CN219659996U

CN219659996U - PCB product containing OCP connector

Info

Publication number: CN219659996U
Application number: CN202321205226.6U
Authority: CN
Inventors: 周志强; 谢明运; 黄金广
Original assignee: Guangzhou Guanghe Technology Co Ltd
Current assignee: Guangzhou Guanghe Technology Co Ltd
Priority date: 2023-05-18
Filing date: 2023-05-18
Publication date: 2023-09-08
Anticipated expiration: 2033-05-18

Abstract

The utility model discloses a PCB product comprising an OCP connector, wherein the OCP connector is arranged at the surface edge of the PCB product, the PCB product further comprises a thickened copper layer assembly, and the thickened copper layer assembly comprises a plurality of first virtual bonding pads which are arranged in parallel; one end of the first virtual bonding pad is positioned in the OCP connector, and the other end of the first virtual bonding pad is positioned in the board edge area; wherein the board edge area is an area between the OCP connector and the PCB product frame. According to the PCB product containing the OCP connector, the thickness of the OCP connector at the edge of the PCB product is increased by thickening the copper layer assembly, and the service life of the OCP connector is prolonged.

Description

PCB product containing OCP connector

Technical Field

The present utility model relates to the field of OCP connectors, and more particularly to a PCB product comprising an OCP connector.

Background

OCP (OpenComputeProject) the connector is an open server architecture for server architecture expansion. The board is usually positioned at the edge of a main board or a clamping board, and is not subjected to gold plating treatment generally, and the requirements on board thickness are higher due to the over-current and the plugging reliability.

If the thickness of the edges of the main board or the clamping board is insufficient, when the OCP connector is connected with other components, the connection part is easily broken and damaged, and the normal operation and the service life of the OCP connector cannot be ensured.

Disclosure of Invention

The present utility model is directed to solving, at least to some extent, one of the problems in the related art. Therefore, an object of the present utility model is to provide a PCB product including an OCP connector, which increases the thickness of the OCP connector at the edge of the PCB product by thickening a copper layer assembly, thereby improving the service life of the OCP connector.

In order to achieve the above purpose, the present utility model adopts the following technical scheme: a PCB product comprising an OCP connector, the surface edge of the PCB product being provided with the OCP connector, further comprising a thickened copper layer assembly comprising a plurality of first dummy pads arranged side by side; one end of the first virtual bonding pad is positioned in the OCP connector, and the other end of the first virtual bonding pad is positioned in the board edge area; wherein the board edge area is an area between the OCP connector and the PCB product frame.

Further, the first virtual pad is of a cuboid structure, the length of the first virtual pad in the first direction is 180mil, and the length of the first virtual pad in the second direction is 5mil; the first direction refers to the direction of connecting the center of the first virtual bonding pad with the center of the board edge area, and the second direction refers to the direction perpendicular to the first direction in the plane of the surface of the PCB product.

Further, in the first direction, the first dummy pad has a dimension of 15mil in the OCP connector.

Further, the intervals between the adjacent first virtual bonding pads are equal.

Further, the first virtual bonding pad is not overlapped with the frame of the PCB product.

Further, a connecting groove is arranged in the OCP connector, and the connecting groove is provided with a notch facing to the surface frame of the PCB product; and a second virtual bonding pad is arranged in the connecting groove.

Further, the length of the second virtual pad in the first direction is 5mil, and the length of the second virtual pad in the second direction is equal to the size of the connecting groove, wherein the first direction refers to the direction of connecting the center of the first virtual pad with the center of the board edge area, and the second direction refers to the direction perpendicular to the first direction in the plane of the surface of the PCB product.

Further, the PCB product comprises a plurality of stacked PCB boards, and the OCP connector is located in the outermost PCB board.

Further, the OCP connector comprises a through hole, and a thickened copper layer assembly at the through hole is positioned in the PCB adjacent to the OCP connector.

Further, the PCB product comprises a stratum, the thickened copper layer assembly further comprises a third virtual bonding pad positioned in an adjacent signal layer of the stratum, and the position of the third virtual bonding pad corresponds to the position of the OCP connector.

