CN2664194Y - Liquid cooling type heat sink - Google Patents
Liquid cooling type heat sink Download PDFInfo
- Publication number
- CN2664194Y CN2664194Y CN 200320117146 CN200320117146U CN2664194Y CN 2664194 Y CN2664194 Y CN 2664194Y CN 200320117146 CN200320117146 CN 200320117146 CN 200320117146 U CN200320117146 U CN 200320117146U CN 2664194 Y CN2664194 Y CN 2664194Y
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- enclosure space
- radiating seat
- liquid
- radiator
- cooling heat
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Abstract
A liquid cooling type heat sink for radiating heating electronic components comprises a first radiating seat, a radiator, a second radiating seat and a pump body; the first radiating seat and the second radiating seat form first and second close spaces for heat exchange respectively which are provided with a plurality of heat exchanging plates; a plurality of diversion paths are arranged between the heat exchanging plates; the pump body is provided with an input terminal and an output terminal which are connected with the second radiating seat and the first radiating seat respectively; the radiator is clung on the first radiating seat tightly; the second radiating seat is clung on the radiator tightly; the second close space is communicated with the first close space. The liquid cooling type heat sink transfers heat of the heating electronic components to the first radiating seat and the second radiating seat by cooling liquid; the radiator is contacted with the first radiating seat and the second radiating seat together and heat exchanging area increases, thereby improving heat exchanging efficiency.
Description
[technical field]
The utility model relates to the heat abstractor of electronic component, particularly about utilizing the heat radiator of electronic element of circulating cooling liquid body.
[background technology]
The electronic component of computer and other electronic equipment all has certain working temperature, and electronic component needs could normal operation in the temperature range that allows.For example, computer cpu (CPU) if the temperature of CPU surpasses the operating temperature range of its permission, often causes computer glitch easily, the data entanglement, lose, even whole electronic component thoroughly damages, and can't repair.So general electronic component all needs to dispose corresponding radiator, outwards distributes in order to the heat that electronic component is produced, and reduces the temperature of electronic component itself, ensures that it can normal operation.
Generally speaking, the prior art electronic component radiator comprises a cooling fan and the radiator of being made up of many fin, described radiator generally is close to the heat-generating electronic elements surface, the heat that heat-generating electronic elements produces conducts to radiator by the contact-making surface between the two, and utilizes fin that heat is dispersed into surrounding air.Cooling fan generally is close to and is leaned against on the radiator, quickens to flow in order to order about air, thereby improves radiating effect.But, practice is found, radiator and the heat-generating electronic elements heat exchange area between the two, be that contact area between the two is limited, heat exchanger effectiveness is difficult to improve, and radiating effect is relatively poor, and particularly the power of electronic component is increasing in recent years, caloric value also constantly increases, and the traditional heat-dissipating device is difficult to satisfy the demand.
See also Fig. 5 and Fig. 6, on April 6th, 1999 application and in March in 2000 Granted publication on the 29th Chinese patent disclose a kind of auxiliary heat dissipation circulatory system No. 99208214.5, it comprises that a pumping 10, with output 11 and input 12 possesses the condenser pipe 30 of cooling wafer 20, and a radiating seat 40 with delivery outlet 41 and input port 42.Condenser pipe 30 1 ends have a condensation output 31, and the other end has a condensation input 32, and cooling wafer 20 is arranged at the precalculated position of described condenser pipe 30, for the inner refrigeration of described condenser pipe.Condensation output 31 links to each other with the input 12 of pumping 10, the output 11 of pumping 10 links to each other by intake line 45 with the input port 42 of radiating seat 40, the delivery outlet 41 of radiating seat 40 links to each other by output pipe 46 with the condensation input 32 of condenser pipe 30, so forms a circuit cycle system.Wherein, described radiating seat 40 is a square pedestal, the bottom corral forms enclosure space, a through hole is respectively established at two ends in described enclosure space, form above-mentioned delivery outlet 41 and input port 42, in enclosure space, establish a plurality of heat radiation walls 43, form end to end guiding gutter (scheming not label) with head and the tail interlace mode row.During use, in the guiding gutter of described radiating seat 40, inject circulating fluid, isolation because of described a plurality of heat radiation walls 43, make circulating fluid follow described guiding gutter to advance, in traveling process, the heat of radiating seat 40 taken out of described radiating seat 40, flow into condenser pipe 30 through output pipe 46, refrigeration through cooling wafer 20, circulating fluid so far changes low-temperature condition into, then export pumping 10 to, described pumping 10 continues that cooled circulating fluid is inputed to radiating seat 40 dispels the heat, lowers the temperature, and so going round and beginning again forms a cooling recirculation system.
