CN108183095A - Flexible display panels and its chip on film structure - Google Patents
Flexible display panels and its chip on film structure Download PDFInfo
- Publication number
- CN108183095A CN108183095A CN201711473116.7A CN201711473116A CN108183095A CN 108183095 A CN108183095 A CN 108183095A CN 201711473116 A CN201711473116 A CN 201711473116A CN 108183095 A CN108183095 A CN 108183095A
- Authority
- CN
- China
- Prior art keywords
- routing layer
- pad
- chip
- film structure
- routing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/528—Geometry or layout of the interconnection structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
Abstract
The present invention provides a kind of flexible display panels and its chip on film structure, the chip on film structure includes substrate, the multiple routing layers being set in turn in from below to up on the substrate, pad area is equipped on each routing layer, pad area in the multiple routing layer is arranged in order along the first direction, the multiple pads being arranged in a linear in a second direction are equipped in pad area on each routing layer, the first direction is vertical with the second direction, and via is equipped in the routing layer on routing layer where the multiple pad.Chip on film structure proposed by the present invention is by setting multiple routing layers and pad being distributed into multiple routing layers, so as to provide more bond pad arrangement spaces, solve the problems, such as that spacing of the bond pad arrangement space not enough and between pad is too small and cannot meet the technological requirement of COF under high definition case.
Description
Technical field
The present invention relates to flexible display technologies field more particularly to a kind of flexible display panels and its chip on film structure.
Background technology
Mobile phone is changed from plane to curved surface currently on the market, in order to expand screen accounting, realizes narrow frame design, 3D or
Curve designs are becoming increasingly popular.Therefore, flexible display screen is also more and more extensive is used.At present, on Flexible Displays
Driving design mainly using COF (chip on film, chip on film encapsulation) structure, it is great that COF structures become Flexible Displays
The display technology of competitive advantage, the most commonly used is 1 row's pads or 2 row's pads to set by COF OLB (Outer Lead Bonding) at present
Meter.With the development of display technology, requirement of the people to the resolution ratio of flexible display screen is also higher and higher, and resolution requirement is higher
More source signal wires are then needed, so as to which the number of COF OLB ends pad, existing 1 row pad or 2 rows will necessarily be increased
Pad design is difficult to the technological requirement for meeting COF.Accordingly, it is desirable to provide a kind of pad for the technological requirement that disclosure satisfy that COF is set
Meter, to solve the above problems.
Invention content
In order to solve the deficiencies in the prior art, the present invention provides a kind of flexible display panels and its chip on film structure, energy
Enough solve that spacing of the bond pad arrangement space not enough and between pad under high definition case be too small and technique that COF cannot be met
It is required that the problem of.
Specific technical solution proposed by the present invention is：A kind of chip on film structure is provided, the chip on film structure includes
Substrate, the multiple routing layers being set in turn in from below to up on the substrate are equipped with pad area on each routing layer, described
Pad area in multiple routing layers is arranged in order along the first direction, is equipped in a second direction in the pad area on each routing layer
The multiple pads being arranged in a linear, the first direction is vertical with the second direction, the routing layer where the multiple pad
On routing layer in be equipped with via.
Further, in the multiple routing layer the pad area of two routing layers of arbitrary neighborhood be staggered in second direction it is predetermined
Distance.
Further, the preset distance is not less than the length of each pad in this second direction.
Further, the spacing in multiple pads on each routing layer between two pads of arbitrary neighborhood is equal.
Further, between two pads of arbitrary neighborhood in the multiple routing layer on two routing layers of arbitrary neighborhood
Spacing is equal.
Further, the shapes and sizes all same of multiple pads on each routing layer and/or the multiple cabling
The shapes and sizes all same of multiple pads in layer in two routing layers of arbitrary neighborhood.
Further, the quantity of multiple pads in each routing layer is equal.
Further, the shapes and sizes of the via on each routing layer are different.
Further, the quantity of the via on each routing layer is unequal.
The present invention also provides a kind of flexible display panels, the flexible display panels include as above any flip
Membrane structure.
Chip on film structure proposed by the present invention includes multiple routing layers, is equipped with pad area on each routing layer, often
It is equipped with multiple pads for being arranged in a linear in a second direction in pad area on one routing layer, walking where the multiple pad
Via is equipped in routing layer on line layer.By setting multiple routing layers and pad being distributed into multiple routing layers, from
And more bond pad arrangement spaces are provided, solve high definition case under bond pad arrangement space not enough and pad between spacing
The problem of technological requirement too small and that COF cannot be met.
Description of the drawings
Below in conjunction with the accompanying drawings, it is described in detail by the specific embodiment to the present invention, technical scheme of the present invention will be made
And other beneficial effects are apparent.
Fig. 1 is the structure diagram of chip on film structure；
Fig. 2 is the sectional view of chip on film structure in Fig. 1；
Fig. 3 is the structure diagram of driving chip.
Specific embodiment
Hereinafter, with reference to the accompanying drawings to detailed description of the present invention embodiment.However, it is possible to come in many different forms real
The present invention is applied, and the present invention should not be construed as limited to the specific embodiment illustrated here.On the contrary, provide these implementations
Example is in order to explain the principle of the present invention and its practical application, so as to make others skilled in the art it will be appreciated that the present invention
Various embodiments and be suitable for the various modifications of specific intended application.In the accompanying drawings, identical label will be used for table always
Show identical element.
With reference to Fig. 1, Fig. 2, flexible display panels provided in this embodiment include display screen, driving chip and chip on film
Structure.Chip on film structure includes substrate 1, the multiple routing layers 2 being set in turn in from below to up on substrate 1, each cabling
Pad area 21 is equipped on layer 2, and the pad area 21 in multiple routing layers 2 is arranged in order along the first direction, on each routing layer 2
Pad area 21 in be equipped with multiple pads 20 for being arranged in a linear in a second direction, first direction is vertical with second direction, multiple
Via 10 is equipped in the routing layer 21 on routing layer 21 where pad 20.First direction in the present embodiment is Y-axis side
To second direction is X-direction.
Driving chip is equipped with a plurality of leads, the total phase of the item number of a plurality of leads and the pad 20 in chip on film structure
It corresponds to a pad 20 Deng, each lead and is simultaneously electrically connected with corresponding pad 20.It is located at outermost cabling on substrate 1
The lead corresponding on driving chip of pad 20 on layer 2 is in direct contact, between substrate 1 and outermost routing layer 2
Pad 20 on routing layer 2 passes through the wire contacts corresponding on driving chip of via 10.
In the present embodiment, the number of routing layer 2 is equipped with 4 layers of routing layer 2 for 4 i.e. substrate 1, this 4 routing layers 2 are along under
Direction on and is followed successively by the first routing layer, the second routing layer, third routing layer and the 4th routing layer, and the second routing layer is equipped with
With the 20 corresponding via 10 of pad on the first routing layer, third routing layer is equipped with corresponding with the pad 20 on the first routing layer
Via 10 and with the 20 corresponding via 10 of pad on the second routing layer, the 4th routing layer be equipped with on the first routing layer
20 corresponding via 10 of pad, with the 20 corresponding via 10 of pad on the second routing layer and with the pad on third routing layer
20 corresponding vias 10.
In this way, the pad 20 on the first routing layer passes through on the second routing layer, third routing layer and the 4th routing layer
Via 10 and the lead on driving chip are in electrical contact, and the pad 20 on the second routing layer passes through third routing layer, the 4th cabling
Via 10 on layer and the lead on driving chip are in electrical contact, and the pad 20 on third routing layer passes through on the 4th routing layer
Via 10 and the lead on driving chip are in electrical contact.Certainly, the quantity of routing layer 2 can be according to the size of chip on film structure
And the requirement of the resolution ratio of flexible display panels is set.
