CN218941419U - Double-sided multilayer printed circuit board - Google Patents
Double-sided multilayer printed circuit board Download PDFInfo
- Publication number
- CN218941419U CN218941419U CN202222897677.2U CN202222897677U CN218941419U CN 218941419 U CN218941419 U CN 218941419U CN 202222897677 U CN202222897677 U CN 202222897677U CN 218941419 U CN218941419 U CN 218941419U
- Authority
- CN
- China
- Prior art keywords
- double
- sided board
- sided
- heat dissipation
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a double-sided multilayer printed circuit board, which belongs to the field of circuit boards and comprises a first double-sided board, a second double-sided board and a third double-sided board, wherein two ends of the second double-sided board and the third double-sided board are respectively provided with a pair of outer butt joint holes, two ends of the first double-sided board are respectively provided with two pairs of rectangular substrates, the upper end surface of each rectangular substrate is provided with a plurality of heat dissipation vertical plates, the top of each heat dissipation vertical plate is provided with a heat dissipation copper plate, two ends of the second double-sided board and the third double-sided board are respectively provided with two pairs of heat dissipation lateral plates, the two ends of the first double-sided board and the third double-sided board are respectively provided with the rectangular substrates, and meanwhile, the corresponding heat dissipation lateral plates and heat dissipation lateral plates are respectively arranged at the two ends of the second double-sided board and the third double-sided board, so that the first double-sided board and the outer double-sided boards in an inner interlayer can be effectively dissipated, and a fan can be optionally arranged above the outer lateral plates, and the double-sided multilayer printed circuit board has better heat dissipation performance, and meets wider use requirements.
Description
Technical Field
The utility model relates to the field of circuit boards, in particular to a double-sided multilayer printed circuit board.
Background
The multilayer printed circuit board is a circuit board with a plurality of wiring layers, a dielectric layer is arranged between every two layers, the double-sided multilayer printed circuit board is an integrated circuit board formed by laminating a plurality of double-sided circuit boards, the requirement of a large number of interconnection intersections in circuit board design can be met, the common double-sided multilayer printed circuit board is fixed through tight lamination, the heat dissipation effect of the internal circuit board is greatly limited, the heat dissipation effect is limited, the circuit board is caused to operate in a high-temperature state under a high-load state, the service life of the circuit board is influenced, and even the internal element is automatically reduced in high temperature and even damaged, so that inconvenience is caused.
Disclosure of Invention
The utility model mainly aims to provide a double-sided multilayer printed circuit board which can effectively solve the problems in the background technology.
In order to achieve the above purpose, the technical scheme adopted by the utility model is as follows:
the utility model provides a two-sided multilayer printed circuit board, includes first double-sided board and second double-sided board and third double-sided board, the second double-sided board is located first double-sided board top position, the third double-sided board is located first double-sided board below position, second double-sided board and third double-sided board both ends respectively are provided with a pair of outer butt joint hole, first double-sided board both ends respectively are provided with two pairs of rectangle base plates, rectangle base plate up end is provided with a plurality of heat dissipation risers, the heat dissipation riser top is provided with the heat dissipation copper, second double-sided board and third double-sided board both ends respectively are provided with two pairs of heat dissipation curb plates, the outside position is provided with two outside crossbeams between the heat dissipation curb plates, the middle part position is provided with a plurality of heat dissipation crossbeams between the heat dissipation curb plates, outside crossbeams are located the heat dissipation crossbeams outside position, the copper is located the heat dissipation crossbeams below position, through setting up the rectangle base plate at first circuit board both ends, and then installs the riser and the heat dissipation copper, sets up a plurality of pairs of rectangle base plates at second double-sided board both ends and third double-sided board both ends and corresponds the heat dissipation riser, the heat dissipation riser top is provided with the heat dissipation copper plate, the second double-sided board and the heat dissipation board respectively, the heat dissipation board has the heat dissipation efficiency to be better than the heat dissipation board in the double-sided board and the heat dissipation board, and the heat dissipation fan can be satisfied in the outside the double-sided board and the heat dissipation board.
Preferably, the lengths and the widths of the first double-sided board, the second double-sided board and the third double-sided board are equal, and insulating layers are arranged between the first double-sided board and the second double-sided board, and between the first double-sided board and the third double-sided board.
