CN218068740U - Liquid cooling device of memory module - Google Patents
Liquid cooling device of memory module Download PDFInfo
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- CN218068740U CN218068740U CN202221564008.7U CN202221564008U CN218068740U CN 218068740 U CN218068740 U CN 218068740U CN 202221564008 U CN202221564008 U CN 202221564008U CN 218068740 U CN218068740 U CN 218068740U
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- liquid cooling
- memory module
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- heat dissipation
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Abstract
The utility model provides a liquid cooling device of memory module, include: at least one card slot, which is arranged on the mainboard and is used for the memory module to be inserted; at least two heat dissipation plates for dissipating heat of the respective attached memory modules; the liquid cooling plate is movably arranged on one side of the clamping groove, covers the top end of the memory module after the memory module is inserted into the clamping groove and is used for carrying out liquid cooling on the heat dissipation plate; and the at least one first fixing clamp is clamped on the surfaces of the heat dissipation plates on the two sides of one memory module and used for fixing the heat dissipation plates and the memory module. The utility model discloses effectively having solved the fixed problem of need the plug between current scheme memory module and the liquid cooling device, fully having considered the characteristics of memory module compact structure, from the heat dissipation of top design liquid cooling board, suitability, maneuverability are stronger, have reduced holistic manufacturing, installation tolerance requirement, but liquid cooling board one end design rotation axis simultaneously, the liquid cooling board is fixed through pivot and buckle, makes things convenient for the memory module dismouting to maintain, has effectively improved the maintainability and the installation convenience of device.
Description
Technical Field
The utility model relates to an electronic equipment's cooling technology field especially relates to liquid cooling technology field.
Background
The memory module becomes a heat dissipation bottleneck in the server due to the limitations of large power consumption, low allowable highest temperature, compact structure, difficulty in designing a large-scale heat sink for heat dissipation and the like. Traditional air cooling is difficult to meet the requirement of memory heat dissipation in a high-power server. Liquid cooling is used as an efficient heat dissipation mode, and the problem of heat dissipation of a memory can be well solved.
In order to solve the problems of compact memory structure and high requirement on liquid cooling design tolerance, a common liquid cooling device structure is shown in fig. 1, a liquid cooling channel is designed in the middle of a memory module, the liquid cooling device of the memory module is composed of a liquid cooling pipe 15, a heat dissipation plate 12 and a heat conduction gasket 13, and the liquid cooling devices of a plurality of memory modules are fixed in a case after being connected in parallel. Memory module 11 is inserted into card slot 14 through the gaps between the components. In the liquid cooling device, the memory chip can be directly cooled, the heat dissipation efficiency is high, but the requirement on the whole assembly is high, and the requirement on tolerance is high and the difficulty in the whole design and installation is higher due to the integrated design of the liquid cooling channel of the memory.
As shown in fig. 2 and 3, a liquid cooling channel is designed at the bottom of the memory module, and the heat dissipation plate 24, the heat conductive gasket 22 and the memory module 21 are fixed to the card slot 26 through the clip 27 to form an integral heat dissipation module, thereby achieving reliable and good contact between the memory module 21 and the heat dissipation plate 24. In this embodiment, since the heat dissipating plate 24 and the liquid cooling pipe 23 are divided into two parts, in order to ensure good heat conduction in the process of transferring heat from the heat dissipating plate 24 to the liquid cooling pipe 23 through the heat conducting gasket 25, the contact area between the heat dissipating plate 24 and the liquid cooling pipe 23 needs to be increased, and therefore, as shown in fig. 2 and 3, the heat conducting keys 28 in the staggered and spaced manner are added below the heat dissipating plate 24. The staggered heat conducting keys 28 ensure that two adjacent memory modules 21 are reliably contacted with the liquid cooling pipes 23 without affecting the insertion and extraction of the memory modules 21. However, the liquid cooling device also has the technical problems of high requirement on the whole assembly, high requirement on the tolerance and higher difficulty in the whole design and installation.