With reference to Fig. 3, in order to save the cabling space of driving chip, two routing layers 2 of arbitrary neighborhood in multiple routing layers 2
Pad area 21 is staggered preset distance in second direction, i.e., first pad 20 of two neighboring pad area 21 in the X-axis direction it
Between distance be preset distance.Preferably, preset distance is not less than each the length, that is, X-axis side of pad 20 in a second direction
To length.In this way, multiple leads 30 for being arranged in a linear of driving chip can simultaneously with the pad on adjacent two layers routing layer 2
20 is in electrical contact, and the item number for the multiple leads 30 being arranged in a linear is equal with the sum of the pad 20 on adjacent two layers routing layer 2,
If substrate 1 is equipped with 4 routing layers 2, the quantity of the pad 20 on each routing layer 2 is 10, then is only used on driving chip
Two line leads 30 are set, and the item number of the lead 30 per a line is 20, and the length of lead 30 in the Y-axis direction exists more than pad 20
Length in Y direction so that the lead on per a line can cover the pad 20 on adjacent two layers routing layer 2 simultaneously.
Certainly, the arrangement mode of the lead on the driving chip in the present embodiment can be with the pad in chip on film structure
20 arrangement mode corresponds to, and does not limit here.
Spacing phase in multiple pads 20 on each routing layer 2 in the present embodiment between two pads of arbitrary neighborhood
Deng the spacing between two pads 20 of arbitrary neighborhood in multiple routing layers 2 on two routing layers 2 of arbitrary neighborhood is equal.It is each
The shapes and sizes all same of multiple pads 20 on a routing layer 2, in multiple routing layers 2 in two routing layers 2 of arbitrary neighborhood
Multiple pads 20 shapes and sizes all same.I.e. each pad area 21 is equal sized, in each pad area 21
The shapes and sizes of pad 20 and spacing all same, and the quantity of multiple pads in each routing layer 2 is also equal, in this way
The preparation process of pad 20 can be simplified, while cause being more evenly distributed for pad 20.
It is in different size due to the contact resistance on driving chip each lead, between pad 20 and lead
Contact area can also have differences.Contact area between pad 20 and lead can change the shape of via 10 by change
Change with size.Certainly, the shapes and sizes of the via 10 in the present embodiment on each routing layer 2 can be identical, passes through
Change the quantity of via 10 to change the contact area between pad 20 and lead.
In addition, chip on film structure further includes pressing area 3 in the present embodiment, press in area 3 equipped with linear along X-direction
Multiple pins 31 of arrangement.It presses area 3 and pad area 21 and is located at the opposite both ends of substrate 1 respectively, press area 3 and be used for and display screen
Bonding pad pressed so that the realization of multiple pins 31 and display screen is electrically connected.
Below by taking resolution ratio is 2160 × 3840 as an example, need to set 3840 pads 20 in chip on film structure, it is assumed that
The length of chip on film structure in the X-axis direction is 50 ㎜, and the number of routing layer 2 is 4, then the pad on each layer of routing layer 2
20 number is 960, is designed according to regular bond pads spacing, and the spacing between two neighboring pad 20 is 35 μm, each weldering
The length of panel 21 in the X-axis direction is 33.6mm, then the right side edge of the pad area 21 and substrate 1 of first layer routing layer 2
Distance is 8.2mm, and the distance of the pad area 21 of the 4th layer of routing layer 2 and the left side edge of substrate 1 is 8.2mm, corresponding, substrate
1 other end keeps for the space in pressing area 3 also can be more, is designed according to the spacing between conventional pin 31, presses area 3
The left and right sides 200 pins 31 can also be set more.
The chip on film structure that the present embodiment proposes is by setting multiple routing layers 2 and pad 20 being distributed to multiple cablings
In layer 2, so as to provide more bond pad arrangement spaces, bond pad arrangement space is solved under high definition case not enough and pad 20
Between spacing it is too small and the problem of the technological requirement of COF cannot be met.In addition, the chip on film structure of the present embodiment can be with
Increase the area in pressing area being connect with display screen.
The above is only the specific embodiment of the application, it is noted that for the ordinary skill people of the art
For member, under the premise of the application principle is not departed from, several improvements and modifications can also be made, these improvements and modifications also should
It is considered as the protection domain of the application.
Claims (10)
1. a kind of chip on film structure, which is characterized in that including substrate, from below to up be set in turn in it is multiple on the substrate
Routing layer, is equipped with pad area on each routing layer, and the pad area in the multiple routing layer is arranged in order along the first direction,
Be equipped with multiple pads for being arranged in a linear in a second direction in pad area on each routing layer, the first direction with it is described
Second direction is vertical, and via is equipped in the routing layer on routing layer where the multiple pad.
2. chip on film structure according to claim 1, which is characterized in that arbitrary neighborhood two in the multiple routing layer
The pad area of routing layer is staggered preset distance in second direction.
3. chip on film structure according to claim 2, which is characterized in that the preset distance is not less than each pad
Length in this second direction.
4. chip on film structure according to claim 1, which is characterized in that appoint in multiple pads on each routing layer
The spacing anticipated between two neighboring pad is equal.
5. chip on film structure according to claim 4, which is characterized in that arbitrary neighborhood two in the multiple routing layer
The spacing between two pads of arbitrary neighborhood on routing layer is equal.
6. chip on film structure according to claim 4, which is characterized in that the shape of multiple pads on each routing layer
The shape of multiple pads in shape and size all same and/or the multiple routing layer in two routing layers of arbitrary neighborhood and big
Small all same.
7. chip on film structure according to claim 1, which is characterized in that the number of multiple pads in each routing layer
It measures equal.
8. chip on film structure according to claim 1, which is characterized in that the shape of the via on each routing layer and
It is of different sizes.
9. chip on film structure according to claim 1, which is characterized in that the quantity of the via on each routing layer is not
It is equal.
10. a kind of flexible display panels, which is characterized in that including the chip on film structure as described in claim 1-9 is any.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711473116.7A CN108183095B (en) | 2017-12-29 | 2017-12-29 | Flexible display panels and its flip chip structure |
| PCT/CN2018/074005 WO2019127786A1 (en) | 2017-12-29 | 2018-01-24 | Flexible display panel and chip on film structure thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711473116.7A CN108183095B (en) | 2017-12-29 | 2017-12-29 | Flexible display panels and its flip chip structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108183095A true CN108183095A (en) | 2018-06-19 |
| CN108183095B CN108183095B (en) | 2019-11-22 |
Family
ID=62548985
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711473116.7A Active CN108183095B (en) | 2017-12-29 | 2017-12-29 | Flexible display panels and its flip chip structure |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN108183095B (en) |
| WO (1) | WO2019127786A1 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109377890A (en) * | 2018-12-21 | 2019-02-22 | 武汉华星光电半导体显示技术有限公司 | Flexible display apparatus |
| CN109597252A (en) * | 2018-12-17 | 2019-04-09 | 武汉天马微电子有限公司 | A kind of liquid crystal display die set and liquid crystal display device |
| CN110111682A (en) * | 2019-04-10 | 2019-08-09 | 深圳市华星光电技术有限公司 | Flip chip and display device |
| CN110689812A (en) * | 2019-11-11 | 2020-01-14 | 昆山国显光电有限公司 | Flexible structure, display panel and display device |
| CN113178132A (en) * | 2021-04-01 | 2021-07-27 | Tcl华星光电技术有限公司 | Flip chip thin film set, display panel and display module |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060228829A1 (en) * | 2005-04-08 | 2006-10-12 | Shih-Ping Hsu | Method for fabricating a flip chip package |
| KR100818116B1 (en) * | 2007-06-20 | 2008-03-31 | 주식회사 하이닉스반도체 | Semiconductor package |
| CN102650785A (en) * | 2012-03-02 | 2012-08-29 | 京东方科技集团股份有限公司 | Display panel and display device |