Compared with the prior art, the technical scheme provided by the embodiment of the utility model has the following advantages: the surface edge of the PCB product is provided with the OCP connector, and meanwhile, the OCP connector is also provided with a thickened copper layer assembly, and the specific thickened copper layer assembly comprises a plurality of first virtual bonding pads which are arranged in parallel; one end of the first virtual bonding pad is positioned in the OCP connector, and the other end of the first virtual bonding pad is positioned in the board edge area; wherein the board edge area is the area between the OCP connector and the PCB product frame. Because the OCP connector is further away from the frame of the PCB product by one end, when an external device is connected with the OCP connector, the external device is positioned in the board edge area, and the first virtual bonding pad is simultaneously positioned in the OCP connector and the board edge area and is used for improving the thickness of the edge of the whole PCB product, including the thickness of the OCP connector and the thickness of the board edge area, the thickness of the OCP connector and the quality of the board edge area are ensured in the use process of the OCP connector, even if the OCP connector is worn by multiple plugging and unplugging, the OCP connector and the board edge area can still keep good mechanical properties, and the service life of the OCP connector is effectively prolonged.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the utility model and together with the description, serve to explain the principles of the utility model.

In order to more clearly illustrate the embodiments of the utility model or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, and it will be obvious to a person skilled in the art that other drawings can be obtained from these drawings without inventive effort.

In the accompanying drawings:

fig. 1 is a schematic diagram of a distribution of first dummy pads in embodiment 2;

fig. 2 is a schematic diagram showing the distribution of the first dummy pads in embodiment 3;

reference numerals: 11. a first dummy pad; 12. a second dummy pad; 13. an OCP connector; 14. a panel edge region; 15. and the connecting groove.

Detailed Description

For a clearer understanding of technical features, objects and effects of the present utility model, a detailed description of embodiments of the present utility model will be made with reference to the accompanying drawings. In the following description, it should be understood that the directions or positional relationships indicated by "front", "rear", "upper", "lower", "left", "right", "longitudinal", "transverse", "vertical", "horizontal", "top", "bottom", "inner", "outer", "head", "tail", etc. are configured and operated in specific directions based on the directions or positional relationships shown in the drawings, and are merely for convenience of describing the present utility model, not to indicate that the mechanism or element referred to must have specific directions, and thus should not be construed as limiting the present utility model.

It should also be noted that unless explicitly stated or limited otherwise, terms such as "mounted," "connected," "secured," "disposed," and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. When an element is referred to as being "on" or "under" another element, it can be "directly" or "indirectly" on the other element or one or more intervening elements may also be present. The terms "first," "second," "third," and the like are used merely for convenience in describing the present utility model and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated, whereby features defining "first," "second," "third," etc. may explicitly or implicitly include one or more such features. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In the following description, for purposes of explanation and not limitation, specific details are set forth such as the particular system architecture, techniques, etc., in order to provide a thorough understanding of the embodiments of the present utility model. It will be apparent, however, to one skilled in the art that the present utility model may be practiced in other embodiments that depart from these specific details. In other instances, detailed descriptions of well-known systems, mechanisms, circuits, and methods are omitted so as not to obscure the description of the present utility model with unnecessary detail.

Example 1

Referring to fig. 1-2, the present utility model provides a PCB product including an OCP connector 13, wherein the OCP connector 13 is disposed on the surface edge of the PCB product, and the PCB product further includes a thickened copper layer assembly, and the thickened copper layer assembly includes a plurality of first dummy pads 11 disposed in parallel; one end of the first virtual pad 11 is located in the OCP connector 13, and the other end is located in the board edge region 14; wherein the board edge area 14 is an area between the OCP connector 13 and the PCB product frame.

Because the OCP connector 13 is further away from the PCB product frame, when an external device is connected to the OCP connector 13, the external device is located in the board edge region 14, and therefore, the thickness of the OCP connector 13 and the thickness of the board edge region 14 both affect the service life of the OCP connector 13.

