamped in the first slot and the second slot.
In addition, the inserting plate 4 further comprises a baffle 43, and the baffle 43 is arranged perpendicular to the first limiting plate 41 and the second limiting plate 42 and used for limiting the radiating fin 5 and limiting the transverse movement of the radiating fin 5 at the inserting plate 4.
Optionally, the whole of the heat sink 5 is flat, the heat sink 5 is attached to the top plate 3 and inserted into the insert plate 4, a heat conducting adhesive is filled between the bottom of the heat sink 5 and the top plate 3, and the surface of the heat sink 5 is provided with a plurality of heat dissipation fins 51.
To sum up, the heat dissipation shell structure for high power switch of this application can derive the produced heat of high power switch, realizes that extensible's structural design improves the heat dissipation function to realize different heat dissipation purposes under the prerequisite of control that the cost varies, accord with different users, different heat dissipation requirements under the different operating modes.
The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and to implement the present invention, so as not to limit the protection scope of the present invention, and all equivalent changes or modifications made according to the spirit of the present invention should be covered by the protection scope of the present invention.
Claims (5)
1. A heat dissipation shell structure for a high-power switch comprises a shell and a switch main body encapsulated in the shell, it is characterized in that a first pipeline installation groove is arranged in the bottom plate of the shell, the first pipeline installation groove is of a continuous annular structure, a second pipeline installation groove is arranged in the top plate of the shell and is of a continuous U-shaped groove structure, the second pipeline installation groove is arranged along the length direction of the top plate and comprises a first pipeline installation area with a groove interval of L and a second pipeline installation area with a groove interval of L, wherein L is not less than 1/2L and not more than 2/3L, an inserting plate is arranged on the top plate corresponding to the second pipeline mounting area and horizontally arranged, and a cooling fin is inserted into the inserting plate, wherein the first pipeline mounting groove and the second pipeline mounting groove are respectively provided with a water-cooling pipe in a penetrating way.
2. The heat dissipation housing structure for a high power switch of claim 1, wherein the board includes a first limiting plate and a second limiting plate disposed along a width direction of the top plate, the first limiting plate and the second limiting plate are both inverted L-shaped in cross section, a first slot for inserting the heat dissipation plate is formed between the first limiting plate and the top plate, a second slot for inserting the heat dissipation plate is formed between the second limiting plate and the top plate, and two sides of the heat dissipation plate are respectively clamped in the first slot and the second slot.
3. The heat-dissipating housing structure for a high power switch of claim 2, wherein the insert further comprises a baffle plate disposed perpendicular to the first and second limiting plates for limiting the heat-dissipating fins.
4. The heat dissipation shell structure for a high power switch as claimed in any one of claims 1 to 3, wherein the heat dissipation fins are flat-shaped as a whole, the heat dissipation fins are attached to the top plate and inserted into the insertion plate, a heat conductive adhesive is filled between the bottom of the heat dissipation fins and the top plate, and a plurality of heat dissipation fins are arranged on the surfaces of the heat dissipation fins.
5. The heat dissipation housing structure for high power exchangers according to any one of claims 1 to 3, wherein the water cooling tubes are connected to an externally disposed heat sink via a transmission line to form a heat dissipation loop.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022115093.6U CN212786452U (en) | 2020-09-24 | 2020-09-24 | Heat dissipation shell structure for high-power switch |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022115093.6U CN212786452U (en) | 2020-09-24 | 2020-09-24 | Heat dissipation shell structure for high-power switch |
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| Publication Number | Publication Date |
|---|---|
| CN212786452U true CN212786452U (en) | 2021-03-23 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022115093.6U Active CN212786452U (en) | 2020-09-24 | 2020-09-24 | Heat dissipation shell structure for high-power switch |
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| Country | Link |
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| CN (1) | CN212786452U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114096093A (en) * | 2021-11-19 | 2022-02-25 | 杭州康吉森自动化科技有限公司 | Integrated controller |
| CN114828515A (en) * | 2022-03-08 | 2022-07-29 | 上海艾涛信息科技发展有限公司 | Data center computer room cooling system |
-
2020
- 2020-09-24 CN CN202022115093.6U patent/CN212786452U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114096093A (en) * | 2021-11-19 | 2022-02-25 | 杭州康吉森自动化科技有限公司 | Integrated controller |
| CN114096093B (en) * | 2021-11-19 | 2023-08-11 | 杭州康吉森自动化科技有限公司 | Integrated controller |
| CN114828515A (en) * | 2022-03-08 | 2022-07-29 | 上海艾涛信息科技发展有限公司 | Data center computer room cooling system |
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