CN115421572A

CN115421572A - Memory bank water cooling device and memory bank water cooling system

Info

Publication number: CN115421572A
Application number: CN202211208173.3A
Authority: CN
Inventors: 张金星; 李文方; 刘耀阳; 夏记成
Original assignee: Inspur Shandong Computer Technology Co Ltd
Current assignee: Inspur Shandong Computer Technology Co Ltd
Priority date: 2022-09-30
Filing date: 2022-09-30
Publication date: 2022-12-02

Abstract

The invention discloses a water cooling device for a memory bank, which comprises: the heat conducting structure is provided with heat conducting surfaces which are used for being attached to the surfaces of the memory strip boards respectively; the heat absorption surface of the evaporation device is in heat conduction contact with the heat conduction structure; an inlet of the condensing plate is communicated with an air outlet of the evaporation device through an air guide channel, and an outlet of the condensing plate is communicated with an inlet of the evaporation device through a liquid return channel; and the radiating fins are arranged on the condensing plate to radiate the heat of the condensing plate. Carry out above-mentioned heat dissipation through liquid, can be quick with heat transfer to make things convenient for flash memory bank department rapid cooling. The heat sink can be far away from the memory bank, so as to avoid the influence of high temperature near the memory bank on the heat dissipation efficiency of the heat sink. And the water cooling mode is adopted to quickly transfer heat, the transfer speed is improved, and meanwhile, a high-power motor is not required to be adopted, so that the noise can be reduced. The invention also discloses a memory bank water cooling system comprising the memory bank water cooling device.

Description

Memory bank water cooling device and memory bank water cooling system

Technical Field

The invention relates to the technical field of electronic equipment heat dissipation, in particular to a memory bank water cooling device and a memory bank water cooling system comprising the memory bank water cooling device.

Background

Memory is one of the main components of a server, and as the storage capacity thereof gradually increases, the maximum power consumption has reached 20W. If 32 memory banks are inserted into a common server, the total power consumption is 640W, and in addition, the power consumption of other components provides a great challenge for heat dissipation of the server.

The traditional heat dissipation mode is that the heat is dissipated by placing more or higher-power fans, so that a lot of requirements are provided for the overall heat dissipation, power consumption, noise and the like of the case. And it is difficult to rapidly conduct heat out, resulting in deviation of actual heat dissipation effect.

In summary, how to effectively solve the problem of poor heat dissipation effect of the memory bank is a problem that needs to be solved by those skilled in the art.

Disclosure of Invention

In view of the above, a first object of the present invention is to provide a memory bank water cooling device, which can effectively solve the problem of poor heat dissipation effect of a memory bank, and a second object of the present invention is to provide a memory bank water cooling system including the above memory bank water cooling device.

In order to achieve the first object, the invention provides the following technical scheme:

a water cooling device for a memory bank comprises:

the heat conducting structure is provided with heat conducting surfaces which are used for being attached to the surfaces of the memory strip boards respectively;

the heat absorption surface of the evaporation device is in heat conduction contact with the heat conduction structure;

an inlet of the condensing plate is communicated with an air outlet of the evaporation device through an air guide channel, and an outlet of the condensing plate is communicated with an inlet of the evaporation device through a liquid return channel;

and the cooling fins are arranged on the condensation plate to dissipate heat of the condensation plate.

When using DRAM water cooling plant, with the heat conduction face of heat conduction structure with the heat conduction contact of the memory slat face that corresponds, with absorb heat from the memory bank, heat conduction structure is in heat transfer to evaporation plant, the inside water of evaporation plant is after the heat absorption, can evaporate, the vapor of evaporation enters into the condensing plate from the air guide passageway, in the condensing plate department, because the fin heat dissipation, so vapor in the condensing plate can pass through the condensing plate with heat transfer to fin, can liquefy into water after the vapor heat gives off, with the gathering in the condensing plate, the water of gathering can be followed back to in the evaporation plant from the liquid return passageway again, in order to recycle. In this DRAM water cooling plant, through heat conduction structure and the contact of DRAM slat face to acquire the heat of DRAM fast, then with heat transfer to evaporation plant, the vapor that forms through the inside water evaporation of evaporation plant can be through the quick flow direction condensing plate of air guide channel, and the fin on the condensing plate is through contacting the heat dissipation with the air, so that vapor liquefaction becomes liquid in the condensing plate, and liquid can return in order can used repeatedly. And carry out above-mentioned heat dissipation through liquid, can be quick with heat transfer to make things convenient for flash memory bank department rapid cooling. The heat sink can be far away from the memory bank, so as to avoid the influence of high temperature near the memory bank on the heat dissipation efficiency of the heat sink. And the water cooling mode is adopted to quickly transfer heat, the transfer speed is improved, and meanwhile, a high-power motor is not required to be adopted, so that the noise can be reduced. In conclusion, the memory bank water cooling device can effectively solve the problem that the heat dissipation effect of the memory bank is not good.

