CN218998360U

CN218998360U - Multilayer circuit board with high precision and fine line width

Info

Publication number: CN218998360U
Application number: CN202222903617.7U
Authority: CN
Inventors: 黄享名; 周敏; 黄享强; 黄享武
Original assignee: Dongguan Hongxin Circuit Co ltd
Current assignee: Dongguan Hongxin Circuit Co ltd
Priority date: 2022-11-02
Filing date: 2022-11-02
Publication date: 2023-05-09
Anticipated expiration: 2032-11-02

Abstract

The utility model discloses a high-precision fine-line-width-distance multilayer circuit board which comprises a connecting frame, wherein bottom plates are fixedly arranged at the lower part of the left end and the lower part of the right end of the connecting frame, a group of through holes are formed in the left part of the upper end and the right part of the upper end of the two bottom plates, the two groups of through holes are distributed symmetrically left and right, each group of through holes are arranged in two, connecting assemblies are clamped at the left side and the right side inside the connecting frame, an installation frame is clamped between the two connecting assemblies together, a main body plate is arranged at the upper end of the installation frame, and heat dissipation equipment is fixedly arranged in the middle of the rear end of the connecting frame. According to the high-precision fine-line-width multilayer circuit board, the heat dissipation equipment is arranged, the motor drives the rotating column, the rotating column drives the fan blades, wind power is sucked into the fixing frame under the rotation of the fan blades, and the motor drives the rotating column and the fan blades to convey the wind power to the lower portion of the fixing frame, so that heat emitted by the main body board is convenient to process.

Description

Multilayer circuit board with high precision and fine line width

Technical Field

The utility model relates to the technical field of multilayer circuit boards, in particular to a multilayer circuit board with high precision and fine line width.

Background

With the continuous miniaturization and high integration of electronic products, the circuit board gradually develops to the directions of high-precision fine circuit, small aperture and high aspect ratio, and the development trends of high-precision circuit board, small aperture, high thickness-to-diameter ratio and narrow line spacing increase the difficulty of circuit board manufacturing, and especially the manufacturing process capability of manufacturing the minimum line width and line spacing is difficult to meet the requirements. The increasing demand of the multilayer circuit board is that the precision requirement of the vast majority of multilayer circuit boards on the outer layer circuit is higher than that of single/double-sided circuit boards, and as the demand of the multilayer circuit board is increased, the problems caused by the operation difficulty of pattern electroplating and alkaline etching in the production process are gradually highlighted, and the rejection rate is continuously exceeded.

The prior art (patent number: CN 214046115U) discloses a high-precision fine-line-width-distance multilayer circuit board, which comprises a first substrate and a second substrate, wherein the first substrate comprises a first circuit area, a board edge, a row hole and a second circuit area, the board edge is arranged on one periphery of the inner wall of the first substrate, and the first circuit area, the second circuit area and the row hole are arranged at the upper end of the outer wall of the first substrate; the first substrate comprises a first covering layer, a circuit layer and a second covering layer; the circuit layer comprises an electroplated thick gold layer, an electroplated nickel layer, a copper thin layer and a base layer, wherein the electroplated thick gold layer is arranged below the first covering layer, the electroplated nickel layer is arranged below the electroplated thick gold layer, the copper thin layer is arranged below the electroplated nickel layer, the base layer is arranged below the copper thin layer, and the second covering layer is arranged below the base layer. The utility model has the beneficial effects that: the polyimide heat conducting layers with the thicknesses of 0.05-0.08mm can prevent the circuit layer from being directly exposed in the air, plays a role in insulating protection, and has a good heat dissipation effect.

The existing multilayer circuit board with high fine line width has the following defects that a large amount of heat can be generated when the multilayer circuit board is operated, and the heat is discharged only under the action of the radiating grooves, so that the novel multilayer circuit board with high fine line width is provided.

Disclosure of Invention

The utility model mainly aims to provide a multilayer circuit board with high precision and fine line width, which can effectively solve the problem of heat dissipation of the multilayer circuit board.

In order to achieve the above purpose, the technical scheme adopted by the utility model is as follows:

the utility model provides a multilayer circuit board of high smart fine rule wide and apart from, includes the link, equal fixed mounting in link left end lower part and right-hand member lower part has the bottom plate, two a set of perforation has all been seted up to bottom plate upper end left part and upper end right part, two sets of perforation is bilateral symmetry distribution and every group sets up to two, the equal joint in inside left side of link and inside right side has coupling assembling, two joint has the mounting bracket jointly between the coupling assembling, the mounting bracket upper end is provided with the main part board, link rear end middle part fixed mounting has firing equipment.

Preferably, clamping grooves are formed in the left side and the right side between the connecting frames, front-back through mounting grooves are formed in the middle of the rear end of the connecting frame, a plurality of heat dissipation grooves which are vertically through are formed in the upper end of the connecting frame, and left-right through screw holes are formed in the front portion of the left end and the front portion of the right end of the connecting frame.

Preferably, the connecting assembly comprises a clamping block, the left end fixedly connected with connecting plate of the clamping block, the linking groove has all been seted up to connecting plate left end upper portion and left end lower part, the anterior activity of clamping block right-hand member is connected with the connecting bolt alternately, the standing groove has been seted up to the mounting bracket upper end, the inside up end of standing groove has been seted up a plurality of upper and lower through No. two radiating grooves, the clamping block joint is in the draw-in groove.

Preferably, the two clamping blocks are symmetrically distributed left and right, the connecting bolts penetrate through the screw holes and are movably inserted and connected on the clamping blocks, and the plurality of second radiating grooves are equidistantly distributed.

Preferably, the heat dissipating device comprises a fixing frame, a plurality of air inlets are formed in the rear end of the fixing frame, a motor is fixedly connected to the inside of the fixing frame, a rotating column is fixedly connected to the output end of the motor, fan blades are fixedly connected to the front end of the rotating column, and the fixing frame is fixedly connected to the inside of the mounting groove.

Preferably, the plurality of air inlets are distributed in an annular array, and the plurality of fan blades are distributed in an annular array.

Compared with the prior art, the utility model has the following beneficial effects:

1. in the utility model, the connecting assembly is arranged, so that the multilayer circuit board is convenient to fix, when the multilayer circuit board is used, the main body board is connected to the mounting frame, the mounting frame is connected between the two connecting plates and clamped in the connecting groove, the clamping block is clamped in the clamping groove, and the main body board is convenient to fix by penetrating the screw holes through the connecting bolts and movably penetrating the clamping block;

2. in the utility model, the heat generated by the main body board is convenient to process by arranging the heat radiating equipment, when the heat generated by the main body board during operation needs to be processed, the motor drives the rotating column, the rotating column drives the fan blades, wind power is sucked into the fixing frame under the rotation of the fan blades, and the motor drives the rotating column and the fan blades to transmit the wind power to the lower part of the fixing frame, so that the heat emitted by the main body board is convenient to process.

Drawings

FIG. 1 is a schematic diagram of the overall structure of a high-precision fine-line-width multi-layer circuit board according to the present utility model;

FIG. 2 is a schematic diagram of the overall structure of a high-precision fine-line-width-spacing multi-layer circuit board connector according to the present utility model;

FIG. 3 is a schematic view showing the overall structure of a connection assembly of a high-precision fine-line-width multi-layer circuit board according to the present utility model;

fig. 4 is a schematic diagram of the overall structure of a heat dissipating device of a high-precision fine-line-width multi-layer circuit board according to the present utility model.

In the figure: 1. a connecting frame; 2. a bottom plate; 3. perforating; 4. a connection assembly; 5. a mounting frame; 6. a main body plate; 7. a heat dissipating device; 8. a clamping groove; 9. a first heat dissipation groove; 10. a screw hole; 11. a mounting groove; 41. a clamping block; 42. a connecting plate; 43. a connection groove; 44. a connecting bolt; 51. a placement groove; 52. a second heat dissipation groove; 71. a fixing frame; 72. an air inlet hole; 73. a motor; 74. rotating the column; 75. and (3) a fan blade.

Detailed Description

The utility model is further described in connection with the following detailed description, in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the utility model easy to understand.

In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific direction, be configured and operated in the specific direction, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "provided," "connected," and the like are to be construed broadly, and may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

As shown in fig. 1-4, a multilayer circuit board with high-precision fine line width comprises a connecting frame 1, wherein a bottom plate 2 is fixedly installed at the lower part of the left end and the lower part of the right end of the connecting frame 1, a group of perforations 3 is respectively formed at the left part of the upper ends and the right part of the upper ends of the two bottom plates 2, the two groups of perforations 3 are distributed in a bilateral symmetry mode and are arranged in two groups, a connecting assembly 4 is clamped at the left side and the right side inside the connecting frame 1, an installation frame 5 is clamped between the two connecting assemblies 4, a main body plate 6 is arranged at the upper end of the installation frame 5, and a heat dissipation device 7 is fixedly installed at the middle part of the rear end of the connecting frame 1.

Clamping grooves 8 are formed in the left side and the right side between the connecting frames 1, a front-back through mounting groove 11 is formed in the middle of the rear end of the connecting frame 1, a plurality of first heat dissipation grooves 9 which are vertically through are formed in the upper end of the connecting frame 1, and left-right through screw holes 10 are formed in the front of the left end and the front of the right end of the connecting frame 1; the connecting assembly 4 comprises a clamping block 41, the left end of the clamping block 41 is fixedly connected with a connecting plate 42, the upper part of the left end and the lower part of the left end of the connecting plate 42 are respectively provided with a connecting groove 43, the front part of the right end of the clamping block 41 is movably connected with a connecting bolt 44 in a penetrating way, the upper end of the mounting frame 5 is provided with a placing groove 51, the upper end surface of the inside of the placing groove 51 is provided with a plurality of second heat dissipation grooves 52 which are penetrated up and down, and the clamping block 41 is clamped in the clamping groove 8; the two clamping blocks 41 are symmetrically distributed left and right, the connecting bolts 44 penetrate through the screw holes 10 and are movably connected to the clamping blocks 41 in a penetrating way, and the plurality of second heat dissipation grooves 52 are equidistantly distributed; first, the main body plate 6 is connected to the mounting frame 5, the mounting frame 5 is connected between the two connecting plates 42 and clamped in the connecting groove 43, the clamping block 41 is clamped in the clamping groove 8, the connecting bolt 44 penetrates the screw hole 10 and is movably inserted and connected to the clamping block 41, and therefore the main body plate 6 is convenient to fix.

The heat dissipation device 7 comprises a fixing frame 71, a plurality of air inlets 72 are formed in the rear end of the fixing frame 71, a motor 73 is fixedly connected inside the fixing frame 71, a rotating column 74 is fixedly connected to the output end of the motor 73, fan blades 75 are fixedly connected to the front end of the rotating column 74, and the fixing frame 71 is fixedly connected to the inside of the mounting groove 11; the plurality of air inlets 72 are distributed in an annular array, and the fan blades 75 are arranged in a plurality of annular arrays; the motor 73 drives the rotating column 74, the rotating column 74 drives the fan blades 75, wind power is sucked into the fixing frame 71 under the rotation of the fan blades 75, and the wind power is conveyed to the lower side of the mounting frame 5 under the operation that the motor 73 drives the rotating column 74 and the fan blades 75, so that heat emitted by the main body plate 6 is convenient to process.

It should be noted that, the present utility model is a multilayer circuit board with high precision and fine line width, the connecting component 4 is provided, so that the multilayer circuit board is convenient to fix, when in use, the main body board 6 is connected to the mounting frame 5, the mounting frame 5 is connected between the two connecting plates 42 and clamped in the connecting groove 43, the clamping block 41 is clamped in the clamping groove 8, the clamping block 41 penetrates through the screw hole 10 through the connecting bolt 44 and is movably inserted and connected to the clamping block 41, so that the main body board 6 is convenient to fix, the heat generated by the main body board 6 is convenient to process by the heat dissipating device 7, when the heat generated by the main body board 6 during operation needs to be processed, the motor 73 drives the rotating column 74, the rotating column 74 drives the fan blade 75, and under the rotation of the fan blade 75, the wind power is sucked into the fixing frame 71, and under the operation of the motor 73 drives the rotating columns 74 and the fan blade 75, so that the wind power is conveyed to the lower part of the mounting frame 5, and the heat emitted by the main body board 6 is convenient to process; limiting the minimum linewidth spacing can be achieved by the presence of an etch factor of the etch.

The foregoing has shown and described the basic principles and main features of the present utility model and the advantages of the present utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a multilayer circuit board of high smart fine rule wide range, includes link (1), its characterized in that: the utility model discloses a heat radiation device, including link (1), mounting bracket (5) upper end is provided with main part board (6), link (1) rear end middle part fixed mounting has radiator unit (7), link (1) left end lower part and right-hand member lower part equal fixed mounting have bottom plate (2), two a set of perforation (3) have all been seted up to bottom plate (2) upper end left part and upper end right part, two sets of perforation (3) are bilateral symmetry distribution and every group sets up to two, link (1) inside left side and inside right side equal joint have coupling assembling (4), two joint has mounting bracket (5) between coupling assembling (4).

2. The high-definition fine line width multi-layer circuit board of claim 1, wherein: clamping grooves (8) are formed in the left side and the right side between the connecting frames (1), front-back through mounting grooves (11) are formed in the middle of the rear end of the connecting frames (1), a plurality of first heat dissipation grooves (9) which are vertically through are formed in the upper end of the connecting frames (1), and left-right through screw holes (10) are formed in the front of the left end and the front of the right end of the connecting frames (1).

3. The high-definition fine line width multi-layer circuit board of claim 2, wherein: coupling assembling (4) are including fixture block (41), fixture block (41) left end fixedly connected with connecting plate (42), linking groove (43) have all been seted up on connecting plate (42) left end upper portion and left end lower part, fixture block (41) right-hand member front portion swing joint has connecting bolt (44), standing groove (51) have been seted up to mounting bracket (5) upper end, a plurality of upper and lower through No. two radiating grooves (52) have been seted up to the inside up end of standing groove (51), fixture block (41) joint is in draw-in groove (8).

4. A high-definition fine line width multi-layer circuit board according to claim 3, wherein: the two clamping blocks (41) are symmetrically distributed left and right, the connecting bolts (44) penetrate through the screw holes (10) and are movably connected to the clamping blocks (41) in a penetrating mode, and the plurality of second radiating grooves (52) are distributed at equal intervals.

5. The high-definition fine line width multi-layer circuit board of claim 4, wherein: the heat dissipation device (7) comprises a fixing frame (71), a plurality of air inlets (72) are formed in the rear end of the fixing frame (71), a motor (73) is fixedly connected inside the fixing frame (71), a rotating column (74) is fixedly connected to the output end of the motor (73), fan blades (75) are fixedly connected to the front end of the rotating column (74), and the fixing frame (71) is fixedly connected to the inside of the mounting groove (11).

6. The high-definition fine line width multi-layer circuit board of claim 5, wherein: the air inlets (72) are distributed in an annular array, and the fan blades (75) are arranged in a plurality and distributed in an annular array.