CN104362449A - Conductive jointing structure with anisotropic conductive particle aggregation improved - Google Patents
Conductive jointing structure with anisotropic conductive particle aggregation improved Download PDFInfo
- Publication number
- CN104362449A CN104362449A CN201410614093.7A CN201410614093A CN104362449A CN 104362449 A CN104362449 A CN 104362449A CN 201410614093 A CN201410614093 A CN 201410614093A CN 104362449 A CN104362449 A CN 104362449A
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- CN
- China
- Prior art keywords
- matrix
- weld pad
- anisotropy
- conducting particles
- depression
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
- H01R12/65—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures characterised by the terminal
Abstract
The invention discloses a conductive jointing structure with anisotropic conductive particle aggregation improved. The conductive jointing structure comprises a first base, a second base and an anisotropic conductive layer. Each of the first base and the second base is provided with at least one first pad and one second pad; the anisotropic conductive layer is connected between the first and second pads so that the first and second pads can be jointed together through the anisotropic conductive layer. The joint of the first and second bases is provided with at least one recess, so that the anisotropic conductive layer is allowed to enter the recesses, conductive particles in the anisotropic conductive layer aggregate at the edge of the first or second base, and the common problem that glue overflow caused short circuit easily occurs to adjacent pads is solved.
Description
Technical field
The present invention relates to conductive bond technical field, particularly relate to the conductive bond structure improving the gathering of anisotropy conducting particles.
Background technology
Anisotropic conductive film (Anisotropic Conductive Fi lm, or anisotropic conductive (Anisotropic conductive adhesive/paste ACF), ACA/ACP) be form with resin and conducting particles synthesis, be mainly used in connection two kinds of different substrate materials and circuit, possess graph thinning, processing procedure is simple, and meet leadless environment-friendly process requirements and without characteristics such as alpha particles, there are good damp proof, now, conduction and insulation function.Generally speaking, ACF, ACA or ACP can be used for the coating laminating between different substrate materials, and it is for a kind of current limit can only circulate in special coating substance between base material by vertical axis Z-direction.Current ACF be usually used in such as soft flat cable, film soft board, with the processing procedure such as glass gluing, the electrode of unlike material can be made by the bonding of anisotropic conductive film or anisotropic conductive, current limit can only from bonding direction (i.e. vertical direction) conducting flowing, and solution is commonly seen the problems such as microscopic wire connection that connector cannot process by this.
For example; as shown in Figure 1A and Figure 1B; when one first matrix 10 (such as: flexible printed wiring board) and one second matrix 20 (such as: pixel control layer) do bind time; it usually can be provided with an anisotropy conductive layer 30 on first weld pad 12 or the second weld pad 22 of the second matrix 20 of the first matrix 10; its generation type such as can be: the anisotropic conductive film pasted, or printing coat anisotropic conductive adhesive.Afterwards, first and second matrix 10,20 is bonded together (as shown in Figure 2) by this anisotropy conductive layer 30 by the mode recycling follow-up board hot pressing.
But it should be noted that as shown in Fig. 3 A and Fig. 3 B, due to current about the design of weld pad external form, it mostly is vertical bar shape.Therefore; as shown in Figure 4; after the connection process of the two completes; usually the Jiao Chu that overflows of anisotropic conductive film at the insulating barrier edge of FPC (flexible printed wiring board) edge and pixel control layer or anisotropic conductive can be found; there is conducting particles to assemble more; and cause the weld pad of adjacent two or more to form short circuit; the edge of insulating barrier can be optical cement (Optically Clear Adhesive; or organic insulator (organochlorine compound OCA); OC) edge, and make follow-up testing electrical property cause the situation of failure.The reason that this phenomenon is formed, as shown in Figure 5, because of when board cutter head is pressed on weld pad, anisotropic conductive film or anisotropic conductive after heated can fluidifys, after adding the extruding of board cutter head, namely those anisotropic conductive films or anisotropic conductive can be made to form the state of overflowing, therefore conducting particles often concentrate near the edge of matrix.
In order to improve the problem that this conducting particles is assembled, prior art proposes the practice of several difference then, comprising: (1) adjusts from process parameter, reduces the incidence that conducting particles is assembled, but this practice can increase the time of producing line tune machine; (2) increase the width between adjacent welding-pad, but this practice can be limited to the size design of final products; And (3) increase conducting resinl to the distance of printed circuit board edge, and this measure can be limited to the size of product equally, many solutions of obvious skill proposition of commonly seeing, and its benefit is neither clearly and helpful.
In view of this, the present inventor is can improve thoughts on above-mentioned disappearance, and according to the correlation experience be engaged in for many years in this respect, concentrate one's attention on observe and study it, and coordinate the utilization of scientific principle, and a kind of modern design being proposed and effective the present invention improving above-mentioned disappearance, it discloses the conductive bond structure that one effectively can improve the gathering of anisotropy conducting particles, and its concrete framework and execution mode will be specified in down.
Summary of the invention
Main purpose of the present invention is that solution adjacent welding-pad of commonly seeing easily forms the problem of short circuit because of excessive glue.
For achieving the above object, the invention provides the conductive bond structure that one improves the gathering of anisotropy conducting particles, described conductive bond structure comprises: one first matrix, is provided with at least one first weld pad; One second matrix, is provided with at least one second weld pad; And an anisotropy conductive layer, be connected between this first weld pad of this first matrix and this second weld pad of this second matrix, make this first matrix can be engaged in this second matrix by this anisotropy conductive layer; Wherein, the joint of this first matrix and this second matrix is provided with at least one depression, makes this anisotropy conductive layer enter this depression, and avoid the conducting particles in this anisotropy conductive layer to be gathered in the edge of this first matrix or this second matrix.
Preferably, this depression is this first weld pad being formed at this first matrix, and this depression is an arc or an irregular polygon.
Preferably, this depression is formed in this second weld pad of this second matrix.
Preferably, this second weld pad is in an arc on one end of the joint of this first matrix and this second matrix.
Preferably, this depression is in an irregular polygon.
Preferably, the material of this anisotropy conductive layer is anisotropic conductive film or anisotropic conductive.
Preferably, this first matrix is a flexible printed wiring board.
Preferably, this second matrix is a pixel control layer.
Preferably, simultaneously this depression is formed in this first weld pad of this first matrix and this second weld pad of this second matrix.
Preferably, this depression is in an arc or irregular polygon.
The present invention proposes the conductive bond structure that one effectively can improve the gathering of anisotropy conducting particles, be characterized in main through when different two matrixes engage, depression is provided with at joint, anisotropy conductive layer is made can suitably to enter this depression, the path that conducting particles is dispersed is provided, improves the problem that conducting particles of commonly seeing focuses mostly in matrix border by this and occur.
Accompanying drawing explanation
Figure 1A is for different two matrixes one of to be carried out engaging structural representation by known techniques;
Figure 1B is for different two matrixes are carried out another structural representation of engaging by known techniques;
Fig. 2 is for different two matrixes of known techniques complete the rear structural representation of joint;
Fig. 3 A is by known techniques one matrix is used the schematic diagram of weld pad external form;
Fig. 3 B is by another matrix of known techniques is used the schematic diagram of weld pad external form;
Fig. 4 is for different two matrixes of known techniques complete the rear detailed maps of joint;
Fig. 5 be for according to Fig. 4 shownschematically its inner conductive particle of structure form the schematic diagram of gathering;
Fig. 6 is the structural representation for the first weld pad according to a first embodiment of the present invention;
Fig. 7 is the schematic diagram for conductive bond structure according to a first embodiment of the present invention;
Fig. 8 is the structural representation for the second weld pad according to a second embodiment of the present invention;
Fig. 9 is the schematic diagram for conductive bond structure according to a second embodiment of the present invention;
Figure 10 A is the structural representation for the first weld pad according to a third embodiment of the present invention;
Figure 10 B is the structural representation for the second weld pad according to a third embodiment of the present invention;
Figure 11 is the schematic diagram for conductive bond structure according to a third embodiment of the present invention;
Figure 12 A is the structural representation for the first weld pad according to a fourth embodiment of the present invention;
Figure 12 B is the structural representation for the second weld pad according to a fourth embodiment of the present invention.
The realization of the object of the invention, functional characteristics and advantage will in conjunction with the embodiments, are described further with reference to accompanying drawing.
Embodiment
Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
For the ease of understanding spirit and the principle of the present invention, a plurality of embodiments disclosed below hold continuous graphic Figure 1A, Figure 1B, Fig. 2 to carry out following explanation.As previously mentioned, conductive bond structure includes: one first matrix 10, is provided with at least one first weld pad (bonding pad) 12; One second matrix 20, is provided with at least one second weld pad (bonding pad) 22; And an anisotropy conductive layer 30, be connected between the first weld pad 12 of the first matrix 10 and the second weld pad 22 of the second matrix 20, make the first matrix 10 can be engaged in the second matrix 20 by this anisotropy conductive layer 30.In the embodiment of the present invention, the first matrix 10 can be such as a flexible printed wiring board (Flexible PrintedCircuit, FPC); And the second matrix 20 can be such as a pixel control layer, by the effect of anisotropy conductive layer 30, the first matrix 10 and the second matrix 20 can complete joint easily.It is worth mentioning that, the material selection of anisotropy conductive layer 30 to be selected from anisotropic conductive film (Anisotropic ConductiveFilm, or anisotropic conductive (Anisotropic conductive adhesive/paste, ACA/ACP) ACF).So, according to one of the present invention embodiment, when the material of anisotropy conductive layer 30 is for anisotropic conductive film, then anisotropy conductive layer 30 can pass through the mode pasted and is formed between this flexible printed wiring board and pixel control layer.As for, when the material of anisotropy conductive layer 30 is for anisotropic conductive, then this anisotropy conductive layer then can pass through printing coating mode be formed between this flexible printed wiring board and pixel control layer, all can in order to implement the goal of the invention of the present invention.
In order to improve the problem that connected structure of commonly seeing often has conducting particles to assemble, the present invention is mainly provided with at least one depression (being detailed later) at the joint of the first matrix 10 and the second matrix 20, make anisotropy conductive layer 30 can enter this depression, reach the phenomenon avoiding the conducting particles in anisotropy conductive layer 30 to produce gathering by this and occur.Wherein, it should be noted that the size of depression need coordinate the material of anisotropy conductive layer 30 to determine, to ensure that the conducting particles that anisotropy conductive layer 30 is interior and the first matrix 10 or the second matrix 20 meet minimal-contact area requirements.Below, the present invention is to provide Fig. 6 ~ 7, Fig. 8 ~ 9, Figure 10 A ~ 11 and Figure 12 A ~ 12B, and those are graphic is the schematic diagram be respectively according to the present invention first, second, third and the 4th embodiment, is hereby described as follows.
First, Fig. 6 ~ 7 are the schematic diagrames of the conductive bond structure improving the gathering of anisotropy conducting particles for first embodiment of the invention, in this first embodiment, as shown in the dotted line circle of Fig. 6, the present invention is the shape of improvement first weld pad 12a, makes described depression 40a be formed in this first weld pad 12a, as can be seen here, this first weld pad 12a at the edge of this first matrix 10, and with one end of the joint of the second weld pad 22 on be present an arc.Therefore, as shown in Figure 7, when the first weld pad 12a of the first matrix 10 and the second weld pad 22 of the second matrix 20 are bonded together, anisotropy conductive layer 30 can enter this depression 40a, the interior conducting particles of anisotropy conductive layer 30 can be disperseed equably, and the phenomenon avoiding conducting particles to be gathered in matrix border especially by this occurs.
Fig. 8 ~ 9 are the schematic diagrames of the conductive bond structure improving the gathering of anisotropy conducting particles for second embodiment of the invention, this second embodiment is roughly with the first embodiment, only difference, please refer to shown in Fig. 8, in the shape that this second embodiment is improvement second weld pad 22a, described depression 40b is formed in this second weld pad 22a, and depression 40b is also roughly in an arc.Therefore, as shown in Figure 9, when the first weld pad 12 of the first matrix 10 and the second weld pad 22a of the second matrix 20 are bonded together, anisotropy conductive layer 30 can enter this depression 40b, the interior conducting particles of anisotropy conductive layer 30 can be disperseed equably, and the phenomenon avoiding conducting particles to be gathered in matrix border especially by this occurs.
