CN110825268A - Touch module, touch display device and electronic equipment - Google Patents
Touch module, touch display device and electronic equipment Download PDFInfo
- Publication number
- CN110825268A CN110825268A CN201911100299.7A CN201911100299A CN110825268A CN 110825268 A CN110825268 A CN 110825268A CN 201911100299 A CN201911100299 A CN 201911100299A CN 110825268 A CN110825268 A CN 110825268A
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- CN
- China
- Prior art keywords
- touch
- substrate
- area
- pads
- circuit board
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
Abstract
The invention relates to a touch module, comprising: a touch panel; the flexible circuit board comprises a substrate and a covering layer which are arranged in a stacked mode, wherein the substrate comprises a first area and a second area, the covering layer is arranged in the second area, and a plurality of openings are formed in the joint of the first area and the second area; and the anisotropic conductive adhesive layer is arranged between the touch panel and the substrate so as to enable the touch panel to be conducted with the flexible circuit board, and the anisotropic conductive adhesive layer can overflow from the opening after being heated and melted. According to the touch module, the opening is formed in the joint of the first area and the second area of the substrate, and the liquid anisotropic conductive adhesive can overflow from the opening in the process of diffusing along the covering layer, so that the conductive particles in the ACF are effectively prevented from being gathered between two adjacent welding pads on the flexible circuit board under the condition that the wiring space of the flexible circuit board is not changed, and the product yield is improved.
Description
Technical Field
The present invention relates to the field of touch display technologies, and in particular, to a touch module, a touch display device, and an electronic apparatus.
Background
When a Bonding pad (Bonding pad) on a Flexible Printed Circuit (FPC) is attached to a touch panel by hot pressing, an overflow of adhesive inevitably occurs between the FPC and the touch panel, that is, an anisotropic conductive adhesive layer located between the FPC and the touch panel is heated and melted and then overflows from a joint of the FPC and the touch panel under an extrusion action of a hot pressing head. When more conductive particles are accumulated at the overflow position, a short circuit is easily generated between two adjacent welding pads, and the product yield is affected.
Disclosure of Invention
Therefore, it is necessary to provide a touch module, a touch display device and an electronic apparatus for solving the problem of short circuit between two adjacent pads caused by more conductive particles gathered at the glue overflow position.
A touch module includes:
a touch panel;
the flexible circuit board comprises a substrate and a covering layer which are arranged in a stacked mode, wherein the substrate comprises a first area and a second area, the covering layer is arranged in the second area, and a plurality of openings are formed in the joint of the first area and the second area; and
the anisotropic conductive adhesive layer is arranged between the touch panel and the substrate so as to enable the touch panel to be conducted with the flexible circuit board, and the anisotropic conductive adhesive layer can overflow from the opening after being heated and melted.
According to the touch module, the opening is formed in the joint of the first area and the second area of the substrate, and the liquid anisotropic conductive adhesive can overflow from the opening in the process of diffusing along the covering layer, so that the conductive particles in the ACF are effectively prevented from being gathered between two adjacent welding pads on the flexible circuit board under the condition that the wiring space of the flexible circuit board is not changed, and the product yield is improved.
In one embodiment, the flexible circuit board includes a plurality of first pads disposed on the substrate, the number of the first pads is at least 2, and the opening is located between every two adjacent first pads.
In one embodiment, the size of the opening is smaller than the distance between two adjacent first bonding pads.
In one embodiment, the first pad extends from the first region into the second region.
In one embodiment, the shape of the opening comprises a circle, an ellipse, a triangle, a square, or a rectangle.
In one embodiment, the touch panel includes a substrate, a plurality of second pads and a touch electrode layer, the second pads and the touch electrode layer are disposed on the substrate, and the second pads are electrically connected to the touch electrode layer.
In one embodiment, the method further comprises at least one of the following steps:
the touch module further comprises an optical adhesive layer and a protective cover plate, wherein the optical adhesive layer is arranged on the surface, far away from the substrate, of the touch electrode layer; and
the touch module further comprises an insulating glue protective layer covering the touch electrode layer.