The utility model aims to thicken an OCP connector 13 and a plate edge region 14, improve the plate thickness, ensure that the OCP connector 13 and the plate edge region 14 can still keep a certain thickness after the OCP connector 13 is subjected to repeated insertion and extraction wear, keep good mechanical properties and further improve the service life of the OCP connector 13.

The surface edge of the PCB product is provided with the OCP connector 13, and meanwhile, a thickened copper layer assembly is also arranged in the OCP connector 13, and the specific thickened copper layer assembly comprises a plurality of first virtual bonding pads 11 which are arranged in parallel; one end of the first dummy pad 11 is located in the OCP connector 13, and the other end is located in the board edge region 14; wherein the board edge area 14 is the area between the OCP connector 13 and the PCB product border. In the utility model, the first virtual bonding pad 11 is simultaneously positioned in the OCP connector 13 and the board edge region 14 and is used for improving the thickness of the edge of the whole PCB product, including the thickness of the OCP connector 13 and the thickness of the board edge region 14, so that the thickness of the OCP connector 13 and the quality of the board edge region 14 are ensured in the use process, even if the OCP connector 13 and the board edge region 14 are subjected to repeated plugging and wearing, the OCP connector 13 and the board edge region 14 can still maintain good mechanical performance, and the service life of the OCP connector 13 is effectively prolonged.

Example 2

Referring to fig. 1, the utility model provides a PCB product including an OCP connector 13, wherein the OCP connector 13 is disposed on the surface edge of the PCB product, and the PCB product further includes a thickened copper layer assembly, and the thickened copper layer assembly includes a plurality of first dummy pads 11 disposed in parallel; one end of the first virtual pad 11 is located in the OCP connector 13, and the other end is located in the board edge region 14; wherein the board edge area 14 is an area between the OCP connector 13 and the PCB product frame.

Further, in the present utility model, the first dummy pad 11 has a rectangular parallelepiped structure, and the length of the first dummy pad 11 in the first direction is 180mil, and the length in the second direction is 5mil; the first direction refers to the direction of the line connecting the center of the first dummy pad 11 and the center of the board edge region 14, and the second direction refers to the direction perpendicular to the first direction in the plane of the surface of the PCB product.

That is, the first direction refers to a direction from the OCP connector 13 toward the border of the PCB product, where the border refers to a border position where the OCP connector 13 is closest. As shown in fig. 1, the first direction refers to the horizontal direction, and the second direction refers to the vertical direction.

The first dummy pads 11 in the present utility model may be copper layers, for example, electroplated copper layers are formed as the first dummy pads 11 by electroplating. Since the present utility model aims to simultaneously raise the thicknesses of the OCP connector 13 and the board edge region 14, the first dummy pads 11 are located in both the OCP connector 13 and the board edge region 14. I.e. a part of the first dummy pads 11 are located in the OCP connector 13 and another part of the first dummy pads 11 are located in the board edge area 14.

Specifically, in the first direction, the first dummy pad 11 has a size of 15mil in the OCP connector 13, and the first dummy pad 11 has a size of 165mil in the half area. It should be noted that in the first direction, the first dummy pads 11 are not completely filled in the OCP connector 13, nor in the board edge region 14, i.e. the first dummy pads 11 do not overlap the border of the PCB product, nor do they overlap the side of the OCP connector 13 away from the board edge region 14.

In order to achieve uniform thickening of the OCP connector 13 and the board edge region 14, the first dummy pads 11 are uniformly distributed in the present utility model, that is, the pitches between adjacent first dummy pads 11 are equal.

In the utility model, the first virtual bonding pad 11 is simultaneously positioned in the OCP connector 13 and the board edge region 14 and is used for improving the thickness of the edge of the whole PCB product, including the thickness of the OCP connector 13 and the thickness of the board edge region 14, so that the thickness of the OCP connector 13 and the quality of the board edge region 14 are ensured in the use process, even if the OCP connector 13 and the board edge region 14 are subjected to repeated plugging and wearing, the OCP connector 13 and the board edge region 14 can still maintain good mechanical performance, and the service life of the OCP connector 13 is effectively prolonged.