In addition, as the liquid cooling device in fig. 1 to fig. 3 is integrally assembled, the liquid cooling channel of the memory module is connected with the main liquid cooling channel, and the liquid cooling device needs to be completely disassembled for maintenance when chips are subsequently replaced or other devices are installed and maintained, and the liquid cooling device needs to be disassembled by a special fixture, so that the problem that the memory liquid cooling is difficult to maintain exists in the liquid cooling device.
Therefore, the current liquid cooling device solves the problems of compact memory structure and high requirement on liquid cooling design tolerance.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a memory module's liquid cooling device for there is the structure to the tolerance requirement height in solving current liquid cooling device, and inconvenient technical problem is maintained to the liquid cooling.
The utility model provides a liquid cooling device of memory module, include: at least one card slot, which is arranged on the mainboard and is used for the memory module to be inserted; at least two heat dissipation plates for dissipating heat of the respective attached memory modules; the liquid cooling plate is movably arranged on one side of the clamping groove, covers the top end of the memory module after the memory module is inserted into the clamping groove and is used for carrying out liquid cooling on the cooling plate; and the at least one first fixing clamp is clamped on the surface of the heat dissipation plate on two sides of one memory module and is used for fixing the heat dissipation plate with the memory module.
In an embodiment of the present invention, the liquid cooling plate is connected to a vertical supporting plate through a rotating shaft, so that the liquid cooling plate covers the top end of the memory module or is separated from the top end of the memory module.
In an embodiment of the present invention, the liquid cooling plate is provided with a cooling liquid inlet and a cooling liquid outlet on one side close to the rotating shaft.
In an embodiment of the present invention, the liquid cooling plate has a plurality of flow channels with a predetermined shape.
In an embodiment of the present invention, a first heat conductive gasket is disposed between the heat dissipation plate and the memory module.
In an embodiment of the invention, the heat dissipation plate has a T-shaped longitudinal section, so that the bottom surface of the top portion of the heat dissipation plate is attached to the top surface of the memory module.
In an embodiment of the present invention, a second heat conducting pad is disposed between the liquid cooling plate and the heat dissipating plate.
In an embodiment of the present invention, the heat dissipation plate further includes at least one second fixing clip, which is pressed on the surface of the liquid cooling plate, and both ends of the liquid cooling plate are fixed on the main board, for pressing the liquid cooling plate tightly against the heat dissipation plate.
In an embodiment of the present invention, the second fixing clip includes: the first fixing rod is fixed on the main board on one side of the liquid cooling board; the second fixing rod is fixed on the main board on the other side of the liquid cooling board; and the pressing part is connected between the first fixing rod and the second fixing rod and is pressed on the surface of the liquid cooling plate.
In an embodiment of the present invention, the pressing portion is in a zigzag shape.
As described above, the utility model discloses a liquid cooling device of memory module has following beneficial effect:
the utility model discloses effectively solved and needed the fixed problem of plug between current scheme memory module and the liquid cooling device, fully considered memory module compact structure's characteristics, from the heat dissipation of top design liquid cooling board, suitability, maneuverability are stronger, have reduced holistic manufacturing, installation tolerance requirement, but liquid cooling board one end design rotation axis simultaneously, the liquid cooling board is fixed through pivot and buckle, makes things convenient for the memory module dismouting to maintain, has effectively improved the maintainability and the installation convenience of device.
Drawings
FIG. 1 is a schematic diagram of a liquid cooling apparatus according to the prior art;
FIGS. 2 and 3 are schematic views showing another structure of a liquid cooling apparatus in the prior art;
fig. 4 is a schematic diagram showing an overall structure of a liquid cooling apparatus of a memory module according to the present invention;
fig. 5 is a schematic structural diagram of a liquid cooling device of a memory module according to the present invention when having a single slot;
fig. 6 is a front view of the liquid cooling apparatus of the memory module of the present invention with a single slot;
fig. 7 is a schematic structural diagram of a liquid cooling plate in a liquid cooling device of a memory module according to the present invention;
fig. 8 is a front view of the liquid cooling device of the memory module according to the present invention with a plurality of slots.
Description of the element reference numerals
11. Memory module
12. Heat radiation plate
13. Heat conducting gasket
14. Clamping groove
21. Memory module
22. Heat conducting gasket
23. Liquid cooling pipe
24. Heat radiation plate
25. Heat conducting gasket
26. Clamping groove
27. Clamp
28. Heat conducting key
100. Liquid cooling device
110. Clamping groove
120. Memory module
130. Heat radiation plate
140. Liquid cooling plate
141. Cooling liquid inlet
142. Coolant outlet
150. First fixing clamp
160. Second fixing clamp
161. First fixed link
162. Second fixing rod
163. Pressing part
170. Supporting plate
180. Rotating shaft
190. First heat-conducting gasket
1100. Second heat-conducting gasket
200. Main board
Detailed Description
The following description is provided for illustrative purposes, and other advantages and features of the present invention will become apparent to those skilled in the art from the following detailed description.
Please refer to fig. 4 to 8. It should be understood that the structure, ratio, size and the like shown in the drawings attached to the present specification are only used for matching with the content disclosed in the specification, so as to be known and read by those skilled in the art, and are not used for limiting the limit conditions that the present invention can be implemented, so that the present invention has no technical essential meaning, and any structure modification, ratio relationship change or size adjustment should still fall within the scope that the technical content disclosed in the present invention can cover without affecting the function that the present invention can produce and the purpose that the present invention can achieve. Meanwhile, the terms such as "upper", "lower", "left", "right", "middle" and "one" used in the present specification are for convenience of description, and are not intended to limit the scope of the present invention, and changes or adjustments of the relative relationship thereof may be made without substantial technical changes, and the present invention is also regarded as the scope of the present invention.
An object of this embodiment is to provide a liquid cooling device of memory module for there is the structure to the tolerance requirement height among the solution current liquid cooling device, and the inconvenient technical problem is maintained to the liquid cooling.
The principle and the implementation of the liquid cooling apparatus of the memory module of the present embodiment will be described in detail below, so that those skilled in the art can understand the liquid cooling apparatus of the memory module of the present embodiment without creative work.
As shown in fig. 4 to fig. 8, the present embodiment provides a liquid cooling apparatus 100 for a memory module, comprising: at least one card slot 110, at least two heat dissipation plates 130, a liquid cooling plate 140, at least one first fixing clip 150 and at least one second fixing clip 160.
The liquid cooling apparatus 100 of the memory module in this embodiment will be described in detail below.
In this embodiment, there are one or more card slots 110. As shown in fig. 4 and 8, a liquid cooling apparatus 100 of the memory module of the present embodiment is shown as a schematic structural diagram when having a plurality of slots. Fig. 5 is a schematic structural diagram of the liquid cooling apparatus 100 of the memory module of the present embodiment when having a single slot. In this embodiment, the card slot 110 is installed on the motherboard 200 for the memory module 120 to be inserted. When there are a plurality of card slots 110, the card slots 110 are disposed side by side, and the memory modules 120 are inserted into the card slots 110 through the gaps of the liquid cooling device 100 of the memory module.
In this embodiment, the memory module 120 may be a memory module 120 such as a DIMM or other memory module, for example, a pluggable hard disk, and the memory module 120 is generally a device to be cooled, which has a chip to be cooled on a surface or a package surface with a relatively flat surface, and the memory module 120 may be inserted into a slot.
In this embodiment, the liquid cooling apparatus 100 of the memory module includes at least two heat dissipation plates 130 for dissipating heat of the respective attached (attached) memory modules 120. The two heat dissipation plates 130 are used for dissipating heat of the respective attached memory modules 120, that is, one heat dissipation plate 130 is corresponding to one memory module 120 for dissipating heat, and when the memory module 120 is inserted into the card slot 110, two surfaces of the memory module 120 are respectively attached to the surfaces of the corresponding heat dissipation plates 130, so as to achieve the purpose of cooling and dissipating heat through the heat dissipation plates 130.
In this embodiment, as shown in fig. 5 and 6, the heat dissipation plate 130 has a T-shaped longitudinal section, such that the bottom surface of the top portion of the heat dissipation plate 130 is attached to the top surface of the top portion of the memory module 120.
The heat dissipation of the chip of the memory module 120 is conducted to the top through the T-shaped heat dissipation plate 130, and the heat is taken away through the liquid cooling plate 140 configured in the top space, thereby effectively improving the heat dissipation efficiency.
In this embodiment, as shown in fig. 4 to fig. 6, the liquid cooling apparatus 100 of the memory module further includes at least one first fixing clip 150, which is clamped on the surface of the heat dissipation plate 130 on two sides of one of the memory modules 120, and is used to fix the heat dissipation plate 130 and the memory module 120.
The number of the first fixing clips 150 is one or more. For example, as shown in fig. 4 to 6, the first fixing clips 150 are two and are uniformly arranged along the heat dissipation plate 130.
Specifically, in this embodiment, the first fixing clip 150 includes a first clip portion tightly attached to the surface of the heat dissipation plate 130 on one side of the memory module 120, a second clip portion tightly attached to the surface of the heat dissipation plate 130 on the other side of the memory module 120, and a connecting portion connecting the first clip portion and the second clip portion and spanning or attaching the top portions of the two heat dissipation plates 130.
The first clamping portion and the second clamping portion are plate-shaped or hollow structures, which is not limited in this embodiment.
In the embodiment, the characteristic of the memory module 120 that the space structure is compact is fully considered, and the first fixing clip 150 is adopted to fix the heat dissipation plate 130 and the memory module 120, so as to reduce the requirement of installation tolerance.
Therefore, the liquid cooling apparatus 100 of the embodiment can effectively solve the problem of high requirement on liquid cooling design tolerance due to the compact structure of the memory module 120 in the prior art.
It should be noted that, in this embodiment, a first thermal gasket 190 is disposed between the heat dissipation plate 130 and the memory module 120, so as to improve the heat dissipation performance. That is, the liquid cooling apparatus 100 contacts the heat sink 130 with the chip of the memory module 120 to be cooled through the first fixing clip 150, and a heat conducting gasket is filled between the heat sink 130 and the chip.
The first thermal pad 190 is made of a thermal interface material, and the first thermal pad 190 directly adheres to the surface of the memory module 120 when the memory module 120 is inserted into the card slot 110, and conducts heat of the memory module 120 to the heat sink 130.
Specifically, in the present embodiment, the lengths of the heat dissipation plate 130 and the first heat conductive pad 190 may be equal or different. When the lengths of the heat spreader 130 and the first thermal pad 190 are not equal, preferably, the length of the first thermal pad 190 matches the length of the surface of the memory module 120.
In this embodiment, the liquid cooling plate 140 is movably installed at one side of the card slot 110, and covers the top end of the memory module 120 after the memory module 120 is inserted into the card slot 110, so as to cool the heat dissipation plate 130.
Specifically, in the present embodiment, as shown in fig. 4 and 7, the liquid cooling plate 140 is connected to a vertical support plate 170 through a rotating shaft 180, so that the liquid cooling plate 140 covers the top end of the memory module 120 or is separated from the top end of the memory module 120.
But liquid cooling plate 140 one end design has rotation axis 180, and liquid cooling plate 140 can rotate around this rotation axis 180, and after rotatory liquid cooling plate 140, can easily take off single memory module 120 and maintain to assembly and maintenance are convenient for.
In the present embodiment, as shown in fig. 4 and fig. 7, the liquid cooling plate 140 is provided with a cooling liquid inlet 141 and a cooling liquid outlet 142 at a side close to the rotating shaft 180; the liquid cooling plate 140 has a plurality of flow channels of a predetermined shape therein.
In this embodiment, the liquid cooling plate 140 has a cooling liquid inlet 141 and a cooling liquid outlet 142, and a liquid flow channel is formed inside the liquid cooling plate for an external cooling working medium to enter the liquid cooling plate 140 for flowing, so as to take away the heat of the chip in the memory module 120.
In this embodiment, a second heat conductive gasket 1100 is disposed between the liquid cooling plate 140 and the heat dissipation plate 130 to improve heat dissipation performance.
The second heat conduction pad 1100 is made of a heat conduction interface material, and the first heat conduction pad 190 directly adheres to the surface of the liquid cooling plate 140 when the liquid cooling plate 140 covers the top of the heat dissipation plate 130, and conducts heat of the heat dissipation plate 130 to the liquid cooling plate 140.
In this embodiment, the number of the second fixing clips 160 is one or more than one. For example, as shown in fig. 4 to 6, the second fixing clips 160 are two and are uniformly arranged along the liquid-cooling plate 140.
In this embodiment, the second fixing clip 160 presses the surface of the liquid cooling plate 140, and both ends of the second fixing clip are fixed on the main board 200, so as to press the liquid cooling plate 140 against the heat dissipation plate 130.
Specifically, in this embodiment, the second fixing clip 160 includes: a first fixing bar 161 fixed to the main plate 200 on one side of the liquid cooling plate 140; a second fixing rod 162 fixed to the main plate 200 at the other side of the liquid cooling plate 140; and a pressing part 163 connected between the first fixing rod 161 and the second fixing rod 162 and pressed against the surface of the liquid cooling plate 140.
Preferably, the pressing part 163 has a zigzag shape. Namely, two or more zigzag fixing clips are used to press the liquid cooling plate 140 onto the top of the heat dissipating plate 130.
The liquid cooling channel design is fixed at memory module 120 top through the fixation clamp of two (or more) Z types with the liquid cooling design of this embodiment, improves the liquid cooling effect, and liquid cooling board 140 is rotatable form moreover, only need loosen the fixation clamp of Z type during the maintenance, and rotatory liquid cooling board 140 back can easily take off single memory module 120 and maintain, effectively solves the difficult problem that memory module 120 liquid cooling is difficult to maintain among the prior art.
The working principle of the liquid cooling apparatus 100 of the memory module in this embodiment is as follows:
the heat dissipation plate 130 and the chip of the memory module 120 are fixed through the first fixing clamp 150, the heat consumption of the chip of the memory module 120 is conducted to the top, the liquid cooling plate 140 is arranged on the top, a liquid cooling working medium flows in the liquid cooling plate 140, heat generated by the chip of the memory module 120 is taken away through the liquid cooling plate 140, and the liquid cooling plate 140Z-shaped fixing clamp is fixed and convenient to fix and detach; one end of the liquid cooling plate 140 is designed with a rotatable shaft 180, the liquid cooling plate 140 can rotate around the shaft, and the liquid cooling plate 140 is rotatable, so that the plugging problem between the memory module 120 and the liquid cooling device 100 can be avoided, and the assembly and maintenance are convenient.
To sum up, the utility model discloses effectively having solved and needing the fixed problem of plug between current scheme memory module and the liquid cooling device, fully having considered memory module compact structure's characteristics, from the heat dissipation of top design liquid cooling board, suitability, maneuverability are stronger, have reduced holistic manufacturing, installation tolerance requirement, but liquid cooling board one end design rotation axis simultaneously, the liquid cooling board is fixed through pivot and buckle, makes things convenient for the memory module dismouting to maintain, has effectively improved the maintainability and the installation convenience of device. Therefore, the utility model effectively overcomes the defects in the prior art and has high industrial utilization value.
The above embodiments are merely illustrative of the principles and effects of the present invention, and are not to be construed as limiting the invention. Any person skilled in the art can modify or change the above embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which may be made by those skilled in the art without departing from the spirit and technical spirit of the present invention shall be covered by the claims of the present invention.
Claims (10)
1. A liquid cooling device for a memory module, comprising:
at least one card slot, which is arranged on the mainboard and is used for the memory module to be inserted;
at least two heat radiation plates for radiating the respective attached memory modules;
the liquid cooling plate is movably arranged on one side of the clamping groove, covers the top end of the memory module after the memory module is inserted into the clamping groove and is used for carrying out liquid cooling on the heat dissipation plate;
and the at least one first fixing clamp is clamped on the surfaces of the heat dissipation plates on the two sides of one memory module and used for fixing the heat dissipation plates and the memory module.
2. The liquid cooling apparatus of claim 1, wherein: the liquid cooling plate is connected to a vertical support plate through a rotating shaft, so that the liquid cooling plate covers the top end of the memory module or is separated from the top end of the memory module.
3. The liquid cooling apparatus of claim 2, wherein: and a cooling liquid inlet and a cooling liquid outlet are formed in one side, close to the rotating shaft, of the liquid cooling plate.
4. A liquid cooling apparatus of a memory module according to claim 2 or 3, wherein: the liquid cooling plate is internally provided with a plurality of flow channels with preset shapes.
5. The liquid cooling apparatus of claim 1, wherein: a first heat conduction gasket is arranged between the heat dissipation plate and the memory module.
6. The liquid cooling apparatus of claim 1, wherein: the heat dissipation plate is T-shaped in longitudinal section, so that the lower surface of the top part of the heat dissipation plate is attached to the upper surface of the top of the memory module.
7. The liquid cooling apparatus of memory module of claim 1 or 5, wherein: and a second heat-conducting gasket is arranged between the liquid cooling plate and the heat dissipation plate.
8. The liquid cooling apparatus of memory module of claim 1 or 6, wherein: the cooling plate fixing device further comprises at least one second fixing clamp, wherein the second fixing clamp presses the surface of the liquid cooling plate, and two ends of the second fixing clamp are fixed on the main board and used for pressing the liquid cooling plate against the cooling plate.
9. The liquid cooling apparatus of claim 8, wherein: the second fixing clip includes:
the first fixing rod is fixed on the main board on one side of the liquid cooling board;
the second fixing rod is fixed on the main board on the other side of the liquid cooling board;
and the pressing part is connected between the first fixing rod and the second fixing rod and is pressed on the surface of the liquid cooling plate.
10. The liquid cooling apparatus of claim 9, wherein: the pressing part is Z-shaped.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221564008.7U CN218068740U (en) | 2022-06-21 | 2022-06-21 | Liquid cooling device of memory module |
| US18/337,399 US20240145333A1 (en) | 2022-06-21 | 2023-06-19 | Liquid cooling device for memory module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221564008.7U CN218068740U (en) | 2022-06-21 | 2022-06-21 | Liquid cooling device of memory module |
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| Publication Number | Publication Date |
|---|---|
| CN218068740U true CN218068740U (en) | 2022-12-16 |
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ID=84434394
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221564008.7U Active CN218068740U (en) | 2022-06-21 | 2022-06-21 | Liquid cooling device of memory module |
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| CN (1) | CN218068740U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115097909A (en) * | 2022-06-21 | 2022-09-23 | 加弘科技咨询(上海)有限公司 | Liquid cooling device of memory module |
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2022
- 2022-06-21 CN CN202221564008.7U patent/CN218068740U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115097909A (en) * | 2022-06-21 | 2022-09-23 | 加弘科技咨询(上海)有限公司 | Liquid cooling device of memory module |
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