CN212628606U - PCB circuit board beneficial to heat dissipation - Google Patents
PCB circuit board beneficial to heat dissipation Download PDFInfo
- Publication number
- CN212628606U CN212628606U CN202021238927.6U CN202021238927U CN212628606U CN 212628606 U CN212628606 U CN 212628606U CN 202021238927 U CN202021238927 U CN 202021238927U CN 212628606 U CN212628606 U CN 212628606U
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- circuit board
- racks
- heat
- pcb circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 81
- 230000009286 beneficial effect Effects 0.000 title claims description 4
- 239000007788 liquid Substances 0.000 claims abstract description 20
- 239000000758 substrate Substances 0.000 claims description 17
- 239000004593 Epoxy Substances 0.000 claims description 6
- 239000011521 glass Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 239000011101 paper laminate Substances 0.000 claims description 4
- 239000000110 cooling liquid Substances 0.000 claims description 3
- 239000004744 fabric Substances 0.000 claims description 3
- 238000007731 hot pressing Methods 0.000 claims description 3
- 239000003973 paint Substances 0.000 claims description 3
- 229920000728 polyester Polymers 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 2
- 239000007769 metal material Substances 0.000 claims 1
- 238000001816 cooling Methods 0.000 abstract description 9
- 238000010438 heat treatment Methods 0.000 abstract description 8
- 239000002826 coolant Substances 0.000 abstract description 7
- 230000000694 effects Effects 0.000 abstract description 4
- 238000004891 communication Methods 0.000 abstract description 3
- 238000003466 welding Methods 0.000 description 3
- 239000000428 dust Substances 0.000 description 2
- 239000000123 paper Substances 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- -1 phenolic aldehyde Chemical class 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a PCB circuit board that helps heat dissipation, a serial communication port, including circuit board body and heat dissipation mechanism, the circuit board body includes the circuit layer, circuit layer bottom and base plate fixed connection, base plate bottom and heating panel fixed connection, the heating panel passes through fastening bolt and is connected with heat dissipation mechanism, heat dissipation mechanism includes the fixed plate, a plurality of radiating grooves have been seted up on the fixed plate surface, the even equidistance of radiating groove sets up, the inside cooling tube that is equipped with of fixed plate between the radiating groove, the cooling tube is S-shaped ring around passing the clearance between the radiating groove, the both ends of cooling tube are equipped with inlet and liquid outlet respectively, inlet and liquid outlet set up the both sides at the fixed. The utility model discloses a heating panel carries out heat conduction, takes away the heat of PCB circuit board through the coolant liquid in the cooling tube, has improved the radiating effect of PCB circuit board.
Description
Technical Field
The utility model relates to a PCB circuit board field, specific is a PCB circuit board that helps heat dissipation.
Background
Pcb (printed circuit board), i.e. printed wiring board, printed circuit board for short, is one of the important parts in the electronics industry. Almost every kind of electronic equipment, as small as electronic watches, calculators, as large as computers, communication electronics, military weaponry systems, has electronic components such as integrated circuits, and printed boards are used to electrically interconnect the various components. The printed circuit board consists of an insulating bottom plate, a connecting lead and a welding disc for assembling and welding electronic elements, and has double functions of a conductive circuit and the insulating bottom plate. The circuit can replace complex wiring to realize electrical connection among elements in the circuit, thereby simplifying the assembly and welding work of electronic products, reducing the wiring workload in the traditional mode and greatly lightening the labor intensity of workers; and the volume of the whole machine is reduced, the product cost is reduced, and the quality and the reliability of the electronic equipment are improved. The printed circuit board has good product consistency, can adopt standardized design, and is beneficial to realizing mechanization and automation in the production process. Meanwhile, the whole printed circuit board subjected to assembly and debugging can be used as an independent spare part, so that the exchange and maintenance of the whole product are facilitated.
The PCB is mounted with many power components, such as switching tubes, rectifiers, etc., which need to be dissipated by a heat sink. The existing PCB is mostly made of optimized materials to improve the heat dissipation performance, the heat dissipation effect is limited, or the PCB is cooled through a fan, but the fan cools the air, dust in the air is attached to the surface of the PCB, the dust is deposited to cause the PCB to break down, and the PCB may be burnt down seriously. Therefore, a clean and dust-free heat dissipation type PCB is needed to satisfy the use of high-power electrical appliances.
SUMMERY OF THE UTILITY MODEL
For solving the not enough of mentioning in the above-mentioned background art, the utility model aims to provide a help radiating PCB circuit board carries out heat conduction through the heating panel, takes away the heat of PCB circuit board through the coolant liquid in the cooling tube, has improved PCB circuit board's radiating effect.
The purpose of the utility model can be realized by the following technical scheme:
the utility model provides a PCB circuit board that helps heat dissipation, a serial communication port, including circuit board body and heat dissipation mechanism, the circuit board body includes the circuit layer, circuit layer bottom and base plate fixed connection, base plate bottom and heating panel fixed connection, the heating panel passes through fastening bolt and is connected with heat dissipation mechanism, heat dissipation mechanism includes the fixed plate, a plurality of radiating grooves have been seted up on the fixed plate surface, the even equidistance of radiating groove sets up, the inside cooling tube that is equipped with of fixed plate between the radiating groove, the cooling tube is the S-shaped ring around passing the clearance between the radiating groove, the both ends of cooling tube are equipped with inlet and liquid outlet respectively, inlet and liquid outlet set up the.
Further preferably, solder mask green paint is coated on the surface of the circuit layer, and a plurality of electronic components are fixedly mounted on the surface of the circuit layer.
Further preferably, the substrate is a rigid material, and the substrate is one of a phenolic paper laminate, an epoxy paper laminate, a polyester glass mat laminate and an epoxy glass cloth laminate.
Further preferably, a plurality of heat conduction racks are fixedly mounted at the top of the heat dissipation plate, the heat conduction racks are embedded in the substrate, the heat conduction racks and the substrate are integrally formed through hot pressing, a plurality of heat dissipation racks are fixedly mounted at the bottom of the heat dissipation plate, the heat dissipation racks are connected with the heat dissipation grooves in an inserting mode, the outer walls of the heat dissipation racks are attached to the inner walls of the heat dissipation grooves, and the heat dissipation plate, the heat conduction racks and the heat dissipation racks are.
Further preferably, the liquid inlet is externally connected with a cooling liquid delivery pump.
The utility model has the advantages that:
the utility model discloses the heat that PCB circuit board during operation electronic component produced conducts to the heat dissipation rack through heat conduction rack, heating panel on, the heat dissipation rack and the coolant liquid heat exchange in the radiating pipe, and the heat that electronic component produced is taken away to the coolant liquid accomplishes the heat dissipation of PCB circuit board, has improved PCB circuit board's radiating effect.
Drawings
The present invention will be further described with reference to the accompanying drawings.
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of the internal structure of the present invention;
FIG. 3 is an enlarged schematic view of the present invention at position A of FIG. 2;
fig. 4 is a schematic view of a disassembled structure of the circuit board body of the present invention;
fig. 5 is a schematic view of the overall structure of the heat dissipation mechanism of the present invention;
fig. 6 is a schematic view of the internal structure of the heat dissipation mechanism of the present invention.
In the figure:
1-circuit board body, 2-heat dissipation mechanism, 3-circuit layer, 4-substrate, 5-heat dissipation plate, 6-fastening bolt, 7-fixing plate, 8-heat dissipation groove, 9-heat dissipation pipe, 10-liquid inlet, 11-liquid outlet, 12-heat conduction rack and 13-heat dissipation rack
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "open hole", "upper", "lower", "thickness", "top", "middle", "length", "inner", "around", and the like, indicate positional or positional relationships, are merely for convenience in describing the present invention and to simplify the description, and do not indicate or imply that the components or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.
As shown in fig. 1-5, a PCB board for facilitating heat dissipation, which is characterized in that, the PCB board comprises a board body 1 and a heat dissipation mechanism 2, the board body 1 comprises a circuit layer 3, the bottom of the circuit layer 3 is fixedly connected with a substrate 4, the bottom of the substrate 4 is fixedly connected with a heat dissipation plate 5, the heat dissipation plate 5 is connected with the heat dissipation mechanism 2 through a fastening bolt 6, the heat dissipation mechanism 2 comprises a fixing plate 7, a plurality of heat dissipation grooves 8 are formed on the surface of the fixing plate 7, the heat dissipation grooves 8 are uniformly arranged at equal intervals, a heat dissipation pipe 9 is arranged inside the fixing plate 7 between the heat dissipation grooves 8, the heat dissipation pipe 9 is in an S-shaped loop and passes through the gap between the heat dissipation grooves 8, two ends of the heat dissipation pipe 9 are respectively provided.
Solder mask green paint is coated on the surface of the circuit layer 3, and a plurality of electronic elements are fixedly arranged on the surface of the circuit layer 3.
The substrate 4 is made of rigid material, and the substrate 4 is one of phenolic aldehyde paper laminated board, epoxy paper laminated board, polyester glass felt laminated board and epoxy glass cloth laminated board.
A plurality of heat conduction racks 12 are fixedly mounted at the top of the heat dissipation plate 5, the heat conduction racks 12 are embedded in the substrate 4, the heat conduction racks 12 and the substrate 4 are integrally formed through hot pressing, a plurality of heat dissipation racks 13 are fixedly mounted at the bottom of the heat dissipation plate 5, the heat dissipation racks 13 are connected with the heat dissipation groove 8 in an inserting mode, the outer wall of each heat dissipation rack 13 is attached to the inner wall of the corresponding heat dissipation groove 8, and the heat dissipation plate 5, the heat conduction racks 12 and the heat dissipation.
The liquid inlet 10 is externally connected with a cooling liquid delivery pump.
The working principle is as follows:
the utility model discloses align heat dissipation rack 13 and radiating groove 8 and insert when the PCB circuit board uses, then it is fixed with circuit board body 1 and heat dissipation mechanism 2 through fastening bolt 6, accomplish the circuit connection of PCB circuit board after mechanism 2 and the electrical apparatus are fixed with the heat dissipation, then be connected inlet 10 and coolant liquid delivery pump, the heat that PCB circuit board during operation electronic component produced passes through heat conduction rack 12, 5 conduction of heating panel are to heat dissipation rack 13 on, the heat exchange of coolant liquid in heat dissipation rack 13 and the cooling tube 9, the heat that electronic component produced is taken away to the coolant liquid accomplishes the heat dissipation of PCB circuit board.
In the description herein, references to the description of "one embodiment," "an example," "a specific example," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention.
Claims (5)
1. The PCB circuit board is characterized by comprising a circuit board body (1) and a heat dissipation mechanism (2), wherein the circuit board body (1) comprises a circuit layer (3), the bottom of the circuit layer (3) is fixedly connected with a substrate (4), the bottom of the substrate (4) is fixedly connected with a heat dissipation plate (5), the heat dissipation plate (5) is connected with the heat dissipation mechanism (2) through a fastening bolt (6), the heat dissipation mechanism (2) comprises a fixing plate (7), a plurality of heat dissipation grooves (8) are formed in the surface of the fixing plate (7), the heat dissipation grooves (8) are uniformly arranged at equal intervals, heat dissipation pipes (9) are arranged inside the fixing plate (7) between the heat dissipation grooves (8), the heat dissipation pipes (9) are S-shaped and encircle to pass through gaps between the heat dissipation grooves (8), and liquid inlets (10) and liquid outlets (11) are respectively arranged at two ends of the heat dissipation pipes (9), the liquid inlet (10) and the liquid outlet (11) are arranged on two sides of the fixing plate (7).
2. The PCB circuit board facilitating heat dissipation according to claim 1, wherein solder-resistant green paint is coated on the surface of the circuit layer (3), and a plurality of electronic components are fixedly mounted on the surface of the circuit layer (3).
3. The PCB circuit board for facilitating heat dissipation according to claim 1, wherein the substrate (4) is a rigid material, and the substrate (4) is one of a phenolic paper laminate, an epoxy paper laminate, a polyester glass mat laminate and an epoxy glass cloth laminate.
4. The PCB circuit board beneficial to heat dissipation according to claim 1, wherein a plurality of heat conducting racks (12) are fixedly mounted at the top of the heat dissipation plate (5), the heat conducting racks (12) are embedded in the substrate (4), the heat conducting racks (12) and the substrate (4) are integrally formed through hot pressing, a plurality of heat dissipation racks (13) are fixedly mounted at the bottom of the heat dissipation plate (5), the heat dissipation racks (13) are inserted into the heat dissipation groove (8), the outer wall of each heat dissipation rack (13) is attached to the inner wall of the heat dissipation groove (8), and the heat dissipation plate (5), the heat conducting racks (12) and the heat dissipation racks (13) are all made of metal materials.
5. The PCB circuit board facilitating heat dissipation according to claim 1, wherein the liquid inlet (10) is externally connected with a cooling liquid delivery pump.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021238927.6U CN212628606U (en) | 2020-06-29 | 2020-06-29 | PCB circuit board beneficial to heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021238927.6U CN212628606U (en) | 2020-06-29 | 2020-06-29 | PCB circuit board beneficial to heat dissipation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212628606U true CN212628606U (en) | 2021-02-26 |
Family
ID=74757796
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021238927.6U Expired - Fee Related CN212628606U (en) | 2020-06-29 | 2020-06-29 | PCB circuit board beneficial to heat dissipation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212628606U (en) |
-
2020
- 2020-06-29 CN CN202021238927.6U patent/CN212628606U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210226 |