Example 3

Referring to fig. 2, the utility model provides a PCB product including an OCP connector 13, wherein the OCP connector 13 is disposed on the surface edge of the PCB product, and the PCB product further includes a thickened copper layer assembly, and the thickened copper layer assembly includes a plurality of first dummy pads 11 disposed in parallel; one end of the first virtual pad 11 is located in the OCP connector 13, and the other end is located in the board edge region 14; wherein the board edge area 14 is an area between the OCP connector 13 and the PCB product frame.

Further, the OCP connector 13 may further be provided with a connection groove 15, where the connection groove 15 has a notch facing the surface frame of the PCB product; the connection groove 15 is provided therein with a second dummy pad 12. The thickness of the connection groove 15 is lower than other non-notched areas in the OCP connector 13, and the present utility model provides a second dummy pad 12 in the connection groove 15 in addition to the first dummy pad 11 mentioned above.

The length of the second dummy pad 12 in the first direction is 5mil, and the length in the second direction is equal to the size of the connecting groove 15, wherein the first direction refers to the direction of connecting the center of the first dummy pad 11 with the center of the board edge area 14, and the second direction refers to the direction perpendicular to the first direction in the plane of the surface of the PCB product. As shown in fig. 2, the first direction refers to the horizontal direction, and the second direction refers to the vertical direction.

In the present utility model, the second dummy pads 12 and the first dummy pads 11 are in a vertical structure, that is, the first dummy pads 11 simultaneously frame the OCP connector 13 and the board edge region 14 for simultaneously thickening the OCP connector 13 and the board edge region 14. The second dummy pads 12 are used for thickening the connecting grooves 15 in the OCP connector 13, and in the extending direction, the first dummy pads 11 extend toward the border of the PCB product, and the second dummy pads 12 penetrate through the connecting grooves 15 in the OCP connector 13.

The second dummy pads 12 in the present utility model may be copper layers, for example, electroplated copper layers are formed as the second dummy pads 12 by electroplating.

The first virtual bonding pad 11 is simultaneously positioned in the OCP connector 13 and the board edge area 14 and is used for improving the thickness of the edge of the whole PCB product, including the thickness of the OCP connector 13 and the thickness of the board edge area 14; the second dummy pad 12 is located in the connection groove 15, and is used for improving the thickness of the connection groove 15 in the OCP connector 13, so that the thickness of the OCP connector 13 and the quality of the board edge area 14 can be guaranteed in the use process of the OCP connector 13, and even if the OCP connector 13 and the board edge area 14 are worn out in a plugging manner for many times, the OCP connector 13 and the board edge area 14 can still maintain good mechanical properties, and the service life of the OCP connector 13 is effectively prolonged.

Example 4

The utility model provides a PCB product comprising an OCP connector 13, wherein the surface edge of the PCB product is provided with the OCP connector 13, and the PCB product further comprises a thickened copper layer assembly, wherein the thickened copper layer assembly comprises a plurality of first virtual bonding pads 11 which are arranged in parallel; one end of the first virtual pad 11 is located in the OCP connector 13, and the other end is located in the board edge region 14; wherein the board edge area 14 is an area between the OCP connector 13 and the PCB product frame.

The first dummy pads 11 in the present utility model may be copper layers, for example, electroplated copper layers are formed as the first dummy pads 11 by electroplating. The second dummy pads 12 may be specifically copper layers, for example, electroplated copper layers are formed as the second dummy pads 12 by electroplating.

The PCB product comprises a plurality of PCB boards which are stacked and pressed, and each PCB board sequentially forms structures such as a stratum, a signal layer, a device layer and the like. Typically the device layer is located on the outermost side of the PCB product, and in the present utility model the OCP connector 13 is located in the device layer, i.e. the OCP connector 13 is located in the outermost PCB board. The device layer surface may also be provided with a shield, and when the device layer outside is provided with a shield, care needs to be taken: if the shield is directly disposed in the OCP connector 13, i.e. the shield occupies the OCP connector 13 and the board edge region 14, the first dummy pads 11 and/or the second dummy pads 12 need to avoid the shield design, and in order to compensate for the thickness at the shield, the first dummy pads 11 and/or the second dummy pads 12 may be designed at corresponding positions in the PCB board adjacent to the device layer. The corresponding position here refers to a position overlapping the shield in the device layer in a third direction, which refers to a direction perpendicular to the first direction and the second direction.

The first dummy pads 11 and/or the second dummy pads 12 provided in adjacent layers are provided in order to ensure that the shield works properly.

Further, if the OCP connector 13 includes a through hole, the thickened copper layer assembly at the through hole is located in the PCB adjacent to the OCP connector 13; because the first virtual bonding pads 11 cannot be arranged at the through holes, the utility model directly deposits the corresponding first virtual bonding pads 11 at the through holes in the adjacent PCB, thereby ensuring that the whole OCP connector 13 of the PCB product is thickened uniformly.

Further, if the PCB product includes a ground layer, the thickened copper layer assembly further includes a third dummy pad located in an adjacent signal layer of the ground layer, and the extension direction and the size of the third dummy pad may be the same as those of the first dummy pad 11. And the position of the third dummy pad corresponds to the position of the OCP connector 13. That is, in the third direction, the third dummy pad overlaps the first dummy pad 11 in the device layer, and the third direction refers to a direction perpendicular to the first direction and the second direction.

The third dummy pad provided in the adjacent signal layer of the ground layer in the present utility model can further increase the thickness of the OCP connector 13 and the board edge region 14.

It is to be understood that the above examples only represent preferred embodiments of the present utility model, which are described in more detail and are not to be construed as limiting the scope of the utility model; it should be noted that, for a person skilled in the art, the above technical features can be freely combined, and several variations and modifications can be made without departing from the scope of the utility model; therefore, all changes and modifications that come within the meaning and range of equivalency of the claims are to be embraced within their scope.

Claims

1. A PCB product comprising an OCP connector, the surface edge of the PCB product being provided with the OCP connector, characterized by further comprising a thickened copper layer assembly comprising a plurality of first dummy pads arranged side by side; one end of the first virtual bonding pad is positioned in the OCP connector, and the other end of the first virtual bonding pad is positioned in the board edge area; wherein the board edge area is an area between the OCP connector and the PCB product frame.

2. The PCB product comprising an OCP connector of claim 1, wherein the first dummy pad has a rectangular parallelepiped structure, a length of the first dummy pad in a first direction is 180 mils, and a length in a second direction is 5 mils; the first direction refers to the direction of connecting the center of the first virtual bonding pad with the center of the board edge area, and the second direction refers to the direction perpendicular to the first direction in the plane of the surface of the PCB product.

3. The PCB product containing an OCP connector of claim 2, wherein the first dummy pad has a dimension in the OCP connector of 15 mils in the first direction.

4. The PCB product comprising an OCP connector of claim 1, wherein the spacing between adjacent ones of the first dummy pads is equal.

5. The PCB product including an OCP connector of claim 4, wherein the first dummy pads do not overlap a border of the PCB product.

6. A PCB product comprising an OCP connector according to claim 1, characterized in that the OCP connector is provided with a connecting groove therein, the connecting groove having a notch facing the surface frame of the PCB product; and a second virtual bonding pad is arranged in the connecting groove.

7. The PCB product including an OCP connector of claim 6, wherein the second dummy pad has a length of 5mil in a first direction and a length equal to a size of the connection groove in a second direction, wherein the first direction is a direction in which a center of the first dummy pad is connected to a center of the board edge region, and the second direction is a direction perpendicular to the first direction in a plane of a surface of the PCB product.

8. The PCB product containing an OCP connector of claim 1, wherein the PCB product comprises a stack of several PCB boards, the OCP connector being located in an outermost PCB board.

9. The PCB product of claim 1, wherein the OCP connector includes a through hole, and wherein the thickened copper layer assembly at the through hole is located in the PCB adjacent to the OCP connector.

10. The PCB product comprising an OCP connector of claim 1, wherein the PCB product comprises a ground layer, wherein the thickened copper layer assembly further comprises a third dummy pad in an adjacent signal layer of the ground layer, wherein the third dummy pad has a position corresponding to the position of the OCP connector.