Preferably, the evaporation device is an evaporation plate, and a plurality of heat conduction structures are arranged on one side of the evaporation plate and are respectively used for being in heat conduction contact with the memory banks.

Preferably, the heat conduction structure comprises two heat conduction plates which are arranged in parallel and used for being clamped on two sides of the memory bank respectively, and the heat conduction plates restrict the distance between the two heat conduction plates through U-shaped clamps.

Preferably, the heat-conducting surface of the heat-conducting plate has a first heat-conducting pad.

Preferably, the heat-conducting plate is a sheet metal part.

Preferably, the side of the first thermal pad away from the thermal conductive surface has an adhesion layer for adhering the memory bank.

Preferably, four corners of the evaporation plate protrude out of the arrangement of the heat conduction structure, and support columns used for abutting against the memory bank mounting plate are arranged.

Preferably, the support column is a bolt.

Preferably, the condensation plate and the evaporation plate are arranged in parallel along the plate surface extension direction.

Preferably, the condensation plate is arranged on one side of the evaporation plate far away from the heat conducting structure, and the parallel direction between the condensation plate and the evaporation plate is consistent with the extending direction of the radiating fins.

Preferably, the edge of one side of the condensation plate, which is far away from the evaporation plate, is provided with a connecting part, and the connecting part is provided with a connecting device with adjustable elasticity in the plate thickness direction for connecting the memory bank mounting structure.

Preferably, the connecting device is a screw, and an elastic supporting device is arranged between a screw head of the screw and the connecting part.

In order to achieve the second object, the present invention further provides a memory bank water cooling system, which includes any one of the above memory bank water cooling apparatuses, including a memory bank, wherein a heat conducting structure of the memory bank water cooling apparatus is sleeved on the memory bank. Because the above-mentioned DRAM water cooling plant has above-mentioned technological effect, the DRAM water cooling system with this DRAM water cooling plant should also have corresponding technological effect.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a memory bank water cooling device according to an embodiment of the present invention;

fig. 2 is an assembly schematic view of a memory bank water cooling device according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram of a memory bank water cooling system according to an embodiment of the present invention;

fig. 4 is a schematic partial structural diagram of a memory bank water cooling system according to an embodiment of the present invention.

The drawings are numbered as follows:

the heat conduction structure comprises a heat conduction structure 1, an evaporation plate 2, a condensation plate 3, a cooling fin 4, an air guide channel 5, a liquid return channel 6, a memory bank 7, a case 8, a support column 9, a connecting device 10, an elastic supporting device 11, a U-shaped clamp 12, a first heat conduction pad 13, a second heat conduction pad 14, a mounting plate 15 and a cross beam 16.

Detailed Description

The embodiment of the invention discloses a memory bank water cooling device, which is used for effectively solving the problem of poor heat dissipation effect of a memory bank.

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1 to 4, fig. 1 is a schematic structural diagram of a memory bank water cooling device according to an embodiment of the present invention; fig. 2 is an assembly schematic view of a memory bank water cooling device according to an embodiment of the present invention; fig. 3 is a schematic structural diagram of a memory bank water cooling system according to an embodiment of the present invention; fig. 4 is a schematic partial structural diagram of a memory bank water cooling system according to an embodiment of the present invention.

In some embodiments, the present embodiment provides a water cooling device for a memory bank 7, so as to dissipate heat of the memory bank 7 in an intelligent terminal such as a server. Wherein the 7 water cooling plant of DRAM is used for adsorbing the heat from the face department of DRAM 7, then through the water in the 7 water cooling plant of DRAM, through the evaporation, derives the heat in order dispelling the heat, utilizes the evaporation characteristics of water promptly, carries out noiselessness and rapid cooling. It should be noted that the water in the water cooling device of the memory bank 7 may be a single water, or may be mixed with other substances to promote evaporation of the water inside.

In some embodiments, the memory bank 7 used in the water cooling device of the memory bank 7 is a strip-shaped plate structure, one end edge of the memory bank 7 in the width direction is used as a plugging end to be plugged into the corresponding interface, of course, the memory bank 7 may also be one end edge of the memory bank in the length direction as a plugging end, and there are a plurality of exposed elements on both side plate surfaces of the memory bank 7, wherein the water cooling device of the memory bank 7 is used for absorbing heat from these heat-generating elements and then radiating the heat.

In some embodiments, the water cooling device of the memory bank 7 mainly comprises an evaporation device, a condensation plate 3 and a cooling fin 4.

