CN210745651U

CN210745651U - Durable circuit board

Info

Publication number: CN210745651U
Application number: CN201921745833.5U
Authority: CN
Inventors: 梁俊杰; 方桓周
Original assignee: Individual
Current assignee: Individual
Priority date: 2019-10-17
Filing date: 2019-10-17
Publication date: 2020-06-12
Anticipated expiration: 2029-10-17

Abstract

The utility model discloses a durable type circuit board, including heat dissipation mechanism and circuit board body, one side of heat dissipation mechanism is provided with the solder mask, and the top surface of solder mask is provided with the silk screen printing layer, the fixed circuit board body that is provided with in bottom of solder mask, and the top surface of circuit board body is located one side of solder mask and is provided with the pin copper foil, one side connection of pin copper foil is provided with the pin. The utility model discloses in, this circuit board body's inside has set up a plurality of reinforcing plates, realizes carrying out the intensity through the reinforcing plate and strengthens printed wiring board's inside, and the reinforcing plate is arranged by big to little order by the nexine to the skin simultaneously, and when using the resistance to compression, no board district forms the echelonment from top to bottom, has improved the toughness and the resistance to compression of the great reinforcing circuit board of the bending number of times of multilayer printed wiring board body, has realized the durable bending resistance performance of circuit board body.

Description

Durable circuit board

Technical Field

The utility model relates to a circuit board technical field especially relates to a durable type circuit board.

Background

The circuit board has the name: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, PCB board, aluminum substrate, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, printed (copper etching technology) circuit board, etc. The circuit board enables the circuit to be miniaturized and visualized, and plays an important role in batch production of fixed circuits and optimization of electric appliance layout. The Circuit Board can be called as a Printed Circuit Board or a Printed Circuit Board, the English name of which is (Printed Circuit Board) PCB, (Flexible Printed Circuit Board) FPC Circuit Board (FPC Circuit Board is also called as Flexible Circuit Board) FPC Circuit Board (FPC Circuit Board is made of polyimide or polyester film as a base material, has the characteristics of high reliability and excellent flexibility, has high wiring density, light weight, thin thickness and good bending property), and the generation and development of a rigid-Flexible Printed Circuit Board (FPC) and PCB), and the new product of the rigid-Flexible Printed Circuit Board is promoted. Therefore, the rigid-flex circuit board is a circuit board with FPC (flexible printed circuit) characteristics and PCB (printed circuit board) characteristics, which is formed by combining a flexible circuit board and a rigid circuit board according to relevant process requirements through processes such as pressing and the like.

The circuit board that market put into use at present has certain not enough in life and practice uses certainly, for example the circuit board is damaged easily in the use bending, and crooked pliability is relatively poor, and the thermal conductivity is low, and stable circuit's connection when unable dispels the heat does not have peculiar mechanism to protect the circuit board in the in-process of production moreover to it is also comparatively time-consuming to the installation of circuit board.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the defects existing in the prior art and providing a durable circuit board.

In order to achieve the above purpose, the utility model adopts the following technical scheme: the utility model provides a durable type circuit board, includes heat dissipation mechanism and circuit board body, one side of heat dissipation mechanism is provided with the solder mask, and the top surface of solder mask is provided with the silk screen printing layer, the fixed circuit board body that is provided with in bottom of solder mask, and the top surface of circuit board body is located one side of solder mask and is provided with the pin copper foil, one side connection of pin copper foil is provided with the pin, and the bottom of pin is located inside one side of circuit board body and is provided with the thermosetting glue film, the inside that the bottom of thermosetting glue film is located the circuit board body is provided with the reinforcing plate, and the inside that bottom one side of reinforcing plate is located the circuit board body is provided with the carrier film, the inside bottom side that one side of reinforcing plate is located the circuit board body is.

Preferably, the bottom surface of the circuit board body is provided with an installation plugboard, and the bottom surface of the installation plugboard is fixedly provided with a plurality of plug pins.

Preferably, one side of the solder mask layer is provided with a baffle on the top surface of the circuit board body.

Preferably, a through hole penetrates through the reinforcing plate, and a hollow copper needle is arranged inside the through hole.

Preferably, the circuit board body and the installation plugboard are both rectangular structures.

Compared with the prior art, the utility model has the advantages that; firstly, a plurality of reinforcing plates are arranged in the circuit board body, the strength of the interior of the printed circuit board is enhanced through the reinforcing plates, the reinforcing plates are arranged from the inner layer to the outer layer in a descending order, when the circuit board is used for resisting compression, the upper part and the lower part of a no-board area form a ladder shape, the bending frequency of the multilayer printed circuit board body is greatly improved, the toughness and the compression resistance of the circuit board are greatly enhanced, the durable bending resistance of the circuit board body is realized, secondly, through arranging through holes on the reinforcing plates and replacing the traditional electroplating action by riveting hollow copper pins in the through holes, the condition of poor circuit contact at the connecting holes caused by the bending of the circuit board is avoided, meanwhile, the heat generated in the operation of the circuit board can be efficiently conducted and dissipated by matching with a heat dissipating mechanism and heat dissipating holes, and the ventilation and heat dissipating effects of the circuit board body, meanwhile, the aging of circuit parts is also prevented, finally, a bearing film and a damping buffer layer are arranged inside the circuit board body, the bearing film can carry out a protection device on the circuit board in the pressing manufacturing process with low thermal shrinkage, and simultaneously, the damping buffer layer is utilized to buffer the pressure generated in the working process of plugging and using the installation plugboard, so that the safety of circuit board manufacturing is greatly improved, the damage rate of the circuit board is reduced, and meanwhile, the work efficiency of plugging and installation of the circuit board is also improved by utilizing the installation plugboard.

Drawings

Fig. 1 is a schematic structural diagram of a durable circuit board according to the present invention;

fig. 2 is a schematic view of an internal structure of a circuit board body of a durable circuit board according to the present invention;

fig. 3 is a schematic diagram of a durable circuit board mounting and plugging board structure provided by the present invention.

Illustration of the drawings:

1-heat dissipation mechanism, 2-heat dissipation holes, 3-baffle, 4-silk screen printing layer, 5-solder mask, 6-pin copper foil, 7-circuit board body, 8-pin, 9-reinforcing plate, 10-thermosetting adhesive layer, 11-shock absorption buffer layer, 12-installation plugboard, 13-pluging pin, 14-through hole, 15-bearing film and 16-no-board area.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, as they may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Referring to fig. 1-3, a durable circuit board includes a heat dissipation mechanism 1 and a circuit board body 7, a solder mask layer 5 is disposed on one side of the heat dissipation mechanism 1, the surface of the top of the solder mask layer 5 is provided with a silk-screen printing layer 4, the bottom of the solder mask layer 5 is fixedly provided with a circuit board body 7, and the top surface of the circuit board body 7 is provided with a pin copper foil 6 at one side of the solder mask layer 5, one side of the pin copper foil 6 is connected with a pin 8, and one side of the bottom of the pin 8, which is positioned inside the circuit board body 7, is provided with a thermosetting adhesive layer 10, the bottom of the thermosetting adhesive layer 10, which is positioned inside the circuit board body 7, is provided with a reinforcing plate 9, and a bearing film 15 is arranged on one side of the bottom of the reinforcing plate 9 and positioned inside the circuit board body 7, and a shock absorption buffer layer 11 is arranged on one side of the reinforcing plate 9 and positioned inside the circuit board body 7 and provided with a no-board area 16 and arranged on the bottom side of the inside of the circuit board body 7.

The bottom surface of circuit board body 7 is provided with installation plugboard 12, and the bottom fixed surface of installation plugboard 12 is provided with a plurality of spigots 13, a side surface of heat dissipation mechanism 1 has been seted up to a louvre 2, and a plurality of louvres 2 distribute along the vertical direction equidistance, the top surface that one side of solder mask 5 is located circuit board body 7 is provided with baffle 3, the inside of reinforcing plate 9 runs through and is provided with through-hole 14, and the inside of through-hole 14 is provided with hollow copper needle, circuit board body 7 is the rectangle structure with installation plugboard 12, and circuit board body 7 is the same with the area size of installation plugboard 12.

The working principle is as follows: when the circuit board is used, the circuit board body 7 is firstly movably installed in a working area used for the circuit board to work, then a plurality of reinforcing plates 9 are arranged in the circuit board body 7, the reinforcing plates 9 are used for reinforcing the strength of the inside of the circuit board body 7, meanwhile, the reinforcing plates 9 are arranged from the inner layer to the outer layer in a descending order, when the circuit board is used for resisting pressure, a no-plate area 16 forms a ladder shape from top to bottom, the bending times of the multilayer circuit board body 7 are improved, the toughness and the pressure resistance of the circuit board are greatly enhanced, the durability and the bending resistance of the circuit board body 7 are realized, in addition, through holes 14 are arranged on the reinforcing plates 9, the traditional electroplating effect is replaced by riveting hollow copper pins in the through holes 14, the condition of poor circuit contact at the connecting holes caused when the circuit board is bent is avoided, and meanwhile, the heat generated in the circuit board operation work can be efficiently conducted by matching with the heat dissipation holes 1, great improvement circuit board body 7 ventilation cooling effect, the ageing of circuit part has also been prevented simultaneously, finally, this circuit board body 7's inside has set up plummer 15 and shock attenuation buffer layer 11, the plummer 15 can carry out protection device to the circuit board at the pressfitting in-process of making by low thermal contraction, utilize shock attenuation buffer layer 11 to cushion the installation plugboard 12 grafting and the pressure that produces in the working process of use simultaneously, great improvement the security that the circuit board was made, the spoilage of circuit board has been reduced, utilize installation plugboard 12 to also improve the work efficiency of circuit board grafting installation simultaneously.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims

1. A durable circuit board comprises a heat dissipation mechanism (1) and a circuit board body (7), and is characterized in that one side of the heat dissipation mechanism (1) is provided with a solder mask layer (5), the top surface of the solder mask layer (5) is provided with a silk-screen printing layer (4), the bottom of the solder mask layer (5) is fixedly provided with the circuit board body (7), one side of the top surface of the circuit board body (7) positioned on the solder mask layer (5) is provided with a pin copper foil (6), one side of the pin copper foil (6) is connected with a pin (8), one side of the bottom of the pin (8) positioned inside the circuit board body (7) is provided with a thermosetting adhesive layer (10), the bottom of the thermosetting adhesive layer (10) positioned inside the circuit board body (7) is provided with a reinforcing plate (9), and one side of the bottom of the reinforcing plate (9) positioned inside the circuit board body (7) is provided, one side of the reinforcing plate (9) is positioned in the circuit board body (7) and is provided with a no-board area (16), and a damping buffer layer (11) is arranged on the bottom side in the circuit board body (7).

2. A durable circuit board according to claim 1, wherein the bottom surface of the circuit board body (7) is provided with a mounting patch board (12), and the bottom surface of the mounting patch board (12) is fixedly provided with a plurality of patch pins (13).

3. The durable circuit board of claim 1, wherein a plurality of heat dissipation holes (2) are formed on a surface of one side of the heat dissipation mechanism (1), and the plurality of heat dissipation holes (2) are vertically and equidistantly distributed.

4. A durable circuit board according to claim 1, characterized in that one side of the solder resist layer (5) at the top surface of the circuit board body (7) is provided with a baffle (3).

5. A durable circuit board according to claim 1, characterized in that the reinforcement plate (9) is provided with through holes (14) through the inside thereof, and that the through holes (14) are provided with hollow copper pins inside thereof.

6. A durable circuit board according to claim 1, wherein the circuit board body (7) and the mounting patch panel (12) are both rectangular in configuration.