Yet above-mentioned heat dissipation circulating system needs one contain the condenser pipe of cooling wafer, because of cooling wafer costs an arm and a leg, so increase whole cost; And the finite volume of radiating seat 40, the quantity that can hold the wall 43 that dispels the heat is therefore limited, and radiating effect still has deficiency, is difficult to satisfy electronic element radiating demand high-power, big caloric value.
In view of this, provide a kind of great heat radiation effect that has, and simple in structure, heat abstractor is real cheaply is necessary.
[summary of the invention]
It is good that the purpose of this utility model provides a kind of radiating effect, simple in structure and lower-cost liquid-cooling heat radiator.
Liquid-cooling heat radiator of the present utility model, heat-generating electronic elements is dispelled the heat, it comprises one first radiating seat, one radiator, one second radiating seat and a pump housing, form respectively in described first radiating seat and second radiating seat and can carry out first of heat exchange, second enclosure space, described first, be respectively arranged with a plurality of heat exchanger fins in second enclosure space, form a plurality of honeycomb ducts between the described heat exchanger fin, the described pump housing has an input and an output, be connected to described second radiating seat and first radiating seat, above-mentioned radiator closely is attached on described first radiating seat, above-mentioned second radiating seat closely is attached on the described radiator, and above-mentioned second enclosure space and above-mentioned first enclosure space interconnect.
The utility model further improves and is to be provided with a radiator fan in described radiator one side, can strengthen radiating effect.
Compared with prior art, liquid-cooling heat radiator of the present utility model utilize cooling liquid with the heat transferred of heat-generating electronic elements to described first radiating seat and second radiating seat, radiator contacts with described first radiating seat and second radiating seat simultaneously, heat exchange area increases, thereby raising heat exchanger effectiveness, radiating effect can greatly strengthen, and cost is lower.
[description of drawings]
Fig. 1 is the stereogram of the utility model liquid-cooling heat radiator;
Fig. 2 is the three-dimensional exploded view of the utility model liquid-cooling heat radiator main body;
Fig. 3 is the vertical view that first radiating seat of Fig. 2 is removed dull and stereotyped lid;
Fig. 4 is the vertical view that second radiating seat of Fig. 2 is removed top cover;
Fig. 5 is a prior art cooling system schematic perspective view;
Fig. 6 is that the liquid conductance of Fig. 5 prior art cooling system is to schematic diagram.
[embodiment]
Please consult Fig. 1 earlier, liquid-cooling heat radiator 100 of the present utility model comprises that a main body 101, is built-in with the liquid tank 200 of the pump housing (figure does not show) and the catheter 410,420 of described main body 101 of a pair of connection and described liquid tank 200, and described main body 101, catheter 410,420 and liquid tank 200 form the circulation circuit of a closure.Described main body 101 is to place a heat-generating electronic elements, and on computer cpu (CPU), under the driving of the described pump housing, cooling liquid flows in described circulation circuit, thereby CPU is dispelled the heat.
Please together consult Fig. 2, described main body 101 comprise first radiating seat 110, one second radiating seat 130 that contacts with CPU surface and be located in described first radiating seat 110 and described second radiating seat 130 between radiator 150.Be connected by a conduit 124 between described first radiating seat 110 and described second radiating seat 130.
Described first radiating seat 110 comprises a pedestal 112 and a flat board lid 120, and wherein pedestal 112 has two relative sidewalls 1031,1033, and surrounds formation one enclosure space (scheming not label) with other sidewall (scheming not label) and described dull and stereotyped lid 120 sealings.
A plurality of heat exchanger fins 115 and a barrier rib 117 are arranged in the enclosure space of described pedestal 112.Described barrier rib 117 is arranged at the enclosure space middle part, and the one end links to each other with sidewall 1031, and the other end is near another sidewall 1033, but not contact with it; And when enclosure space sealed, the top of barrier rib 117 contacted with described dull and stereotyped lid 120 sealings, and the top of each heat exchanger fin 115 contacts with described dull and stereotyped lid 120 sealings, avoids the overhead stream mistake of cooling liquid from described heat exchanger fin 115 and described barrier rib 117.Described heat exchanger fin 115 is arranged at the both sides of barrier rib 117 respectively, and parallel to each other, and the close sidewall 1031 and 1033 in its two ends, but contact with it; At a distance of certain distance, form a plurality of honeycomb ducts 119 (seeing also Fig. 3) between adjacent two heat exchanger fins 115.For described dull and stereotyped lid 120 is installed, the sidewall 1031,1033 of described pedestal 112 and the inboard of other sidewall can be provided with a sealed step (scheming not label), its height is identical with the height of described heat exchanger fin 115 and barrier rib 117, so help flat board lid 120 is fixed in described pedestal 112 with welding manner, improve sealing.
Described dull and stereotyped lid 120 is provided with first through hole 122 that is connected with described enclosure space, and sidewall 1031 is provided with an inlet 114 that is connected with described enclosure space, and described inlet 114 is connected to the output 204 of liquid tank 200 by catheter 420.Described inlet 114 is opened in an end of sidewall 1031, and described first through hole 122 is opened in the position of described dull and stereotyped lid 120 near sidewall 1031 other ends, and like this, the described inlet 114 and first through hole 122 lay respectively at the both sides of barrier rib 117.
Described radiator 150 is made up of a plurality of sheet fin 151, and described radiator 150 lower surfaces can cover 120 surfaces in flat board by the welding manner secure bond, is dispersed in the air with the heat that described first radiating seat 110 is absorbed.
Described second radiating seat 130 comprises a base plate 131 and a top cover 140, and described top cover 140 has a roof 143 and four sidewalls 141 that extend along described roof 143 peripheries downwards, and described base plate 131 and top cover 140 are in conjunction with forming an enclosure space.Modes such as described base plate 131 can weld are fixed in described radiator 150 upper surfaces, be extended with a plurality of heat exchanger fins 135 and a barrier rib 137 on the described base plate 131, the set-up mode of described heat exchanger fin 135 and barrier rib 137 is identical with the heat exchanger fin 115 of described first radiating seat 110 and barrier rib 117, be that described barrier rib 137 is positioned at the middle part, described heat exchanger fin 135 is parallel to each other and keeps at a certain distance away, and forms a plurality of honeycomb ducts 139 (seeing also Fig. 4).When top cover 140 formed enclosure space with base plate 131 sealings, described barrier rib 137 1 ends contacted with a sidewall 141 of top cover 140, and the other end is near relative another sidewall (scheming not label), but not contact with it; The top of described barrier rib 137 contacts with described top cover 140 sealings, avoids cooling liquid from described overhead stream mistake.Described heat exchanger fin 135 two ends are near sidewall 141 and another relative sidewall, but not contact with it.Described base plate 131 offers one second through hole 132 and is connected with described enclosure space, and described second through hole 132 is communicated with by conduit 124 with first through hole 122 of described first radiating seat 110.Described top cover 140 offers a liquid outlet 142 and is connected with described enclosure space, and described liquid outlet 142 is connected to the input 202 of described liquid tank 200 by catheter 410.Described liquid outlet 142 is opened in an end of sidewall 141, and second through hole 132 is opened in the position of described base plate 131 near sidewall 141 other ends, and like this, the described liquid outlet 142 and second through hole 132 lay respectively at the both sides of barrier rib 137.