Figure 10 A, Figure 10 B and figure are the schematic diagrames of the conductive bond structure improving the gathering of anisotropy conducting particles for third embodiment of the invention.With first, second embodiment unlike, in this 3rd embodiment, the present invention is the shape simultaneously improveing the first weld pad 12b second weld pad 22b, described depression 40c is formed in the first weld pad 12b and the second weld pad 22b simultaneously, and this depression 40c roughly becomes an arc.Be schematic diagram rear together with Figure 10 A and Figure 10 B shownschematically structural engagement shown in Figure 11, as seen from Figure 11, after the first weld pad 12b engages with the second weld pad 22b, anisotropy conductive layer 30 suitably can enter depression 40c, make conducting particles dispersed, reach the effect avoiding conducting particles gathering.
Figure 12 A and Figure 12 B is the schematic diagram for fourth embodiment of the invention, with the first ~ three embodiment unlike, in this 4th embodiment, the present invention is the shape of improvement first weld pad 12c and/or the second weld pad 22c, that is, described depression 40d is optionally formed in the 1, first weld pad 12c; Or 2, in the second weld pad 22c; Or 3, can be formed in the first weld pad 12c and the second weld pad 22c simultaneously.Further, in this 4th embodiment, the shape of this depression 40d can be an irregular polygon.Therefore, the shape of depression to do the change of appropriateness, only make first, second weld pad upon engagement, anisotropy conductive layer can enter this depression, conducting particles is uniformly distributed, reduce the structure of the risk of conducting particles gathering, all when the claim being subordinate to the present invention.If the personage haveing the knack of technique field does one voluntarily understanding the particular content of the present invention and changes implementer according to this, when can not with the scope of the claims of restriction the present invention.
Be with, in sum, in order to solve the problem that conducting particles is assembled, the present invention proposes the conductive bond structure that one effectively can improve the gathering of anisotropy conducting particles, be characterized in main through when different two matrixes engage, be provided with depression at joint, make anisotropy conductive layer can suitably enter this depression, the path that conducting particles is dispersed is provided, improves the problem that conducting particles of commonly seeing focuses mostly in matrix border by this and occur.
Moreover, connected structure disclosed by the present invention, described depression is optionally formed at different two matrixes wherein in any one weld pad, or is also all formed with depression in indivedual weld pads of two matrixes simultaneously, and above-mentioned many enforcement aspects all can in order to implement the goal of the invention of the present invention.Further, the shape of depression also can according to the actual requirements and designed, designed it (such as: arc, regular polygon, or irregular polygon etc.).Therefore, therefore, compared to known techniques, the present invention not only with the low complex degree in practice with the advantage such as specifically can to implement, more can make different two matrixes after conductive bond, still can maintain good electrical characteristic, solving commonly sees engages the problem that electrical short easily occurs the Jiao Chu that overflows.Obvious the present invention, compared to known techniques, has splendid industry applications and competitiveness in fact.
These are only the preferred embodiments of the present invention; not thereby the scope of the claims of the present invention is limited; every utilize specification of the present invention and accompanying drawing content to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present invention.
Claims (10)
1. improve a conductive bond structure for anisotropy conducting particles gathering, it is characterized in that, described conductive bond structure comprises:
One first matrix, is provided with at least one first weld pad;
One second matrix, is provided with at least one second weld pad; And
One anisotropy conductive layer, is connected between this first weld pad of this first matrix and this second weld pad of this second matrix, makes this first matrix can be engaged in this second matrix by this anisotropy conductive layer;
Wherein, the joint of this first matrix and this second matrix is provided with at least one depression, makes this anisotropy conductive layer enter this depression, and avoid the conducting particles in this anisotropy conductive layer to be gathered in the edge of this first matrix or this second matrix.
2. improve the conductive bond structure of anisotropy conducting particles gathering as claimed in claim 1, it is characterized in that, this depression is this first weld pad being formed at this first matrix, and this depression is an arc or an irregular polygon.
3. improve the conductive bond structure of anisotropy conducting particles gathering as claimed in claim 1, it is characterized in that, this depression is formed in this second weld pad of this second matrix.
4. improve the conductive bond structure of anisotropy conducting particles gathering as claimed in claim 3, it is characterized in that, this second weld pad is in an arc on one end of the joint of this first matrix and this second matrix.
5. improve the conductive bond structure of anisotropy conducting particles gathering as claimed in claim 3, it is characterized in that, this depression is in an irregular polygon.
6. improve the conductive bond structure of anisotropy conducting particles gathering as claimed in claim 1, it is characterized in that, the material of this anisotropy conductive layer is anisotropic conductive film or anisotropic conductive.
7. improve the conductive bond structure of anisotropy conducting particles gathering as claimed in claim 1, it is characterized in that, this first matrix is a flexible printed wiring board.
8. improve the conductive bond structure of anisotropy conducting particles gathering as claimed in claim 1, it is characterized in that, this second matrix is a pixel control layer.
9. improve the conductive bond structure of anisotropy conducting particles gathering as claimed in claim 1, it is characterized in that, simultaneously this depression is formed in this first weld pad of this first matrix and this second weld pad of this second matrix.
10. improve the conductive bond structure of anisotropy conducting particles gathering as claimed in claim 9, it is characterized in that, this depression is in an arc or irregular polygon.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410614093.7A CN104362449A (en) | 2014-11-03 | 2014-11-03 | Conductive jointing structure with anisotropic conductive particle aggregation improved |
| TW103139505A TWI573501B (en) | 2014-11-03 | 2014-11-14 | A conductive bonding structure for improving the aggregation of anisotropic conductive particles |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410614093.7A CN104362449A (en) | 2014-11-03 | 2014-11-03 | Conductive jointing structure with anisotropic conductive particle aggregation improved |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104362449A true CN104362449A (en) | 2015-02-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410614093.7A Pending CN104362449A (en) | 2014-11-03 | 2014-11-03 | Conductive jointing structure with anisotropic conductive particle aggregation improved |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104362449A (en) |
| TW (1) | TWI573501B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105578718A (en) * | 2015-12-29 | 2016-05-11 | 广东欧珀移动通信有限公司 | Flexible circuit board, circuit connection structure and mobile terminal |
| CN110825268A (en) * | 2019-11-12 | 2020-02-21 | 业成科技（成都）有限公司 | Touch module, touch display device and electronic equipment |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11298127A (en) * | 1998-04-16 | 1999-10-29 | Fujikura Ltd | Printed circuit |
| KR20050003260A (en) * | 2003-06-30 | 2005-01-10 | 엘지.필립스 엘시디 주식회사 | Liquid crystal display device |
| CN101216619A (en) * | 2008-01-10 | 2008-07-09 | 友达光电股份有限公司 | Planar display and method of manufacture and photoelectric device and process for production thereof |
| CN102117788A (en) * | 2010-01-05 | 2011-07-06 | 瑞鼎科技股份有限公司 | Electronic chip with dredging gap and substrate |
| CN103094737A (en) * | 2011-11-05 | 2013-05-08 | 宝宸（厦门）光学科技有限公司 | Pin structure and pin connecting structure |
| CN103336558A (en) * | 2013-06-13 | 2013-10-02 | 业成光电（深圳）有限公司 | Electronic device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI351670B (en) * | 2006-05-18 | 2011-11-01 | Au Optronics Corp | Signal transmission assembly and display panel app |
-
2014
- 2014-11-03 CN CN201410614093.7A patent/CN104362449A/en active Pending
- 2014-11-14 TW TW103139505A patent/TWI573501B/en not_active IP Right Cessation
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11298127A (en) * | 1998-04-16 | 1999-10-29 | Fujikura Ltd | Printed circuit |
| KR20050003260A (en) * | 2003-06-30 | 2005-01-10 | 엘지.필립스 엘시디 주식회사 | Liquid crystal display device |
| CN101216619A (en) * | 2008-01-10 | 2008-07-09 | 友达光电股份有限公司 | Planar display and method of manufacture and photoelectric device and process for production thereof |
| CN102117788A (en) * | 2010-01-05 | 2011-07-06 | 瑞鼎科技股份有限公司 | Electronic chip with dredging gap and substrate |
| CN103094737A (en) * | 2011-11-05 | 2013-05-08 | 宝宸（厦门）光学科技有限公司 | Pin structure and pin connecting structure |
| CN103336558A (en) * | 2013-06-13 | 2013-10-02 | 业成光电（深圳）有限公司 | Electronic device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105578718A (en) * | 2015-12-29 | 2016-05-11 | 广东欧珀移动通信有限公司 | Flexible circuit board, circuit connection structure and mobile terminal |
| CN110825268A (en) * | 2019-11-12 | 2020-02-21 | 业成科技（成都）有限公司 | Touch module, touch display device and electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201618607A (en) | 2016-05-16 |
| TWI573501B (en) | 2017-03-01 |
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