Preferably, the positions of the two ends of the first double-sided board corresponding to the outer butt joint holes are provided with inner butt joint holes, the diameters of the inner butt joint holes and the outer butt joint holes are equal, and the first double-sided board, the second double-sided board and the third double-sided board are fixedly connected through copper plating on the inner walls of the inner butt joint holes and the outer butt joint holes.
Preferably, the length of the rectangular substrate is equal to the distance between the two heat dissipation side plates, and the width of the heat dissipation copper plate is equal to the length of the heat dissipation side plates.
Preferably, a pair of additional fans are arranged above the outer transverse plate and the heat dissipation transverse plate, and a pair of positioning round holes are respectively arranged at two sides of the upper end surface of the additional fans.
Preferably, two pairs of additional mounting holes are respectively formed in two sides of the upper end face of the outer transverse plate, an inner clamping block is arranged in each additional mounting hole through bonding, a top plate is arranged at the top of each inner clamping block, a supporting plate is arranged at the head of each top plate, and mounting screw holes are formed in the middle of each supporting plate corresponding to the corresponding positioning round holes.
Compared with the prior art, the utility model has the following beneficial effects:
according to the utility model, the rectangular base plates are arranged at the two ends of the first circuit board, the heat dissipation vertical plate and the heat dissipation copper plate are further arranged, and the corresponding heat dissipation lateral plates and the heat dissipation transverse plates are arranged at the two ends of the second double-sided plate and the third double-sided plate, so that the first double-sided plate and the outer double-sided plate in the internal interlayer can be effectively dissipated, and meanwhile, the fans can be selectively arranged above the outer transverse plates, so that the double-sided multilayer printed circuit board has better heat dissipation performance, and wider use requirements are met.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present utility model;
FIG. 2 is a schematic view of a first dual panel according to the present utility model;
fig. 3 is a schematic view of the fan according to the present utility model.
In the figure: 1. a first double-sided board; 2. a second double-sided panel; 3. a third double-sided board; 4. an inner butt joint hole; 5. an outer butt joint hole; 6. an insulating layer; 7. a rectangular substrate; 8. a heat dissipation vertical plate; 9. a heat-dissipating copper plate; 10. a heat radiation side plate; 11. an outer lateral plate; 12. a heat radiation cross plate; 13. a fan is additionally arranged; 14. adding a mounting hole; 15. an inner clamping block; 16. a top plate; 17. a supporting plate; 18. positioning the round hole; 19. and (5) installing screw holes.
Detailed Description
The utility model is further described in connection with the following detailed description, in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the utility model easy to understand.
As shown in fig. 1-3, a double-sided multilayer printed circuit board comprises a first double-sided board 1, a second double-sided board 2 and a third double-sided board 3, wherein the second double-sided board 2 is positioned above the first double-sided board 1, the third double-sided board 3 is positioned below the first double-sided board 1, a pair of outer butt joint holes 5 are respectively arranged at two ends of the second double-sided board 2 and the third double-sided board 3, two pairs of rectangular substrates 7 are respectively arranged at two ends of the first double-sided board 1, a plurality of heat dissipation vertical plates 8 are arranged at the upper end surfaces of the rectangular substrates 7, a heat dissipation copper plate 9 is arranged at the top of the heat dissipation vertical plates 8, two pairs of heat dissipation lateral plates 10 are respectively arranged at two ends of the second double-sided board 2 and the third double-sided board 3, two outer lateral plates 11 are arranged at the outer sides between the heat dissipation lateral plates 10, a plurality of heat dissipation lateral plates 12 are arranged at the middle positions between the heat dissipation lateral plates 10, the outer lateral plates 11 are positioned at the outer sides of the heat dissipation lateral plates 12, and the heat dissipation copper plates 9 are positioned at the positions below the heat dissipation lateral plates 12.
