CN210298189U

CN210298189U - Corrosion-resistant circuit board

Info

Publication number: CN210298189U
Application number: CN201921220405.0U
Authority: CN
Inventors: 王树波; 柯小龙; 司俊峰
Original assignee: Shenzhen Sprint Circuit Co ltd
Current assignee: Shenzhen Sprint Circuit Co ltd
Priority date: 2019-07-31
Filing date: 2019-07-31
Publication date: 2020-04-10
Anticipated expiration: 2029-07-31

Abstract

The utility model discloses a corrosion-resistant circuit board, in particular to the technical field of circuit boards, which comprises a substrate, wherein an insulating board is fixedly arranged at the top of the substrate, an electronic element is fixedly arranged at the top of the insulating board, an anti-corrosion layer is arranged at the top of the insulating board, a heat dissipation mechanism is arranged at the top of the insulating board, and limiting mechanisms are arranged at the bottom of the substrate and the top of the insulating layer; the heat dissipation mechanism comprises a heat dissipation channel and heat dissipation grooves, the heat dissipation channel is embedded inside the insulating plate, and the number of the heat dissipation grooves is multiple. The utility model discloses a be equipped with heat dissipation channel and radiating groove to be equipped with a plurality of louvres in the radiating groove inner chamber, and be linked together louvre and heat dissipation channel, in the use, the louvre can absorb the heat that electronic component produced, and dispel through heat dissipation channel, thereby reduces the heat of this circuit board, is favorable to protecting electronic component, and then guarantees the normal use of this circuit board.

Description

Corrosion-resistant circuit board

Technical Field

The utility model relates to a circuit board technical field, more specifically say, the utility model relates to a corrosion-resistant circuit board.

Background

The circuit board can be called as a printed circuit board or a printed circuit board, and the FPC circuit board is also called as a flexible printed circuit board which is made of polyimide or polyester film as a base material and has high reliability and excellent flexibility. Has the characteristics of high wiring density, light weight, thin thickness and good bending property) and the birth and development of the FPC and the PCB of the rigid-flexible Printed Circuit Board (PCB), and the new product of the rigid-flexible printed circuit board (FPC) is promoted. Therefore, the rigid-flex circuit board is a circuit board with FPC (flexible printed circuit) characteristics and PCB (printed circuit board) characteristics, which is formed by combining a flexible circuit board and a rigid circuit board according to relevant process requirements through processes such as pressing and the like.

Patent application publication No. CN 209120536U's utility model discloses a corrosion-resistant printed circuit board, in this technical scheme, can improve the corrosion resistance of circuit board under the double-deck protection through being equipped with gold-plate layer and nickel coating to prevented that gold-plate layer wearing and tearing back circuit board corrosion resistance from declining, improved the life of circuit board.

However, in practical use, there are still many disadvantages, such as that the circuit board cannot effectively dissipate the heat generated by the electronic components, and when the heat is too much, the circuit board may cause short circuit of the electronic components, thereby affecting the normal use of the circuit board.

SUMMERY OF THE UTILITY MODEL

In order to overcome the above-mentioned defect of prior art, the embodiment of the utility model provides a corrosion-resistant circuit board, through being equipped with heat dissipation channel and radiating groove, and be equipped with a plurality of louvres in the radiating groove inner chamber, and be linked together louvre and heat dissipation channel, in the use, the louvre can be with the heat absorption that electronic component produced, and dispel through heat dissipation channel, thereby reduce the heat of this circuit board, be favorable to protecting electronic component, and then guarantee the normal use of this circuit board, in order to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: a corrosion-resistant circuit board comprises a substrate, wherein an insulating plate is fixedly arranged on the top of the substrate, an electronic element is fixedly arranged on the top of the insulating plate, an anti-corrosion layer is arranged on the top of the insulating plate, a heat dissipation mechanism is arranged on the top of the insulating plate, and limiting mechanisms are arranged on the bottom of the substrate and the top of the insulating layer;

the heat dissipation mechanism comprises a heat dissipation channel and heat dissipation grooves, the heat dissipation channel is embedded inside the insulation board, the number of the heat dissipation grooves is set to be multiple, a plurality of the heat dissipation grooves are evenly arranged at the top of the insulation board, the inner cavity side walls and the bottoms of the heat dissipation grooves are provided with heat dissipation holes, and the heat dissipation holes penetrate through the inner side walls and the bottom of the inner cavity of the heat dissipation grooves and are communicated with the heat dissipation channel.

In a preferred embodiment, the corrosion protection layer comprises a nickel plating layer provided on top of the insulating plate and a gold plating layer provided on top of the nickel plating layer.

In a preferred embodiment, the number of the heat dissipation holes is set to be multiple, and the plurality of heat dissipation holes are uniformly arranged on the inner side wall of the heat dissipation groove and the bottom of the inner cavity.

In a preferred embodiment, the top of the insulating plate is provided with four fixing holes, the four fixing holes are respectively arranged at four corners of the top of the insulating plate, and the fixing holes sequentially penetrate through the insulating plate and the top of the substrate.

In a preferred embodiment, the limiting mechanism comprises a clamping block and a clamping groove, the clamping block is fixed at the bottom of the base plate through a bolt, the clamping groove is arranged at the top of the insulating plate, and the clamping block is matched with the clamping groove.

In a preferred embodiment, the number of the fixture blocks and the number of the clamping grooves are four, four fixture blocks are respectively arranged at four corners of the bottom of the base plate, and four clamping grooves are respectively arranged at four corners of the top of the insulating plate.

In a preferred embodiment, the height of the latch is greater than the height of the electronic component.

In a preferred embodiment, the limiting mechanism further comprises four buffer springs, the four buffer springs are respectively arranged at four corners of the bottom of the base plate, the distance between every two of the four buffer springs is smaller than the distance between every two of the four fixture blocks, and cushion pads are fixedly arranged at the bottom ends of the four buffer springs.

The utility model discloses a technological effect and advantage:

1. compared with the prior art, the heat dissipation channel and the heat dissipation groove are arranged, the plurality of heat dissipation holes are formed in the inner cavity of the heat dissipation groove and communicated with the heat dissipation channel, and in the using process, the heat dissipation holes can absorb heat generated by the electronic element and dissipate the heat through the heat dissipation channel, so that the heat of the circuit board is reduced, the electronic element is protected, and the normal use of the circuit board is ensured;

2. through being equipped with fixture block and draw-in groove, when a plurality of circuit boards are carried to needs, engage through fixture block and draw-in groove, conveniently carry a plurality of circuit boards, simultaneously, through being equipped with buffer spring, utilize buffer spring's elasticity can increase the combination degree between fixture block and the draw-in groove, prevent the circuit board landing, moreover, be equipped with the blotter in the buffer spring bottom, can prevent that buffer spring from destroying the anticorrosive coating at insulation board top.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention.

Fig. 2 is a schematic diagram of the substrate connection of the present invention.

Fig. 3 is a cross-sectional view of the overall structure of the present invention.

Fig. 4 is an enlarged view of a portion a in fig. 1 according to the present invention.

Fig. 5 is an enlarged view of a portion B of fig. 1 according to the present invention.

The reference signs are: the heat dissipation structure comprises a base plate 1, an insulation plate 2, an electronic element 3, a heat dissipation mechanism 4, a limiting mechanism 5, a heat dissipation channel 6, a heat dissipation groove 7, a heat dissipation hole 8, a nickel plating layer 9, a gold plating layer 10, a fixing hole 11, a clamping block 12, a clamping groove 13, a buffer spring 14 and a buffer cushion 15.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

1-5, the corrosion-resistant circuit board comprises a substrate 1, wherein an insulating plate 2 is fixedly arranged on the top of the substrate 1, an electronic element 3 is fixedly arranged on the top of the insulating plate 2, an anti-corrosion layer is arranged on the top of the insulating plate 2, a heat dissipation mechanism 4 is arranged on the top of the insulating plate 2, and a limiting mechanism 5 is arranged on the bottom of the substrate 1 and the top of the insulating layer;

the heat dissipation mechanism 4 comprises a heat dissipation channel 6 and heat dissipation grooves 7, the heat dissipation channel 6 is embedded in the insulating plate 2, the number of the heat dissipation grooves 7 is multiple, the heat dissipation grooves 7 are uniformly arranged at the top of the insulating plate 2, heat dissipation holes 8 are formed in the side walls and the bottoms of the inner cavities of the heat dissipation grooves 7, and the heat dissipation holes 8 penetrate through the inner side walls and the bottoms of the inner cavities of the heat dissipation grooves 7 and are communicated with the heat dissipation channel 6;

the anti-corrosion layer comprises a nickel plating layer 9 and a gold plating layer 10, the nickel plating layer 9 is arranged on the top of the insulating plate 2, and the gold plating layer 10 is arranged on the top of the nickel plating layer 9;

