CN110286535B - Display module, manufacturing method of display module and display device - Google Patents
Display module, manufacturing method of display module and display device Download PDFInfo
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- CN110286535B CN110286535B CN201910536264.1A CN201910536264A CN110286535B CN 110286535 B CN110286535 B CN 110286535B CN 201910536264 A CN201910536264 A CN 201910536264A CN 110286535 B CN110286535 B CN 110286535B
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13458—Terminal pads
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
Abstract
The application discloses a display module, a manufacturing method of the display module and a display device, wherein the display module comprises a display panel, a switching flexible circuit board, a driving module and a main flexible circuit board; the display panel is divided into a display area and a non-display area, the non-display area comprises a binding area, the binding area is provided with m rows of first bonding pads, the switching flexible circuit board comprises m first flexible circuit boards, one first flexible circuit board is correspondingly bound and electrically connected with one row of first bonding pads, and the m first flexible circuit boards are sequentially stacked in a direction perpendicular to the plane of the array substrate; the driving module comprises a driving chip and COG glass, wherein m rows of second bonding pads are arranged on the surface of the same side of the COG glass bound with the driving chip, and one first flexible circuit board is correspondingly bound and electrically connected with one row of second bonding pads; the reliability of the binding process of the switching flexible circuit board can be ensured, and the narrow frame design of the display module is facilitated.
Description
Technical Field
The application relates to the technical field of display, in particular to a display module, a manufacturing method of the display module and a display device.
Background
With the development of consumer electronics devices in the aspects of lightness, thinness, narrow frame, high resolution, high screen occupation ratio and the like, the size of the lower frame of the display module is required to be smaller and smaller, and the integrated circuit Chip is bound On Glass (COG, Chip On Glass) which is a technology used more in the current display module. To overcome this, an integrated circuit chip (IC) and a main flexible circuit board are first bonded to the relay glass, and then signals are transmitted to the display panel through the relay flexible circuit board. By the mode, the size of the lower frame of the display panel can be reduced to be less than 2.5mm, and the switching flexible circuit board is bent to the back of the display module, so that the screen occupation ratio of the whole machine design is improved.
However, as the demand for PPI (pixel density) of the display device in the market is higher and higher, the pixel area is smaller and smaller, and meanwhile, the pixel circuit is more and more complex, and the signal routing arrangement of the high PPI is more and more dense, the signal lines in the display panel are electrically connected with the switching flexible circuit board through the signal routing, because the switching flexible circuit board is flexible and easy to warp due to the inherent property and has a certain alignment deviation during binding, the distance between two adjacent pins in the switching flexible circuit board needs to be kept enough, but the too dense signal lines cannot be in one-to-one corresponding binding connection with the switching flexible circuit board, and the binding process of the switching flexible circuit board faces a huge challenge.
Disclosure of Invention
The embodiment of the invention provides a display module, a manufacturing method of the display module and a liquid crystal display device, which are used for solving the binding process problem of a bridging flexible circuit board in the narrow frame design in the prior art.
In a first aspect, to solve the above technical problem, an embodiment of the present invention provides a display module, including: the display device comprises a display panel, a switching flexible circuit board, a driving module and a main flexible circuit board;
the display panel is divided into a display area and a non-display area, the non-display area is arranged around the display area, the display panel comprises an array substrate and a color film substrate which are oppositely arranged, the array substrate comprises a first edge area which exceeds one side of the color film substrate, the first edge area is a step area of the display panel, the step area is a non-display area of the display panel, the step area comprises a binding area, the switching flexible circuit board is bound to the binding area, the binding area is provided with m rows of first bonding pads, the switching flexible circuit board comprises m first flexible circuit boards, one first flexible circuit board is correspondingly bound and electrically connected with one row of first bonding pads, and the m first flexible circuit boards are sequentially stacked in a direction perpendicular to the plane of the array substrate;
the driving module comprises a driving chip and COG glass, wherein m rows of second bonding pads are arranged on the surface of the same side of the COG glass bound with the driving chip, one first flexible circuit board is correspondingly bound and electrically connected with one row of second bonding pads, one end of the COG glass is correspondingly bound and electrically connected with m first flexible circuit boards, the other end of the COG glass is bound and electrically connected with the main flexible circuit board, and the driving chip is communicated with the array substrate through a circuit in the COG glass and a circuit in the m first flexible circuit boards; wherein m is a positive integer of 2 or more.
Optionally, a plurality of first binding pins extending in the same direction and arranged side by side are arranged on the surface of each first flexible circuit board facing the first pad; and a plurality of second binding pins which extend along the same direction and are arranged side by side are arranged on the surface of each first flexible circuit board facing the second bonding pad.
Optionally, when the display panel, the adapting flexible circuit board and the COG glass are in a tiled state, the COG glass points to the direction of the array substrate, the length of the ith flexible circuit board is longer than that of the (i-1) th flexible circuit board, and the distance between the first binding pin and the second binding pin on the ith flexible circuit board is longer than that between the first binding pin and the second binding pin on the (i-1) th flexible circuit board; the ith flexible circuit board is positioned on one side of the (i-1) th flexible circuit board far away from the array substrate along the direction vertical to the plane of the array substrate, wherein i is more than or equal to 1 and is less than or equal to m, and m is a positive integer more than or equal to 2.
Optionally, each row of the first pads is provided with a plurality of first strip-shaped pins extending along the same direction and arranged side by side; and a plurality of first strip-shaped pins are arranged between adjacent rows and/or columns in a staggered manner.
Optionally, the length of the first strip-shaped pin is L1 along the column direction, wherein L1 is equal to or greater than 700um and equal to or less than 1100 um; along the row direction, the width of the first strip-shaped pin is W1, wherein W1 is more than or equal to 15 μm; two adjacent first bar pin interval be S1, wherein, 40um is no less than S1 is no less than 60 um.
Optionally, in the column direction, a distance between two adjacent rows of the first pads is d, where d is greater than or equal to 0.05mm and less than or equal to 0.1 mm.
Optionally, in the row direction, the via holes corresponding to two adjacent first bar-shaped pins are respectively connected to different ends of the corresponding first bar-shaped pins in the extending direction.
Optionally, the plurality of signal traces include a first signal trace and a second signal trace, and the first signal trace and the second signal trace are arranged in a different-layer insulating manner; and along the column direction, the first bonding pads in two adjacent rows are respectively and correspondingly electrically connected with the first signal routing and the second signal routing.
Optionally, the signal traces further include third signal traces, and the third signal traces are touch control signal traces; and the single row of first bonding pads is correspondingly and electrically connected with the plurality of third signal wires.
In a second aspect, an embodiment of the present invention provides a method for manufacturing a display panel, where the method includes:
providing a display panel, wherein the display panel is divided into a display area and a non-display area, the non-display area is arranged around the display area, the display panel comprises an array substrate and a color film substrate, the array substrate comprises a first edge area exceeding one side of the color film substrate, the first edge area is a step area of the display panel, the step area is the non-display area of the display panel, the step area comprises a binding area, and the binding area is provided with m rows of first bonding pads;
providing a switching flexible circuit board, wherein the switching flexible circuit board comprises m first flexible circuit boards, one first flexible circuit board is correspondingly bound and electrically connected with one row of first bonding pads, and the m first flexible circuit boards are sequentially stacked along a direction perpendicular to the plane of the array substrate; in the direction perpendicular to the plane of the array substrate, the ith flexible circuit board is positioned on one side of the (i-1) th flexible circuit board far away from the array substrate, wherein i is more than or equal to 1 and less than or equal to m, and m is a positive integer more than or equal to 2;
binding the ith-1 flexible circuit board with the corresponding ith-1 row of first bonding pads, and then binding the ith flexible circuit board with the corresponding ith row of first bonding pads;
providing a driving module, wherein the driving module comprises a driving chip and COG glass, and one end of the COG glass is correspondingly bound and electrically connected with the m first flexible circuit boards respectively;
and providing a main flexible circuit board, and correspondingly binding and electrically connecting the other end of the COG glass with the main flexible circuit board.
Optionally, m groups of alignment marks are manufactured on the array substrate, and one group of alignment marks corresponds to one row of the first bonding pads; along the column direction, the alignment mark comprises a first end and a second end which are oppositely arranged, wherein the first end is positioned at one side of the second end close to the display area, and when in alignment, the edge of the ith flexible circuit board is flush with the first end of the ith group of alignment marks; wherein i is more than or equal to 1 and less than or equal to m, and m is a positive integer more than or equal to 2.
In a third aspect, an embodiment of the present invention provides a display device, which includes the display panel according to the first aspect.
The invention has the following beneficial effects:
in the embodiment provided by the invention, on one hand, the through flexible circuit board comprises m first flexible circuit boards, the binding region of the array substrate comprises m rows of first bonding pads, and one first flexible circuit board and one row of first bonding pads are correspondingly bound and electrically connected; the gap between two adjacent electric connecting terminals in the first bonding pad is sufficient, the binding process of the flexible circuit board is not influenced, and reliable electric connection between the multiple rows of first bonding pads on the array substrate binding area and the multiple first flexible circuit boards is guaranteed. On the other hand, in the direction perpendicular to the plane of the array substrate, the m first flexible circuit boards are sequentially stacked, so that even if the first flexible circuit boards are additionally arranged, the heights of the first bonding pads with the number corresponding to the row number of the first flexible circuit boards and the distance between two adjacent rows of the first bonding pads are increased, finally the m first flexible circuit boards are folded back to the back of the display panel, and the number of the bonding pads in the display panel binding area is increased under the condition that the size of the lower frame area of the display panel is not increased, so that the reliability and the qualification rate of the binding process of the switching flexible circuit board are improved. Meanwhile, the dense signal wires of the display device with high PPI can be effectively and electrically connected with the switching flexible circuit board.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:
FIG. 1 is a schematic diagram of a planar structure of a display module according to the prior art;
fig. 2 is a schematic plan view of a display panel to be bonded and a flexible circuit board for connection in a display module according to an embodiment of the present invention;
FIG. 3 is a schematic cross-sectional view of the display panel and the adaptive flexible circuit board to be bonded in the display module shown in FIG. 2;
FIG. 4 is an exploded view of a display module assembly according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of a bonding plane structure of the display module shown in FIG. 4;
FIG. 6 is a cross-sectional view of a display module assembly of FIG. 5;
fig. 7 is a schematic plan view illustrating a display module according to an embodiment of the present invention;
fig. 8 is a diagram of a first connection structure of connection lines and pads in a display panel according to an embodiment of the present invention;
fig. 9 is a diagram of a first connection structure of connection lines and pads in a display panel according to another embodiment of the present invention;
FIG. 10 is a schematic view of an array substrate in a display module according to an embodiment of the invention;
fig. 11 is a diagram of a first connection structure of connection lines and pads in a display panel according to still another embodiment of the present invention;
fig. 12 is a flowchart of a method for manufacturing a display module according to an embodiment of the invention;
fig. 13 is a schematic structural diagram of a display panel of a display module according to an embodiment of the present invention.
Detailed Description
As used in the specification and in the claims, certain terms are used to refer to particular components. As one skilled in the art will appreciate, manufacturers may refer to a component by different names. This specification and claims do not intend to distinguish between components that differ in name but not function. In the following description and in the claims, the terms "include" and "comprise" are used in an open-ended fashion, and thus should be interpreted to mean "include, but not limited to. "substantially" means within an acceptable error range, within which a person skilled in the art can solve the technical problem to substantially achieve the technical result. The description which follows is a preferred embodiment of the present application, but is made for the purpose of illustrating the general principles of the application and not for the purpose of limiting the scope of the application. The protection scope of the present application shall be subject to the definitions of the appended claims.
Fig. 1 is a schematic structural diagram of a display module provided in the prior art, and as shown in fig. 1, the display module includes a display panel, the display panel includes a display area AA 'and a non-display area BB'; the non-display area BB 'is located at one side of the display area AA', and is provided with a first pad x 1; the switching flexible circuit board F 'comprises a first end and a second end, wherein the first end comprises a first binding pin y1, the first binding pin y1 of the first end is in binding connection with a first pad x1 of the non-display area BB', the first end refers to the end, bound with the display panel, of the switching flexible circuit board F ', the second end refers to the end, bound with the COG driving module C', of the switching flexible circuit board, and the second end comprises a second binding pin y 2.
The COG driving module C ' includes a transit glass G1 and an integrated circuit chip (IC) I ', the integrated circuit chip (IC) I ' is bound with the transit glass G1, a second pad x2 is arranged on the transit glass G1, a second binding pin y2 at a second end is bound with a second pad x2 on the transit glass G1, one end of a main flexible circuit board F2 is bound with the transit glass G1, and the other end of the main flexible circuit board F2 is connected to an external control signal generation module through an interface end.
Although the size of the lower frame of the display panel can be reduced by bonding the integrated circuit chip (IC) and the main flexible circuit board to the relay glass and then transmitting signals to the display panel through the relay flexible circuit board, since a plurality of data signal lines and a plurality of touch signal lines in the display panel need to be connected to the integrated circuit chip (IC) on the relay glass in a one-to-one manner through the relay flexible circuit board, taking a 6.25 inch display screen, a width of the display panel of 68.04mm, and a resolution of the display screen of 720RGB 1520 as examples, the number of required asg (absolute grant) silicon gate signal traces is 19 × 2 ═ 38 (bars), the number of data signal lines is 3 × 720 ═ 2160 (bars), and the number of touch signal lines is 18 × 32 ═ 576 (bars), since the signal lines are connected to the integrated circuit chip (IC) on the relay glass in a one-to-one connection manner, therefore, the number of the bonding pins required by the bonding area on the array substrate is 38+2160+576 ═ 3116 (pieces), and the number of the electrical connection terminals required by the interposer flexible circuit board is 38+2160+576 ═ 3116 (pieces), it can be understood that the electrical connection terminals are also the bonding pins of the flexible circuit board, the distance between two adjacent electrical connection terminals of the interposer flexible circuit board is 68.04(mm)/3116 ═ 24.52(um), the gap between the electrical connection terminals on the interposer flexible circuit board is too small, and the wire pitch is too small, which cannot be achieved by the existing flexible circuit board manufacturing process.
In order to solve the above problems, embodiments of the present invention provide a display module, a method for manufacturing the display module, and a display device.
The display module comprises a display panel, a switching flexible circuit board, a driving module and a main flexible circuit board.
The display panel is divided into a display area and a non-display area, the non-display area is arranged around the display area, the display panel comprises an array substrate and a color film substrate which are arranged oppositely, the array substrate comprises a first edge area which exceeds one side of the color film substrate, the first edge area is a step area of the display panel, the step area is the non-display area of the display panel, the step area comprises a binding area, the switching flexible circuit board is bound to the binding area, the binding area is provided with m rows of first bonding pads, the switching flexible circuit board comprises m first flexible circuit boards, one first flexible circuit board is correspondingly bound and electrically connected with one row of first bonding pads, and m is a positive integer which is more than or equal to 2.
The driving module comprises a driving Chip and COG (Chip On Glass) Glass, the technology that an integrated circuit Chip is bound On the Glass is more used in the current liquid crystal display module, m rows of second bonding pads are arranged On the surface of the same side of the COG Glass bound with the driving Chip, one first flexible circuit board is correspondingly bound with one row of second bonding pads and electrically connected, one end of the COG Glass is correspondingly bound with m first flexible circuit boards and electrically connected, the other end of the COG Glass is bound with a main flexible circuit board and electrically connected, and the driving Chip is conducted with the array substrate through the internal circuit of the COG Glass and the internal circuit of the m first flexible circuit boards.
The technical scheme of the embodiment of the invention can improve the quantity of the bonding pads of the binding area of the display panel under the condition of not increasing the size of the lower frame area of the display panel so as to improve the reliability and the qualification rate of the binding process of the switching flexible circuit board.
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in further detail below.
Fig. 2 is a schematic plan view of a display panel to be bonded and a flexible circuit board for connection in a display module according to an embodiment of the present invention; fig. 3 is a schematic cross-sectional view of the display panel and the transition flexible circuit board to be bonded in the display module shown in fig. 2.
Referring to fig. 2-3, the display module is for a liquid crystal display module, the display module comprising: display panel 100, transition flexible circuit board 200. The display panel 100 is divided into a display area AA and a non-display area BA, the non-display area BA is disposed around the display area AA, the display panel 100 includes an array substrate 110 and a color film substrate 120 which are disposed opposite to each other, the array substrate 110 includes a first edge area which exceeds one side of the color film substrate 120, the first edge area is a step area BAs of the display panel 100, the step area BAs is also an area where a lower frame of the non-display area of the display panel is located, a bonding area T is disposed on the step area BAs and used for bonding connection with a flexible circuit board, a plurality of rows of first pads X1 are disposed on the bonding area T, the number of the first pads X1 is set to m rows, and m is a positive integer greater than or equal to 2. Adopt a plurality of first flexible circuit boards fi as the switching flexible circuit board, the quantity of first flexible circuit board fi equals the row number of first pad X1 to with one first flexible circuit board fi and one row first pad X1 corresponds binds the electricity and connects.
FIG. 4 is an exploded view of a display module assembly according to an embodiment of the present invention; FIG. 5 is a schematic diagram of a bonding plane structure of the display module shown in FIG. 4; FIG. 6 is a cross-sectional view of a display module assembly of FIG. 5; fig. 7 is a schematic plan view illustrating a display module according to an embodiment of the invention.
With continued reference to fig. 4-7, the driving module 300 includes a COG glass 310 and a driving chip 320 bonded on the surface of the COG glass 310, wherein a plurality of rows of second pads X2 are disposed on the same side of the COG glass 310 to which the driving chip 320 is bonded, the number of the second pads X2 is also set to m rows, and m is a positive integer greater than or equal to 2; at this time, the number of the first flexible circuit boards fi is also equal to the number of the rows of the second pads, so that one first flexible circuit board fi and one row of the second pads X2 are correspondingly bound and electrically connected.
One end of the first flexible circuit board fi is bound with the first pad X1 and is connected, the other end of the first flexible circuit board fi is bound with the second pad X2 and is connected, and the driving chip 320 is conducted with the array substrate 110 through the internal circuit of the COG glass 310 and the internal circuit of the m first flexible circuit boards fi. Specifically, one end of m first flexible circuit boards fi is in one-to-one corresponding binding connection with m rows of first pads located on the binding region, the other end of the m first flexible circuit boards fi is in one-to-one corresponding binding connection with m rows of second pads located on the COG glass 310, the other end of the COG glass 310 is bound with one end of the main flexible circuit board 400 and electrically connected, and the other end of the main flexible circuit board 400 is connected to an external control signal generation module (not shown) through an interface end.
Specifically, a plurality of first binding pins Y1 extending in the same direction and arranged side by side are arranged on the surface of each first flexible circuit board fi facing the first pad X1, and are used for one-to-one corresponding binding connection with the first pad X1; every first flexible circuit board fi faces the surface of second pad X2 is provided with a plurality of second that extend along same direction and set up side by side and binds pin Y2 for with the second pad X2 carries out the one-to-one and binds the connection.
Further, the m first flexible circuit boards fi are sequentially stacked, wherein, in a direction perpendicular to the plane of the array substrate 110, the ith first flexible circuit board is located on one side of the i-1 th first flexible circuit board away from the array substrate 110, where i is greater than or equal to 1 and is greater than or equal to m, and m is a positive integer greater than or equal to 2; when the display panel 100, the adapting flexible circuit board 200, and the COG glass 310 are in a flat state, the COG glass 310 points to the direction of the array substrate 110, the length of the ith flexible circuit board is greater than the length of the (i-1) th flexible circuit board, and the distance DSi between the first binding pin Y1 and the second binding pin Y2 on the ith flexible circuit board is greater than the distance DSi-1 between the first binding pin and the second binding pin on the (i-1) th flexible circuit board.
In the embodiment of the invention, a plurality of first flexible circuit boards are jointly used as the switching flexible circuit boards, a row of electric connection terminals are designed on one first flexible circuit board and are used for being correspondingly and electrically connected with a row of first bonding pads on the array substrate, and when the first flexible circuit boards are bound, each first flexible circuit board is arranged above the binding area of the array substrate, and pressure is applied to each first flexible circuit board one by one for pressing, namely, only the area where the row of electric connection terminals on the first flexible circuit board is located needs to be pressed at one time, so that the binding process is simpler and easier to operate, and the qualification rate of the binding process is higher. If a plurality of rows of electrical connection terminals are designed on one flexible circuit board and then are directly and correspondingly bound and electrically connected with a plurality of rows of first bonding pads X1 on the array substrate 110, pressure needs to be simultaneously applied to the plurality of rows of electrical connection terminals on the switching flexible circuit board for stitching during binding, the stitching process is difficult, the uniformity of the pressure of each row of electrical connection terminals is poor, the qualification rate of the binding process of the switching flexible circuit board is low, and poor display is easy to occur. Fig. 8 is a diagram of a first connection structure of connection lines and pads in a display panel according to an embodiment of the present invention; fig. 9 is a diagram of a first connection structure of connection lines and pads in a display panel according to another embodiment of the present invention.
Referring to fig. 8 to 9, in the embodiment of the invention, the first pad X1 located in the non-display area BA of the array substrate 120 includes a plurality of rows of first bar-shaped pins Bpi arranged in the same direction and side by side; the first bonding pads X1 are used for being electrically connected with the switching flexible circuit board fi, and each first strip-shaped pin Bpi is respectively and correspondingly electrically connected with an electric connection terminal of the switching flexible circuit board fi one by one, and the length L1 of each first strip-shaped pin Bpi is designed within the range that L1 is larger than or equal to 700um and smaller than or equal to 1100um in the column direction.
Optionally, with continued reference to fig. 8, between adjacent rows and/or columns, a plurality of the first stripe-shaped leads Bpi are arranged in a staggered manner. The compact distribution mode of the first strip-shaped pins Bpi can make the space of the binding area T where the first pad X1 is located smaller, thereby being beneficial to realizing the narrow frame design of the display module.
Optionally, with continued reference to FIG. 8, the first bar-shaped lead Bpi has a width W1 along the row direction, wherein W1 is greater than or equal to 15 μm; the distance between two adjacent first strip pins Bpi is S1, and S1 is not less than 40um and not more than 60 um.
In the embodiment shown in fig. 8, in particular, the distance between two adjacent first strip pins Bpi is S1, although the smaller the distance between two adjacent first bar-shaped pins Bpi is, the better, the process is limited by the existing flexible circuit board, the gap between the electrical connection terminals on the switching flexible circuit board cannot be made very small, and the flexible circuit board is flexible and easy to bend, and certain alignment deviation exists during binding, therefore, the distance S1 between two adjacent first strip pins Bpi is at least designed to be 40um or more and S1 or more and 60um or less, the problem of poor contact or no binding between the first pins on the binding region and each electric connection terminal on the transfer flexible circuit board is avoided to the greatest extent, therefore, the bonding reliability between the plurality of first pins Bpi on the bonding region and the switching flexible circuit board fi in the embodiment of the invention is favorably ensured.
Specifically, as shown in the embodiment shown in fig. 8, along the column direction, the distance between two adjacent rows of first pads X1 is d, wherein d is greater than or equal to 0.05mm and less than or equal to 0.1mm, and when the distance between two adjacent rows of first pads X1 is 0.05mm, two adjacent first flexible circuit boards that are stacked can be bound on two adjacent rows of first pads X1, respectively, and the deformation amount of the ith first flexible circuit board that tilts up due to the influence of the thickness of the ith-1 st first flexible circuit board can be accommodated. Therefore, the distance d is set to 0.05mm or more. On the other hand, the distance d is not necessarily too large to affect the size of the lower frame of the display panel, and the distance d is set to 0.1 mm.
Thus, in the column direction, the total length of the bonding region T occupied by the m rows of the first pads X1 is m × L1+ (m-1) × d. Under the condition that the length L1 of the first strip-shaped pin Bpi is fixed, the smaller the distance d between two adjacent rows of first pads X1 is, the smaller the occupied space of the binding region T is, in the embodiment of the invention, the switching flexible circuit board comprises m first flexible circuit boards fi, the number of rows of the first pads X1 arranged in the binding region T is m, one first flexible circuit board fi is correspondingly bound and electrically connected with one row of the first pads X1, and the m first flexible circuit boards fi are sequentially stacked in the direction perpendicular to the plane of the array substrate 110; the ith flexible circuit board is positioned on the side, away from the array substrate, of the ith-1 th flexible circuit board, wherein i is more than or equal to 1 and less than or equal to m, and m is a positive integer more than or equal to 2. By adopting the arrangement mode, because the first flexible circuit boards fi are independent from each other, the distance d between two adjacent rows of the first bonding pads X1 can be designed to be more than or equal to 0.05mm and less than or equal to 0.1 mm. Compared with a design mode of designing a plurality of rows of electric connecting terminals on one flexible circuit board, a mode of electrically connecting via holes and conductive wiring layers needs to be designed between two adjacent rows of electric connecting terminals, so that the reduction of the distance d is facilitated, and the narrow frame design of the display panel 100 is realized.
The array substrate 110 further includes a plurality of signal traces SL respectively disposed in the non-display area BA, and the plurality of signal traces SL are electrically connected to the first bar-shaped pins Bpi of the first bonding pad X1 through vias Chi in a one-to-one correspondence manner.
Further, as shown in fig. 9, along the row direction, the via holes Chi corresponding to two adjacent first strip pins Bpi are respectively connected to different ends of the corresponding first strip pins Bpi in the extending direction. The adjacent via holes Chi are connected to the corresponding first strip pins Bpi in a staggered manner, so that the distance S1 between the first strip pins Bpi is reduced, and the signal conduction between two adjacent first strip pins Bpi is prevented.
Fig. 10 is a schematic view of an array substrate structure in a display module according to an embodiment of the invention.
As shown in fig. 10, the array substrate 110 further includes a plurality of scan lines G extending in the row direction and a plurality of data lines D1 extending in the column direction, the scan lines G and the data lines D1 intersect to define a plurality of sub-pixels sp1 arranged in an array; optionally, one sub-pixel row is driven by two of the scanning lines G; in the same sub-pixel row, two adjacent sub-pixels are electrically connected to the same data line D1 and are connected to different scanning lines G; along the row direction, two adjacent sub-pixel columns share one data line D1; the plurality of data lines D1 are electrically connected to the plurality of signal lines, that is, the number of data lines can be halved by adopting the dual gate driving (dual gate) design, that is, half of the data signal routing can be saved, so that the number of the first pins Bpi in the bonding region T can be halved. Optionally, the array substrate 110 further includes a plurality of touch lines D2 extending in the column direction, and the touch line D2 and the data line D1 may be made of data lines at the same layer.
Optionally, the signal traces SL include a first signal trace (not shown) and a second signal trace (not shown), and the first signal trace and the second signal trace are arranged in a different-layer insulating manner; the two adjacent rows of the first bonding pads X1 are electrically connected by adopting signal routing wires of different layers, so that the signal conduction problem generated when the two adjacent rows of the first bonding pads X1 are too close to each other in binding can be avoided.
Fig. 11 is a diagram of a first connection structure of connection lines and pads in a display panel according to still another embodiment of the present invention.
As shown in fig. 11, the signal traces further include a third signal trace (not shown), the plurality of touch lines D2 are electrically connected to the plurality of third signal traces correspondingly, and the third signal trace is used for providing a touch signal for the touch line; and a single row of the first pads X1 is electrically connected to a plurality of third signal traces correspondingly. Because the touch line D2 can be made on a different layer from other signal lines, if the arrangement is made, the row of first pads X1 connected to the touch line D2 and the adjacent first pads X1 are connected to the signal lines of a different layer, so that the distance between the two adjacent rows of first pads X1 only needs to consider exposure errors at this time, and it is not necessary to consider conduction between the signal lines of the two adjacent rows of first pads X1, and more first pads X1 can be placed in the bonding region T of the array substrate 110.
Based on the same inventive concept, an embodiment of the invention provides a method for manufacturing a display module, and fig. 12 is a method for manufacturing a display module according to an embodiment of the invention. Referring to fig. 12, the method includes:
step 501: providing a first display panel, wherein the display panel is divided into a display area and a non-display area, the non-display area is arranged around the display area, the display panel comprises an array substrate and a color film substrate, the array substrate comprises a first edge area exceeding one side of the color film substrate, the first edge area is a step area of the display panel, the step area is the non-display area of the display panel, the step area comprises a binding area, and the binding area is provided with m rows of first bonding pads;
step 502: providing a switching flexible circuit board, wherein the switching flexible circuit board comprises m first flexible circuit boards, one first flexible circuit board is correspondingly bound and electrically connected with one row of first bonding pads, and the m first flexible circuit boards are sequentially stacked along a direction perpendicular to the plane of the array substrate; in the direction perpendicular to the plane of the array substrate, the ith flexible circuit board is positioned on one side of the (i-1) th flexible circuit board far away from the array substrate, wherein i is more than or equal to 1 and less than or equal to m, and m is a positive integer more than or equal to 2;
as shown in fig. 3 to 7, the m first flexible circuit boards fi are sequentially stacked, wherein, along a direction perpendicular to a plane of the array substrate 110, an ith first flexible circuit board is located on an i-1 th side of the first flexible circuit board away from the array substrate 110, where i is greater than or equal to 1 and is less than or equal to m, and m is a positive integer greater than or equal to 2; when the display panel 100, the adapting flexible circuit board 200, and the COG glass 310 are in a flat state, the COG glass 310 points to the direction of the array substrate 110, the length of the ith flexible circuit board is greater than the length of the (i-1) th flexible circuit board, and the distance DSi between the first binding pin Y1 and the second binding pin Y2 on the ith flexible circuit board is greater than the distance DSi-1 between the first binding pin and the second binding pin on the (i-1) th flexible circuit board. The projections of the m first flexible circuit boards on the array substrate are overlapped.
Step 503: binding the ith-1 flexible circuit board with the corresponding ith-1 row of first bonding pads, and then binding the ith flexible circuit board with the corresponding ith row of first bonding pads;
step 504: providing a driving module, wherein the driving module comprises a driving chip and COG glass, and one end of the COG glass is correspondingly bound and electrically connected with the m first flexible circuit boards respectively;
step 505: and providing a main flexible circuit board, and correspondingly binding and electrically connecting the other end of the COG glass with the main flexible circuit board.
Specifically, fig. 13 is a schematic structural diagram of a display panel of a display module according to an embodiment of the present invention. As shown in fig. 13, m sets of alignment marks Mark may be formed on the array substrate 110, where one set of alignment marks corresponds to one row of the first pads X1; alternatively, a group of marks may include two alignment marks Mark disposed along the same row, and the first pad X1 is located between two adjacent alignment marks Mark, and the alignment marks Mark may have a cross shape, a trapezoid shape, a square shape, or other shapes, which is not limited herein.
Optionally, the alignment Mark includes a first end and a second end that are arranged oppositely, where the first end is located at one side of the second end close to the display area AA, and when aligning, the edge of the ith flexible circuit board is aligned with the first end of the ith group of alignment marks and then is bonded, so as to save the space of the bonding area and ensure the connection reliability of the switching flexible circuit board; wherein i is more than or equal to 1 and less than or equal to m, and m is a positive integer more than or equal to 2.
Optionally, the alignment mark includes a serial number mark for corresponding binding connection with the ith corresponding first flexible circuit board, in the binding process, the serial number may be marked on the switching flexible circuit board correspondingly, the flexible circuit board close to the side of the array substrate 110 is bound first, and then the flexible circuit boards are gradually bound and connected in sequence to the side far away from the array substrate 110. Wherein i is more than or equal to 1 and less than or equal to m, and m is a positive integer more than or equal to 2.
Based on the same inventive concept, an embodiment of the present invention provides a display device, which includes the display module described above. The display device can be a liquid crystal display, a liquid crystal display screen, a liquid crystal television and other display devices, and can also be mobile equipment such as a mobile phone, a tablet personal computer, a notebook computer and the like.
As can be seen from the above embodiments, the embodiments of the present invention have the following beneficial effects:
on one hand, the switching flexible circuit board comprises m first flexible circuit boards, the binding area of the array substrate comprises m rows of first bonding pads, and one first flexible circuit board and one row of first bonding pads are correspondingly bound and electrically connected; the gap between two adjacent electric connecting terminals in the first bonding pad is sufficient, the binding process of the flexible circuit board is not influenced, and reliable electric connection between the multiple rows of first bonding pads on the array substrate binding area and the multiple first flexible circuit boards is guaranteed. On the other hand, in the direction perpendicular to the plane of the array substrate, the m first flexible circuit boards are sequentially stacked, so that even if the first flexible circuit boards are additionally arranged, the heights of the first bonding pads with the number corresponding to the row number of the first flexible circuit boards and the distance between two adjacent rows of the first bonding pads are increased, finally the m first flexible circuit boards are folded back to the back of the display panel, and the number of the bonding pads in the display panel binding area is increased under the condition that the size of the lower frame area of the display panel is not increased, so that the reliability and the qualification rate of the binding process of the switching flexible circuit board are improved. Meanwhile, the dense signal wires of the display device with high PPI can be effectively and electrically connected with the switching flexible circuit board.
The foregoing description shows and describes several preferred embodiments of the present application, but as aforementioned, it is to be understood that the application is not limited to the forms disclosed herein, but is not to be construed as excluding other embodiments and is capable of use in various other combinations, modifications, and environments and is capable of changes within the scope of the inventive concept as expressed herein, commensurate with the above teachings, or the skill or knowledge of the relevant art. And that modifications and variations may be effected by those skilled in the art without departing from the spirit and scope of the application, which is to be protected by the claims appended hereto.
Claims (15)
1. A display module, comprising: the display device comprises a display panel, a switching flexible circuit board, a driving module and a main flexible circuit board;
the display panel is divided into a display area and a non-display area, the non-display area is arranged around the display area, the display panel comprises an array substrate and a color film substrate which are oppositely arranged, the array substrate comprises a first edge area which exceeds one side of the color film substrate, the first edge area is a step area of the display panel, the step area is a non-display area of the display panel, the step area comprises a binding area, the switching flexible circuit board is bound to the binding area, the binding area is provided with m rows of first bonding pads, the switching flexible circuit board comprises m first flexible circuit boards, one first flexible circuit board is correspondingly bound and electrically connected with one row of first bonding pads, and the m first flexible circuit boards are sequentially stacked in a direction perpendicular to the plane of the array substrate;
the driving module comprises a driving chip and COG glass, wherein m rows of second bonding pads are arranged on the surface of the same side of the COG glass bound with the driving chip, one first flexible circuit board is correspondingly bound and electrically connected with one row of second bonding pads, one end of the COG glass is correspondingly bound and electrically connected with m first flexible circuit boards, the other end of the COG glass is bound and electrically connected with the main flexible circuit board, and the driving chip is communicated with the array substrate through a circuit in the COG glass and a circuit in the m first flexible circuit boards; wherein m is a positive integer of 2 or more.
2. The display module of claim 1,
a plurality of first binding pins which extend along the same direction and are arranged side by side are arranged on the surface, facing the first bonding pad, of each first flexible circuit board;
and a plurality of second binding pins which extend along the same direction and are arranged side by side are arranged on the surface of each first flexible circuit board facing the second bonding pad.
3. The display module of claim 2,
when the display panel, the adapting flexible circuit board and the COG glass are in a tiled state, the COG glass points to the direction of the array substrate, the length of the ith flexible circuit board is greater than that of the (i-1) th flexible circuit board, and the distance between the first binding pin and the second binding pin on the ith flexible circuit board is greater than that between the first binding pin and the second binding pin on the (i-1) th flexible circuit board; the ith flexible circuit board is positioned on one side of the (i-1) th flexible circuit board far away from the array substrate along the direction vertical to the plane of the array substrate, wherein i is more than or equal to 1 and is less than or equal to m, and m is a positive integer more than or equal to 2.
4. The display module of claim 1,
each row of first bonding pads is provided with a plurality of first strip-shaped pins which extend along the same direction and are arranged side by side;
and a plurality of first strip-shaped pins are arranged between adjacent rows and/or columns in a staggered manner.
5. The display module of claim 4,
along the column direction, the length of the first strip-shaped pin is L1, wherein L1 is more than or equal to 700um and less than or equal to 1100 um;
along the row direction, the width of the first strip-shaped pin is W1, wherein W1 is more than or equal to 15 μm; two adjacent first bar pin interval be S1, wherein, 40um is no less than S1 is no less than 60 um.
6. The display module of claim 5,
and along the column direction, the distance between every two adjacent rows of first bonding pads is d, wherein d is more than or equal to 0.05mm and less than or equal to 0.1 mm.
7. The display module of claim 6,
and the signal wires are respectively arranged in the step area and are electrically connected with the first strip pins in the first bonding pad in a one-to-one correspondence manner through via holes.
8. The display module of claim 7,
along the row direction, the through holes corresponding to two adjacent first strip-shaped pins are respectively connected with different ends in the extension direction of the corresponding first strip-shaped pins.
9. The display module according to claim 7 or 8, wherein the plurality of signal traces include a first signal trace and a second signal trace, and the first signal trace and the second signal trace are arranged in a different-layer insulating manner;
and along the column direction, the first bonding pads in two adjacent rows are respectively and correspondingly electrically connected with the first signal routing and the second signal routing.
10. The display module according to claim 9, wherein the signal traces further include a third signal trace, the third signal trace being a touch signal trace;
and the single row of first bonding pads is correspondingly and electrically connected with the plurality of third signal wires.
11. The display module as claimed in claim 10, wherein the display panel comprises m sets of alignment marks, and one set of alignment marks corresponds to one row of the first pads;
along the column direction, the alignment mark comprises a first end and a second end which are oppositely arranged, wherein the first end is positioned at one side of the second end close to the display area.
12. A manufacturing method of a display module is characterized by comprising the following steps:
providing a display panel, wherein the display panel is divided into a display area and a non-display area, the non-display area is arranged around the display area, the display panel comprises an array substrate and a color film substrate, the array substrate comprises a first edge area exceeding one side of the color film substrate, the first edge area is a step area of the display panel, the step area is the non-display area of the display panel, the step area comprises a binding area, and the binding area is provided with m rows of first bonding pads;
providing a switching flexible circuit board, wherein the switching flexible circuit board comprises m first flexible circuit boards, one first flexible circuit board is correspondingly bound and electrically connected with one row of first bonding pads, and the m first flexible circuit boards are sequentially stacked along a direction perpendicular to the plane of the array substrate; in the direction perpendicular to the plane of the array substrate, the ith flexible circuit board is positioned on one side of the (i-1) th flexible circuit board far away from the array substrate, wherein i is more than or equal to 1 and less than or equal to m, and m is a positive integer more than or equal to 2;
binding the ith-1 flexible circuit board with the corresponding ith-1 row of first bonding pads, and then binding the ith flexible circuit board with the corresponding ith row of first bonding pads;
providing a driving module, wherein the driving module comprises a driving chip and COG glass, and one end of the COG glass is correspondingly bound and electrically connected with the m first flexible circuit boards respectively;
and providing a main flexible circuit board, and correspondingly binding and electrically connecting the other end of the COG glass with the main flexible circuit board.
13. The manufacturing method according to claim 12, characterized by comprising:
manufacturing m groups of alignment marks on the array substrate, wherein one group of alignment marks corresponds to one row of first bonding pads;
along the column direction, the alignment mark comprises a first end and a second end which are oppositely arranged, wherein the first end is positioned at one side of the second end close to the display area, and when in alignment, the edge of the ith flexible circuit board is flush with the first end of the ith group of alignment marks; wherein i is more than or equal to 1 and less than or equal to m, and m is a positive integer more than or equal to 2.
14. The manufacturing method according to claim 13, comprising:
the alignment marks comprise numbering marks and are used for being correspondingly bound and connected with the ith first flexible circuit board, wherein i is more than or equal to 1 and is less than or equal to m, and m is a positive integer more than or equal to 2.
15. A display device comprising a display module according to any one of claims 1 to 11.
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| CN109001945A (en) * | 2018-09-27 | 2018-12-14 | 武汉华星光电技术有限公司 | Display panel and display module |
| CN109068478A (en) * | 2018-11-01 | 2018-12-21 | 武汉天马微电子有限公司 | Flexible circuit board and display device |
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| CN110286535A (en) | 2019-09-27 |
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