In this embodiment, in order to effectively connect and mount the first double-sided board 1, the second double-sided board 2 and the third double-sided board 3, the lengths and widths of the first double-sided board 1, the second double-sided board 2 and the third double-sided board 3 are equal, insulating layers 6 are respectively arranged between the first double-sided board 1 and the second double-sided board 2, and between the first double-sided board 1 and the third double-sided board 3, inner butt joint holes 4 are respectively arranged at positions of two ends of the first double-sided board 1 corresponding to the outer butt joint holes 5, diameters of the inner butt joint holes 4 and the outer butt joint holes 5 are equal, and the first double-sided board 1, the second double-sided board 2 and the third double-sided board 3 are fixedly connected through copper plating on inner walls of the inner butt joint holes 4 and the outer butt joint holes 5;
in this embodiment, in order to enable the inner and outer circuit boards to enhance the heat dissipation effect, the length of the rectangular substrate 7 is equal to the distance between the two heat dissipation side plates 10, and the width of the heat dissipation copper plate 9 is equal to the length of the heat dissipation side plate 10;
in this embodiment, in order to additionally improve the heat dissipation performance according to the high-load running environment, the double-sided multilayer circuit board can adapt to more use environments, a pair of additional fans 13 are arranged above the outer transverse plate 11 and the heat dissipation transverse plate 12, a pair of positioning round holes 18 are respectively formed in two sides of the upper end surface of each additional fan 13, two pairs of additional holes 14 are respectively formed in two sides of the upper end surface of each outer transverse plate 11, an inner clamping block 15 is arranged in each additional hole 14 through bonding, a top plate 16 is arranged at the top of each inner clamping block 15, a supporting plate 17 is arranged at the head of each top plate 16, and mounting screw holes 19 are formed in the middle of each supporting plate 17 corresponding to the positioning round holes 18.
It should be noted that, in actual use, the insulating layer 6 is firstly provided, then the heat dissipation side plates 10 at two ends of the second double-sided board 2 are aligned with the heat dissipation copper plates 9 at two ends of the first double-sided board 1 to be installed, so that the heat dissipation copper plates 9 enter the position between the heat dissipation side plates 10 and move to the position below the heat dissipation transverse plate 12, the third double-sided board 3 is installed below the first double-sided board 1 according to the same method, the second double-sided board 2 and the third double-sided board 3 are symmetrically arranged, and then copper plating connection is performed in the opposite inner butt joint holes 4 and the outer butt joint holes 5, so that the double-sided multi-layered printed circuit board is assembled, and in the running process of the circuit board, the outer second double-sided board 2 and the third double-sided board 3 perform effective heat dissipation through the heat dissipation side plates 10 and the heat dissipation transverse plate 12, so that the running temperature of the outer circuit board is reduced, and meanwhile, the inner first double-sided board 1 performs effective heat dissipation through the vertical plates 8 and the heat dissipation copper plates 9 connected with the outside, so that the running temperature of the inner circuit board is reduced, under the cooperation, the whole double-sided board can be effectively reduced, and the using temperature of the multi-layered circuit board can be satisfied; further, when the heat dissipation device is used for a specific high-power and high-load operation environment, the fan 13 can be additionally arranged above the heat dissipation transverse plate 12, the heat dissipation rate is improved through additionally arranging the fan 13, the heat dissipation performance is further improved, when the heat dissipation device is installed, the additionally arranged hole 14 above the outer transverse plate 11 is firstly found, the inner clamping block 15 below the top plate 16 is inserted into the additionally arranged hole 14 and is fixedly adhered, then the fan 13 is additionally arranged above the supporting plate 17 at the head part of the top plate 16, the fixing is completed through the screw rod matched with the positioning round hole 18 and the mounting screw hole 19, and the heat dissipation effect of the double-sided multilayer circuit board can be again improved through additionally arranging the fan 13, so that the high-load operation environment is met.
The foregoing has shown and described the basic principles and main features of the present utility model and the advantages of the present utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims. The scope of the utility model is defined by the appended claims and equivalents thereof.
Claims (6)
1. The utility model provides a two-sided multilayer printed circuit board, includes first double-sided board (1) and second double-sided board (2) and third double-sided board (3), second double-sided board (2) are located first double-sided board (1) top position, third double-sided board (3) are located first double-sided board (1) below position, its characterized in that: the double-sided board comprises a first double-sided board (3) and a second double-sided board (2) and a second double-sided board (3), wherein a pair of outer butt joint holes (5) are respectively formed in the two ends of the first double-sided board (1), two pairs of rectangular base plates (7) are respectively arranged at the two ends of the first double-sided board, a plurality of heat dissipation vertical plates (8) are arranged on the upper end faces of the rectangular base plates (7), heat dissipation copper plates (9) are arranged at the tops of the heat dissipation vertical plates (8), two pairs of heat dissipation lateral plates (10) are respectively arranged at the two ends of the second double-sided board (2) and the third double-sided board (3), two outer lateral plates (11) are arranged at the outer lateral positions between the heat dissipation lateral plates (10), a plurality of heat dissipation lateral plates (12) are arranged at the middle positions between the heat dissipation lateral plates (10), and the heat dissipation copper plates (9) are arranged at the outer lateral positions of the heat dissipation lateral plates (12).