Seeing also Fig. 3, is the vertical view that first radiating seat 110 removes dull and stereotyped lid 120.Described heat exchanger fin 115 parallel arrangements, form a plurality of parallel honeycomb ducts 119, inlet 114 is opened in an end of sidewall 1031, it is positioned at barrier rib 117 1 sides, and first through hole 122 (seeing also Fig. 2) of dull and stereotyped lid 120 is arranged at the position near sidewall 1031 other ends, and it is positioned at the opposite side of barrier rib 117.So, when cooling liquid behind the enclosure space of inlet 114 input first radiating seat 110, at first a plurality of honeycomb ducts 119 along barrier rib 117 1 sides flow to sidewall 1033, a plurality of honeycomb ducts 119 along barrier rib 117 opposite sides flow to sidewall 1031 again, first through hole 122 from flat board lid 120 flows out at last, is input to by conduit 124 in the enclosure space of second radiating seat 130.Thereby the cooling liquid each several part honeycomb duct 119 of can fully flowing through carries out sufficient heat exchange with each several part heat exchanger fin 115.
Seeing also Fig. 4, is the vertical view that second radiating seat 130 removes top cover 140.Described heat exchanger fin 135 parallel arrangements, form a plurality of parallel honeycomb ducts 139, liquid outlet 142 is opened in an end (seeing also Fig. 2) of sidewall 141, it is positioned at barrier rib 137 1 sides, and second through hole 132 of base plate 131 is arranged at the position near sidewall 141 other ends, and it is positioned at the opposite side of barrier rib 137.So, when cooling liquid behind the enclosure space of second through hole 132 input, second radiating seat 130, at first flow to another sidewall relative with sidewall 141 along a plurality of honeycomb ducts 139 of barrier rib 137 1 sides, a plurality of honeycomb ducts 139 along barrier rib 137 opposite sides flow to sidewall 141 again, flow out from liquid outlet 142 at last.Thereby the cooling liquid each several part honeycomb duct 139 of can fully flowing through carries out sufficient heat exchange with each several part heat exchanger fin 135.
See also Fig. 1 and Fig. 2 again, during use, the pedestal 112 of first radiating seat 110 of the utility model liquid-cooling heat radiator 100 is close to the CPU surface, the heat of CPU partly conducts to a plurality of heat exchanger fins 115 of described pedestal 112, be dispersed in the air after also having simultaneously the part heat directly to conduct to radiator 150 through dull and stereotyped lid 120, cooling liquid is behind inlet 114 input enclosure spaces, in traveling process, carry out heat exchange with pedestal 112 and heat exchanger fin 115, absorb behind the heat a part of heat transferred to described dull and stereotyped lid 120, described dull and stereotyped lid 120 is distributed to heat transferred in the air to radiator 150; Then, the cooling liquid that absorbs heat flows into the enclosure space of second radiating seat 130 via conduit 124, and in continuing traveling process, carry out heat exchange with the base plate 131 and the heat exchanger fin 135 of second radiating seat 130, with with another part heat transferred to base plate 131, described base plate 131 is distributed to heat transferred in the air to radiator 150; Through after the heat exchange, cooling liquid inputs to liquid tank 200 from liquid outlet 142 outputs through catheter 410, enters next circulation then under the pump housing drives.
For improving radiating effect, the utility model can further be installed a radiator fan in a side of radiator 150, strengthens the radiating effect of radiator 150.
In the above-described embodiments, the combined radiator that radiator 150 adopts by a plurality of sheet fin 151 be combined intos is appreciated that ground, and the utility model also can adopt the aluminium extruded type radiator.In addition, inlet 114 of the present utility model is arranged with the position of liquid outlet 142 also can the variation of other position, as long as can make cooling liquid fully pass through the heat exchanger fin of enclosure space each several part.
The structure that is appreciated that the utility model first radiating seat 110 and second radiating seat 130 is not limited thereto, as long as its inside can form enclosure space, when cooling liquid is flowed through described enclosure space, can carry out heat exchange with heat exchanger fin 115,135 and get final product; The honeycomb duct 119,139 that forms in the enclosure space also is not limited to the structure that the foregoing description is described, and for example also can adopt the guiding gutter structure as the known techniques of Fig. 6.
Claims (10)
1. liquid-cooling heat radiator, heat-generating electronic elements is dispelled the heat, it comprises one first radiating seat, one radiator, one second radiating seat and a pump housing, form respectively in described first radiating seat and second radiating seat and can carry out first of heat exchange, second enclosure space, described first, be respectively arranged with a plurality of heat exchanger fins in second enclosure space, form a plurality of honeycomb ducts between the described heat exchanger fin, the described pump housing has an input and an output, be connected to described second radiating seat and first radiating seat, it is characterized in that: above-mentioned radiator closely is attached on described first radiating seat, above-mentioned second radiating seat closely is attached on the above-mentioned radiator, and above-mentioned second enclosure space and above-mentioned first enclosure space interconnect.
2. liquid-cooling heat radiator as claimed in claim 1 is characterized in that: a plurality of heat exchanger fins in described first enclosure space are to be arranged in parallel and the space certain distance, and the periphery of described heat exchanger fin and described first enclosure space keeps at a certain distance away.
3. liquid-cooling heat radiator as claimed in claim 2, it is characterized in that: in described first enclosure space barrier rib is set further, described barrier rib one end contacts with the peripheral seal of described first enclosure space, and the periphery of the other end and first enclosure space keeps at a certain distance away.
4. liquid-cooling heat radiator as claimed in claim 1 is characterized in that: the heat exchanger fin in described second enclosure space is to be arranged in parallel and the space certain distance, and the periphery of the described heat exchanger fin and second enclosure space keeps at a certain distance away.
5. liquid-cooling heat radiator as claimed in claim 4, it is characterized in that: in described second enclosure space barrier rib is set further, described barrier rib one end contacts with the peripheral seal of described second enclosure space, the other end and second enclosure space peripheral spaced apart.
6. liquid-cooling heat radiator as claimed in claim 1 is characterized in that: described first enclosure space offers an inlet and communicates with described first enclosure space, and the output of the described pump housing is connected with described inlet.
7. liquid-cooling heat radiator as claimed in claim 6 is characterized in that: described second enclosure space offers a liquid outlet and communicates with described second enclosure space, and the input of the described pump housing links to each other with described liquid outlet.
8. liquid-cooling heat radiator as claimed in claim 1 is characterized in that: described second enclosure space and first enclosure space are to interconnect by a conduit.
9. liquid-cooling heat radiator as claimed in claim 1 is characterized in that: described radiator is made up of a plurality of sheet fin.
10. liquid-cooling heat radiator as claimed in claim 1 is characterized in that: described liquid-cooling heat radiator further comprises a liquid tank, and the described pump housing is to place in the described liquid tank.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200320117146 CN2664194Y (en) | 2003-10-13 | 2003-10-13 | Liquid cooling type heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200320117146 CN2664194Y (en) | 2003-10-13 | 2003-10-13 | Liquid cooling type heat sink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2664194Y true CN2664194Y (en) | 2004-12-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200320117146 Expired - Lifetime CN2664194Y (en) | 2003-10-13 | 2003-10-13 | Liquid cooling type heat sink |
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| Country | Link |
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| CN (1) | CN2664194Y (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7418996B2 (en) | 2005-08-12 | 2008-09-02 | Foxconn Technology Co., Ltd. | Integrated liquid cooling system for electronic components |
| CN100444369C (en) * | 2006-10-13 | 2008-12-17 | 无锡江南计算技术研究所 | High power integrated ciruit chip cooling device |
| CN101208797B (en) * | 2005-06-29 | 2011-08-17 | 英特尔公司 | Liquid cooling system of electrical device |
| CN103186206A (en) * | 2011-12-28 | 2013-07-03 | 鸿富锦精密工业（深圳）有限公司 | Radiator assembly |
| US8910706B2 (en) | 2009-02-05 | 2014-12-16 | International Business Machines Corporation | Heat sink apparatus with extendable pin fins |
| CN104349641A (en) * | 2013-07-30 | 2015-02-11 | 宏碁股份有限公司 | Circulating heat dissipation module |
| US9210831B2 (en) | 2013-04-15 | 2015-12-08 | International Business Machines Corporation | Separable and integrated heat sinks facilitating cooling multi-compnent electronic assembly |
| CN106098657A (en) * | 2016-08-15 | 2016-11-09 | 华南理工大学 | The small-scale liquid cooling system of a kind of electrohydraulic dynamic Micropump driving and method |
| TWI576555B (en) * | 2013-08-28 | 2017-04-01 | 宏碁股份有限公司 | Cycling heat dissipation module |
| CN107731765A (en) * | 2017-11-16 | 2018-02-23 | 安徽合电气科技有限公司 | A kind of integrated liquid cooling heat radiator |
| CN108235653A (en) * | 2017-12-29 | 2018-06-29 | 华南理工大学 | A kind of liquid-cooling type flat aluminum heat-pipe radiator and its manufacturing method |
| CN110647226A (en) * | 2019-10-08 | 2020-01-03 | 周川 | Reinforced water-cooling computer cooling equipment |
-
2003
- 2003-10-13 CN CN 200320117146 patent/CN2664194Y/en not_active Expired - Lifetime
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101208797B (en) * | 2005-06-29 | 2011-08-17 | 英特尔公司 | Liquid cooling system of electrical device |
| US7418996B2 (en) | 2005-08-12 | 2008-09-02 | Foxconn Technology Co., Ltd. | Integrated liquid cooling system for electronic components |
| CN100444369C (en) * | 2006-10-13 | 2008-12-17 | 无锡江南计算技术研究所 | High power integrated ciruit chip cooling device |
| US8910706B2 (en) | 2009-02-05 | 2014-12-16 | International Business Machines Corporation | Heat sink apparatus with extendable pin fins |
| CN103186206A (en) * | 2011-12-28 | 2013-07-03 | 鸿富锦精密工业（深圳）有限公司 | Radiator assembly |
| US9210831B2 (en) | 2013-04-15 | 2015-12-08 | International Business Machines Corporation | Separable and integrated heat sinks facilitating cooling multi-compnent electronic assembly |
| US9456527B2 (en) | 2013-04-15 | 2016-09-27 | International Business Machines Corporation | Fabricating separable and integrated heat sinks facilitating cooling multi-component electronic assembly |
| CN104349641B (en) * | 2013-07-30 | 2017-05-03 | 宏碁股份有限公司 | Circulating heat dissipation module |
| CN104349641A (en) * | 2013-07-30 | 2015-02-11 | 宏碁股份有限公司 | Circulating heat dissipation module |
| TWI576555B (en) * | 2013-08-28 | 2017-04-01 | 宏碁股份有限公司 | Cycling heat dissipation module |
| CN106098657A (en) * | 2016-08-15 | 2016-11-09 | 华南理工大学 | The small-scale liquid cooling system of a kind of electrohydraulic dynamic Micropump driving and method |
| CN106098657B (en) * | 2016-08-15 | 2018-09-14 | 华南理工大学 | A kind of small-sized liquid cooling system and method for the driving of electrohydraulic dynamic Micropump |
| CN107731765A (en) * | 2017-11-16 | 2018-02-23 | 安徽合电气科技有限公司 | A kind of integrated liquid cooling heat radiator |
| CN107731765B (en) * | 2017-11-16 | 2020-02-07 | 安徽祥博传热科技有限公司 | Integrated liquid cooling radiator |
| CN108235653A (en) * | 2017-12-29 | 2018-06-29 | 华南理工大学 | A kind of liquid-cooling type flat aluminum heat-pipe radiator and its manufacturing method |
| CN110647226A (en) * | 2019-10-08 | 2020-01-03 | 周川 | Reinforced water-cooling computer cooling equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CX01 | Expiry of patent term |
Expiration termination date: 20131013 Granted publication date: 20041215 |