CN219800100U

CN219800100U - Thermoelectric refrigeration CPU radiator

Info

Publication number: CN219800100U
Application number: CN202320545509.9U
Authority: CN
Inventors: 刘峰铭; 廖月鹏; 石杰勇
Original assignee: Shenzhen Jianju Technology Co ltd
Current assignee: Shenzhen Jianju Technology Co ltd
Priority date: 2023-03-16
Filing date: 2023-03-16
Publication date: 2023-10-03
Anticipated expiration: 2033-03-16

Abstract

The utility model relates to the technical field of heat dissipation, in particular to a thermoelectric refrigeration CPU radiator, which aims to solve the problems that the passive heat dissipation response speed is low, the heat exchange efficiency is low, and the heat dissipation requirement of a high-performance CPU cannot be met in the prior art. The utility model comprises the following steps: the first heat dissipation assembly comprises a first base and a copper water heat pipe arranged at the bottom of the first base; the second heat dissipation assembly comprises a second base and a copper water heat pipe arranged at the bottom of the second base, and the second base is attached to the CPU; and the thermoelectric assembly comprises a semiconductor panel arranged between the first base and the second base, the refrigeration surface of the semiconductor panel is attached to the second base, and the heating surface of the semiconductor panel is attached to the first base. The heat exchange device has high heat exchange performance and high response speed, and can meet the heat dissipation requirement of high-performance CPU over-frequency or long-time high-load work by transmitting the cold quantity generated by the refrigerating surface of the semiconductor panel to the CPU for heat dissipation.

Description

Thermoelectric refrigeration CPU radiator

Technical Field

The utility model belongs to the technical field of heat dissipation, and particularly relates to a thermoelectric refrigeration CPU heat radiator.

Background

With the rapid development of the technology level, the CPU of electronic products such as a computer and a server has stronger performance and faster speed, and meanwhile, the CPU also has the disadvantage of increased power consumption, the requirement on heat dissipation is further improved, if the CPU dissipates heat untimely, the CPU can perform self-protection to reduce the frequency so as to reduce heat, which can lead to the performance reduction of the CPU and even the downtime of the computer.

In the CPU radiator in the prior art, most of the CPU radiators adopt a copper water heat pipe technology, and the copper water heat pipe radiator is arranged on the outer surface of the CPU; the copper water heat pipe is in contact with the outer surface of the CPU, and heat generated by the CPU is transferred to the copper water heat pipe through the contact surface and then transferred to the outside, so that the heat dissipation of the CPU is completed. However, the existing copper water heat pipe technology is passive heat radiation, and the passive heat radiation performance is low, and the response speed is low; in addition, most of cooling fans of the copper water heat pipe radiator in the prior art are hung externally, the air turbulence effect is limited, the effective utilization area of the radiating fins is small, and the existing copper water heat pipe radiator cannot meet the high heat consumption of a high-performance CPU, for example: the heat dissipation requirement of over-frequency and long-time high-load work is easy to cause the overhigh temperature of hardware, and the faults of a processor or a main board are caused.

Disclosure of Invention

The utility model provides a thermoelectric refrigeration CPU radiator, which aims to solve the problems that the passive heat radiation response speed is low, the heat exchange efficiency is low, and the heat radiation requirement of a high-performance CPU cannot be met in the prior art.

In order to solve the technical problems, the utility model adopts the following technical scheme:

the utility model provides a thermoelectric refrigeration CPU radiator, comprising:

the first heat dissipation assembly comprises a first base and a copper water heat pipe, wherein the copper water heat pipe is arranged at the bottom of the first base;

the second heat dissipation assembly comprises a second base and the copper water heat pipe, and the copper water heat pipe is arranged at the bottom of the second base; the lower surface of the second base is attached to the CPU; the method comprises the steps of,

a thermoelectric assembly including a semiconductor panel; the upper surface and the lower surface of the semiconductor panel are respectively provided with a heating surface and a cooling surface; the semiconductor panel is arranged between the first base and the second base, the refrigerating surface is attached to the upper surface of the second base, and the heating surface is attached to the lower surface of the first base.