2. The double-sided multilayer printed circuit board according to claim 1, wherein: the lengths and the widths of the first double-sided board (1), the second double-sided board (2) and the third double-sided board (3) are equal, and insulating layers (6) are arranged between the first double-sided board (1) and the second double-sided board (2) and between the first double-sided board (1) and the third double-sided board (3).
3. The double-sided multilayer printed circuit board according to claim 1, wherein: the double-sided copper plating device is characterized in that inner butt joint holes (4) are formed in the positions, corresponding to the outer butt joint holes (5), of the two ends of the first double-sided board (1), the inner butt joint holes (4) are equal to the outer butt joint holes (5) in diameter, and the first double-sided board (1), the second double-sided board (2) and the third double-sided board (3) are fixedly connected through copper plating on the inner walls of the inner butt joint holes (4) and the outer butt joint holes (5).
4. The double-sided multilayer printed circuit board according to claim 1, wherein: the length of the rectangular base plate (7) is equal to the distance between the two radiating side plates (10), and the width of the radiating copper plate (9) is equal to the length of the radiating side plates (10).
5. The double-sided multilayer printed circuit board according to claim 1, wherein: a pair of additional fans (13) are arranged above the outer transverse plate (11) and the heat dissipation transverse plate (12), and a pair of positioning round holes (18) are respectively formed in two sides of the upper end surface of each additional fan (13).
6. The double-sided multilayer printed circuit board according to claim 5, wherein: two pairs of additional mounting holes (14) are respectively formed in the two sides of the upper end face of the outer transverse plate (11), an inner clamping block (15) is arranged in the additional mounting holes (14) through bonding, a top plate (16) is arranged at the top of the inner clamping block (15), a supporting plate (17) is arranged at the head of the top plate (16), and mounting screw holes (19) are formed in the middle of the supporting plate (17) corresponding to the positioning round holes (18).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222897677.2U CN218941419U (en) | 2022-11-01 | 2022-11-01 | Double-sided multilayer printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222897677.2U CN218941419U (en) | 2022-11-01 | 2022-11-01 | Double-sided multilayer printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218941419U true CN218941419U (en) | 2023-04-28 |
Family
ID=86085132
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222897677.2U Active CN218941419U (en) | 2022-11-01 | 2022-11-01 | Double-sided multilayer printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218941419U (en) |
-
2022
- 2022-11-01 CN CN202222897677.2U patent/CN218941419U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN205071462U (en) | Multilayer circuit board heat conduction radiation structure | |
| CN218941419U (en) | Double-sided multilayer printed circuit board | |
| CN216700705U (en) | Modular multilayer circuit board place structure | |
| CN102036470B (en) | Low-thermal-resistance and high-radiation metal-base circuit board | |
| CN111741596B (en) | Printed circuit board for computer and manufacturing method thereof | |
| CN210381441U (en) | High-temperature-resistant circuit board | |
| CN113727515A (en) | Metal copper-clad plate | |
| CN221151622U (en) | Porous heat dissipation circuit board structure | |
| CN207382669U (en) | A kind of double-sided PCB board with radiator structure | |
| CN210579422U (en) | Printed circuit board with copper-based embedded circuit | |
| CN210042381U (en) | PCB circuit board of high-efficient heat dissipation multilayer | |
| US11662087B2 (en) | Power supply device and high-power illumination system | |
| CN219627991U (en) | Composite metallurgical material low-temperature cofiring heat dissipation substrate | |
| CN219269148U (en) | Spliced PCB circuit board | |
| CN219999671U (en) | Metal substrate structure | |
| CN205179511U (en) | Power electronic component circuit board of high heat dissipating ability | |
| CN220965257U (en) | Printed circuit board based on metal substrate | |
| CN215647575U (en) | Multilayer ceramic printed circuit board | |
| CN214675829U (en) | Intensive heat conduction and heat dissipation ultra-multilayer printed circuit board | |
| CN214481487U (en) | Copper-clad plate with internal circulating cooling structure | |
| CN210007992U (en) | kinds of multi-layer printed composite integrated circuit board | |
| CN219421155U (en) | Printed circuit board with good heat dissipation effect | |
| CN221103650U (en) | Multilayer PCB circuit board for liquid crystal display | |
| CN212115779U (en) | Circuit board structure with heat dissipation support | |
| CN215121306U (en) | High thermal adhesive circuit board with multi-layer composite connection |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |