CN214675829U - Intensive heat conduction and heat dissipation ultra-multilayer printed circuit board - Google Patents
Intensive heat conduction and heat dissipation ultra-multilayer printed circuit board Download PDFInfo
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- CN214675829U CN214675829U CN202023250240.7U CN202023250240U CN214675829U CN 214675829 U CN214675829 U CN 214675829U CN 202023250240 U CN202023250240 U CN 202023250240U CN 214675829 U CN214675829 U CN 214675829U
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- circuit board
- heating panel
- curb plate
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- multilayer printed
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Abstract
The utility model discloses a radiating super multilayer printed circuit board of intensive heat conduction, including the basic unit's circuit board, the upper end laminating of basic unit's circuit board is connected with first heating panel, the middle level circuit board is connected in the laminating of the upper end of basic unit's circuit board, the second heating panel is connected in the laminating of middle level circuit board upper end, the laminating of middle level circuit board upper end connects upper circuit board. The utility model discloses a beneficial effect circuit board upper end in proper order is laminated and is connected with middle level circuit board and upper circuit board, carry out the printing of circuit through the circuit board of multilayer, reach high dense circuit's overall arrangement, at the circuit board of basic unit, middle level circuit board and upper circuit board interval punishment do not laminate and are connected with first heating panel and second heating panel, first heating panel and second heating panel are connected with the first curb plate and the second curb plate of both sides respectively, first curb plate and second curb plate pass through fin and air contact heat dissipation, realize first heating panel and second heating panel fast and derive thermal heat exchange.
Description
Technical Field
The utility model belongs to the technical field of the circuit board, concretely relates to radiating super multilayer printed circuit board of intensive heat conduction.
Background
The circuit board has the name: the printed circuit board comprises a ceramic circuit board, an alumina ceramic circuit board, an aluminum nitride ceramic circuit board, a PCB board, an aluminum substrate, a high-frequency board, a thick copper board, an impedance board, a PCB, an ultrathin circuit board, a printed circuit board and the like. The circuit board enables the circuit to be miniaturized and visualized, and plays an important role in batch production of fixed circuits and optimization of electric appliance layout. The circuit board can be called as a printed circuit board or a printed circuit board, the English name is PCB, FPC circuit board is also called as a flexible circuit board which is made of polyimide or polyester film as a base material and has high reliability and excellent flexibility.
The existing circuit board is mostly arranged in a single layer mode, multi-layer circuit printing cannot be carried out, a common circuit board cannot rapidly dissipate heat in the using process, heat is easily gathered in the circuit board, the circuit board is easily overheated, and the actual service life of the circuit board is shortened.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a radiating super multilayer printed circuit board of intensive heat conduction to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: an intensive heat-conducting and heat-dissipating super-multilayer printed circuit board comprises a base circuit board, wherein the upper end of the base circuit board is connected with a first heat-dissipating plate in a laminating manner, the upper end of the base circuit board is connected with a middle circuit board in a laminating manner, the upper end of the middle circuit board is connected with an upper circuit board in a laminating manner, the two ends of the base circuit board are connected with connecting ends, the internal connecting ends of the connecting ends are connected with signal connectors, the signal connectors are respectively arranged corresponding to the base circuit board, the middle circuit board and the upper circuit board, the two sides of the base circuit board are respectively connected with a first side plate and a second side plate in a clamping manner, the first side plate is fixedly connected with the first heat-dissipating plate, the second side plate is fixedly connected with the second heat-dissipating plate, one sides of the first side plate and the second side plate are both connected with fins, one sides of the first side plate and the second side plate are both connected with a shunt cavity, a plurality of air outlet holes are formed in the two sides of the flow dividing cavity, and connecting pipes are connected to the flow dividing cavity.
Preferably, the upper end of the base circuit board is fixedly connected with a positioning column, and the middle circuit board and the upper circuit board are provided with clamping holes matched with the positioning column.
Preferably, two groups of the positioning columns are arranged at the upper end of the base circuit board, the two groups of the positioning columns are both in an oblong shape, the side lines of one group of the positioning columns extend along the length direction of the base circuit board, and the side lines of the other group of the positioning columns are perpendicular to the length direction of the base circuit board.
Preferably, the two sides of the connecting end are respectively connected with a limiting clamping block, and the free end of the limiting clamping block is arc-shaped.
Preferably, the first heat dissipation plate and the second heat dissipation plate are provided with a plurality of strip-shaped plates, and the first heat dissipation plate and the second heat dissipation plate are arranged oppositely.
Preferably, the fins are arranged on one sides of the first side plate and the second side plate and are distributed at equal intervals.
Preferably, the flow dividing cavity is arranged in the middle of the plurality of fins, and the plurality of air outlet holes are arranged in the middle of the plurality of fins in an opposite mode.
Compared with the prior art, the beneficial effects of the utility model are that:
(1) the utility model discloses a high-density circuit's overall arrangement, including basic unit's circuit board, middle level circuit board and upper strata circuit board, the laminating is connected with middle level circuit board and upper strata circuit board in proper order in basic unit's circuit board upper end, carry out the printing of circuit through the multilayer circuit board, reach high dense circuit's overall arrangement, at basic unit's circuit board, middle level circuit board and upper strata circuit board interval punishment do not laminate and are connected with first heating panel and second heating panel, first heating panel and second heating panel are connected with the first curb plate and the second curb plate of both sides respectively, first curb plate and second curb plate pass through fin and air contact heat dissipation, realize first heating panel and second heating panel fast and derive thermal heat exchange.
(2) When the whole heat of device is too high, can insert outside cold air with the connecting pipe, the both sides of cold air through reposition of redundant personnel cavity go out the venthole and derive, the cooling air with the heat exchange of fin with higher speed, carry out one step promotion heat exchange efficiency, realize the holistic quick cooling of device, spacing fixture block is connected respectively to the both sides of connection end, the free end of spacing fixture block is the arc, carry out the joint installation through the spacing fixture block of connection end upper end both sides, avoid connecting the breaking away from of end connection signal input part, the erection joint is stable, it is convenient to use.
Drawings
Fig. 1 is a schematic perspective view of the present invention;
fig. 2 is a schematic top view of the present invention;
fig. 3 is a schematic view of the explosion-proof connection structure of the base circuit board of the present invention;
fig. 4 is an enlarged schematic structural diagram of a in fig. 1 according to the present invention.
In the figure: 1. a base circuit board; 2. a positioning column; 3. a first heat dissipation plate; 4. a middle layer circuit board; 5. a second heat dissipation plate; 6. an upper layer circuit board; 7. connecting the end heads; 8. a signal connector; 9. a limiting clamping block; 10. a first side plate; 11. a second side plate; 12. a fin; 13. a flow dividing cavity; 14. an air outlet; 15. and (4) connecting the pipes.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides an intensive heat conduction and dissipation ultra-multilayer printed circuit board, which comprises a base circuit board 1, a first heat sink 3 attached to the upper end of the base circuit board 1, a middle circuit board 4 attached to the upper end of the base circuit board 1, a second heat sink 5 attached to the upper end of the middle circuit board 4, an upper circuit board 6 attached to the upper end of the middle circuit board 4, connection terminals 7 attached to the two ends of the base circuit board 1, signal connectors 8 connected to the inside of the connection terminals 7, the signal connectors 8 corresponding to the base circuit board 1, the middle circuit board 4 and the upper circuit board 6, a first side board 10 and a second side board 11 connected to the two sides of the base circuit board 1 in a snap-fit manner, the first side board 10 fixedly connected to the first heat sink 3, the second side board 11 fixedly connected to the second heat sink 5, and fins 12 connected to one side of the first side board 10 and the second side board 11, the shunting cavity 13 is connected to one side of first curb plate 10 and second curb plate 11, and the both sides of shunting cavity 13 set up a plurality of ventholes 14, are connected with connecting pipe 15 on the shunting cavity 13.
In this embodiment, furthermore, the upper end fixedly connected with reference column 2 of basic unit's circuit board 1, middle level circuit board 4 and upper strata circuit board 6 set up the joint hole that matches with reference column 2, carry out the connection location of middle level circuit board 4 and upper strata circuit board 6 through reference column 2 on basic unit's circuit board 1, and the installation location is accurate.
In this embodiment, furthermore, two sets of positioning columns 2 are arranged at the upper end of the base circuit board 1, two sets of positioning columns 2 are both in a long circle shape, the side lines of one set of positioning columns 2 extend along the length direction of the base circuit board 1, the side lines of the other set of positioning columns 2 are perpendicular to the length direction of the base circuit board 1, and fool-proof installation of the upper middle circuit board 4 and the upper circuit board 6 is performed through the two sets of positioning columns 2 arranged in different directions, so that wrong installation of the middle circuit board 4 and the upper circuit board 6 is avoided.
In this embodiment, further, spacing fixture block 9 is connected respectively to the both sides of connecting end 7, and the free end of spacing fixture block 9 is the arc, carries out the joint installation through the spacing fixture block 9 of connecting end 7 upper end both sides, avoids connecting end 7 to connect breaking away from of signal input part, and the erection joint is stable, and it is convenient to use.
In this embodiment, furthermore, first heating panel 3 and second heating panel 5 set up a plurality of bar plates, and first heating panel 3 and second heating panel 5 set up relatively, carry out thermal even heat conduction through a plurality of bar plates of first heating panel 3 and second heating panel 5, and first heating panel 3 and second heating panel 5 that set up relatively derive inside heat both sides, and the heat is derived efficiently, and the radiating effect is good.
In this embodiment, further, fin 12 sets up a plurality ofly in first curb plate 10 and 11 one sides of second curb plate, and a plurality of fins 12 are equidistant to be distributed, through a plurality of fins 12 increase heat transfer area, promote the heat transfer effect.
In this embodiment, furtherly, reposition of redundant personnel cavity 13 sets up in a plurality of fins 12 middle part position, and a plurality of ventholes 14 just are setting up at a plurality of fins 12 interval middle parts, and the reposition of redundant personnel cavity 13 that sets up through the middle part carries out the leading-in of cooling air current, and a plurality of ventholes 14 can carry out quick heat exchange with the leading-in a plurality of fins 12 interval departments of air current, promote heat exchange efficiency.
The utility model discloses a theory of operation and use flow: when the device is used, the upper end of a base circuit board 1 is sequentially connected with a middle circuit board 4 and an upper circuit board 6 in an attaching manner, the circuit is printed through the multilayer circuit boards, the layout of a high-density circuit is achieved, a first heat dissipation plate 3 and a second heat dissipation plate 5 are respectively connected at intervals of the base circuit board 1, the middle circuit board 4 and the upper circuit board 6 in an attaching manner, the first heat dissipation plate 3 and the second heat dissipation plate 5 are respectively connected with a first side plate 10 and a second side plate 11 at two sides, the first side plate 10 and the second side plate 11 are in contact heat dissipation with air through fins 12, heat exchange of heat conducted out by the first heat dissipation plate 3 and the second heat dissipation plate 5 is rapidly realized, when the overall heat of the device is too high, a connecting pipe 15 can be connected with external cold air, the cold air is conducted out through air outlet holes 14 at two sides of a shunting cavity 13, the heat exchange between the cold air and the fins 12 is accelerated, and the heat exchange efficiency is further improved, realize the holistic quick cooling of device, spacing fixture block 9 is connected respectively to the both sides of connection end 7, and the free end of spacing fixture block 9 is the arc, carries out the joint installation through the spacing fixture block 9 of connection end 7 upper end both sides, avoids the separation from of connection end 7 connection signal input part, and the erection joint is stable, and it is convenient to use.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides a super multilayer printed circuit board of intensive heat conduction radiating, includes basic unit's circuit board (1), its characterized in that: the upper end laminating of basic unit's circuit board (1) is connected with first heating panel (3), the upper end laminating of basic unit's circuit board (1) is connected with middle level circuit board (4), second heating panel (5) is connected in the laminating of middle level circuit board (4) upper end, upper circuit board (6) is connected in the laminating of middle level circuit board (4) upper end, the both ends of basic unit's circuit board (1) are connected with connection end (7), the internal connection signal connector (8) of connection end (7), signal connector (8) correspond the setting with basic unit's circuit board (1), middle level circuit board (4) and upper circuit board (6) respectively, the both sides of basic unit's circuit board (1) are the joint respectively and are connected first curb plate (10) and second curb plate (11), first curb plate (10) fixed connection first heating panel (3), second curb plate (11) fixed connection second heating panel (5), fin (12) are all connected to one side of first curb plate (10) and second curb plate (11), reposition of redundant personnel cavity (13) is all connected to one side of first curb plate (10) and second curb plate (11), the both sides of reposition of redundant personnel cavity (13) set up a plurality of ventholes (14), be connected with connecting pipe (15) on reposition of redundant personnel cavity (13).
2. The dense heat conduction and dissipation ultra-multilayer printed circuit board as recited in claim 1, wherein: the upper end fixedly connected with reference column (2) of basic unit's circuit board (1), middle level circuit board (4) and upper circuit board (6) set up the joint hole that matches with reference column (2).
3. The dense heat conduction and dissipation ultra-multilayer printed circuit board as recited in claim 2, wherein: the positioning columns (2) are arranged in two groups at the upper end of the base circuit board (1), the two groups of positioning columns (2) are both in a long circle shape, the side lines of the positioning columns (2) extend in the length direction of the base circuit board (1), and the side lines of the positioning columns (2) in the other group are perpendicular to the length direction of the base circuit board (1).
4. The dense heat conduction and dissipation ultra-multilayer printed circuit board as recited in claim 1, wherein: the two sides of the connecting end (7) are respectively connected with a limiting clamping block (9), and the free end of the limiting clamping block (9) is arc-shaped.
5. The dense heat conduction and dissipation ultra-multilayer printed circuit board as recited in claim 1, wherein: the first heat dissipation plate (3) and the second heat dissipation plate (5) are provided with a plurality of strip-shaped plates, and the first heat dissipation plate (3) and the second heat dissipation plate (5) are arranged oppositely.
6. The dense heat conduction and dissipation ultra-multilayer printed circuit board as recited in claim 1, wherein: the fins (12) are arranged on one sides of the first side plate (10) and the second side plate (11) in a plurality, and the fins (12) are distributed at equal intervals.
7. The dense heat conduction and dissipation ultra-multilayer printed circuit board as recited in claim 6, wherein: the flow distribution cavity (13) is arranged in the middle of the plurality of fins (12), and the air outlet holes (14) are arranged in the middle of the interval of the plurality of fins (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023250240.7U CN214675829U (en) | 2020-12-29 | 2020-12-29 | Intensive heat conduction and heat dissipation ultra-multilayer printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023250240.7U CN214675829U (en) | 2020-12-29 | 2020-12-29 | Intensive heat conduction and heat dissipation ultra-multilayer printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214675829U true CN214675829U (en) | 2021-11-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202023250240.7U Active CN214675829U (en) | 2020-12-29 | 2020-12-29 | Intensive heat conduction and heat dissipation ultra-multilayer printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214675829U (en) |
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2020
- 2020-12-29 CN CN202023250240.7U patent/CN214675829U/en active Active
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