CN105578718A - Flexible circuit board, circuit connection structure and mobile terminal - Google Patents
Flexible circuit board, circuit connection structure and mobile terminal Download PDFInfo
- Publication number
- CN105578718A CN105578718A CN201511025697.9A CN201511025697A CN105578718A CN 105578718 A CN105578718 A CN 105578718A CN 201511025697 A CN201511025697 A CN 201511025697A CN 105578718 A CN105578718 A CN 105578718A
- Authority
- CN
- China
- Prior art keywords
- pad
- line
- flexible pcb
- layer
- cover layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0108—Transparent
Abstract
The invention discloses a flexible circuit board. The flexible circuit board comprises a first cover film layer, a first line layer, a transparent flexible substrate, a second line layer and a second cover film layer, which are sequentially stacked, wherein the transparent flexible substrate comprises a line region and a connection region; the position, opposite to the connection region, of the first cover film layer is hollowed out; the first line layer comprises a line and a bonding pad; the line is located in the line region; the bonding pad is located in the connection region; the line is electrically connected with the bonding pad; the position, opposite to the connection region, of the second line layer is hollowed out; and the position, opposite to the connection region, of the second cover film layer is transparently arranged. The flexible circuit board disclosed by the invention can easily achieve welding alignment. The invention further discloses a circuit connection structure and a mobile terminal.
Description
Technical field
The present invention relates to circuit interconnection technique field, particularly relate to a kind of flexible PCB, a kind of circuit connection structure and a kind of mobile terminal.
Background technology
Along with the fast development of electronics technology, the electronic product of the various different demands according to consumer is also and then constantly weeded out the old and bring forth the new.Consumption market makes various individualized electronic product be in great demand, wherein with the electronic equipment of portable product, as product main flows especially such as mobile phone, PDA (personal digital assistant), digital camera, Liquid Crystal Modules.Further, above-mentioned electronic product designer trends and be used as with lighting, slimming, low priceization, high-quality, high-precision densification the main inducing bought that stimulates consumer.
In addition, general electronic products more tends to become strong greatly to make the function of self, and attract consumer's desire to purchase further, therefore various different function can be increased in conjunction with more module, so general except adding display, main circuit board, internal memory, also add camera module or network operation module is to make the function diversification more of its electronic product.
Often need to connect by circuit at above-mentioned different intermodule, therefore usually use cable or flexible circuit board when connection, connect these modules by the mode of welding.But because the electronic product in modern times is more towards compactization, cause Welding Structure more subtilized.So the installation in order to realize high-density line in narrower and small small product size, be formed at weld pad on circuit board except having meticulousr size, its arrangement is also more intensive.
Obtain it is noted that when the pad on circuit board is tending towards high-density array, in welding process, often occur producing pad solder inconsistent phenomenon because spacing is too small, cause the problem that is short-circuited between pad.This kind to misplace the short circuit problem caused due to pad solder, has become the principal element that circuit board fraction defective raises.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of flexible PCB of easy exactitude position pad, a kind ofly adopts the circuit connection structure of described flexible PCB and a kind of mobile terminal adopting described flexible PCB.
To achieve these goals, embodiment of the present invention adopts following technical scheme:
On the one hand, a kind of flexible PCB is provided, comprise the first cover layer be cascading, first line layer, transparent flexible substrate, second line layer and the second cover layer, described transparent flexible substrate comprises line areas and bonding pad, described first cover layer is just to the position hollow out of described bonding pad, described first line layer comprises the circuit being positioned at described line areas and the pad being positioned at described bonding pad, described circuit and the electrical connection of described pad, described second line layer is just to the position hollow out of described bonding pad, described second cover layer is just arranged the location transparency of described bonding pad.
Preferably, described second cover layer is just to the position hollow out of described bonding pad.
Preferably, described line areas and the described bonding pad intersection of described transparent flexible substrate are formed with a boundary line, the first spacing is formed between described second cover layer and described boundary line, form the second spacing between described second line layer and described boundary line, described second spacing is greater than described first spacing.
Preferably, described first cover layer and described second cover layer are transparent film layer.
Preferably, described second cover layer adopts transparent material and covers the described bonding pad of described flexible PCB.
Preferably, described line areas and the described bonding pad intersection of described transparent flexible substrate are formed with a boundary line, form the second spacing between described second line layer and described boundary line.
Preferably, described first cover layer is transparent film layer.
Preferably, described transparent flexible substrate material is polyimides.
On the other hand, a kind of circuit connection structure is also provided, comprise the flexible PCB as described in above-mentioned any one, transparent anisotropic conductive film and there is the device being connected pad, described pad and described connection pad one_to_one corresponding are arranged, and described anisotropic conductive film is placed between described pad and described connection pad in order to realize electrical connection.
Preferably, the bonding area of described pad is less than the bonding area of described connection pad.
Again on the one hand, additionally provide a kind of mobile terminal, comprise the flexible PCB as described in above-mentioned any one.
Compared to prior art, the present invention has following beneficial effect:
Flexible PCB of the present invention due to described first cover layer just to the position hollow out of described bonding pad, described flexible base, board be transparency carrier, described second line layer just just arranges the location transparency of described bonding pad the position hollow out of described bonding pad, described second cover layer, the surrounding of the described pad in the described bonding pad of therefore described flexible PCB is in pellucidity.Time on the connection pad described flexible PCB being connected to other devices, intuitively can arrive described pad and whether be connected pad accurate contraposition correspondingly with described, simple, intuitive, efficiency are high, improve welding yield.
When circuit connection structure of the present invention connects, first face up the described connection pad one of described device placement, described connection pad places described anisotropic conductive film, and then the described pad one of described flexible PCB is faced down aligns overlapping with described connection pad.Due to the surrounding of the described pad of described flexible PCB be in pellucidity, described anisotropic conductive film is transparent, therefore the described pad of described flexible PCB align the described connection pad of described device time, intuitively can arrive described pad and be connected between pad whether aim at placement correspondingly with described, simple, intuitive, efficiency are high, improve welding yield.
Accompanying drawing explanation
In order to be illustrated more clearly in technical scheme of the present invention, be briefly described to the accompanying drawing used required in execution mode below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained as these accompanying drawings.
The sectional structure schematic diagram of a kind of flexible PCB that Fig. 1 provides for the embodiment of the present invention.
The schematic top plan view of a kind of flexible PCB that Fig. 2 provides for the embodiment of the present invention.
The sectional structure schematic diagram of the another kind of flexible PCB that Fig. 3 provides for the embodiment of the present invention.
The sectional structure schematic diagram of a kind of circuit connection structure that Fig. 4 provides for the embodiment of the present invention.
Embodiment
Below in conjunction with the accompanying drawing in embodiment of the present invention, the technical scheme in embodiment of the present invention is clearly and completely described.
Refer to Fig. 1 and Fig. 2, the sectional structure schematic diagram of a kind of flexible PCB that Fig. 1 provides for the embodiment of the present invention, the schematic top plan view of a kind of flexible PCB that Fig. 2 provides for the embodiment of the present invention.Flexible PCB described in the embodiment of the present invention, comprise the first cover layer 1 be cascading, first line layer 2, transparent flexible substrate 3, second line layer 4 and the second cover layer 5, described transparent flexible substrate 3 comprises line areas 100 and bonding pad 200, described first cover layer 1 is just to the position hollow out of described bonding pad 200, described first line layer 2 comprises the circuit being positioned at described line areas 100 of electrical connection and is positioned at the pad 21 of described bonding pad 200, described second line layer 4 is just to the position hollow out of described bonding pad 200, described second cover layer 5 is just arranged the location transparency of described bonding pad.
In the present embodiment, due to described flexible PCB described first cover layer 1 just to the position hollow out of described bonding pad 200, described flexible base, board 3 be transparency carrier, described second line layer 4 just just arranges the location transparency of described bonding pad the position hollow out of described bonding pad 200, described second cover layer 5, the surrounding of the described pad 21 in the described bonding pad 200 of therefore described flexible PCB is in pellucidity.Time on the connection pad described flexible PCB being connected to other devices, intuitively can arrive described pad 21 and whether be connected pad accurate contraposition correspondingly with described, simple, intuitive, efficiency are high, improve welding yield.
As a preferred embodiment of the present invention, as shown in Figure 1, described second coverlay 5 layers is just to the position hollow out of described bonding pad 200, and therefore described second coverlay 5 is just visual to the location transparency of described bonding pad 200.
Further, described line areas 100 and described bonding pad 200 intersection of described transparent flexible substrate 3 are formed with a boundary line A, described second cover layer 5 forms the first interval S 1 with described boundary line A, described second line layer 4 forms the second interval S 2 with described boundary line A, and described second interval S 2 is greater than described first interval S 1.Also namely described second line layer 4 forms a determining deviation with described bonding pad 200; protect the circuit in described line layer 4 not to be damaged in the connecting welding of described flexible PCB, described second cover layer 5 completely covers described second line layer 4 to play a protective role simultaneously.
Further, described first cover layer 1 and described second cover layer 5 can adopt transparent material to make, completely visual with the circuit realizing described flexible PCB.Certainly, described first cover layer 1 and described second cover layer 5 also can be opaque, can arrange according to real needs.
Further, described transparent flexible substrate 3 material is polyimides.
As another kind of preferred embodiment of the present invention, refer to Fig. 3, described second cover layer 5 adopts transparent material and covers the described bonding pad 200 of described flexible PCB, and therefore described second coverlay 5 is just visual to the location transparency of described bonding pad 200.
Further; described line areas 100 and described bonding pad 200 intersection of described transparent flexible substrate 3 are formed with a boundary line A; described second line layer 4 forms the second interval S 2 with described boundary line A; also namely described second line layer 4 forms a determining deviation with described bonding pad 200, protects the circuit in described line layer 4 not to be damaged in the connecting welding of described flexible PCB.
Further, described first cover layer 1 can adopt transparent material to make, completely visual with the circuit realizing described flexible PCB.Certainly, described first cover layer 1 also can be opaque, can arrange according to real needs.
Further, described transparent flexible substrate 3 material is polyimides.
Refer to Fig. 4, the embodiment of the present invention also provides a kind of circuit connection structure, comprise as the flexible PCB above as described in embodiment, transparent anisotropic conductive film 7 and there is the device 6 being connected pad 61, described pad 21 and described connection pad 61 one_to_one corresponding are arranged, and described anisotropic conductive film 7 is placed between described pad 21 and described connection pad 61 in order to realize electrical connection.
When described circuit connection structure connects, first face up the described connection pad 61 1 of described device 6 placement, described connection pad 61 places described anisotropic conductive film 7, and then the described pad 21 1 of described flexible PCB is faced down aligns overlapping with described connection pad 61.Due to the surrounding of the described pad 61 of described flexible PCB be in pellucidity, described anisotropic conductive film 7 is transparent, therefore the described pad 21 of described flexible PCB align the described connection pad 61 of described device 6 time, intuitively can arrive described pad 21 and be connected between pad 61 whether aim at placement correspondingly with described, simple, intuitive, efficiency are high, improve welding yield.
Further, the bonding area of described pad is less than the bonding area of described connection pad, reduce further described pad 21 align described connection pad 61 time produce the risk of dislocation, improve welding yield.
The embodiment of the present invention additionally provides a kind of mobile terminal, comprises flexible PCB described above.Described mobile terminal refers to the computer equipment that can use in movement, includes but not limited to mobile phone, notebook, panel computer, POS, vehicle-mounted computer, camera etc.
The above is the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention; can also make some improvements and modifications, these improvements and modifications are also considered as protection scope of the present invention.
Claims (10)
1. a flexible PCB, it is characterized in that, comprise the first cover layer be cascading, first line layer, transparent flexible substrate, second line layer and the second cover layer, described transparent flexible substrate comprises line areas and bonding pad, described first cover layer is just to the position hollow out of described bonding pad, described first line layer comprises the circuit being positioned at described line areas and the pad being positioned at described bonding pad, described circuit and the electrical connection of described pad, described second line layer is just to the position hollow out of described bonding pad, described second cover layer is just arranged the location transparency of described bonding pad.
2. flexible PCB as claimed in claim 1, it is characterized in that, described second cover layer is just to the position hollow out of described bonding pad.
3. flexible PCB as claimed in claim 2, it is characterized in that, described line areas and the described bonding pad intersection of described transparent flexible substrate are formed with a boundary line, the first spacing is formed between described second cover layer and described boundary line, form the second spacing between described second line layer and described boundary line, described second spacing is greater than described first spacing.
4. flexible PCB as claimed in claim 3, it is characterized in that, described first cover layer and described second cover layer are transparent film layer.
5. flexible PCB as claimed in claim 1, is characterized in that, described second cover layer adopts transparent material and covers the described bonding pad of described flexible PCB.
6. flexible PCB as claimed in claim 5, it is characterized in that, described line areas and the described bonding pad intersection of described transparent flexible substrate are formed with a boundary line, form the second spacing between described second line layer and described boundary line.
7. flexible PCB as claimed in claim 6, it is characterized in that, described first cover layer is transparent film layer.
8. a circuit connection structure, it is characterized in that, comprise the flexible PCB as described in any one of claim 1-7, transparent anisotropic conductive film and there is the device being connected pad, described pad and described connection pad one_to_one corresponding are arranged, and described anisotropic conductive film is placed between described pad and described connection pad in order to realize electrical connection.
9. circuit connection structure as claimed in claim 8, it is characterized in that, the bonding area of described pad is less than the bonding area of described connection pad.
10. a mobile terminal, is characterized in that, comprises the flexible PCB as described in any one of claim 1-7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511025697.9A CN105578718B (en) | 2015-12-29 | 2015-12-29 | Flexible PCB, circuit connection structure and mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511025697.9A CN105578718B (en) | 2015-12-29 | 2015-12-29 | Flexible PCB, circuit connection structure and mobile terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105578718A true CN105578718A (en) | 2016-05-11 |
| CN105578718B CN105578718B (en) | 2018-09-04 |
Family
ID=55888223
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201511025697.9A Active CN105578718B (en) | 2015-12-29 | 2015-12-29 | Flexible PCB, circuit connection structure and mobile terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105578718B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109068478A (en) * | 2018-11-01 | 2018-12-21 | 武汉天马微电子有限公司 | Flexible circuit board and display device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005234335A (en) * | 2004-02-20 | 2005-09-02 | Advanced Display Inc | Liquid crystal display device |
| KR20090119249A (en) * | 2008-05-15 | 2009-11-19 | 삼성전기주식회사 | The method of fabricating circuit board |
| CN202310283U (en) * | 2011-10-28 | 2012-07-04 | 惠州Tcl移动通信有限公司 | Hard fold flexible printed circuit board |
| US20120261168A1 (en) * | 2007-03-02 | 2012-10-18 | Raytheon Company | Method for fabricating electrical circuitry on ultra-thin plastic films |
| CN203399392U (en) * | 2013-07-01 | 2014-01-15 | 宸鸿科技(厦门)有限公司 | Flexible printed circuit board and touch-controlled panel using same |
| CN104362449A (en) * | 2014-11-03 | 2015-02-18 | 业成光电（深圳）有限公司 | Conductive jointing structure with anisotropic conductive particle aggregation improved |
-
2015
- 2015-12-29 CN CN201511025697.9A patent/CN105578718B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005234335A (en) * | 2004-02-20 | 2005-09-02 | Advanced Display Inc | Liquid crystal display device |
| US20120261168A1 (en) * | 2007-03-02 | 2012-10-18 | Raytheon Company | Method for fabricating electrical circuitry on ultra-thin plastic films |
| KR20090119249A (en) * | 2008-05-15 | 2009-11-19 | 삼성전기주식회사 | The method of fabricating circuit board |
| CN202310283U (en) * | 2011-10-28 | 2012-07-04 | 惠州Tcl移动通信有限公司 | Hard fold flexible printed circuit board |
| CN203399392U (en) * | 2013-07-01 | 2014-01-15 | 宸鸿科技(厦门)有限公司 | Flexible printed circuit board and touch-controlled panel using same |
| CN104362449A (en) * | 2014-11-03 | 2015-02-18 | 业成光电（深圳）有限公司 | Conductive jointing structure with anisotropic conductive particle aggregation improved |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109068478A (en) * | 2018-11-01 | 2018-12-21 | 武汉天马微电子有限公司 | Flexible circuit board and display device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105578718B (en) | 2018-09-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2017140055A1 (en) | Substrate, chip on film, and electronic device | |
| CN104698636A (en) | Display panel and electronic device | |
| CN203849700U (en) | Touch pad and touch display device | |
| TWI526905B (en) | Touch panel module and touch display device having the same | |
| CN204287637U (en) | Array base palte, display panel and display device | |
| US10314172B2 (en) | Flexible substrate and display device | |
| US20210212207A1 (en) | Flexible printed circuit and manufacture method thereof, electronic device module and electronic device | |
| US11589461B2 (en) | Flexible printed circuit and manufacturing method thereof, electronic device module and electronic device | |
| KR102251684B1 (en) | Chip on film package and display apparatus having the same | |
| US10620735B2 (en) | Force touch module, manufacturing method thereof, display screen and display device | |
| TW200732802A (en) | Electro-optical device, electronic apparatus, and interface board | |
| WO2020156595A9 (en) | Flexible circuit board and manufacturing method, display device, circuit board structure and display panel thereof | |
| US20160345436A1 (en) | Circuit board, manufacturing method thereof and display apparatus | |
| CN103972201A (en) | Package structure and display module | |
| CN105578718A (en) | Flexible circuit board, circuit connection structure and mobile terminal | |
| US10672698B2 (en) | Chip on film including signal lines for multiple signal paths and a display device having thereof | |
| CN105116578A (en) | Drive chip structure and liquid crystal display device | |
| US20160286651A1 (en) | Circuit board, manufacturing method thereof, and display device | |
| CN114265516B (en) | Touch display panel and display device | |
| WO2018219128A1 (en) | Array substrate and display device | |
| CN102364567A (en) | Flat panel display | |
| CN103118483B (en) | Electronic assembly | |
| CN202916555U (en) | Liquid crystal displayer and connecting structure thereof | |
| US10692815B2 (en) | Chip on glass package assembly | |
| CN101546054B (en) | Active component array substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Patentee after: OPPO Guangdong Mobile Communications Co., Ltd. Address before: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Patentee before: Guangdong OPPO Mobile Communications Co., Ltd. |