CN108471671B - Binding structure and binding method of flexible circuit board and flexible device - Google Patents

Binding structure and binding method of flexible circuit board and flexible device Download PDF

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Publication number
CN108471671B
CN108471671B CN201810054491.6A CN201810054491A CN108471671B CN 108471671 B CN108471671 B CN 108471671B CN 201810054491 A CN201810054491 A CN 201810054491A CN 108471671 B CN108471671 B CN 108471671B
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China
Prior art keywords
circuit board
groove
binding
flexible
flexible circuit
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CN201810054491.6A
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Chinese (zh)
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CN108471671A (en
Inventor
田源
周茂清
张乐
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Kunshan Govisionox Optoelectronics Co Ltd
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Kunshan Govisionox Optoelectronics Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09172—Notches between edge pads

Abstract

The invention discloses a binding structure of a flexible circuit board, which comprises a first circuit board and a second circuit board, wherein a plurality of first golden fingers are distributed in a binding area of the first circuit board, a plurality of second golden fingers are distributed in a binding area of the second circuit board, a first groove is formed between the adjacent first golden fingers in the first circuit board, and a second groove is formed between the adjacent second golden fingers on the second circuit board; and each first golden finger and each second golden finger are in one-to-one contraposition compression joint, and the corresponding first groove and the corresponding second groove are in contraposition joint to form a vacuum first sealing cavity. The binding structure strengthens the binding strength of the flexible circuit board under the combined action of the conductive adhesive layer and atmospheric pressure. The invention also discloses a binding method for forming the binding structure of the flexible circuit board and a flexible device comprising the binding structure of the flexible circuit board.

Description

Binding structure and binding method of flexible circuit board and flexible device
Technical Field
The invention relates to the technical field of binding processes, in particular to a binding structure and a binding method of a flexible circuit board and a flexible device.
Background
The flexible printed circuit board is a flexible printed circuit board which is made of polyimide or polyester film as a base material and has high reliability and excellent performance. The Flexible Printed Circuit board (FPC) has the characteristics of high wiring density, light weight, thin thickness and good bending property. At present, flexible circuit boards are widely used in electronic products such as mobile phones, notebook computers, tablet computers, digital cameras, and the like.
Bonding refers to a process of combining and conducting an FPC and a Panel (Panel), or a Printed Circuit Board (PCB) through a Conductive Adhesive (ACF) according to a certain work flow in a production process of a display, and is a process commonly used in a display module factory.
However, in the prior art, since the FPC is made of a flexible material, in the process of binding the module, the FPC is easily affected by temperature changes, and expansion, contraction and other phenomena occur, so that the contact effect of the gold finger is poor, the signal connection and transmission are poor after binding, and the display of the screen body is poor.
Disclosure of Invention
In order to overcome the defects and shortcomings in the prior art, the invention aims to provide a binding structure and a binding method of a flexible circuit board and a flexible device, so as to strengthen the binding strength of the flexible circuit board, enhance the contact effect between golden fingers, and avoid the problems of poor display of a screen body and the like.
The purpose of the invention is realized by the following technical scheme:
the invention provides a binding structure of a flexible circuit board, which comprises a first circuit board and a second circuit board, wherein a plurality of first golden fingers are distributed in a binding area of the first circuit board, a plurality of second golden fingers are distributed in a binding area of the second circuit board, a first groove is formed between the adjacent first golden fingers in the first circuit board, and a second groove is formed between the adjacent second golden fingers on the second circuit board; and each first golden finger and each second golden finger are in one-to-one contraposition compression joint, and the corresponding first groove and the corresponding second groove are in contraposition joint to form a vacuum first sealing cavity.
Further, the first groove and the second groove have the same structure, wherein the first groove is surrounded by a base of the binding area as a bottom wall, two adjacent golden fingers and shielding walls respectively connected with corresponding ends of the two adjacent golden fingers as side walls, and the shielding walls and the base are integrally formed.
Furthermore, a third groove is formed in each first golden finger, a fourth groove is formed in each second golden finger, and the third grooves and the fourth grooves on the corresponding first golden fingers and the corresponding second golden fingers are combined in an aligned mode to form a second vacuum sealing cavity.
Further, the third groove and the fourth groove are identical in structure, wherein the third groove extends along the length direction of the corresponding first gold finger.
Further, a conductive adhesive layer is formed between the bonding region of the first circuit board and the bonding region of the second circuit board, and the conductive adhesive layer is formed between the corresponding first gold finger and the second gold finger and is continuously formed between the corresponding first groove and the second groove.
Furthermore, no conductive adhesive layer is arranged between the corresponding third groove and the corresponding fourth groove and communicated with each other.
Furthermore, the part, which is not butted with the outer edge of the binding area of the first circuit board and the second circuit board, is provided with bonding glue.
Further, the first circuit board is a flexible circuit board, and the second circuit board is a flexible circuit board or a printed circuit board.
The invention also provides a binding method for forming the binding structure of the flexible circuit board, which comprises the following steps:
providing a first circuit board and a second circuit board, placing the first circuit board and the second circuit board in a closed cavity, and vacuumizing the closed cavity;
and in a vacuum state, carrying out counterpoint crimping on the first gold finger and the second gold finger in the binding area of the first circuit board and the second circuit board, and enabling the corresponding first groove and the corresponding second groove to be counterpoint-jointed to form a vacuum first sealing cavity, and optionally, enabling the third groove and the fourth groove to be counterpoint-jointed to form a vacuum second sealing cavity.
The invention also provides a flexible device, which comprises the binding structure of the flexible circuit board.
The invention provides a binding structure and a binding method of a flexible circuit board, which comprise a first circuit board and a second circuit board, wherein a plurality of first golden fingers are distributed in a binding area of the first circuit board, a plurality of second golden fingers are distributed in a binding area of the second circuit board, a first groove is formed between the adjacent first golden fingers in the first circuit board, and a second groove is formed between the adjacent second golden fingers on the second circuit board; each first golden finger and each second golden finger counterpoint crimping one by one, corresponding first recess and second recess counterpoint joint form the first sealed chamber of vacuum, through the combined action of conducting resin layer and atmospheric pressure, have strengthened the intensity of binding of flexible circuit board, have strengthened the contact effect between the golden finger, have avoided the screen body to appear showing badly scheduling problem.
Drawings
Fig. 1 is a schematic perspective view of a bonding structure of a flexible circuit board according to the present invention;
FIG. 2 is a schematic cross-sectional view taken at A-A of FIG. 1;
FIG. 3 is a schematic perspective view of a circuit board according to a first embodiment of the present invention;
FIG. 4 is a schematic cross-sectional view of the first embodiment of the present invention before binding;
FIG. 5 is a schematic cross-sectional view taken along line B-B of FIG. 1 illustrating the first embodiment of the present invention;
FIG. 6 is a schematic perspective view of a circuit board according to a second embodiment of the present invention;
FIG. 7 is a schematic cross-sectional view of the second embodiment of the present invention before binding;
FIG. 8 is a schematic cross-sectional view taken along line B-B of FIG. 1 illustrating a second embodiment of the present invention;
fig. 9 is a flowchart of a binding method of a flexible circuit board in the present invention.
Detailed Description
To further illustrate the technical means and effects of the present invention for achieving the predetermined purpose, the following detailed description will be made with reference to the accompanying drawings and preferred embodiments of the present invention for the specific implementation, structure, features and effects of the flexible device and the binding structure and the binding method of the flexible circuit board according to the present invention:
[ first embodiment ]
As shown in fig. 1 to 5, a bonding structure of a flexible circuit board according to a first embodiment of the present invention may enhance the bonding strength of the flexible circuit board, the bonding structure includes a first circuit board 10 and a second circuit board 20, a plurality of first gold fingers 101 are arranged in a bonding region of the first circuit board 10, a plurality of second gold fingers 201 are arranged in a bonding region of the second circuit board 20, a first groove 401 is formed between adjacent first gold fingers 101 on the first circuit board 10, a second groove 402 is formed between adjacent second gold fingers 201 on the second circuit board 20, each first gold finger 101 and each second gold finger 201 are aligned and pressed one by one, and a vacuum first sealed cavity 601 is formed by aligning and bonding the corresponding first groove 401 and second groove 402.
The binding structure of the flexible circuit board can be formed by crimping each first gold finger 101 and each second gold finger 201 in a one-to-one alignment manner in a vacuum state; at this time, the corresponding first recess 401 and second recess 402 are aligned to form a vacuum first sealed cavity 601. The pressure in the vacuum first sealed cavity 601 is lower than the atmospheric pressure, which is beneficial to increasing the bonding strength of the bonding area part in the first circuit board 10 and the second circuit board 20, thereby achieving the effect of reinforcing the bonding. The first Circuit Board 10 is a Flexible Printed Circuit (FPC), and the second Circuit Board 20 may be a Flexible Circuit Board or a Printed Circuit Board (PCB).
In one embodiment, the conductive adhesive layer 30 is formed between the bonding region of the first circuit board 10 and the bonding region of the second circuit board 20, the conductive adhesive layer 30 is formed between the corresponding first gold finger 101 and the second gold finger 201 and continuously formed between the corresponding first groove 401 and the corresponding second groove 402, and the conductive adhesive layer 30 is continuously arranged between the corresponding first groove 401 and the corresponding second groove 402, which is beneficial to ensuring the conductive performance of the gold fingers. The Conductive adhesive layer 30 may be an Anisotropic Conductive Film (ACF).
In one embodiment, the first recess 401 and the second recess 402 have the same structure, wherein the first recess 401 is surrounded by a bottom wall formed by the substrate of the bonding region and side walls formed by two adjacent gold fingers and shielding walls respectively connected to corresponding ends of the two adjacent gold fingers, and the shielding walls are integrally formed with the substrate. After the binding is completed, the substrate and the shielding wall are sealed together with the first golden finger 101 and the second golden finger 201 to form a first sealed cavity 601; under the optimal condition, the first golden finger 101 on the first circuit board 10 and the corresponding second golden finger 201 on the second circuit board 20 are conductively connected together through the conductive adhesive layer 30, and the bonding force and the atmospheric pressure combined action through the conductive adhesive layer 30 achieve the effect of reinforcing the binding, the binding strength of the flexible circuit board is enhanced, the contact effect between the golden fingers is enhanced, and the problems of poor display and the like of the screen body are avoided.
In one embodiment, the bonding glue 50 is disposed on the portion of the first circuit board 10 and the portion of the second circuit board 20 where the outer edges of the bonding regions are not butted, in this embodiment, the bonding glue 50 is respectively disposed on two sides of the bonding region, so that the first circuit board 10 and the second circuit board 20 are tightly bonded, and the first gold finger 101 and the second gold finger 201 in the bonding region are sealed, thereby preventing the first gold finger 101 and the second gold finger 201 from being oxidized, and further enhancing the bonding effect. The adhesive 50 may be an Ultraviolet (UV) curable adhesive, and the adhesiveness thereof is rapidly enhanced by UV irradiation.
[ second embodiment ]
As shown in fig. 6 to 8, a bonding structure of a flexible circuit board according to a second embodiment of the present invention may enhance the bonding strength of the flexible circuit board, the bonding structure includes a first circuit board 10 and a second circuit board 20, a plurality of first gold fingers 101 are arranged in a bonding region of the first circuit board 10, a plurality of second gold fingers 201 are arranged in a bonding region of the second circuit board 20, a first groove 401 is formed between adjacent first gold fingers 101 on the first circuit board 10, a second groove 402 is formed between adjacent second gold fingers 201 on the second circuit board 20, each first gold finger 101 and each second gold finger 201 are aligned and pressed one by one, and a vacuum first sealed cavity 601 is formed by aligning and bonding the corresponding first groove 401 and second groove 402.
Further, a third groove 403 is formed in each first gold finger 101, a fourth groove 404 is formed in each second gold finger 201, and the corresponding third groove 403 and fourth groove 404 are aligned and joined to form a second vacuum sealed cavity 602.
The binding structure of the flexible circuit board can be formed by crimping each first gold finger 101 and each second gold finger 201 in a one-to-one alignment manner in a vacuum state; at this time, the corresponding first recess 401 and second recess 402 are aligned to form a vacuum first sealed cavity 601, and the corresponding third recess 403 and fourth recess 404 are aligned to form a vacuum second sealed cavity 602. The pressure in the first vacuum sealing chamber 601 and the second vacuum sealing chamber 602 is smaller than the atmospheric pressure, which is beneficial to increasing the bonding strength of the bonding area portion in the first circuit board 10 and the second circuit board 20, thereby achieving the effect of reinforcing the bonding. The first Circuit Board 10 is a Flexible Printed Circuit (FPC), and the second Circuit Board 20 may be a Flexible Circuit Board or a Printed Circuit Board (PCB).
In one embodiment, the conductive adhesive layer 30 is formed between the bonding region of the first circuit board 10 and the bonding region of the second circuit board 20, the conductive adhesive layer 30 is formed between the corresponding first gold finger 101 and the second gold finger 201 and continuously formed between the corresponding first groove 401 and the corresponding second groove 402, and the conductive adhesive layer 30 is continuously arranged between the corresponding first groove 401 and the corresponding second groove 402, which is beneficial to ensuring the conductive performance of the gold fingers. The Conductive adhesive layer 30 may be an Anisotropic Conductive Film (ACF). Preferably, the corresponding third groove 403 and the fourth groove 404 are not provided with the conductive adhesive layer 30 and are communicated with each other, and the corresponding third groove 403 and the fourth groove 404 are communicated with each other, so that the adsorption force between the corresponding first golden finger 101 and the corresponding second golden finger 201 is increased, the bonding strength of the bonding area portion of the first circuit board 10 and the second circuit board 20 is increased, and the effect of reinforcing the bonding is achieved.
In one embodiment, the first recess 401 and the second recess 402 have the same structure, wherein the first recess 401 is surrounded by a bottom wall formed by the substrate of the bonding region and side walls formed by two adjacent gold fingers and shielding walls respectively connected to corresponding ends of the two adjacent gold fingers, and the shielding walls are integrally formed with the substrate. After the binding is completed, the substrate and the shielding wall are sealed together with the first golden finger 101 and the second golden finger 201 to form a first sealed cavity 601; under the optimal condition, the first golden finger 101 on the first circuit board 10 and the corresponding second golden finger 201 on the second circuit board 20 are conductively connected together through the conductive adhesive layer 30, and the bonding force and the atmospheric pressure combined action through the conductive adhesive layer 30 achieve the effect of reinforcing the binding, the binding strength of the flexible circuit board is enhanced, the contact effect between the golden fingers is enhanced, and the problems of poor display and the like of the screen body are avoided.
In one embodiment, the third recess 403 and the fourth recess 404 have the same structure, wherein the third recess 403 extends along the length direction of the corresponding first gold finger 101. Preferably, the width of the side wall formed by extending the first groove 401 along the length direction of the first golden finger 101 is not greater than 1/6 of the whole width of the first golden finger 101, and the thickness of the side wall of the first groove 401 is smaller than that of the first golden finger 101, so that the strength of the first golden finger 101 and the second golden finger 201 is ensured, and the vacuum adsorption force is also improved.
In one embodiment, the bonding glue 50 is disposed on the portion of the first circuit board 10 and the portion of the second circuit board 20 where the outer edges of the bonding regions are not butted, in this embodiment, the bonding glue 50 is respectively disposed on two sides of the bonding region, so that the first circuit board 10 and the second circuit board 20 are tightly bonded, and the first gold finger 101 and the second gold finger 201 in the bonding region are sealed, thereby preventing the first gold finger 101 and the second gold finger 201 from being oxidized, and further enhancing the bonding effect. The adhesive 50 may be an Ultraviolet (UV) curable adhesive, and the adhesiveness thereof is rapidly enhanced by UV irradiation.
This second embodiment adds a second sealed cavity 602 within each first gold finger 101 and each second gold finger 201, further increasing the strength of the bond, compared to the first embodiment.
[ third embodiment ]
As shown in fig. 9, the present invention further provides a method for binding the binding structure of the flexible circuit board, which can enhance the binding strength of the flexible circuit board, the method comprising:
providing a first circuit board 10 and a second circuit board 20, placing the first circuit board 10 and the second circuit board 20 in a closed cavity, and vacuumizing the closed cavity;
under the condition that the closed cavity is in a vacuum state, the first gold finger 101 and the second gold finger 201 in the binding area of the first circuit board 10 and the second circuit board 20 are in counterpoint crimping, and the corresponding first groove 401 and the corresponding second groove 402 are in counterpoint bonding to form a vacuum first sealing cavity 601; when the third groove 403 is formed in the first gold finger 101 and the fourth groove 404 is formed in the second gold finger 201, the corresponding third groove 403 and the corresponding fourth groove 404 are aligned and bonded to form a second vacuum sealed cavity 602;
after the bonding is completed, the first circuit board 10 and the second circuit board 20 are taken out from the sealed cavity, and the first sealed cavity 601 and the second sealed cavity 602 are kept in a vacuum state.
The binding method provided in this embodiment is the same as the binding structure described above, and for further details of the binding method, reference may be made to the description of the binding structure described above, which is not described herein again.
The present invention also provides a flexible device, including the above binding structure of the flexible circuit board, wherein the flexible device may be a display device, such as an AMOLED (organic light emitting diode display device).
In this document, the terms upper, lower, left, right, front, rear and the like are used for defining the positions of the structures in the drawings and the positions of the structures relative to each other, and are only used for the clarity and convenience of the technical solution. It is to be understood that the use of the directional terms should not be taken to limit the scope of the claims.
Although the present invention has been described with reference to the preferred embodiments, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (9)

1. A binding structure of a flexible circuit board comprises a first circuit board (10) and a second circuit board (20), wherein a plurality of first golden fingers (101) are arranged in a binding area of the first circuit board (10), and a plurality of second golden fingers (201) are arranged in a binding area of the second circuit board (20), and is characterized in that a first groove (401) is formed between adjacent first golden fingers (101) in the first circuit board (10), and a second groove (402) is formed between adjacent second golden fingers (201) on the second circuit board (20); each first golden finger (101) and each second golden finger (201) are in one-to-one contraposition compression joint, a first vacuum sealing cavity (601) is formed by contraposition joint of a corresponding first groove (401) and a corresponding second groove (402), the first groove (401) and the second groove (402) are identical in structure, wherein the first groove (401) is surrounded by a base of a binding area as a bottom wall, two adjacent golden fingers and shielding walls respectively connected with corresponding ends of the two adjacent golden fingers as side walls.
2. The bonding structure of the flexible circuit board according to claim 1, wherein a third groove (403) is formed in each first gold finger (101), a fourth groove (404) is formed in each second gold finger (201), and the corresponding third groove (403) and fourth groove (404) are aligned and combined to form a second vacuum sealed cavity (602).
3. The bonding structure of the flexible circuit board according to claim 2, wherein the third groove (403) and the fourth groove (404) have the same structure, and the third groove (403) extends along the length direction of the corresponding first gold finger (101).
4. The bonding structure of a flexible circuit board according to any one of claims 1 to 3, wherein a conductive adhesive layer (30) is formed between the bonding region of the first circuit board (10) and the bonding region of the second circuit board (20), and the conductive adhesive layer (30) is formed between the respective first gold finger (101) and the second gold finger (201) and is continuously formed between the respective first groove (401) and the second groove (402).
5. The binding structure of the flexible circuit board according to claim 4, wherein the corresponding third groove (403) and the corresponding fourth groove (404) are not provided with the conductive adhesive layer (30) and are communicated with each other.
6. The binding structure of a flexible circuit board according to any one of claims 1 to 3, wherein the portion of the first circuit board (10) and the second circuit board (20) where the outer edges of the bound region do not abut is provided with an adhesive (50).
7. The binding structure of a flexible circuit board according to any one of claims 1 to 3, wherein the first circuit board (10) is a flexible circuit board, and the second circuit board (20) is a flexible circuit board or a printed circuit board.
8. A bonding method of forming a bonding structure of a flexible circuit board according to any one of claims 1 to 7, the method comprising:
providing a first circuit board (10) and a second circuit board (20), placing the first circuit board (10) and the second circuit board (20) in a closed cavity, and vacuumizing the closed cavity;
a third groove (403) is formed in each first golden finger (101), and a fourth groove (404) is formed in each second golden finger (201);
and in a vacuum state, carrying out counterpoint crimping on the first gold finger (101) and the second gold finger (201) in the binding area of the first circuit board (10) and the second circuit board (20), and enabling the corresponding first groove (401) and the corresponding second groove (402) to be counterpoint bonded to form a vacuum first sealed cavity (601), and optionally enabling the third groove (403) and the fourth groove (404) to be counterpoint bonded to form a vacuum second sealed cavity (602).
9. A flexible device, characterized in that the flexible device comprises a binding structure of the flexible circuit board according to any one of claims 1 to 7.
CN201810054491.6A 2018-01-19 2018-01-19 Binding structure and binding method of flexible circuit board and flexible device Active CN108471671B (en)

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CN109041448B (en) * 2018-09-26 2020-05-12 深圳市致竑光电有限公司 Bonding method of FPC (Flexible printed Circuit) of luminescent glass
CN113168790A (en) * 2018-12-19 2021-07-23 深圳市柔宇科技股份有限公司 Flexible panel and manufacturing method thereof
CN113010054B (en) * 2021-04-20 2022-07-05 广州视源电子科技股份有限公司 Binding method of capacitive screen
CN113624809A (en) * 2021-07-28 2021-11-09 厦门市铂联科技股份有限公司 UV glue curing detection method
CN113825304B (en) * 2021-09-30 2024-01-12 惠科股份有限公司 Circuit board structure and display device

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JP2857537B2 (en) * 1992-05-22 1999-02-17 アルプス電気株式会社 Liquid crystal display
CN101807371B (en) * 2010-04-07 2011-09-28 苏州凯蒂亚半导体制造设备有限公司 Position precorrection device in ACF attaching equipment of flat-panel display
CN203658693U (en) * 2013-11-27 2014-06-18 浙江金徕镀膜有限公司 Pressing and connecting device for flexible printed circuit board
CN205755053U (en) * 2015-11-30 2016-11-30 厦门天马微电子有限公司 A kind of printed circuit board (PCB) and display device
CN105974675B (en) * 2016-07-13 2019-02-19 深圳市华星光电技术有限公司 Flexible display panels and preparation method thereof

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