the number of the heat dissipation holes 8 is multiple, and the heat dissipation holes 8 are uniformly formed in the inner side wall of the heat dissipation groove 7 and the bottom of the inner cavity;

the top of the insulating plate 2 is provided with four fixing holes 11, the four fixing holes 11 are respectively arranged at four corners of the top of the insulating plate 2, and the fixing holes 11 sequentially penetrate through the insulating plate 2 and the top of the substrate 1;

the limiting mechanism 5 comprises a clamping block 12 and a clamping groove 13, the clamping block 12 is fixed at the bottom of the base plate 1 through a bolt, the clamping groove 13 is arranged at the top of the insulating plate 2, and the clamping block 12 is matched with the clamping groove 13;

the number of the fixture blocks 12 and the number of the clamping grooves 13 are four, the four fixture blocks 12 are respectively arranged at four corners of the bottom of the base plate 1, and the four clamping grooves 13 are respectively arranged at four corners of the top of the insulating plate 2;

the height of the fixture block 12 is greater than that of the electronic element 3;

the limiting mechanism 5 further comprises four buffer springs 14, the number of the buffer springs 14 is four, the four buffer springs 14 are respectively arranged at four corners of the bottom of the base plate 1, the distance between every two buffer springs 14 is smaller than the distance between every two fixture blocks 12, and cushion pads 15 are fixedly arranged at the bottom ends of the buffer springs 14.

The specific implementation mode is as follows: when the heat dissipation device is used, firstly, the insulation plate 2 is fixed at the top of the base, then, the nickel plating layer 9 and the gold plating layer 10 are sequentially arranged at the top of the insulation plate 2, the corrosion-resistant strength is improved, then, the electronic element 3 is fixed at the top of the insulation plate 2, the heat dissipation device can be used, firstly, the complete circuit board is fixed at a proper position through the fixing hole 11, in the using process, the electronic element 3 can generate a large amount of heat, part of the heat can be absorbed by the heat dissipation hole 8, the heat is conveyed into the heat dissipation channel 6 through the heat dissipation hole 8, then, the heat is released to the outside of the circuit board through the heat dissipation channel 6, the heat dissipation effect is realized, when a plurality of circuit boards need to be carried, firstly, the clamping block 12 and the buffer spring 14 are fixed at the bottom of the base through bolts, then, the clamping block 12 is clamped into, the portable heat dissipation device is convenient to carry, in the splicing process, the buffer cushion 15 at the bottom of the buffer spring 14 can be attached to the top of the insulating plate 2 and can extrude the buffer spring 14, the splicing degree between two connected circuit boards can be increased under the action of the elastic force of the buffer spring 14, the circuit boards are prevented from sliding off, in addition, the buffer cushion 15 is arranged at the bottom end of the buffer spring 14, the buffer spring 14 can be prevented from damaging the anti-corrosion layer at the top of the insulating plate 2, through the arrangement of the heat dissipation channel 6 and the heat dissipation groove 7, the plurality of heat dissipation holes 8 are arranged in the inner cavity of the heat dissipation groove 7, the heat dissipation holes 8 are communicated with the heat dissipation channel 6, in the use process, the heat generated by the electronic element 3 can be absorbed by the heat dissipation holes 8 and dissipated through the heat dissipation channel 6, thereby, the heat of the circuit board is reduced, the electronic element 3 is favorably protected, the circuit board cannot effectively dissipate heat generated by the electronic element 3, and when the heat is excessive, the electronic element 3 is short-circuited, so that the normal use of the circuit board is affected.

The utility model discloses the theory of operation:

referring to the attached drawings 1-5 of the specification, in the using process, the electronic component 3 can generate a large amount of heat, part of the heat can be absorbed by the heat dissipation holes 8, the heat dissipation holes 8 convey the heat to the heat dissipation channel 6, then the heat dissipation channel 6 releases the heat to the outside of the circuit board, thereby realizing the heat dissipation effect, when a plurality of circuit boards need to be carried, firstly, the fixture block 12 and the buffer spring 14 are fixed at the bottom of the base by using bolts, then, the fixture block 12 is clamped into the clamping groove 13 at the top of the insulating board 2, thereby realizing the purpose of connecting the circuit boards, being convenient to carry, furthermore, when being spliced, the buffer cushion 15 at the bottom of the buffer spring 14 can be attached to the top of the insulating board 2 and extrude the buffer spring 14, under the action of the elastic force of the buffer spring 14, the combination degree between the two connected circuit boards, moreover, be equipped with blotter 15 in buffer spring 14 bottom, can prevent that buffer spring 14 from destroying the anticorrosive coating at 2 tops of insulation board, through being equipped with heat dissipation channel 6 and radiating groove 7, and be equipped with a plurality of louvres 8 in the radiating groove 7 inner chamber, and be linked together louvre 8 and heat dissipation channel 6, in the use, louvre 8 can absorb the heat that electronic component 3 produced, and dispel through heat dissipation channel 6, thereby reduce the heat of this circuit board, be favorable to protecting electronic component 3, and then guarantee the normal use of this circuit board.

The points to be finally explained are: first, in the description of the present application, it should be noted that, unless otherwise specified and limited, the terms "mounted," "connected," and "connected" should be understood broadly, and may be a mechanical connection or an electrical connection, or a communication between two elements, and may be a direct connection, and "upper," "lower," "left," and "right" are only used to indicate a relative positional relationship, and when the absolute position of the object to be described is changed, the relative positional relationship may be changed;

secondly, the method comprises the following steps: in the drawings of the disclosed embodiments of the present invention, only the structures related to the disclosed embodiments are referred to, and other structures can refer to the common design, and under the condition of no conflict, the same embodiment and different embodiments of the present invention can be combined with each other;

and finally: the above description is only for the preferred embodiment of the present invention and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A corrosion-resistant circuit board comprising a substrate (1), characterized in that: an insulating plate (2) is fixedly arranged at the top of the substrate (1), an electronic element (3) is fixedly arranged at the top of the insulating plate (2), an anti-corrosion layer is arranged at the top of the insulating plate (2), a heat dissipation mechanism (4) is arranged at the top of the insulating plate (2), and limiting mechanisms (5) are arranged at the bottom of the substrate (1) and the top of the insulating layer;

heat dissipation mechanism (4) are including heat dissipation channel (6) and radiating groove (7), heat dissipation channel (6) are inlayed and are established inside insulation board (2), the quantity of radiating groove (7) sets up to a plurality of, and is a plurality of radiating groove (7) evenly set up at insulation board (2) top, and are a plurality of radiating groove (7) inner chamber lateral wall and bottom all are provided with louvre (8), louvre (8) run through radiating groove (7) inside wall and inner chamber bottom, and are linked together with heat dissipation channel (6).

2. A corrosion resistant circuit board according to claim 1, wherein: the anti-corrosion layer comprises a nickel plating layer (9) and a gold plating layer (10), the nickel plating layer (9) is arranged on the top of the insulating plate (2), and the gold plating layer (10) is arranged on the top of the nickel plating layer (9).

3. A corrosion resistant circuit board according to claim 1, wherein: the number of louvre (8) sets up to a plurality ofly, and is a plurality of louvre (8) evenly sets up at radiating groove (7) inside wall and inner chamber bottom.

4. A corrosion resistant circuit board according to claim 1, wherein: insulation board (2) top is provided with fixed orifices (11), the quantity of fixed orifices (11) sets up to four, four fixed orifices (11) set up respectively in insulation board (2) top four corners position, fixed orifices (11) run through insulation board (2) and base plate (1) top in proper order.

5. A corrosion resistant circuit board according to claim 1, wherein: the limiting mechanism (5) comprises a clamping block (12) and a clamping groove (13), the clamping block (12) is fixed to the bottom of the base plate (1) through a bolt, the clamping groove (13) is formed in the top of the insulating plate (2), and the clamping block (12) is matched with the clamping groove (13).

6. A corrosion resistant circuit board according to claim 5, wherein: the number of the clamping blocks (12) and the number of the clamping grooves (13) are four, the four clamping blocks (12) are arranged at four corners of the bottom of the base plate (1) respectively, and the four clamping grooves (13) are arranged at four corners of the top of the insulating plate (2) respectively.

7. A corrosion resistant circuit board according to claim 5, wherein: the height of the fixture block (12) is larger than that of the electronic element (3).

8. A corrosion resistant circuit board according to claim 5, wherein: stop gear (5) still include buffer spring (14), the quantity of buffer spring (14) sets up to four, four buffer spring (14) set up respectively in base plate (1) bottom four corners position, four buffer spring (14) distance between two liang is less than four fixture block (12) distance between two liang, four buffer spring (14) bottom is all fixed and is equipped with blotter (15).