| CN107134443A (en) * | 2017-06-23 | 2017-09-05 | 厦门天马微电子有限公司 | The method for packing of chip on film, display device and integrated circuit |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003086629A (en) * | 2001-09-13 | 2003-03-20 | Hitachi Ltd | Cof-type semiconductor device and manufacturing method thereof |
| KR20080059836A (en) * | 2006-12-26 | 2008-07-01 | 엘지디스플레이 주식회사 | Cof and lcd with the same |
| KR102212323B1 (en) * | 2014-02-10 | 2021-02-04 | 삼성디스플레이 주식회사 | Display device |
| CN107204346B (en) * | 2017-07-27 | 2019-09-24 | 厦门天马微电子有限公司 | Array substrate, display panel and display device |
| CN107167971A (en) * | 2017-07-28 | 2017-09-15 | 武汉天马微电子有限公司 | Display panel and display device |
-
2017
- 2017-12-29 CN CN201711473116.7A patent/CN108183095B/en active Active
-
2018
- 2018-01-24 WO PCT/CN2018/074005 patent/WO2019127786A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060228829A1 (en) * | 2005-04-08 | 2006-10-12 | Shih-Ping Hsu | Method for fabricating a flip chip package |
| KR100818116B1 (en) * | 2007-06-20 | 2008-03-31 | 주식회사 하이닉스반도체 | Semiconductor package |
| CN102650785A (en) * | 2012-03-02 | 2012-08-29 | 京东方科技集团股份有限公司 | Display panel and display device |
| CN107134443A (en) * | 2017-06-23 | 2017-09-05 | 厦门天马微电子有限公司 | The method for packing of chip on film, display device and integrated circuit |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109597252A (en) * | 2018-12-17 | 2019-04-09 | 武汉天马微电子有限公司 | A kind of liquid crystal display die set and liquid crystal display device |
| CN109377890A (en) * | 2018-12-21 | 2019-02-22 | 武汉华星光电半导体显示技术有限公司 | Flexible display apparatus |
| CN110111682A (en) * | 2019-04-10 | 2019-08-09 | 深圳市华星光电技术有限公司 | Flip chip and display device |
| CN110111682B (en) * | 2019-04-10 | 2021-06-01 | Tcl华星光电技术有限公司 | Chip on film and display device |
| CN110689812A (en) * | 2019-11-11 | 2020-01-14 | 昆山国显光电有限公司 | Flexible structure, display panel and display device |
| CN110689812B (en) * | 2019-11-11 | 2022-05-10 | 昆山国显光电有限公司 | Flexible structure, display panel and display device |
| CN113178132A (en) * | 2021-04-01 | 2021-07-27 | Tcl华星光电技术有限公司 | Flip chip thin film set, display panel and display module |
| WO2022205551A1 (en) * | 2021-04-01 | 2022-10-06 | Tcl华星光电技术有限公司 | Chip-on-film group, display panel and display module |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2019127786A1 (en) | 2019-07-04 |
| CN108183095B (en) | 2019-11-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108183095B (en) | Flexible display panels and its flip chip structure | |
| CN110286535B (en) | Display module, manufacturing method of display module and display device | |
| US10732752B1 (en) | Display panel and display device | |
| US20200210041A1 (en) | Touch display panel and bonding method thereof | |
| KR102104126B1 (en) | LED pixel point, light emitting member, light emitting panel and display screen | |
| CN103809344B (en) | Display device | |
| CN109147584A (en) | A kind of LED display unit group and display panel | |
| US11515243B2 (en) | Display device and chip-on-film structure thereof | |
| TWI486106B (en) | Pin structure and pin connection structure | |
| US10340215B2 (en) | Chip on film and display device | |
| CN113327516B (en) | Display panel and display device | |
| CN209015627U (en) | A kind of LED display unit group and display panel | |
| CN107204346B (en) | Array substrate, display panel and display device | |
| CN104951170B (en) | Touch control display panel | |
| CN107515698B (en) | Touch panel | |
| WO2014153897A1 (en) | Transparent conductive film | |
| CN100479139C (en) | Driver chip and display apparatus | |
| US20230098663A1 (en) | Display panel and display device | |
| CN107132950B (en) | Touch panel and display device | |
| CN113193017A (en) | Display panel and display device | |
| CN114237424A (en) | Touch display panel and display device | |
| CN110133929B (en) | Array substrate and manufacturing method thereof, display panel and display module | |
| WO2019114089A1 (en) | Flexible display device and driving element thereof | |
| JP2022547752A (en) | display panel and display device | |
| CN109686259B (en) | Display panel and display device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |