CN109068478A - Flexible circuit board and display device - Google Patents
Flexible circuit board and display device Download PDFInfo
- Publication number
- CN109068478A CN109068478A CN201811294642.1A CN201811294642A CN109068478A CN 109068478 A CN109068478 A CN 109068478A CN 201811294642 A CN201811294642 A CN 201811294642A CN 109068478 A CN109068478 A CN 109068478A
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- CN
- China
- Prior art keywords
- flexible circuit
- circuit board
- alignment mark
- functional pin
- line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims abstract description 53
- 239000000463 material Substances 0.000 claims abstract description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 24
- 229910052802 copper Inorganic materials 0.000 claims description 24
- 239000010949 copper Substances 0.000 claims description 24
- 239000004642 Polyimide Substances 0.000 claims description 22
- 229920001721 polyimide Polymers 0.000 claims description 22
- 230000005540 biological transmission Effects 0.000 claims description 2
- 230000001502 supplementing effect Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 13
- 239000003984 copper intrauterine device Substances 0.000 description 8
- 230000008859 change Effects 0.000 description 6
- 238000002407 reforming Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 239000004952 Polyamide Substances 0.000 description 3
- 150000002466 imines Chemical class 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229920002647 polyamide Polymers 0.000 description 3
- 230000008569 process Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The embodiment of the invention provides a flexible circuit board and a display device, relates to the technical field of display, and is low in cost because a light supplementing direction does not need to be changed and equipment does not need to be modified or new equipment does not need to be purchased even if a binding mode is changed when two flexible circuit boards are bound. The flexible circuit board includes: a substrate made of a light transmitting material; the functional pins and the first alignment marks are positioned on the first side of the substrate; the flexible circuit board comprises a first contraposition mark area, the first contraposition mark is positioned in the first contraposition mark area, and the functional pins are positioned outside the first contraposition mark area; and the film layers of the flexible circuit board in the first contraposition mark area except the first contraposition mark are all made of light-transmitting materials.
Description
Technical field
The present invention relates to field of display technology more particularly to a kind of flexible circuit board and display devices.
Background technique
In the electronic device, it usually will use flexible circuit board (Flexible Printed Circuit, FPC), such as
In display device, including display panel, mainboard and two FPC, two FPC bind (Bonding) together, one of FPC
It is connected to display panel, another FPC is connected to mainboard, to realize the electrical connection of mainboard and display panel.
When binding connection between two FPC, in order to guarantee that the pin on two FPC is effectively electrically connected, need to carry out pair
Corresponding transmission region is arranged in general, being that alignment mark is arranged on a FPC wherein in position on another FPC, however, this
Kind alignment mode, required light filling direction is fixed, if the binding mode in production process changes, needs to be transformed
Required light filling direction, leads to higher cost when equipment or buying new equipment are to cooperate binding.
Summary of the invention
The embodiment of the present invention provides a kind of flexible circuit board and display device, when two flexible circuit boards are bound, even if
Binding mode changes, and also haves no need to change light filling direction, and without reforming equipment or buying new equipment, cost is relatively low.
On the one hand, the embodiment of the present invention provides a kind of flexible circuit board, comprising:
Substrate, the substrate include translucent material；
Functional pin and the first alignment mark positioned at first side of substrate；
The flexible circuit board includes the first alignment mark region, and first alignment mark is located at first register guide
Remember in region, the functional pin is located at except first alignment mark region；
Film layer of the flexible circuit board in first alignment mark region in addition to the first alignment mark be
Luminescent material.
Optionally, the flexible circuit board is translucent material in the film layer of described substrate second side.
Optionally, above-mentioned flexible circuit board further include:
The first glue-line far from the substrate side in the film layer of the functional pin place；
Far from the first polyimide layer of the substrate side, first polyimide layer on first glue-line
Film layer where being pasted on the functional pin by first glue-line；
Positioned at second glue-line of described substrate second side；
Far from the second polyimide layer of the substrate side, second polyimide layer on second glue-line
The substrate is pasted on by second glue-line.
Optionally, above-mentioned flexible circuit board further include:
Positioned at the paving layers of copper of described substrate second side, the paving layers of copper is hollow out in first alignment mark region；
Where perpendicular to the flexible circuit board on the direction of plane, the paving layers of copper covers the functional pin.
Optionally, above-mentioned flexible circuit board further include:
The first glue-line far from the substrate side in the film layer of the functional pin place；
Far from the first polyimide layer of the substrate side, first polyimide layer on first glue-line
Film layer where being pasted on the functional pin by first glue-line；
The second glue-line far from the substrate side in the paving layers of copper；
Far from the second polyimide layer of the substrate side, second polyimide layer on second glue-line
The paving layers of copper is pasted on by second glue-line.
Optionally, first alignment mark and the functional pin same layer are arranged, first alignment mark with it is described
The shapes and sizes of functional pin are all the same.
Optionally, the quantity of the functional pin is multiple, and the quantity of first alignment mark is two, the multiple
Functional pin and two first alignment marks are arranged as a line, and two first alignment marks are located at the multiple
The opposite sides of functional pin.
Optionally, above-mentioned flexible circuit board further include:
The second alignment mark positioned at first side of substrate, the direction of plane where perpendicular to the flexible circuit board
On, the paving layers of copper covers second alignment mark.
Optionally, second alignment mark is one or more test pins.
Optionally, the quantity of the functional pin is multiple, and the quantity of first alignment mark is two, described second
The quantity of alignment mark is two, the multiple functional pin, two first alignment marks and two second contrapositions
Tag arrangement is a line；
Two first alignment marks are located at the opposite sides of the multiple functional pin, and two described second pair
Position label is located at the opposite sides of the multiple functional pin, and two second alignment marks are located at two described first
Between alignment mark.
On the other hand, the embodiment of the present invention also provides a kind of display device, comprising:
First flexible circuit board and the second flexible circuit board, first flexible circuit board are above-mentioned flexible circuit board,
First flexible circuit board and second flexible circuit board binding connection；
Display panel, one of first flexible circuit board and second flexible circuit board and the display panel
Connection.
Flexible circuit board and display device in the embodiment of the present invention, wherein flexible circuit board is where the first alignment mark
The first alignment mark region in, the film layer in addition to the first alignment mark is translucent material so that work as the flexible circuit board
When binding with other flexible circuit boards, no matter light is injected from the which side of the flexible circuit board, the first contraposition may be passed through
Marked region realizes light filling function when being aligned by the first alignment mark, so even binding mode changes,
Light filling direction is had no need to change, without reforming equipment or buying new equipment, cost is relatively low.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is this hair
Bright some embodiments for those of ordinary skill in the art without any creative labor, can be with
It obtains other drawings based on these drawings.
Fig. 1 is a kind of structural schematic diagram of flexible circuit board in the embodiment of the present invention；
Fig. 2 be Fig. 1 in AA ' to one week the schematic diagram of the section structure；
Fig. 3 be Fig. 1 in AA ' to another the schematic diagram of the section structure；
Fig. 4 is the structural schematic diagram of another flexible circuit board in the embodiment of the present invention；
Fig. 5 is the structural schematic diagram of another flexible circuit board in the embodiment of the present invention；
Fig. 6 be Fig. 5 in BB ' to a kind of the schematic diagram of the section structure；
Fig. 7 is a kind of structural schematic diagram of display device in the embodiment of the present invention.
Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is
A part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art
Every other embodiment obtained without creative efforts, shall fall within the protection scope of the present invention.
The term used in embodiments of the present invention is only to be not intended to be limiting merely for for the purpose of describing particular embodiments
The present invention.In the embodiment of the present invention and the "an" of singular used in the attached claims, " described " and "the"
It is also intended to including most forms, unless the context clearly indicates other meaning.
As depicted in figs. 1 and 2, Fig. 1 is a kind of structural schematic diagram of flexible circuit board in the embodiment of the present invention, Fig. 2 Fig. 1
Middle AA ' to one week the schematic diagram of the section structure, the embodiment of the present invention provides a kind of flexible circuit board, comprising: substrate 1, substrate 1 wrap
Include translucent material；Functional pin 2 and the first alignment mark 31 positioned at 1 first side of substrate (upside of substrate 1 in Fig. 2)；It is flexible
Circuit board includes the first alignment mark region 41, and the first alignment mark 31 is located in the first alignment mark region 41, functional pin 2
Except the first alignment mark region 41；Flexible circuit board in the first alignment mark region 41 except the first alignment mark 31 it
Outer film layer is translucent material.
Specifically, functional pin 2 is electrically connected for realizing with external, can be realized by metallic copper, functional pin 2
Exposed in the upside of substrate 1, in order to be electrically connected with other external pins, and this is electrically connected as to realize certain normal function
Electrical connection, the first alignment mark 31 formed by light-proof material, has an individual shape, the cross of example as shown in figure 1, in order to
It is used as alignment mark.First alignment mark region 41 is the region where the first alignment mark 31, the first alignment mark area
The area in domain 41 is greater than the area of the first alignment mark 31, in the first alignment mark region 41, only the first alignment mark 31
For non-transparent material, other film layers are translucent material, so that light be allow to pass through in the first alignment mark region 41
Region except one alignment mark 31 passes through, to realize the light filling when the flexible circuit board and other flexible circuit boards are bound.
It should be noted that being not construed as limiting in the embodiment of the present invention for the concrete shape of the first alignment mark, for example, can be cross
Shape, T-shaped, round etc..
Flexible circuit board in the embodiment of the present invention removes in the first alignment mark region where the first alignment mark
Film layer except first alignment mark is translucent material, so that when the flexible circuit board and other flexible circuit boards are bound,
No matter light is injected from the which side of the flexible circuit board, the first alignment mark region may be passed through, realize and pass through first pair
Light filling function when position label is aligned also haves no need to change light filling direction, is not necessarily to so even binding mode changes
Reforming equipment or buying new equipment, cost is relatively low.
Optionally, as depicted in figs. 1 and 2, flexible circuit board is equal in the film layer of 1 second side of substrate (downside of Fig. 2 substrate 1)
For translucent material.That is, not having paving layers of copper on entire flexible circuit board, below functional pin 2, in binding contraposition equipment to this
When flexible circuit board carries out light filling, light filling whether is carried out from top or carries out light filling from below, can normally be viewed
First alignment mark 31.
Optionally, as depicted in figs. 1 and 2, above-mentioned flexible circuit board further include: be located at remote in 2 place film layer of functional pin
The first glue-line 51 from 1 side of substrate；First polyimide layer 61 of separate 1 side of substrate on the first glue-line 51, first
Polyimide layer 61 is pasted on 2 place film layer of functional pin and substrate 1 by the first glue-line 51, the first polyimide layer 61
It realizes and is electrically connected with external in order to expose functional pin 2 with hollowed out area on the first glue-line 51；Positioned at substrate 1
Second glue-line 52 of second side (downside of substrate 1 in Fig. 2)；Far from the second polyamides of 1 side of substrate on the second glue-line 52
Imine layer 62, the second polyimide layer 62 are pasted on substrate 1 by the second glue-line 52.
Optionally, as shown in figures 1 and 3, Fig. 3 be Fig. 1 in AA ' to another the schematic diagram of the section structure, flexible circuit
Plate further include: be located at the paving layers of copper 7 of 1 second side of substrate (downside of substrate 1 in Fig. 3), spread layers of copper 7 in the first alignment mark region
It is hollow out in 41；Where perpendicular to flexible circuit board on the direction of plane, 7 covering function pin 2 of layers of copper is spread.The present invention is implemented
Paving layers of copper 7 in example is to be equipped with the film layer of metallic copper, can be used for playing electric action, and for playing enhancing flexible electrical
The effect of the structural strength of road plate, certainly, paving layers of copper 7 can not also play conduction and be used as, and only enhance flexibility with metallic copper
The effect of the structural strength of circuit board.
Specifically, 7 covering function pin 2 of layers of copper is spread, in order to enhance the structural strength of 2 region of functional pin, from
And in binding, there is functional pin 2 and more well press effect, that is, improve the electrical connection properties of functional pin 2, spread layers of copper
7 in the first alignment mark region 41 be hollow out, binding contraposition equipment to the flexible circuit board carry out light filling when, whether from
Top carries out light filling and still carries out light filling from below, can normally view the first contraposition by the first alignment mark region 41
Label 31.
Optionally, as shown in figures 1 and 3, flexible circuit board further include: be located in 2 place film layer of functional pin far from base
First glue-line 51 of 1 side of plate；Far from the first polyimide layer 61 of 1 side of substrate, the first polyamides on the first glue-line 51
Imine layer 61 is pasted on 2 place film layer of functional pin and substrate 1 by the first glue-line 51；Far from base in paving layers of copper 7
Second glue-line 52 of 1 side of plate；Far from the second polyimide layer 62 of 1 side of substrate, the second polyamides on the second glue-line 52
Imine layer 62 is pasted on paving layers of copper 7 by the second glue-line 52.
Optionally, as shown in figure 4, Fig. 4 is the structural schematic diagram of another flexible circuit board in the embodiment of the present invention, first
Alignment mark 31 and 2 same layer of functional pin are arranged, and the shapes and sizes of the first alignment mark 31 and functional pin 2 are all the same, i.e.,
First alignment mark 31 is used as dummy pin, although not having pin function, and function due to its shape, size and location
Energy pin 2 is identical, therefore can be formed with functional pin 2 by same patterning processes, saves process costs.
Optionally, as shown in figure 4, the quantity of functional pin 2 be it is multiple, the quantity of the first alignment mark 31 is two, more
A functional pin 2 and two the first alignment marks 31 are arranged as a line, and two the first alignment marks 31 are located at multiple functions
The opposite sides of pin 2.
Specifically, the effect of the first alignment mark 31 is functional pin 2 and the external pin enable on flexible circuit board
Accurate contraposition, effective electrical connection of assurance function pin 2, so that stable signal transmission is realized, therefore, as 2 row of functional pin
When being classified as a line, contraposition is realized in order to more accurately pass through the first alignment mark 31, it can be in 2 orientation of row functional pin
On opposite sides the first alignment mark 31 is respectively set, in this way, by 2 opposite sides of a line functional pin be arranged first pair
Position label 31 is aligned, and the contraposition accuracy of the row functional pin 2 can be improved.
Optionally, as shown in Figure 5 and Figure 6, Fig. 5 is the structural representation of another flexible circuit board in the embodiment of the present invention
Figure, Fig. 6 be in Fig. 5 BB ' to a kind of the schematic diagram of the section structure, flexible circuit board further include: be located at 1 first side of substrate (in Fig. 6
The upside of substrate 1) the second alignment mark 32, where perpendicular to flexible circuit board on the direction of plane, paving layers of copper 7 covering the
Two alignment marks 32.
Specifically, the back side of the second alignment mark 32 spreads copper, can be by way of the light filling of downside according to the second register guide
Note 32 is aligned, in addition, the first contraposition is removed without copper is spread in the back side of the first alignment mark 31 in i.e. the first alignment mark region 41
Be light-transmissive film layer except label 31, can by way of downside light filling or upside light filling according to the first alignment mark 31 into
Row contraposition, can also be had no need to change with the first alignment mark 31 of two sides light filling even if binding mode changes by increasing
Light filling direction, without reforming equipment or buying new equipment, cost is relatively low.
Optionally, as shown in Figure 5 and Figure 6, the second alignment mark 32 is one or more test pins, the second alignment mark
Therefore second alignment mark 32 can be multiplexed with test pin, due to its back side by the 32 normal alignment marks for spreading copper for the back side
Copper is spread, structural strength is larger, therefore can guarantee reliability when being electrically connected when test with external pin, still further aspect,
It when flexible circuit board is bound, does not need to be tested, therefore, which can be used as alignment mark use.
Optionally, as shown in Figure 5 and Figure 6, the quantity of functional pin 2 is multiple, and the quantity of the first alignment mark 31 is two
A, the quantity of the second alignment mark 32 is two, 2, two the first alignment marks 31 of multiple functional pins and two second contrapositions
Label 32 is arranged as a line；Two the first alignment marks 31 are located at the opposite sides of multiple functional pins 2, and two second pair
Position label 32 is located at the opposite sides of multiple functional pins 2, and two the second alignment marks 32 are located at two the first register guides
Between note 31.
Specifically, the distance between the second alignment mark 32 and functional pin 2 are relatively close, therefore its back side spreads copper, Neng Goujin
One step enhances the structural strength of functional pin 2, to make functional pin 2 have in binding and more well press effect；First
Farther out, therefore its back side does not spread copper for the distance between alignment mark 31 and functional pin 2, i.e. in the first alignment mark region 41
It is light-transmissive film layer in addition to the first alignment mark 31, it can be by way of downside light filling or upside light filling according to first pair
Position label 31 aligned, by increase can with the first alignment mark 31 of two sides light filling, even if binding mode changes,
Light filling direction is had no need to change, without reforming equipment or buying new equipment, cost is relatively low.
As shown in fig. 7, Fig. 7 is a kind of structural schematic diagram of display device in the embodiment of the present invention, the embodiment of the present invention is also
There is provided a kind of display device, comprising: the first flexible circuit board 101 and the second flexible circuit board 102, the first flexible circuit board 101
For the flexible circuit board in above-described embodiment, the first flexible circuit board 101 and the binding connection of the second flexible circuit board 102；Display
Panel 100, one of the first flexible circuit board 101 and the second flexible circuit board 102 are connect with display panel 100.
The display device can be any tool such as mobile phone, tablet computer, laptop, electric paper book or television set
There is the electronic equipment of display function.
Display device in the embodiment of the present invention has flexible circuit board, and the flexible circuit board is in the first alignment mark institute
The first alignment mark region in, the film layer in addition to the first alignment mark is translucent material so that work as the flexible circuit
When plate and other flexible circuit boards are bound, no matter light is injected from the which side of the flexible circuit board, first pair may be passed through
Position marked region, realizes light filling function when being aligned by the first alignment mark, so even binding mode changes,
Also light filling direction is had no need to change, without reforming equipment or buying new equipment, cost is relatively low.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Within mind and principle, any modification, equivalent substitution, improvement and etc. done be should be included within the scope of the present invention.
Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention., rather than its limitations；To the greatest extent
Pipe present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that: its according to
So be possible to modify the technical solutions described in the foregoing embodiments, or to some or all of the technical features into
Row equivalent replacement；And these are modified or replaceed, various embodiments of the present invention technology that it does not separate the essence of the corresponding technical solution
The range of scheme.
Claims (11)
1. a kind of flexible circuit board characterized by comprising
Substrate, the substrate include translucent material；
Functional pin and the first alignment mark positioned at first side of substrate；
The flexible circuit board includes the first alignment mark region, and first alignment mark is located at first alignment mark area
In domain, the functional pin is located at except first alignment mark region；
Film layer of the flexible circuit board in first alignment mark region in addition to the first alignment mark is light transmission material
Material.
2. flexible circuit board according to claim 1, which is characterized in that
The flexible circuit board is translucent material in the film layer of described substrate second side.
3. flexible circuit board according to claim 2, which is characterized in that further include:
The first glue-line far from the substrate side in the film layer of the functional pin place；
Far from the first polyimide layer of the substrate side on first glue-line, first polyimide layer passes through
First glue-line is pasted on film layer where the functional pin；
Positioned at second glue-line of described substrate second side；
Far from the second polyimide layer of the substrate side on second glue-line, second polyimide layer passes through
Second glue-line is pasted on the substrate.
4. flexible circuit board according to claim 1, which is characterized in that further include:
Positioned at the paving layers of copper of described substrate second side, the paving layers of copper is hollow out in first alignment mark region；
Where perpendicular to the flexible circuit board on the direction of plane, the paving layers of copper covers the functional pin.
5. flexible circuit board according to claim 4, which is characterized in that further include:
The first glue-line far from the substrate side in the film layer of the functional pin place；
Far from the first polyimide layer of the substrate side on first glue-line, first polyimide layer passes through
First glue-line is pasted on film layer where the functional pin；
The second glue-line far from the substrate side in the paving layers of copper；
Far from the second polyimide layer of the substrate side on second glue-line, second polyimide layer passes through
Second glue-line is pasted on the paving layers of copper.
6. flexible circuit board according to claim 1, which is characterized in that
First alignment mark and the functional pin same layer are arranged, the shape of first alignment mark and the functional pin
Shape and size are all the same.
7. flexible circuit board according to claim 6, which is characterized in that
The quantity of the functional pin be it is multiple, the quantity of first alignment mark is two, the multiple functional pin and
Two first alignment marks are arranged as a line, and two first alignment marks are located at the multiple functional pin
Opposite sides.
8. flexible circuit board according to claim 4, which is characterized in that further include:
The second alignment mark positioned at first side of substrate, where perpendicular to the flexible circuit board on the direction of plane,
The paving layers of copper covers second alignment mark.
9. flexible circuit board according to claim 8, which is characterized in that
Second alignment mark is one or more test pins.
10. flexible circuit board according to claim 8, which is characterized in that
The quantity of the functional pin be it is multiple, the quantity of first alignment mark is two, second alignment mark
Quantity is two, and the multiple functional pin, two first alignment marks and two second alignment marks are arranged as
A line；
Two first alignment marks are located at the opposite sides of the multiple functional pin, two second register guides
Note is located at the opposite sides of the multiple functional pin, and two second alignment marks are located at two first contrapositions
Between label.
11. a kind of display device characterized by comprising
First flexible circuit board and the second flexible circuit board, first flexible circuit board are to appoint in the claims 1 to 10
Flexible circuit board described in meaning one, first flexible circuit board and second flexible circuit board binding connection；
Display panel, one of first flexible circuit board and second flexible circuit board connect with the display panel
It connects.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811294642.1A CN109068478B (en) | 2018-11-01 | 2018-11-01 | Flexible circuit board and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811294642.1A CN109068478B (en) | 2018-11-01 | 2018-11-01 | Flexible circuit board and display device |
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| Publication Number | Publication Date |
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| CN109068478A true CN109068478A (en) | 2018-12-21 |
| CN109068478B CN109068478B (en) | 2020-04-07 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201811294642.1A Active CN109068478B (en) | 2018-11-01 | 2018-11-01 | Flexible circuit board and display device |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110061037A (en) * | 2019-04-25 | 2019-07-26 | 京东方科技集团股份有限公司 | Flexible base board and display device |
| CN110286535A (en) * | 2019-06-20 | 2019-09-27 | 上海天马微电子有限公司 | Display module, manufacturing method of display module and display device |
| CN110687729A (en) * | 2019-09-30 | 2020-01-14 | 上海天马微电子有限公司 | Display module and display device |
| CN110930866A (en) * | 2019-11-26 | 2020-03-27 | Tcl华星光电技术有限公司 | Chip on film and display device |
| CN113316305A (en) * | 2020-02-26 | 2021-08-27 | 颀邦科技股份有限公司 | Flexible circuit board |
| CN113380865A (en) * | 2021-06-07 | 2021-09-10 | 京东方科技集团股份有限公司 | Display device |
| CN113421909A (en) * | 2021-06-24 | 2021-09-21 | 云谷（固安）科技有限公司 | Display panel and display device |
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| CN1722930A (en) * | 2004-05-28 | 2006-01-18 | 日本梅克特隆株式会社 | Flexible circuit substrate |
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