CN108471671A - The binding structure and binding method and flexible device of flexible PCB - Google Patents
The binding structure and binding method and flexible device of flexible PCB Download PDFInfo
- Publication number
- CN108471671A CN108471671A CN201810054491.6A CN201810054491A CN108471671A CN 108471671 A CN108471671 A CN 108471671A CN 201810054491 A CN201810054491 A CN 201810054491A CN 108471671 A CN108471671 A CN 108471671A
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- Prior art keywords
- groove
- circuit board
- binding
- golden finger
- flexible pcb
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/09172—Notches between edge pads
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Combinations Of Printed Boards (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a kind of binding structures of flexible PCB, including first circuit board and second circuit board, multiple first golden fingers are placed in the binding area of first circuit board, multiple second golden fingers are placed in the binding area of second circuit board, it is formed with the first groove in first circuit board between the first adjacent golden finger, the second groove is formed between the second adjacent golden finger on second circuit board；Each first golden finger and each second golden finger align crimping one by one, and corresponding first groove and the contraposition engagement of the second groove form the first annular seal space of vacuum.The binding structure is by under the collective effect of conductive adhesive layer and atmospheric pressure, strengthening the binding intensity of flexible PCB.The invention also discloses a kind of binding method of binding structure forming above-mentioned flexible PCB and the flexible device of the binding structure including above-mentioned flexible PCB.
Description
Technical field
The present invention relates to binding technology fields, more particularly to a kind of binding structure of flexible PCB and binding side
Method and flexible device.
Background technology
Flexible PCB is that have height reliability as one kind made of base material using polyimides or polyester film, excellent
Flexible printed circuit.Abbreviation soft board or FPC (Flexible Printed Circuit, flexible PCB) have wiring
The feature that density is high, light-weight, thickness is thin, bending is good.Currently, flexible PCB be widely used in mobile phone, laptop,
In the electronic products such as tablet computer, digital camera.
It refers in the production process of display, by FPC and panel (Panel) to bind (Bonding)) or FPC and printing
Circuit board (Printed Circuit Board, PCB) passes through conducting resinl (Anisotropic Conductive Film, ACF)
The process for being grouped together and being connected according to certain workflow is the technique that display module factory generally uses.
But in the prior art, because FPC is flexible material, in binding module technique, easily brought by temperature change
Influence, it may appear that expansion, shrink phenomena such as, cause golden finger contact effect it is bad, cause binding after signal connect transmission it is bad, screen
It is bad that display occurs in body.
Invention content
In order to overcome shortcoming and defect existing in the prior art, the purpose of the present invention is to provide a kind of flexible PCBs
Binding structure and binding method and flexible device enhance connecing between golden finger to reinforce the binding intensity of flexible PCB
Effect is touched, screen body is avoided the problems such as display is bad occur.
The purpose of the invention is achieved by the following technical solution：
The present invention provides a kind of binding structure of flexible PCB, including first circuit board and second circuit board, and described
It is placed with multiple first golden fingers in the binding area of one circuit board, multiple second are placed in the binding area of the second circuit board
Golden finger, is formed with the first groove in the first circuit board between the first adjacent golden finger, phase on the second circuit board
It is formed with the second groove between the second adjacent golden finger；Each first golden finger and each second golden finger align pressure one by one
It connects, corresponding first groove and the contraposition of the second groove engage the first annular seal space for forming vacuum.
Further, first groove is identical as second groove structure, wherein first groove is to bind area
Substrate be bottom wall, block respectively with two adjacent golden fingers and with what the respective end of two adjacent golden fingers was connected
Wall surrounds for side wall, and the shelter wall is integrally formed with the substrate.
Further, it is formed with third groove in each first golden finger, is formed in each second golden finger
Four grooves, third groove and the contraposition of the 4th groove on corresponding first golden finger and the second golden finger, which combine, forms the of vacuum
Two seal chambers.
Further, the third groove is identical with the 4th groove structure, wherein the third groove is along corresponding
The length direction of one golden finger extends.
Further, it is formed with and leads between the binding area of the first circuit board and the binding area of the second circuit board
Electric glue-line, the conductive adhesive layer are formed between corresponding first golden finger and the second golden finger, and are continuously formed in corresponding
The first groove and the second groove between.
Further, conductive adhesive layer is not set between corresponding third groove and the 4th groove and is connected.
Further, the undocked part of the outer edge in the binding area of the first circuit board and the second circuit board is set
There is bonded adhesives.
Further, the first circuit board is flexible PCB, and the second circuit board is flexible PCB or printing
Circuit board.
The present invention also provides a kind of binding method for the binding structure forming above-mentioned flexible PCB, the method packets
It includes：
First circuit board and second circuit board are provided, the first circuit board and the second circuit board are placed in confined air
Intracavitary carries out vacuumize process to the closed cavity；
Under vacuum conditions, by first golden finger in the binding area of the first circuit board and the second circuit board and the
Two golden fingers carry out contraposition crimping, and corresponding first groove and the contraposition engagement of the second groove is made to form the first sealing of vacuum
Chamber and optional third groove and the contraposition engagement of the 4th groove form the second seal chamber of vacuum.
The present invention also provides a kind of flexible device, the flexible device includes the binding knot of above-mentioned flexible PCB
Structure.
The binding structure and binding method of flexible PCB provided by the invention, including first circuit board and second circuit
Plate is placed with multiple first golden fingers in the binding area of the first circuit board, arranges in the binding area of the second circuit board
There are multiple second golden fingers, is formed with the first groove in the first circuit board between the first adjacent golden finger, described second
On circuit board the second groove is formed between the second adjacent golden finger；Each first golden finger and each second golden finger
Contraposition crimping one by one, corresponding first groove and the contraposition engagement of the second groove form the first annular seal space of vacuum, pass through conducting resinl
The collective effect of layer and atmospheric pressure, strengthens the binding intensity of flexible PCB, enhances the contact effect between golden finger,
It avoids screen body and the problems such as display is bad occurs.
Description of the drawings
Fig. 1 is the dimensional structure diagram of the binding structure of flexible PCB in the present invention；
Fig. 2 is the cross section structure schematic diagram at A-A in Fig. 1；
Fig. 3 is the dimensional structure diagram of circuit board in first embodiment of the invention；
Fig. 4 is the cross section structure schematic diagram before being bound in first embodiment of the invention；
Fig. 5 is cross section structure schematic diagram of the first embodiment of the invention along Fig. 1 at B-B；
Fig. 6 is the dimensional structure diagram of circuit board in second embodiment of the invention；
Fig. 7 is the cross section structure schematic diagram before being bound in second embodiment of the invention；
Fig. 8 is cross section structure schematic diagram of the second embodiment of the invention along Fig. 1 at B-B；
Fig. 9 is the flow chart of the binding method of flexible PCB in the present invention.
Specific implementation mode
It is of the invention to reach the technological means and effect that predetermined goal of the invention is taken further to illustrate, below in conjunction with
Attached drawing and preferred embodiment, to the binding structure of flexible PCB and binding method that propose according to the present invention and flexible device
Specific implementation mode, structure, feature and its effect, detailed description are as follows：
[first embodiment]
As shown in Figures 1 to 5, the binding structure for the flexible PCB that first embodiment of the invention provides, can reinforce flexibility
The binding intensity of circuit board, the binding structure include first circuit board 10 and second circuit board 20, the first circuit board 10
Binding area in be placed with multiple first golden fingers 101, multiple second gold medals are placed in the binding area of the second circuit board 20
Finger 201, is formed with the first groove 401 on first circuit board 10 between the first adjacent golden finger 101, on second circuit board 20
The second groove 402, each first golden finger 101 and each second gold medal hand are formed between the second adjacent golden finger 201
Refer to 201 contraposition crimping one by one, the contraposition engagement of 401 and second groove 402 of corresponding first groove forms the first annular seal space of vacuum
601。
The binding structure of above-mentioned flexible PCB can be by under vacuum conditions, by each first golden finger, 101 He
Each second golden finger 201 aligns crimping one by one；At this point, 401 and second groove 402 of corresponding first groove contraposition engagement shape
At the first annular seal space 601 of vacuum.And the pressure in the first annular seal space 601 of vacuum is less than atmospheric pressure, is conducive to increase by first
The bond strength of area part is bound in circuit board 10 and second circuit board 20, and then achievees the effect that reinforce binding.Wherein, first
Circuit board 10 is flexible PCB (Flexible Printed Circuit, FPC), and second circuit board 20 can be flexible circuit
Plate, or printed circuit board (Printed Circuit Board, PCB).
In one of the embodiments, in the binding in the binding area and the second circuit board 20 of the first circuit board 10
Conductive adhesive layer 30 is formed between area, the conductive adhesive layer 30 is formed in 101 and second golden finger 201 of corresponding first golden finger
Between, and be continuously formed between 401 and second groove 402 of corresponding first groove, conductive adhesive layer 30 is corresponding first
It continuously arranges between groove 401 and the second groove 402, advantageously ensures that the electric conductivity of golden finger.Conductive adhesive layer 30 can be
Anisotropy conductiving glue (Anisotropic Conductive Film, ACF).
The first groove 401 is identical as 402 structure of the second groove in one of the embodiments, wherein the first groove 401 with
The substrate for binding area is bottom wall, is connected respectively with two adjacent golden fingers and with the respective end of two adjacent golden fingers
Shelter wall surrounded for side wall, shelter wall and substrate are integrally formed.After the completion of binding, substrate and shelter wall and the first golden finger
101 and second golden finger 201 seal form first annular seal space 601 together；Under preferable case, first on first circuit board 10
Second golden finger 201 corresponding on second circuit board 20 of golden finger 101 is electrically connected together by conductive adhesive layer 30, is passed through
The bonding force and atmospheric pressure collective effect of conductive adhesive layer 30 achieve the effect that reinforce binding, reinforce the binding of flexible PCB
Intensity enhances the contact effect between golden finger, and screen body is avoided the problems such as display is bad occur.
The outer edge in the binding area of first circuit board 10 and second circuit board 20 is undocked in one of the embodiments,
Part is equipped with bonded adhesives 50, and in the present embodiment, bonded adhesives 50 is separately positioned on the both sides in binding area, makes 10 He of first circuit board
20 close adhesion of second circuit board, to binding area in the first golden finger 101 and the second golden finger 201 play sealing function, prevent
Only the first golden finger 101 and the second golden finger 201 are aoxidized, while also further enhancing binding effect.Wherein, bonded adhesives 50
It can be ultraviolet curing glue (Ultraviolet Ray, UV) glue, quickly enhance its viscosity by ultraviolet illumination.
[second embodiment]
As shown in Figure 6 to 8, the binding structure for the flexible PCB that second embodiment of the invention provides, can reinforce flexibility
The binding intensity of circuit board, the binding structure include first circuit board 10 and second circuit board 20, the first circuit board 10
Binding area in be placed with multiple first golden fingers 101, multiple second gold medals are placed in the binding area of the second circuit board 20
Finger 201, is formed with the first groove 401 on first circuit board 10 between the first adjacent golden finger 101, on second circuit board 20
The second groove 402, each first golden finger 101 and each second gold medal hand are formed between the second adjacent golden finger 201
Refer to 201 contraposition crimping one by one, the contraposition engagement of 401 and second groove 402 of corresponding first groove forms the first annular seal space of vacuum
601。
Further, third groove 403 is formed in each first golden finger 101, in each second golden finger 201
It is formed with the 4th groove 404, the contraposition engagement of 403 and the 4th groove 404 of corresponding third groove forms the second seal chamber of vacuum
602。
The binding structure of above-mentioned flexible PCB can be by under vacuum conditions, by each first golden finger, 101 He
Each second golden finger 201 aligns crimping one by one；At this point, 401 and second groove 402 of corresponding first groove contraposition engagement shape
At the first annular seal space 601 of vacuum, the contraposition engagement of 403 and the 4th groove 404 of corresponding third groove forms the second close of vacuum
Seal chamber 602.And the pressure in the first annular seal space 601 of vacuum and the second seal chamber 602 is less than atmospheric pressure, is conducive to increase by first
The bond strength of area part is bound in circuit board 10 and second circuit board 20, and then achievees the effect that reinforce binding.Wherein, first
Circuit board 10 is flexible PCB (Flexible Printed Circuit, FPC), and second circuit board 20 can be flexible circuit
Plate, or printed circuit board (Printed Circuit Board, PCB).
In one of the embodiments, in the binding in the binding area and the second circuit board 20 of the first circuit board 10
Conductive adhesive layer 30 is formed between area, the conductive adhesive layer 30 is formed in 101 and second golden finger 201 of corresponding first golden finger
Between, and be continuously formed between 401 and second groove 402 of corresponding first groove, conductive adhesive layer 30 is corresponding first
It continuously arranges between groove 401 and the second groove 402, advantageously ensures that the electric conductivity of golden finger.Conductive adhesive layer 30 can be
Anisotropy conductiving glue (Anisotropic Conductive Film, ACF).Under preferable case, corresponding third groove 403
And the 4th conductive adhesive layer 30 is not arranged between groove 404 and is connected, by making 403 and the 4th groove of corresponding third groove
It is connected between 404, is conducive to increase the adsorption capacity between 101 and second golden finger 201 of corresponding first golden finger, and then increase
The bond strength of area part is bound in first circuit board 10 and second circuit board 20, and then achievees the effect that reinforce binding.
The first groove 401 is identical as 402 structure of the second groove in one of the embodiments, wherein the first groove 401 with
The substrate for binding area is bottom wall, is connected respectively with two adjacent golden fingers and with the respective end of two adjacent golden fingers
Shelter wall surrounded for side wall, shelter wall and substrate are integrally formed.After the completion of binding, substrate and shelter wall and the first golden finger
101 and second golden finger 201 seal form first annular seal space 601 together；Under preferable case, first on first circuit board 10
Second golden finger 201 corresponding on second circuit board 20 of golden finger 101 is electrically connected together by conductive adhesive layer 30, is passed through
The bonding force and atmospheric pressure collective effect of conductive adhesive layer 30 achieve the effect that reinforce binding, reinforce the binding of flexible PCB
Intensity enhances the contact effect between golden finger, and screen body is avoided the problems such as display is bad occur.
Third groove 403 is identical with 404 structure of the 4th groove in one of the embodiments, wherein 403 edge of third groove
The length direction of corresponding first golden finger 101 extends.Preferably, length direction of first groove 401 along the first golden finger 101
The width of the side wall extended to form is not more than the 1/6 of 101 overall width of the first golden finger, and the thickness of 401 side wall of the first groove is small
In the thickness of the first golden finger 101, the intensity of the first golden finger 101 and the second golden finger 201 ensure that, while also improving true
The attached dynamics of suction.
The outer edge in the binding area of first circuit board 10 and second circuit board 20 is undocked in one of the embodiments,
Part is equipped with bonded adhesives 50, and in the present embodiment, bonded adhesives 50 is separately positioned on the both sides in binding area, makes 10 He of first circuit board
20 close adhesion of second circuit board, to binding area in the first golden finger 101 and the second golden finger 201 play sealing function, prevent
Only the first golden finger 101 and the second golden finger 201 are aoxidized, while also further enhancing binding effect.Wherein, bonded adhesives 50
It can be ultraviolet curing glue (Ultraviolet Ray, UV) glue, quickly enhance its viscosity by ultraviolet illumination.
This second embodiment is compared with first embodiment, in each first golden finger 101 and each second golden finger 201
The second seal chamber 602 is inside increased, the intensity of binding is further increased.
[3rd embodiment]
As shown in figure 9, the present invention also provides the binding method of the binding structure of above-mentioned flexible PCB, flexible electrical can be reinforced
The binding intensity of road plate, the method includes：
First circuit board 10 and second circuit board 20 are provided, first circuit board 10 and second circuit board 20 are placed in confined air
Intracavitary carries out vacuumize process to closed cavity；
In the case where closed cavity is in vacuum state, by first gold medal in the binding area of first circuit board 10 and second circuit board 20
Finger 101 and the second golden finger 201 carry out contraposition crimping, and the contraposition of 401 and second groove 402 of corresponding first groove is connect
Close the formation first annular seal space 601 for forming vacuum；When being formed with third groove 403, the second golden finger in the first golden finger 101
When being formed with four grooves 404 in 201, the contraposition engagement of 403 and the 4th groove 404 of corresponding third groove forms the second of vacuum
Seal chamber 602；
After the completion of binding, first circuit board 10 and second circuit board 20 are taken out from closed cavity, first annular seal space 601
Vacuum state is kept with the second seal chamber 602.
Binding method provided in this embodiment belongs to same design with above-mentioned binding structure, about the more of binding method
Details may refer to the description of above-mentioned binding structure, and details are not described herein.
The present invention also provides the binding structures of a kind of flexible device, including above-mentioned flexible PCB, wherein the flexibility
Device can be display device, for example, AMOLED (organic LED display device).
Herein, the nouns of locality such as involved up, down, left, right, before and after be with the structure in attached drawing be located in figure with
And structure mutual position defines, only for the purpose of expressing the technical solution clearly and conveniently.It should be appreciated that the side
The use of position word should not limit the claimed range of the application.
The above described is only a preferred embodiment of the present invention, restriction in any form not is done to the present invention, though
So the present invention has been disclosed as a preferred embodiment, and however, it is not intended to limit the invention, any technology people for being familiar with this profession
Member, without departing from the scope of the present invention, when the technology contents using the disclosure above make a little change or modification,
For the equivalent embodiment of equivalent variations, as long as be without departing from technical solution of the present invention content, it is right according to the technical essence of the invention
Any simple modification, equivalent change and modification made by above example still fall within the protection domain of technical solution of the present invention
Within.
Claims (10)
1. a kind of binding structure of flexible PCB, including first circuit board (10) and second circuit board (20), first electricity
It is placed with multiple first golden fingers (101) in the binding area of road plate (10), arranges in the binding area of the second circuit board (20)
Have multiple second golden fingers (201), which is characterized in that in the first circuit board (10) adjacent the first golden finger (101) it
Between be formed with the first groove (401), be formed with second between adjacent the second golden finger (201) on the second circuit board (20)
Groove (402)；Each first golden finger (101) and each second golden finger (201) align crimping one by one, and corresponding first
Groove (401) and the second groove (402) contraposition engagement form the first annular seal space (601) of vacuum.
2. the binding structure of flexible PCB according to claim 1, which is characterized in that first groove (401) with
Second groove (402) structure is identical, wherein first groove (401) is to bind the substrate in area as bottom wall, with adjacent
Two golden fingers and the shelter wall being connected respectively with the respective end of two adjacent golden fingers surround for side wall, described to block
Wall is integrally formed with the substrate.
3. the binding structure of flexible PCB according to claim 1, which is characterized in that each first golden finger
(101) it is formed with third groove (403) in, is formed with the 4th groove (404) in each second golden finger (201), accordingly
Third groove (403) and the contraposition of the 4th groove (404) combine the second seal chamber (602) for forming vacuum.
4. the binding structure of flexible PCB according to claim 3, which is characterized in that the third groove (403) and
4th groove (404) structure is identical, wherein length of the third groove (403) along corresponding first golden finger (101)
Direction extends.
5. the binding structure of flexible PCB as claimed in any of claims 1 to 4, which is characterized in that described
It is formed with conductive adhesive layer (30) between the binding area and the binding area of the second circuit board (20) of first circuit board (10), it is described
Conductive adhesive layer (30) is formed between corresponding first golden finger (101) and the second golden finger (201), and is continuously formed in phase
Between the first groove (401) answered and the second groove (402).
6. the binding structure of flexible PCB according to claim 5, which is characterized in that corresponding third groove (403)
And the 4th conductive adhesive layer (30) is not arranged between groove (404) and is connected.
7. the binding structure of flexible PCB as claimed in any of claims 1 to 4, which is characterized in that described
The part that the outer edge in the binding area of one circuit board (10) and the second circuit board (20) is undocked is equipped with bonded adhesives (50).
8. the binding structure of flexible PCB as claimed in any of claims 1 to 4, which is characterized in that described
One circuit board (10) is flexible PCB, and the second circuit board (20) is flexible PCB or printed circuit board.
9. a kind of binding method for the binding structure forming the flexible PCB described in any one of claim 1 to 8, special
Sign is, the method includes：
First circuit board (10) and second circuit board (20) are provided, by the first circuit board (10) and the second circuit board
(20) it is placed in closed cavity, vacuumize process is carried out to the closed cavity；
Under vacuum conditions, by first golden finger in the binding area of the first circuit board (10) and the second circuit board (20)
(101) and the second golden finger (201) carries out contraposition crimping, and makes corresponding first groove (401) and the second groove (402) right
Position engagement forms the first annular seal space (601) of vacuum and optionally third groove (403) and the contraposition of the 4th groove (404) connect
Close the second seal chamber (602) for forming vacuum.
10. a kind of flexible device, which is characterized in that the flexible device includes described in any one of claim 1 to 8
The binding structure of flexible PCB.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810054491.6A CN108471671B (en) | 2018-01-19 | 2018-01-19 | Binding structure and binding method of flexible circuit board and flexible device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810054491.6A CN108471671B (en) | 2018-01-19 | 2018-01-19 | Binding structure and binding method of flexible circuit board and flexible device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108471671A true CN108471671A (en) | 2018-08-31 |
| CN108471671B CN108471671B (en) | 2020-04-24 |
Family
ID=63266002
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810054491.6A Active CN108471671B (en) | 2018-01-19 | 2018-01-19 | Binding structure and binding method of flexible circuit board and flexible device |
Country Status (1)
| Country | Link |
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| CN (1) | CN108471671B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109041448A (en) * | 2018-09-26 | 2018-12-18 | 深圳市致竑光电有限公司 | A kind of adhering method of the FPC of fluorescent glass |
| CN113010054A (en) * | 2021-04-20 | 2021-06-22 | 广州视源电子科技股份有限公司 | Binding method of capacitive screen |
| CN113168790A (en) * | 2018-12-19 | 2021-07-23 | 深圳市柔宇科技股份有限公司 | Flexible panel and manufacturing method thereof |
| CN113624809A (en) * | 2021-07-28 | 2021-11-09 | 厦门市铂联科技股份有限公司 | UV glue curing detection method |
| CN113825304A (en) * | 2021-09-30 | 2021-12-21 | 惠科股份有限公司 | Circuit board structure and display device |
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| JPH05323346A (en) * | 1992-05-22 | 1993-12-07 | Alps Electric Co Ltd | Liquid crystal display device |
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| CN203658693U (en) * | 2013-11-27 | 2014-06-18 | 浙江金徕镀膜有限公司 | Pressing and connecting device for flexible printed circuit board |
| CN105974675A (en) * | 2016-07-13 | 2016-09-28 | 深圳市华星光电技术有限公司 | Flexible display panel and manufacturing method thereof |
| CN205755053U (en) * | 2015-11-30 | 2016-11-30 | 厦门天马微电子有限公司 | A kind of printed circuit board (PCB) and display device |
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| JPH05323346A (en) * | 1992-05-22 | 1993-12-07 | Alps Electric Co Ltd | Liquid crystal display device |
| CN101807371A (en) * | 2010-04-07 | 2010-08-18 | 苏州凯蒂亚半导体制造设备有限公司 | Position precorrection device in ACF attaching equipment of flat-panel display |
| CN203658693U (en) * | 2013-11-27 | 2014-06-18 | 浙江金徕镀膜有限公司 | Pressing and connecting device for flexible printed circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109041448A (en) * | 2018-09-26 | 2018-12-18 | 深圳市致竑光电有限公司 | A kind of adhering method of the FPC of fluorescent glass |
| CN113168790A (en) * | 2018-12-19 | 2021-07-23 | 深圳市柔宇科技股份有限公司 | Flexible panel and manufacturing method thereof |
| CN113010054A (en) * | 2021-04-20 | 2021-06-22 | 广州视源电子科技股份有限公司 | Binding method of capacitive screen |
| CN113624809A (en) * | 2021-07-28 | 2021-11-09 | 厦门市铂联科技股份有限公司 | UV glue curing detection method |
| CN113825304A (en) * | 2021-09-30 | 2021-12-21 | 惠科股份有限公司 | Circuit board structure and display device |
| CN113825304B (en) * | 2021-09-30 | 2024-01-12 | 惠科股份有限公司 | Circuit board structure and display device |
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| Publication number | Publication date |
|---|---|
| CN108471671B (en) | 2020-04-24 |
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