The further scheme is as follows: the bottom of the first base and the bottom of the second base are both provided with heat pipe grooves; the copper water heat pipe is in an L shape formed by a transverse section and a vertical section, the transverse section is provided with a heat absorption end, and the vertical section is provided with a heat release end;

the heat absorption end of the copper water heat pipe of the first heat dissipation component is arranged in a heat pipe groove of the first base; and the heat absorption end of the copper water heat pipe of the second heat dissipation assembly is arranged in the heat pipe groove of the second base.

The further scheme is as follows: a flat surface is arranged at the bottom of the heat absorbing end of the copper water heat pipe; the flat surface is flush with the lower port of the heat pipe groove.

Based on the scheme, the flat surface is flush with the lower port of the heat pipe groove, so that the contact area of the second base and the CPU can be increased, the heat absorption end of the copper water heat pipe is directly contacted with the surface of the CPU, and the heat resistance can be reduced.

The further scheme is as follows: the first radiating component and the second radiating component comprise a plurality of radiating fins, and the radiating fins are arranged in a stacked mode;

the heat release end of the copper water heat pipe of the first heat radiation component is arranged on the heat radiation fins of the first heat radiation component in a penetrating way; the heat release end of the copper water heat pipe of the second heat radiation component is arranged on the heat radiation fins of the second heat radiation component in a penetrating way.

Based on the scheme, the heat absorption end of the copper water heat pipe absorbs heat, so that working media in the copper water heat pipe are heated and evaporated to form steam, the steam rises to the heat release end of the copper water heat pipe, and heat exchange is carried out between the heat dissipation fins and the outside.

The further scheme is as follows: the thermoelectric assembly further includes a temperature sensor for detecting the temperature of the CPU.

Based on the scheme, when the temperature sensor detects that the temperature of the CPU is lower, the semiconductor panel stops working, so that the thermoelectric refrigeration CPU radiator is more energy-saving.

The further scheme is as follows: the thermoelectric refrigeration CPU radiator also comprises a packaging component; the packaging assembly comprises an upper transverse plate, a lower transverse plate, a left vertical plate and a right vertical plate; the left vertical plate, the lower transverse plate, the right vertical plate and the upper transverse plate are sequentially connected end to form a rectangular frame;

the packaging assembly is arranged between the radiating fins of the first radiating assembly and the radiating fins of the second radiating assembly, and the lower transverse plate is attached to the upper surface of the first base.

The further scheme is as follows: fin locating grooves are formed in the left end and the right end of each radiating fin, and buckling strips are arranged on the two sides of each left vertical plate and the two sides of each right vertical plate;

the radiating fins of the first radiating component are arranged on the left side of the packaging component; the left buckling strip of the left vertical plate and the left buckling strip of the right vertical plate are respectively clamped in the left fin positioning groove and the right fin positioning groove of the radiating fin;

the radiating fins of the second radiating component are arranged on the right side of the packaging component; and the right side buckling strip of the left vertical plate and the right side buckling strip of the right vertical plate are respectively clamped in the left fin positioning groove and the right fin positioning groove of the radiating fin.

Based on the scheme, the packaging assembly packages the first heat dissipation assembly, the second heat dissipation assembly and the fan together, so that the structure of the thermoelectric refrigeration CPU heat sink is more compact; meanwhile, the packaging component packages the fan between the first heat dissipation component and the second heat dissipation component, so that heat dissipation efficiency is improved.

The further scheme is as follows: the thermoelectric refrigeration CPU radiator also comprises a fan; the fan is fixed in the packaging assembly, the air suction end of the fan faces the radiating fins of the first radiating assembly, and the air blowing end faces the radiating fins of the second radiating assembly.

The further scheme is as follows: the inner surface of the left vertical plate is provided with a fan positioning groove, and the fan is fixed in the packaging assembly through the fan positioning groove.

Based on the scheme, the fan is favorable for capturing air flow, enhancing air turbulence effect and enhancing heat exchange effect.

The further scheme is as follows: the thermoelectric refrigeration CPU radiator also comprises a U-shaped bracket, and lugs are arranged on two sides of the bracket; the support is arranged between the lower transverse plate and the first base, and the thermoelectric refrigeration CPU radiator is fixed on the CPU through the support lugs.

The beneficial effects of the utility model are as follows:

in the utility model, the refrigerating surface of the semiconductor panel is attached to the upper surface of the second base, and the lower surface of the second base is attached to the CPU, so that the cold generated by the refrigerating surface of the semiconductor panel is transmitted to the CPU through the second base to dissipate heat of the CPU. The heating surface of the semiconductor panel is attached to the lower surface of the first base, and heat generated by the heating surface of the semiconductor panel is absorbed by the copper water heat pipe arranged on the first base and then exchanges heat with the outside. According to the utility model, the copper water heat pipe is matched with the thermoelectric assembly, so that the thermoelectric refrigeration CPU radiator has high heat exchange performance and high response speed; the heat dissipation requirement of high-performance CPU over-frequency or long-time high-load work can be met by transmitting the cold energy generated by the refrigerating surface of the semiconductor panel to the CPU for heat dissipation.

In addition, when the temperature of the CPU is lower, a part of heat of the CPU is radiated through the copper water heat pipe of the second radiating component, and the rest of heat is transmitted to the copper water heat pipe of the first radiating component through the semiconductor panel to radiate, so that the semiconductor panel only performs auxiliary radiation, and the semiconductor panel stops refrigerating; the copper water heat pipe of the first heat dissipation assembly and the copper water heat pipe of the second heat dissipation assembly can meet the heat dissipation requirement of the low-temperature CPU, and the semiconductor panel stops working, so that the utility model is more energy-saving.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present utility model and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of a thermoelectric refrigeration CPU heat sink of the present utility model;

FIG. 2 is a schematic diagram of an exploded construction of a thermoelectric refrigeration CPU heat sink according to the present utility model;

FIG. 3 is a schematic view of an exploded view of a first heat dissipating assembly according to the present utility model;

FIG. 4 is a schematic diagram of an exploded view of a second heat dissipating assembly according to the present utility model;

FIG. 5 is a schematic view of the structure of a thermoelectric module of the present utility model;

FIG. 6 is a schematic structural view of the package assembly of the present utility model;

fig. 7 is a schematic view of the structure of the fan and the bracket of the present utility model.

The reference numerals in the figures illustrate:

1-a first heat dissipation assembly; 11-a first base; 111-positioning columns; 112-bracket fixing holes; 113-a heat pipe tank; 12-copper water heat pipe; 121-a heat absorbing end; 122-a heat release end; 123-flat surfaces; 13-radiating fins; 131-fin locating grooves; 132-connecting plates; 133-perforating holes; 2-a second heat sink assembly; 21-a second base; 211-through holes; 212—a temperature sensor hole; a 3-thermoelectric module; 31-a semiconductor panel; 32-a temperature sensor; 33-a control panel; 34-data connector; 35-data lines; 4-packaging the assembly; 41-left riser; 411-snap bars; 412-fan positioning slots; 42-upper cross plate; 421-cylindrical pins; 43-right riser; 431-groove; 432-an interface; 44-lower cross plate; 441-positioning holes; 5-a fan; 51-an air suction end; 52-a blowing end; 6-a bracket; 61-lugs.

Detailed Description

The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model. All other embodiments, which can be obtained by a person skilled in the art without creative efforts, are included in the protection scope of the present utility model based on the embodiments of the present utility model.

Note that the thermal load is not limited to the CPU. Other electronic devices requiring heat dissipation are also possible, and are not listed in this embodiment. In the description of the present utility model, the azimuth or positional relationship indicated by "upper", "lower", "left", "right", "horizontal", "vertical", "inside", "outside", etc. are based on the azimuth or positional relationship shown in the drawings, or the azimuth or positional relationship in which the inventive product is conventionally put in use, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the apparatus or element referred to must have a specific azimuth, be configured and operated in a specific azimuth, and therefore should not be construed as limiting the present utility model.

As shown in fig. 1 and 2, the present embodiment provides a thermoelectric refrigeration CPU heat sink, including:

the first heat dissipation assembly 1 comprises a first base 11 and a copper water heat pipe 12, wherein the copper water heat pipe 12 is arranged at the bottom of the first base 11;

the second heat dissipation assembly 2 comprises a second base 21 and the copper water heat pipe 12, and the copper water heat pipe 12 is arranged at the bottom of the second base 21; the lower surface of the second base 21 is attached to the CPU; the method comprises the steps of,

a thermoelectric module 3 including a semiconductor panel 31; the upper surface and the lower surface of the semiconductor panel 31 are respectively provided with a heating surface and a cooling surface; the semiconductor panel 31 is disposed between the first base 11 and the second base 21, the cooling surface is attached to the upper surface of the second base 21, and the heating surface is attached to the lower surface of the first base 11.

Specifically, the cooling capacity generated on the cooling surface of the semiconductor panel 31 is transmitted to the CPU through the second base 21 to cool. After the heat generated by the heating surface of the semiconductor panel 31 is absorbed by the heat absorbing end 121 of the copper water heat pipe 12, the working medium in the copper water heat pipe 12 is heated and evaporated, the steam rises to the heat releasing end 122 of the copper water heat pipe 12 and exchanges heat with an external medium (for example, air), the steam is condensed into a liquid after being cooled, and the liquid flows back under the action of gravity to continue to be heated and evaporated.

The number of the copper water heat pipes 12 of the first heat dissipation component 1 and the number of the copper water heat pipes 12 of the second heat dissipation component 2 are at least 4; for example: the number of the copper heat pipes 12 of the first heat dissipation assembly 1 and the number of the copper heat pipes 12 of the second heat dissipation assembly 2 may be 4, 5 or 6.

The improved scheme is as follows:

as shown in fig. 3 and 4, the bottom of the first base 11 and the bottom of the second base 21 are provided with heat pipe grooves 113; the copper water heat pipe 12 is in an L shape formed by a transverse section and a vertical section, the transverse section is provided with a heat absorbing end 121, and the vertical section is provided with a heat releasing end 122;

the heat absorbing end 121 of the copper water heat pipe 12 of the first heat dissipation component 1 is arranged in the heat pipe groove 113 of the first base 11; the heat absorbing end 121 of the copper water heat pipe 12 of the second heat dissipating component 2 is disposed in the heat pipe groove 113 of the second base 21.

A flat surface 123 is arranged at the bottom of the heat absorbing end 121 of the copper water heat pipe 12; the flat surface 123 is flush with the lower port of the heat pipe groove 113.

The first heat dissipation assembly 1 and the second heat dissipation assembly 2 comprise a plurality of heat dissipation fins 13, and the heat dissipation fins 13 are arranged in a stacked manner;

the heat release end 122 of the copper water heat pipe 12 of the first heat radiation component 1 is arranged on the heat radiation fins 13 of the first heat radiation component 1 in a penetrating way; the heat release end 122 of the copper water heat pipe 12 of the second heat dissipation component 2 is arranged on the heat dissipation fins 13 of the second heat dissipation component 2 in a penetrating way.

Specifically, the number of the heat dissipation fins 13 is set according to the actual length of the heat dissipation end 122 of the copper water heat pipe 12; for example: the number of the heat dissipation fins 13 may be 40, 45 or 50. The left side and the right side of the radiating fins 13 are vertically provided with connecting plates 132, and the radiating fins 13 are connected in a stacked manner through the connecting plates 132; at least 4 penetrating holes 133 for penetrating the heat release end 122 of the copper water heat pipe 12 are uniformly formed in the surface of the heat radiation fin 13, and the number of the penetrating holes 133 corresponds to the number of the copper water heat pipe 12; after the heat release ends 122 of the copper water heat pipes 12 are penetrated through the heat release ends 122 of the plurality of heat dissipation fins 13, the plurality of heat dissipation fins 13 are pressed on the heat release ends 122 of the copper water heat pipes 12 in an interference fit manner, so that the plurality of heat dissipation fins 13 are fixed with the heat release ends 122 of the copper water heat pipes 12.

As shown in fig. 3, the upper surface of the first base 11 is provided with a positioning column 111 and a bracket fixing hole 112. The bottom of the first base 11 is provided with heat pipe grooves 113, and the number of the heat pipe grooves 113 corresponds to the number of the copper water heat pipes 12; the heat absorbing end 121 of the copper water heat pipe 12 is arranged in the heat pipe groove 113 through a press-fitting process; the lower surface of the first base 11 is provided with a fixing hole.

As shown in fig. 4, the bottom of the second base 21 is provided with heat pipe slots 113, and the number of the heat pipe slots 113 corresponds to the number of the copper water heat pipes 12; the heat absorbing end 121 of the copper water heat pipe 12 is disposed in the heat pipe groove 113 by a press-fitting process. The lower surface of the second base 21 is provided with a temperature sensor hole 212 and a through hole 211.

The structural size and number of the radiating fins 13, the structural size and number of the copper water heat pipes 12 of the second radiating component 2 are the same as those of the radiating fins 13, the structural size and number of the copper water heat pipes 12 of the first radiating component 1, the assembly structure of the radiating fins 13 and the copper water heat pipes 12, the assembly structure of the copper water heat pipes 12 and the heat pipe grooves 113 of the second radiating component 2 are the same as those of the assembly structure of the radiating fins 13 and the copper water heat pipes 12, the assembly structure of the copper water heat pipes 12 and the assembly structure of the heat pipe grooves 113 of the first radiating component 1.

Bolts pass through the through holes 211 and the fixing holes to fix the first base 11 and the second base 21 together.

As shown in fig. 5, the thermoelectric module 3 further includes a temperature sensor 32 for detecting the temperature of the CPU.

Specifically, the temperature sensor 32 is installed in the temperature sensor hole 212, and the CPU temperature may be collected.

When the temperature of the CPU collected by the temperature sensor 32 is greater than or equal to 60 ℃, the semiconductor panel 31 starts to work, and the refrigeration surface of the semiconductor panel 31 generates cold energy;

when the CPU temperature acquired by the temperature sensor 32 is less than 60 ℃, the semiconductor panel 31 stops working.

The material of the semiconductor panel 31 is a material with high thermal conductivity, and when the semiconductor panel 31 stops working, the heat of the CPU is transferred upwards to the first base 11 through the semiconductor panel 31. The semiconductor panel 31 is further provided with a through hole 211 for passing through a bolt and positioning.

As shown in fig. 5, the thermoelectric module 3 further includes a control panel 33, and a data connector 34 for connecting to a CPU is provided on the control panel 33. The control panel 33 is connected to the semiconductor panel 31 via data lines 35.

The thermoelectric refrigeration CPU radiator also comprises a packaging component 4; the package assembly 4 includes an upper cross plate 42, a lower cross plate 44, a left riser 41 and a right riser 43; the left vertical plate 41, the lower transverse plate 44, the right vertical plate 43 and the upper transverse plate 42 are sequentially connected end to form a rectangular frame;

the packaging component 4 is disposed between the heat dissipation fins 13 of the first heat dissipation component 1 and the heat dissipation fins 13 of the second heat dissipation component 2, and the lower transverse plate 44 is attached to the upper surface of the first base 11.

Fin positioning grooves 131 are formed in the left and right ends of the radiating fins 13, and buckling strips 411 are arranged on the two sides of the left vertical plate 41 and the right vertical plate 43;

the heat dissipation fins 13 of the first heat dissipation assembly 1 are arranged on the left side of the packaging assembly 4; the left fastening strip 411 of the left riser 41 and the left fastening strip 411 of the right riser 43 are respectively fastened in the left fin positioning groove 131 and the right fin positioning groove 131 of the heat dissipation fin 13;

the heat dissipation fins 13 of the second heat dissipation component 2 are arranged on the right side of the packaging component 4; and the right fastening strip 411 of the left riser 41 and the right fastening strip 411 of the right riser 43 are respectively fastened in the left fin positioning groove 131 and the right fin positioning groove 131 of the heat dissipation fin 13.

Specifically, as shown in fig. 6, the upper transverse plate 42 and the left vertical plate 41 are integrally formed, and the right vertical plate 43 and the lower transverse plate 44 are integrally formed; the lower end of the left vertical plate 41 is provided with a cylindrical pin 421, and the left end of the lower transverse plate 44 is provided with a through hole 211 for inserting the cylindrical pin 421; the right end cylindrical pin 421 of the upper transverse plate 42, and the upper end of the right vertical plate 43 is provided with a groove 431 for installing the cylindrical pin 421.

The lower cross plate 44 is provided with a positioning hole 441 and a through hole 211, and the positions of the positioning hole 441 and the through hole 211 correspond to the positions of the positioning column 111 of the first base 11 and the bracket fixing hole 112. The positioning column 111 of the first base 11 is inserted into the positioning hole 441, and the through hole 211 and the bracket fixing hole 112 of the first base 11 are used for fixing the bracket 6.

The right riser 43 is provided with an insertion port 432, the control panel 33 is fixed on the inner side of the right riser 43, and the data connector 34 on the control panel 33 passes through the insertion port 432.

As shown in fig. 7, the thermoelectric refrigeration CPU heat sink further includes a fan 5; the fan 5 is fixed inside the package assembly 4, the air suction end 51 of the fan 5 faces the heat dissipation fins 13 of the first heat dissipation assembly 1, and the air blowing end 52 faces the heat dissipation fins 13 of the second heat dissipation assembly 2.

The inner surface of the left riser 41 is provided with a fan positioning groove 412, and the fan 5 is fixed in the packaging assembly 4 through the fan positioning groove 412.

The thermoelectric refrigeration CPU radiator also comprises a U-shaped bracket 6, wherein both sides of the bracket 6 are provided with lugs 61; the bracket 6 is arranged between the lower transverse plate 44 and the first base 11, and the thermoelectric refrigeration CPU radiator is fixed on the CPU through the lugs 61.

Specifically, as shown in fig. 7, the bracket 6 is provided with the positioning hole 441 and the through hole 211, and the positions of the positioning hole 441 and the through hole 211 correspond to the positions of the positioning post 111 of the first base 11 and the bracket fixing hole 112. The positioning column 111 of the first base 11 is inserted into the positioning hole 441, and the bolt sequentially passes through the through hole 211 on the lower transverse plate 44, the through hole 211 on the bracket 6, and the bracket fixing hole 112 on the first base 11, so that the bracket 6 is disposed between the lower transverse plate 44 and the first base 11. The lugs 61 are provided with mounting holes through which bolts pass to fix the thermoelectric refrigeration CPU radiator to the CPU.

In this embodiment, the assembly sequence of the thermoelectric refrigeration CPU heat sink is:

firstly, the copper water heat pipe 12 is pressed into a heat pipe groove 113 of the first base 11, a plurality of heat radiation fins 13 are pressed on the copper water heat pipe 12 and welded firmly, and the assembly of the first heat radiation component 1 is completed; and similarly, the second heat dissipation assembly 2 is assembled according to the assembly method of the first heat dissipation assembly 1.

Next, the semiconductor panel 31 is disposed between the first chassis 11 and the second chassis 21, the heating surface of the semiconductor panel 31 is bonded to the lower surface of the first chassis 11, the cooling surface of the semiconductor panel 31 is bonded to the upper surface of the second chassis 21, and the temperature sensor 32 is inserted into the temperature sensor hole 212 of the second chassis 21, and then the second chassis 21, the semiconductor panel 31 and the first chassis 11 are fixed together by sequentially passing through the through hole 211 of the second chassis 21, the through hole 211 of the semiconductor panel 31 and the fixing hole of the lower surface of the first chassis 11 from bottom to top using bolts.

Finally, the cylindrical pin 421 at the lower end of the left vertical plate 41 is inserted into the through hole 211 at the left end of the lower transverse plate 44, and the cylindrical pin 421 at the right end of the upper transverse plate 42 is arranged in the groove 431 at the upper end of the right vertical plate 43, so that the assembly of the packaging assembly 4 is completed; the packaging assembly 4 is fixed above the first base 11 through the positioning hole 441 and the through hole 211, and the left fastening strip 411 of the left riser 41 and the left fastening strip 411 of the right riser 43 are respectively fastened in the left fin positioning groove 131 and the right fin positioning groove 131 of the heat dissipation fin 13, and the right fastening strip 411 of the left riser 41 and the right fastening strip 411 of the right riser 43 are respectively fastened in the left fin positioning groove 131 and the right fin positioning groove 131 of the heat dissipation fin 13. The fan 5 is fixed in the package assembly 4 by the fan positioning groove 412. The control panel 33 of the thermoelectric module 3 is fixed on the inner side of the right riser 43, and the data connector 34 on the control panel 33 passes through the plug-in interface 432 to complete the integral assembly of the thermoelectric refrigeration CPU radiator.