Between evaporation plant and condensing plate 3, the import of condensing plate 3 with evaporation plant's gas outlet passes through air guide channel 5 and communicates, and the export of condensing plate 3 and evaporation plant's import are through returning liquid passageway 6 and communicating. So that the evaporation of water in the evaporation plant after absorbing the heat, form gas, vapor derives from the gas outlet, enters condensing plate 3 through air guide channel 5, dispels the heat in condensing plate 3, becomes liquid after the heat dissipation, and liquid flows out from the export of condensing plate 3, in reentering evaporation plant through liquid return channel 6 to continue recycling. It should be noted that, when the heating temperature of the memory bank 7 is not high, in order to facilitate evaporation and heat dissipation, the system may be a closed system, and the pressure in the closed system is reduced, so as to reduce the boiling point through pressure reduction, thereby meeting the requirement of evaporation and heat dissipation.

How the water vapor evaporated in the evaporation device enters the condensation plate 3 through the air guide channel 5 can be realized by utilizing the characteristic that the water vapor floats in the air and enters the condensation plate 3 along with the air guide channel 5 in the rising process; of course, the water vapor in the evaporation device may be drawn toward the condensation plate 3 by a fan or the like. Similarly, how the liquid in the condensation plate 3 enters the evaporation device through the liquid return channel 6 can be that the liquid in the condensation plate 3 flows into the liquid return channel 6 under the action of gravity by virtue of gravitational potential energy, and the liquid continues to flow into the evaporation device in the liquid return channel 6 under the action of gravity; it is of course also possible to pump the fluid in the condensation plate 3 into the evaporation device by means of a fluid pump.

The heat absorbing surface of the evaporation device is used for obtaining heat from the memory bank 7, and the heat can be directly obtained or indirectly obtained. In which heat is directly obtained, for example, the heat absorbing surface of the evaporation device can be directly in heat conduction contact with the heat dissipating surface of the memory bank 7, so as to directly obtain heat from the memory bank 7. Of course, the heat conducting structure 1 may be indirectly adopted, and the heat conducting structure 1 transfers heat from the memory bank 7 to the evaporation device, so as to indirectly obtain the heat at the memory bank 7. After the heat absorption surface of the evaporation device absorbs heat, the water in the evaporation device is heated to form water vapor.

The heat sink 4 is disposed on the condensation plate 3 to dissipate heat from the condensation plate 3, so that the gas in the condensation plate 3 is converted into liquid by heat dissipation through the heat sink 4. The purpose of the heat sink 4 is to increase the contact area with air, so as to improve the heat dissipation efficiency with air. The heat dissipation fins 4 may be arranged as required, and may be in the form of a flat plate or a spiral so as to improve heat dissipation.

In some embodiments, when the memory bank 7 water cooling device is applied, the heat absorbing surface of the evaporation device is in heat-conducting contact with the memory bank 7 to absorb heat from the memory bank 7 to be transferred to the internal water, the water inside the evaporation device evaporates after absorbing heat, the evaporated water vapor enters the condensation plate 3 from the air guide channel 5, at the condensation plate 3, the water vapor in the condensation plate 3 transfers heat to the heat sink 4 through the condensation plate 3 due to the heat dissipation of the heat sink 4, the water vapor is liquefied into water after dissipating heat, so as to be collected in the condensation plate 3, and the collected water returns to the evaporation device from the liquid return channel 6 for recycling.

In some embodiments, a heat conducting structure 1 may be provided, the heat conducting structure 1 being arranged between the evaporation device and the memory bank 7 for heat transfer.

Wherein heat conduction structure 1 has the heat conduction face of subsides in memory bank 7 face department, wherein paste and use can high-efficient heat conduction as the standard, certainly for heat conduction efficiency is high, also can set up heat conduction layer, first heat conduction pad 13 etc. between the two, through pasting the setting to guarantee the large tracts of land contact between heat conduction face and the memory bank 7 face of heat conduction structure 1, in order to carry out the heat conduction.

Wherein, the heat conducting structure 1 is provided with a heat conducting surface to be in heat conducting contact with the memory bank 7, so that the heat can be obtained from the memory bank 7, the heat dissipation of the memory bank 7 is accelerated, and the heat absorbing contact with the memory bank 7 can be ensured. The heat conducting structure 1 can be a U-shaped structure and is clamped on the memory bank 7 from the back side of the plugging end of the memory bank 7; or a sleeving structure to be sleeved on the memory bank 7; wherein the heat conducting structure 1 may also abut against the memory bank 7 such that the two are arranged one above the other.

Wherein the heat absorbing surface of the evaporation device is in heat conducting contact with the heat conducting structure 1, so that the heat of the heat conducting structure 1 is transferred into the evaporation device through the heat conducting contact, and the water in the evaporation device starts to evaporate. Wherein heat conduction structure 1 can adopt the heat conductivity to show the components and parts heat conduction efficiency that is higher than DRAM 7 to guarantee that heat conduction structure 1 can be quick with heat from DRAM 7 transmit to evaporation plant in, wherein evaporation plant and heat conduction structure 1 can integrated into one piece, or large tracts of land contact, in order to guarantee heat conduction efficiency between. Of course, can be

In some embodiments, when the memory bank 7 water cooling device is applied, the heat conducting surface of the heat conducting structure 1 is in heat conducting contact with the corresponding surface of the memory bank 7 to absorb heat from the memory bank 7, the heat conducting structure 1 transfers the heat to the evaporation device, water inside the evaporation device evaporates after absorbing the heat, the evaporated water vapor enters the condensation plate 3 from the air guiding channel 5, at the condensation plate 3, the heat is transferred to the heat dissipation fins 4 through the condensation plate 3 because the heat dissipation fins 4 dissipate the heat, the water vapor heat is liquefied into water after dissipating the heat, and the water is collected in the condensation plate 3, and the collected water is returned to the evaporation device from the liquid return channel 6 for recycling. In this 7 water cooling plant of DRAM, through

heat conduction structure

1 and 7 face contacts of DRAM to acquire the heat of DRAM 7 fast, then with heat transfer to evaporation plant, the vapor that forms through the inside water evaporation of evaporation plant, can be through the quick flow direction condensing plate 3 of air guide channel 5, fin 4 on the condensing plate 3 is through contacting the heat dissipation with the air, so that vapor liquefaction becomes liquid in the condensing plate 3, liquid can return in order to can used repeatedly. And carry out above-mentioned heat dissipation through liquid, can be quick with heat transfer to make things convenient for memory bank 7 department rapid cooling. The heat sink 4 may be disposed away from the memory bank 7 to avoid high temperature near the memory bank 7 from affecting the heat dissipation efficiency of the heat sink 4. And the water cooling mode is adopted to quickly transfer heat, the transfer speed is improved, and meanwhile, a high-power motor is not required to be adopted, so that the noise can be reduced. In conclusion, the water cooling device for the memory bank 7 can effectively solve the problem that the heat dissipation effect of the memory bank 7 is not good.

In some embodiments, only one side of the memory bank 7 is in heat conduction contact with the heat conducting structure 1, so as to obtain heat from one side of the memory bank 7, and this kind of structure can be applied to narrow space, so as to ensure that the installation of the heat conducting structure 1 does not interfere with the installation of the memory bank 7, and simultaneously, the requirement on the heat dissipation efficiency of the memory bank 7 is not high, and simultaneously, the heat conduction efficiency of the heat conducting structure 1 can meet the requirement, and also only one side of the memory bank 7 is in contact with the heat conducting structure 1. If a plurality of memory bars 7 are arranged in parallel, the space of the adjacent memory bars 7 is not enough, one memory bar 7 may correspond to one heat conduction structure 1, and one heat conduction structure 1 is stacked on one side of the memory bar 7. When a plurality of memory bars 7 are arranged in parallel, the heat conducting structures 1 are respectively arranged on the same side of the memory bars 7, that is, the heat conducting structures 1 are arranged alternately. Of course, the heat conducting structures 1 respectively corresponding to the two memory bars 7 may be arranged between each group of two adjacent memory bars 7.

In some embodiments, when there are a plurality of memory banks 7, one heat conducting structure 1 may be inserted between two memory banks 7, and two opposite sides of the heat conducting structure respectively abut against the memory banks 7 on two sides, so as to be in heat conducting contact with two memory banks 7 simultaneously.

In some embodiments, of course, a heat conducting structure 1 may also be provided with a plurality of mounting slots for cooperating with a plurality of memory chips 7, respectively, and each mounting slot has a heat conducting surface for heat conducting contact with two side plates of the memory chip 7 in the mounting slot.

In some embodiments, the heat conducting structure 1 may have two heat conducting surfaces for respectively abutting against the board surfaces on the two sides of the memory bank 7, so that the board surfaces on the two sides of the memory bank 7 can both conduct heat out through the heat conducting structure 1, so that the memory bank 7 can be rapidly cooled, and the heat dissipation efficiency is improved.

In some embodiments, when there are a plurality of heat conducting structures 1, each heat conducting structure 1 may be in heat conducting connection with the same evaporation apparatus, or may be in heat conducting connection with different evaporation apparatuses, and may be specifically configured correspondingly as required.