In one embodiment, the opening has two continuous portions, one of which is located in the first region and the other of which is located in the second region and is blocked by the cover layer.
A preparation method of a touch display device comprises the following steps:
providing the touch module, and performing hot-pressing binding on the touch panel and the flexible circuit board to obtain a finished touch module;
and attaching the touch module finished product to a display module to obtain the touch display device.
An electronic device comprises the touch display device manufactured by the manufacturing method.
Drawings
Fig. 1 is a schematic structural diagram of a touch display device in an embodiment;
fig. 2 is a front view of a substrate and first pads of a flexible circuit board in the touch display device shown in fig. 1;
FIG. 3 is an enlarged view taken at A in FIG. 1;
FIG. 4 is a cross-sectional view taken along line B-B of FIG. 2;
fig. 5 is a design of a binding scheme between a touch panel and a flexible circuit board in the prior art.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1, a touch display device 100 includes a display module 10 and a touch module 20, wherein the touch module 20 is attached to the display module 10. The Display module 10 may be a liquid crystal Display (lcd) or an organic electroluminescent Display (OLED).
Referring to fig. 1 and fig. 2, the touch module 20 includes a touch panel 21, a flexible circuit board 22 and an anisotropic conductive adhesive layer 23, the flexible circuit board 22 includes a substrate 221 and a cover layer 222, which are stacked, the substrate 221 includes a first region 221a and a second region 221b, the cover layer 222 is disposed in the second region 221b, and a plurality of openings 221c are disposed at a connection position of the first region 221a and the second region 221 b; the anisotropic conductive adhesive layer 23 is located between the touch panel 21 and the substrate 221, so that the touch panel 21 is electrically connected to the flexible circuit board 22, and the anisotropic conductive adhesive layer 23 can overflow from the opening 221c after being heated and melted.
In one embodiment, the flexible circuit board 22 is a double-layer board, and the cover layer 222 is made of the same material as the substrate 221, referring to fig. 3, an adhesive layer 224 is disposed between the substrate 221 and the cover layer 222 for adhering the substrate 221 and the cover layer 222 together. In other embodiments, the flexible circuit board 22 is a single layer board, and the covering layer 222 is a sprayed protective layer covering the area where the circuit is formed on the substrate 221, which not only saves materials, but also achieves a better sealing effect for the circuit.
Specifically, referring to fig. 3, a first Bonding pad 223 is disposed on the substrate 221, a plurality of second Bonding pads 211(Bonding pads) are disposed on the touch panel 21, and the flexible circuit board 22 and the touch panel 21 are electrically connected through the first Bonding pad 223 and the second Bonding pads 211.
In order to realize the conduction between the flexible circuit board 22 and the touch panel 21, a hot-pressing binding operation is required, which includes the following steps: firstly, forming an anisotropic conductive adhesive layer 23 on the touch panel 21 by means of pasting or printing coating, wherein the anisotropic conductive adhesive layer 23 covers the second bonding pads 211 of the touch panel 21; then, the flexible circuit board 22 is brought close to the touch panel 21, and the first pads 223 on the flexible circuit board 22 are aligned with the second pads 211 on the touch panel 21; finally, the bonding head is pressed on the surface of the substrate 221 of the flexible circuit board 22, which is away from the first bonding pad 223, and the second bonding pad 211 and the first bonding pad 223 are subjected to thermocompression.
In the hot pressing and attaching process, the anisotropic conductive adhesive layer 23 located between the second bonding pad 211 and the first bonding pad 223 is heated and melted, and under the pressure of the hot pressing head, the distance between the first bonding pad 223 and the second bonding pad 211 is reduced, and the covering layer 222 is approximately attached to the touch panel 21. The Anisotropic Conductive Film (ACF) generated after the anisotropic conductive adhesive layer 23 is heated and melted diffuses toward the periphery, and since the first bonding pads 223 are connected to the edges of the anisotropic conductive adhesive layer 23 and the cover layer 222, the liquid ACF is shielded by the cover layer 222 during the diffusion process toward the right side, conductive particles in the ACF can be gathered in the gap between the cover layer 222 and the first bonding pads 223, and two adjacent first bonding pads 223 are easily conducted to cause short circuit.
By arranging the opening 221c at the joint of the first region 221a and the second region 221b of the substrate 221, the liquid ACF can overflow from the opening 221c in the process of diffusing along the gap between the covering layer 222 and the first bonding pad 223, thereby effectively avoiding the conductive particles in the ACF from gathering between two adjacent first bonding pads 223 to cause short circuit, and improving the product yield.
Referring to fig. 5, in the prior art, the size of the first bonding pad 530 is increased to increase the distance between the anisotropic conductive film 400 and the cap layer 520, so as to increase the diffusion space of the liquid ACF and prevent the adjacent first bonding pads 530 from short-circuiting. However, on the premise that the area of the substrate 510 of the flexible circuit board 500 is not changed, since the size of the first pad 530 disposed on the substrate 510 is increased, the area of the covering layer 520 is correspondingly reduced, which results in a reduction of the routing space d on the flexible circuit board 500 and affects the routing design. The technical scheme of the invention solves the problem of short circuit caused by gathering ACF conductive particles between two adjacent first welding pads 223 without changing the routing space of the flexible circuit board 22.
Further, the opening 221c has two continuous portions, one of which is located in the first region 221a, and the other of which is located in the second region 221b and is shielded by the cover layer 222.
Referring to fig. 2, in an embodiment, the number of the first pads 223 is at least 2, and the opening 221c is located between every two adjacent first pads 223. The substrate 221 is provided with openings 221c corresponding to the area between every two first pads 223, so as to ensure that no short circuit problem occurs between every two first pads 223 due to aggregation of ACF conductive particles.
The size of the opening 221c is smaller than the pitch of two adjacent first pads 223. If the size of the opening 221c on the substrate 221 is too large, the strength of the flexible circuit board 22 will be affected. The size of the opening 221c is preferably not more than the distance between two adjacent first pads 223, so as to provide a diffusion space for the ACF and ensure the strength of the flexible circuit board 22.
It should be noted that the opening 221c should not be disposed in the area where the first pad 223 is located, that is, the opening 221c and the first pad 223 are disposed alternately, so as to avoid affecting the electrical connection between the first pad 223 and the substrate 221.
In particular embodiments, the shape of the opening 221c includes a circle, an oval, a triangle, a square, or a rectangle. For example, when the shape of the opening 221c is a circle, the size of the opening 221c refers to the diameter of the circle. When the shape of the opening 221c is an ellipse, the size of the opening 221c refers to the major axis of the ellipse. When the shape of the opening 221c is triangular, the size of the opening 221c refers to the longest side of the triangle. When the shape of the opening 221c is square or rectangular, the size of the opening 221c refers to a diagonal line of the square or rectangle.
The touch panel 21 includes a substrate 212 and a touch electrode layer 213 formed on the substrate 212, and the second pads 211 are electrically connected to the touch electrode layer 213. The touch electrode layer 213 includes a plurality of first sensing electrodes extending along a longitudinal direction and a plurality of second sensing electrodes extending along a transverse direction, the first sensing electrodes and the second sensing electrodes are insulated from each other, and the touch electrode layer 213 may be a metal grid. The ends of the first sensing electrode and the second sensing electrode are respectively provided with a second pad 211 so as to transmit the touch sensing signal to the flexible circuit board 22, and the second pad 211 may be a gold finger.
The flexible circuit board 22 is provided with a control circuit, and the first pad 223 extends from the first region 221a to the second region 221b so as to be electrically connected to the control circuit, so that the touch sensing signal generated on the touch electrode layer 213 is transmitted to the control circuit provided on the flexible circuit board 22 through the first pad 223, so as to identify the touch information of the user.
The touch module 20 further includes an optical adhesive layer 24 and a protective cover 25, wherein the optical adhesive layer 24 is disposed on the surface of the touch electrode layer 213 away from the substrate 212. The protective cover 25 is used to protect the touch panel 21 so as to isolate the touch electrode layer 213 of the touch panel 21 from external moisture and air, and the optical adhesive layer 24 is used to connect the protective cover 25 and the touch panel 21 together.
The touch module 20 further includes an insulating protective layer 26 covering the touch electrode layer 213. The area of the touch electrode layer 213 not covered by the optical adhesive layer 24 is provided with an insulating adhesive protection layer 26 to prevent the exposed touch electrode layer 213 from being corroded.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A touch module, comprising:
a touch panel;
the flexible circuit board comprises a substrate and a covering layer which are arranged in a stacked mode, wherein the substrate comprises a first area and a second area, the covering layer is arranged in the second area, and a plurality of openings are formed in the joint of the first area and the second area; and
the anisotropic conductive adhesive layer is arranged between the touch panel and the substrate so as to enable the touch panel to be conducted with the flexible circuit board, and the anisotropic conductive adhesive layer can overflow from the opening after being heated and melted.
2. The touch module of claim 1, wherein the flexible circuit board comprises a plurality of first pads disposed on the substrate, the number of the first pads is at least 2, and the opening is located between every two adjacent first pads.
3. The touch module of claim 2, wherein the size of the opening is smaller than a distance between two adjacent first pads.
4. The touch module of claim 2, wherein the first pad extends from the first region to the second region.
5. The touch module of claim 1, wherein the opening has a shape selected from the group consisting of a circle, an ellipse, a triangle, a square, and a rectangle.
6. The touch module of claim 1, wherein the touch panel comprises a substrate, a plurality of second pads and a touch electrode layer, the second pads and the touch electrode layer are disposed on the substrate, and the second pads are electrically connected to the touch electrode layer.
7. The touch module of claim 6, further comprising at least one of:
the touch module further comprises an optical adhesive layer and a protective cover plate, wherein the optical adhesive layer is arranged on the surface, far away from the substrate, of the touch electrode layer; and
the touch module further comprises an insulating glue protective layer covering the touch electrode layer.
8. The touch module of claim 1, wherein the opening has two continuous portions, one of the two continuous portions is located in the first area, and the other continuous portion is located in the second area and is blocked by the cover layer.
9. A preparation method of a touch display device is characterized by comprising the following steps:
providing the touch module according to any one of claims 1-8, and performing hot-pressing lamination on the touch panel and the flexible circuit board to obtain a finished touch module;
and attaching the touch module finished product to a display module to obtain the touch display device.
10. An electronic device comprising the touch display device manufactured by the manufacturing method of claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911100299.7A CN110825268B (en) | 2019-11-12 | 2019-11-12 | Touch module, touch display device and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911100299.7A CN110825268B (en) | 2019-11-12 | 2019-11-12 | Touch module, touch display device and electronic equipment |
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| CN110825268A true CN110825268A (en) | 2020-02-21 |
| CN110825268B CN110825268B (en) | 2022-12-02 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112068729A (en) * | 2020-08-26 | 2020-12-11 | 业成光电(无锡)有限公司 | Touch display module and touch display device |
| CN113391723A (en) * | 2021-06-02 | 2021-09-14 | 业成科技（成都）有限公司 | Touch panel |
| CN113674636A (en) * | 2021-08-03 | 2021-11-19 | Tcl华星光电技术有限公司 | Preparation method of tiled display device, tiled display device and tiled display unit |
| WO2021238443A1 (en) * | 2020-05-25 | 2021-12-02 | 京东方科技集团股份有限公司 | Display module and display apparatus |
| WO2022047676A1 (en) * | 2020-09-02 | 2022-03-10 | 京东方科技集团股份有限公司 | Flexible circuit board and preparation method therefor, touch panel and preparation method therefor |
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|---|---|
| CN110825268B (en) | 2022-12-02 |
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