The utility model is further described below in connection with the working principle:

when the temperature sensor 32 of the thermoelectric assembly 3 detects that the temperature of the CPU is more than or equal to 60 ℃, the semiconductor panel 31 starts to work; the cooling capacity generated by the cooling surface of the semiconductor panel 31 is transmitted to the CPU through the second base 21 to cool the CPU; after the heat generated by the heating surface of the semiconductor panel 31 is absorbed by the heat absorbing end 121 of the copper water heat pipe 12, the working medium in the copper water heat pipe 12 is heated and evaporated, the steam rises to the heat releasing end 122 of the copper water heat pipe 12, the heat is transferred to the heat dissipating fins 13 to exchange heat with air, the steam is condensed into liquid after being cooled, and the liquid flows back under the action of gravity to continue to be heated and evaporated.

When the temperature sensor 32 of the thermoelectric module 3 detects that the temperature of the CPU is less than 60 ℃, the semiconductor panel 31 stops working; a part of heat of the CPU is radiated by the copper water heat pipe 12 of the second heat radiation component 2, and the rest of heat is transferred upward to the copper water heat pipe 12 of the first heat radiation component 1 by the semiconductor panel 31 to radiate.

The utility model is not limited to the above-mentioned alternative embodiments, on the premise of not contradicting each other, can combine arbitrarily between every scheme; any person who is in the light of the present utility model can obtain other products in various forms, however, any changes in shape or structure are within the scope of the present utility model as defined by the claims.

Claims

1. A thermoelectric refrigeration CPU heatsink, comprising:

2. A thermoelectric refrigeration CPU heatsink as set forth in claim 1, wherein: the bottom of the first base and the bottom of the second base are both provided with heat pipe grooves; the copper water heat pipe is in an L shape formed by a transverse section and a vertical section, the transverse section is provided with a heat absorption end, and the vertical section is provided with a heat release end;

3. A thermoelectric refrigeration CPU heatsink as set forth in claim 2, wherein: a flat surface is arranged at the bottom of the heat absorbing end of the copper water heat pipe; the flat surface is flush with the lower port of the heat pipe groove.

4. A thermoelectric refrigeration CPU heatsink as set forth in claim 2, wherein: the first radiating component and the second radiating component comprise a plurality of radiating fins, and the radiating fins are arranged in a stacked mode;

5. A thermoelectric refrigeration CPU heatsink as set forth in claim 1, wherein: the thermoelectric assembly further includes a temperature sensor for detecting the temperature of the CPU.

6. A thermoelectric refrigeration CPU heatsink as set forth in claim 4 wherein: also comprises a packaging assembly; the packaging assembly comprises an upper transverse plate, a lower transverse plate, a left vertical plate and a right vertical plate; the left vertical plate, the lower transverse plate, the right vertical plate and the upper transverse plate are sequentially connected end to form a rectangular frame;

7. The thermoelectric refrigeration CPU heat sink as set forth in claim 6 wherein: fin locating grooves are formed in the left end and the right end of each radiating fin, and buckling strips are arranged on the two sides of each left vertical plate and the two sides of each right vertical plate;

8. The thermoelectric refrigeration CPU heat sink as set forth in claim 6 wherein: the fan is also included; the fan is fixed inside the packaging assembly; the fan comprises an air suction end and an air blowing end, wherein the air suction end faces the radiating fins of the first radiating component, and the air blowing end faces the radiating fins of the second radiating component.

9. The thermoelectric refrigeration CPU heat sink as set forth in claim 8 wherein: the inner surface of the left vertical plate is provided with a fan positioning groove, and the fan is fixed in the packaging assembly through the fan positioning groove.

10. The thermoelectric refrigeration CPU heat sink as set forth in claim 6 wherein: the device also comprises a U-shaped bracket, wherein both sides of the bracket are provided with lugs; the support is arranged between the lower transverse plate and the first base, and the thermoelectric refrigeration CPU radiator is fixed on the CPU through the support lugs.