In some embodiments, when there are multiple heat conducting structures 1, correspondingly, multiple heat conducting structures 1 may be in heat conducting contact with the same memory bank 7, for example, two heat conducting structures 1 are respectively disposed on two sides of the memory bank 7 in the thickness direction to be in heat conducting contact with the board surfaces on the two sides of the thickness direction. Of course, a plurality of heat conducting structures 1 may be arranged in parallel along the extending direction of the board surface at one board surface of the memory bank 7.

In some embodiments, the evaporation device may be an evaporation plate 2, and a side plate surface of the evaporation plate 2 has a plurality of heat conducting structures 1, so that the plate surface of the evaporation plate 2 is fully utilized. That is, a plurality of heat conductive structures 1 are installed at one side of the evaporation plate 2.

In some embodiments, when the evaporating plate 2 has a plurality of heat conducting structures 1 on one side, the heat conducting structures are respectively used for being in heat conducting contact with the memory bars 7. So that one side of the evaporating plate 2 can absorb heat from a plurality of memory banks 7 at the same time, and better absorb heat and reduce the temperature of a plurality of memory banks 7 which are installed in a centralized manner at the same time. So that it can be better applied to a server with multiple memory banks 7.

In some embodiments, the heat conducting structure 1 may be a block structure, for example, a plurality of mounting slots are formed to match with the plurality of memory chips 7.

In some embodiments, the heat conducting structure 1 may be a heat conducting plate or at least include one heat conducting plate, wherein one side plate surface of the heat conducting plate is a heat conducting surface for being disposed against the memory stick 7, so that the heat conducting plate and the memory stick 7 are in heat conducting contact.

In some embodiments, the heat conducting structure 1 may include two heat conducting plates disposed in parallel for being clamped at two sides of the memory bank 7 respectively, so as to be disposed at two sides of the memory bank 7 respectively through the two heat conducting plates, so that the memory bank 7 conducts heat from the two side plate surfaces to the two side heat conducting plates. Two heat-conducting plates can all be connected with evaporation plant 2 heat conduction, wherein how heat conduction contact between heat-conducting plate and the evaporation plant 2, can set up as required, generally is that a plurality of heat-conducting plates set up side by side on evaporation plant 2. In particular, one side edge of the heat-conducting plate can be bent to form a folded plate, and the folded plate is attached to the heat-conducting plate, so that the folded plate can be in large-area contact with the heat-conducting plate to conduct heat conduction.

In some embodiments, the two heat conduction plates of the heat conduction structure 1 are clamped on two sides of the memory chip 7, and particularly, a connection device 10 may be provided, and the connection device 10 may be a locking device to push the two heat conduction plates to be close to each other, so that the two heat conduction plates are tightly attached to two sides of the memory chip 7 to ensure the contact therebetween.

In some embodiments, where the connection device 10 may be a bolt, the two heat conducting plates are exposed on the side of the memory bank 7, the bolt penetrates through the exposed portions of the two sides and then is locked by a nut to complete the locking connection.

In some embodiments, the connecting device 10 may also adopt a U-shaped clip 12, and two side edges of the U-shaped clip 12 are respectively connected with the heat conducting plates on two sides, such as integrally formed connection, so that the whole is combined into a U-shaped structure. But this pushing effect is not good. Here, it is preferable that both side portions of the U-shaped clip 12 push the heat conductive plates to move toward the memory bank 7 from the sides of the heat conductive plates away from the memory bank 7. The U-shaped clips 12 may be disposed at one end of the memory bank 7 far from the plugging end to be disposed near the evaporation plate 2, or may be at two longitudinal ends, for example, if one end of the memory bank 7 in the width direction is the plugging end, the two ends in the length direction of the memory bank 7 may be considered as the two ends in the longitudinal direction.

In some embodiments, two U-shaped clips 12 may be arranged side by side along the length of the heat-conducting plate, although only one or more may be provided. The U-shaped clamp 12 may be bent by a strip-shaped plate to form a U-shape, or bent by a square frame along the middle part to form a U-shape. Correspondingly, in order to avoid the U-shaped clip 12 interfering with the memory bank 7 installation, it is preferable that the heat conducting plate is provided with a groove matching with the clamping portion of the U-shaped clip 12 to avoid the clamping portion of the U-shaped clip 12 protruding. Correspondingly, the connecting pieces can be arranged at the two ends of the two heat-conducting plates in the length direction, and the two ends of the connecting pieces are connected with the two heat-conducting plates in an integrated forming mode.

In some embodiments, the heat conducting surface may be in direct contact with the memory bank 7 for conducting heat. However, considering manufacturing tolerances and other reasons, the memory bank 7 and the heat conducting structure 1 are generally rigid structures, and the contact effect is difficult to ensure, and therefore, it is preferable that the first heat conducting pad 13 is disposed on the heat conducting surface, and the first heat conducting pad 13 is abutted on the heat conducting surface and is located between the heat conducting surface and the memory bank 7 during use, so as to transfer heat between the memory bank 7 and the heat conducting surface.

In some embodiments, the heat-conducting surface of the heat-conducting plate may be provided with the first heat-conducting pad 13, so as to dissipate heat through the first heat-conducting pad 13.

In some embodiments, the first thermal pad 13 may be made of a thermal conductive material with a compression rate of not less than 30%, so as to ensure close contact between the memory bank 7 and the thermal conductive surface, i.e., effectively improve the contact surface, so as to ensure the heat dissipation efficiency. The first thermal Pad 13 may be made of a general thermal conductive material, such as a thermal conductive silicone sheet, or may be made of a Gap Pad VO Ultra Soft (Ultra Soft Gap Pad).

In some embodiments, a heat conductive silicone may be disposed between the memory stick 7 and the heat conductive surface to conduct heat.

In some embodiments, the heat-conducting plate needs to have a strong heat-conducting efficiency, and at the same time needs to bear a certain pressure to ensure close contact with the memory bank 7. Based on this, can make the heat-conducting plate be the sheet metal component, as the sheet metal component, can also be according to the characteristics on memory bank 7 surface, carry out corresponding molding to better laminating memory bank 7. Wherein the sheet metal part can be attached to the evaporating plate 2 and welded and fixed.

In some embodiments, for better heat conduction, a second heat conduction pad 14 may be attached to a side plate surface of the evaporation plate 2, wherein the material of the second heat conduction pad 14 may refer to the first heat conduction pad 13 in the above embodiments. One end of the heat conducting structure 1 abuts against the second heat conducting pad 14, so that heat is conducted through the second heat conducting pad 14. When a plurality of heat conducting structures 1 are provided, then a plurality of heat conducting structures 1 can be in heat conducting contact with the evaporation plate 2 through the same second heat conducting pad 14.

In some embodiments, the evaporation plate 2 may be a square plate, the inside of the evaporation plate is hollow to form a cavity for storing water, two openings are provided to connect the air guide channel 5 and the liquid return channel 6, respectively, and the corresponding structure of the condensation plate 3 may refer to the evaporation plate. How to set up the cavity in the plate body structure, can slot on the plate body to cover the apron, apron and slotted frid sealing connection, such as welding, bonding etc. make the whole be platelike structure, and the vallecular cavity of frid is platelike structure's cavity.

In some embodiments, in order to facilitate the thermal contact between the memory bank 7 and the first thermal pad 13 and avoid the release, an adhesion layer may be further provided on a side of the first thermal pad 13 away from the thermal surface for adhering the memory bank 7.

In some embodiments, during actual installation, the memory bank 7 is generally installed vertically, that is, the lower end of the memory bank 7 is a plug end, and the evaporating plate 2 is disposed at the upper edge of the memory bank 7, wherein the heat conducting plate and the memory bank 7 are horizontally juxtaposed, that is, the heat conducting plate and the memory bank 7 are juxtaposed in the thickness direction of the memory bank 7. In order to support and mount the evaporation plate 2 conveniently, four corners of the evaporation plate 2 protrude from the arrangement of the heat conduction structure 1, and the support columns 9 used for connecting the memory bank 7 and the mounting plate 15 are arranged, so that the support columns 9 are supported by the mounting plate 15 of the memory bank 7, and the evaporation plate 2 is supported without being supported by the memory bank 7.

The supporting pillar 9 may directly abut against the mounting plate 15 of the memory bank 7 for supporting, and in order to enhance the supporting effect, the supporting pillar 9 may be preferably further connected to the mounting plate 15 of the memory bank 7. The memory bank 7 mounting plate 15 may be directly or indirectly connected to the memory bank 7, may be a PCB (printed circuit board), or may be a chassis 8, such as a chassis 8 of a server.

In some embodiments, the support posts 9 may be screwed to the evaporating plate 2 to better mount the evaporating plate 2 to the memory bank 7 mounting plate 15 through the support posts 9.

In some embodiments, the supporting columns 9 may be bolts, and nuts of the bolts may abut against the evaporating plate 2 or the mounting plate 15 of the memory bank 7.

In some embodiments, the bolts may pass through the evaporating plate 2, then through the memory bank 7 mounting plate 15, and then be screwed with the nuts on the side of the memory bank 7 mounting plate 15 away from the memory bank 7.

In some embodiments, the condensation plate 3 and the evaporation plate 2 may be juxtaposed in the plate thickness direction, that is, may be juxtaposed in the plugging direction of the memory bank 7. Or may be arranged in parallel along a direction perpendicular to the plugging direction of the memory banks 7.

In some embodiments, the condensation plate 3 and the evaporation plate 2 may be juxtaposed in the plate surface extending direction so as to be staggered in the plate surface extending direction. The plate surface extending direction here may be the plate surface extending direction of the condensation plate 3, or the plate surface extending direction of the evaporation plate 2. Through setting up side by side along face extension direction, can make better staggering of condensation plate 3 and evaporating plate 2 to make things convenient for better heat dissipation.

In some embodiments, the juxtaposition direction between the condensation plate 3 and the evaporation plate 2 along the extension direction of the plate surface coincides with the extension direction of the memory bank 7. So that evaporating plate 2's heat transmits to condensing plate 3 as early as possible, and the direction of transfer is along the extension direction of fin 4, when avoiding along memory bank 7 thickness direction heat transfer, has passed through a plurality of memory banks 7 to interfere the heat dissipation of different memory banks 7.

In some embodiments, the condensation plate 3 may be arranged on a side of the evaporation plate 2 facing away from the heat conducting structure 1. So that when the device is installed, a height difference is formed to facilitate liquid backflow. When using promptly, evaporating plate 2 sets up 7 upsides at internal memory, and the evaporating plate 2 that corresponds sets up at 1 upside of heat conduction structure, and condensing plate 3 can set up on the upper side relative to evaporating plate 2 to do benefit to during vapor floats and enters into condensing plate 3, then the liquid in condensing plate 3 can fall to evaporating plate 2 under the action of gravity.

In some embodiments, the parallel direction between the condensation plate 3 and the evaporation plate 2 along the extension direction of the plate surface is consistent with the extension direction of the cooling fins 4, so that the air can pass through the evaporation plate 2 and the cooling fins 4 in sequence to form an ordered air flow, and better heat dissipation can be ensured.

In some embodiments, the condensation plate 3 can be directly or indirectly mounted on the evaporation plate 2, and can also be directly or indirectly mounted on the memory bank 7 mounting plate 15.

In some embodiments, for better fixation, it is preferable that the edge of the side of the condensation plate 3 away from the evaporation plate 2 has a connection part, and the connection part has a connection device 10 with adjustable elasticity in the plate thickness direction for connecting the memory bank 7 mounting structure. The memory bank 7 mounting structure may be the mounting plate 15, the case 8, or a beam 16 of the case 8.

In some embodiments, wherein the resilient means is resiliently adjustable, the mounting structure position of the memory sticks 7 in the cold plate 3 can be adjusted in the mounting direction. The adjustment direction of the elastic device can be the up-down direction, mainly the place where the error easily occurs in the installation position of the condensation plate 3, when the installation is performed, because the positions of the memory bank 7 and the heat conduction structure 1 in the insertion direction of the memory bank 7 are not controllable, the positions of the memory bank 7 and the installation structure of the memory bank 7 are not controllable, and therefore the position of the elastic device in the direction is preferably adjustable. Wherein the resilient means may be an elastomer or a spring.

In some embodiments, it is preferable that the connection device 10 is a screw rod, and the elastic support device 11 is provided between the head of the screw rod and the connection portion, wherein the screw rod and the memory stick 7 mounting structure can be locked by the thread on the screw rod matching with the thread on the memory stick 7 mounting structure, and the screw rod is equivalent to a screw; or the screw and the memory bank 7 mounting structure can be matched with the nut thread on the other side through the thread on the screw so as to be locked through the nut, and the nut and the screw are combined into a bolt pair at the moment.

In some embodiments, as shown in the drawings, the lower end of the memory bank 7 is a plugging end, and is plugged downward into the mounting plate 15 of the memory bank 7, the width direction of the memory bank 7 is an up-down direction, and the plurality of memory banks 7 are sequentially arranged in parallel along the thickness direction of the memory bank 7. The heat conducting structures 1 are downwards sleeved on the memory bank 7, and the heat conducting structures 1 are sequentially arranged on the lower side of the evaporating plate 2 in parallel and are in heat conducting contact with the evaporating plate 2. The memory banks 7 are respectively sleeved with different heat conducting structures 1. Wherein the condensing plate 3 is disposed at one side of the evaporating plate 2 in a horizontal direction, and is disposed upward with respect to the evaporating plate 2. Also comprises an air duct provided with an air guide channel 5 and a liquid return pipe provided with a liquid return channel 6. Wherein one end of the air duct is connected with the middle part of the upper side of the evaporating plate 2, after extending upwards, the air duct is bent to extend in the horizontal direction and extends to the condensing plate 3 in the horizontal direction. One end of the liquid return pipe is connected with one side of the evaporation plate 2, then extends in the horizontal direction, then bends to vertically extend upwards, and is connected to the bottom side of the condensation plate 3 after vertically extending. The plurality of heat radiating fins 4 are sequentially arranged on the condensation plate 3 in parallel to perform rapid heat radiation.

Wherein the four corners of evaporating plate 2 are provided with a support column 9 respectively, and support column 9 is connected on evaporating plate 2 to support mutually with the mainboard, in order to support whole evaporating plate 2, wherein the mainboard is memory bank 7 mounting panel 15 promptly. And the condensing plate 3 is kept away from one side border of evaporating plate 2 and has connecting portion, and connecting portion form the intercommunication through-hole that link up from top to bottom, and connecting device 10 includes screw and spring, and the screw passes through the through-hole and is connected to 8 crossbeams of quick-witted case 16, and pass through the spring butt between the spiral shell head of screw and the connecting portion, and 8 crossbeams of quick-witted case 16 are just a part of memory bank 7 mounting structure.

Wherein evaporating plate 2, condensing plate 3, air duct and return the liquid pipe and all prefer the copper spare to have better heat conductivility, can integrated into one piece connect, also can welded connection.

In some embodiments, as shown in the drawings, in order to make the heat conducting plates better in heat conducting contact with the evaporating plate, a layer of second heat conducting pad 14 may be further provided on the lower side of the evaporating plate 2, wherein the upper side of each heat conducting plate is abutted by the second heat conducting pad 14 to conduct heat with the evaporating plate therein through the second heat conducting pad 14.

In some embodiments, during assembly, first two first heat-conducting pads 13 are adhered to two sides of the memory bank 7, then the heat-conducting structure 1 is sleeved on the memory bank to form a new memory module, then the new memory module is inserted into a slot of a motherboard, and then the evaporation plate 2 and the condensation plate 3 which are connected together are installed. Wherein the four corners of evaporating plate 2 support on the mainboard through support column 9 respectively, and the screw thread section of support column 9 passes the mainboard after, dies through the nut lock. And at the connection portion of the condensation plate 3, it is fixed on the beam 16 of the cabinet 8 by the spring screw, which is the above-mentioned connection device 10.

Based on the memory bank 7 water cooling device provided in the above embodiment, the invention further provides a memory bank 7 water cooling system, the memory bank 7 water cooling system includes any one of the memory bank 7 water cooling devices in the above embodiments, and further includes a memory bank 7, and the heat conducting structure 1 of the memory bank 7 water cooling device is sleeved on the memory bank 7. Since the memory bank 7 water cooling system adopts the memory bank 7 water cooling device in the above embodiment, please refer to the above embodiment for the beneficial effects of the memory bank 7 water cooling system.

The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. The utility model provides a DRAM water cooling plant which characterized in that includes:

the heat conducting structure is provided with heat conducting surfaces which are respectively attached to the surfaces of the memory strip boards;

and the radiating fins are arranged on the condensing plate to radiate the heat of the condensing plate.

2. The device of claim 1, wherein the evaporation device is an evaporation plate, and a side plate of the evaporation plate has a plurality of the heat conducting structures for respectively contacting with the memory chips.

3. The device of claim 2, wherein the heat conducting structure comprises two heat conducting plates arranged side by side for being clamped at two sides of the memory bank respectively, and the heat conducting plates are constrained in distance by U-shaped clamps.

4. The die pad water cooling device of claim 3, wherein the heat conducting surface of the heat conducting plate has a first heat conducting pad.

5. The memory bank water cooling device of claim 4, wherein the heat conducting plate is a sheet metal part.

6. The device of claim 5, wherein a side of the first thermal pad away from the thermal surface has an adhesive layer for adhering to the die.

7. The device according to claim 5, wherein four corners of the evaporation plate protrude from the arrangement of the heat conducting structure, and support columns for abutting against the memory bank mounting plate are provided.

8. The die bank water cooling device of claim 7, wherein the support posts are bolts.

9. The water cooling device for the memory bank as claimed in any one of claims 2 to 8, wherein the condensation plate and the evaporation plate are juxtaposed in a plate surface extension direction.

10. The water cooling device according to claim 9, wherein the condensation plate is disposed on a side of the evaporation plate away from the heat conducting structure, and a parallel direction between the condensation plate and the evaporation plate is consistent with an extending direction of the heat dissipation fins.

11. The die cartridge water cooling device according to claim 10, wherein a connecting portion is provided on an edge of the condensing plate away from the evaporating plate, and the connecting portion is provided with a connecting device with adjustable elasticity in a plate thickness direction for connecting the die cartridge mounting structure.

12. The device of claim 11, wherein the connection device is a screw, and an elastic support device is provided between a screw head of the screw and the connection portion.

13. A memory bank water cooling system, comprising a memory bank, characterized by further comprising the memory bank water cooling device of any one of claims 1-12, wherein a heat conducting structure of the memory bank water cooling device is sleeved on the memory bank.