CN219421141U - Conductive laminated structure, control panel and display device - Google Patents
Conductive laminated structure, control panel and display device Download PDFInfo
- Publication number
- CN219421141U CN219421141U CN202222715221.XU CN202222715221U CN219421141U CN 219421141 U CN219421141 U CN 219421141U CN 202222715221 U CN202222715221 U CN 202222715221U CN 219421141 U CN219421141 U CN 219421141U
- Authority
- CN
- China
- Prior art keywords
- conductive
- conductive layer
- lamination area
- substrate
- lamination
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The application belongs to the technical field of display and provides a conductive laminated structure, a control panel and a display device, wherein the conductive laminated structure comprises a substrate, a first conductive layer and a second conductive layer; wherein, the first conductive layer is formed on the substrate; the first conductive layer is provided with a first lamination area, and the first lamination area is provided with a first hollowed-out structure exposed to the substrate; the second conductive layer is formed on the substrate and is provided with a second lamination area, the second lamination area is overlapped and covered on the first lamination area and is electrically connected with the first lamination area, and the second lamination area is partially filled in the first hollow structure and is connected with the substrate at the first hollow structure; the control panel includes a conductive laminate structure; the display device includes a control panel. The application aims to solve the technical problem that in the prior art, the stress of the upper conductive layer and the lower conductive layer at the lap joint position is large.
Description
Technical Field
The application belongs to the technical field of display, and particularly relates to a conductive laminated structure, a control panel and a display device.
Background
Along with the development of display technology, display devices are increasingly used, and commonly used display devices include smart phones, tablet computers, televisions, displays and the like.
The display device may generally include a display panel and a driving chip; in the display panel, the overlapping position of the two conductive layers on the substrate is usually in a stacking overlapping mode, and a large stress exists between the upper metal layer and the lower metal layer at the overlapping position, so that the adhesive force between the upper metal layer and the lower metal layer is weak; when FPC binding is carried out on the upper metal, the phenomenon of separation between the upper metal and the lower metal is easy to occur, the conductivity of the upper metal and the lower metal is influenced, and the FPC refers to a flexible circuit board; in addition, because of the existence of larger stress between the upper metal layer and the lower metal layer, the tensile property of the FPC is affected, the FPC is easy to separate and fall off, and the reliability requirement of the product is not met.
Disclosure of Invention
The purpose of this application is to provide a conductive lamination structure, control panel and display device, aims at solving the technical problem that upper and lower two-layer conducting layer is great in overlap joint position stress in prior art.
A first object of the present application is to provide a conductive laminated structure including:
a substrate;
a first conductive layer formed on the substrate; the first conductive layer is provided with a first lamination area, and the first lamination area is provided with a first hollowed-out structure exposed to the substrate; a kind of electronic device with high-pressure air-conditioning system
The second conductive layer is formed on the substrate and is provided with a second lamination area, the second lamination area is overlapped and covered on the first lamination area and is electrically connected with the first lamination area, and the second lamination area is partially filled in the first hollow structure and is connected with the substrate at the first hollow structure.
In one embodiment, the first conductive layer includes a plurality of first conductive portions extending in a stripe shape, the plurality of first conductive portions are spaced apart and arranged in parallel, and the first lamination region is formed at an extension end of the first conductive portion; the second conductive layer comprises a plurality of second conductive parts which extend in a strip shape, the number of the second conductive parts is the same as that of the first conductive parts, the second conductive parts are arranged at intervals and in parallel, and the second lamination area is formed at the extending end of the second conductive parts; one of the second lamination areas corresponds to and overlaps one of the first lamination areas.
In one embodiment, the first hollow structure includes a plurality of connection holes, and the plurality of connection holes are spaced and arranged in an array; the second lamination area is filled into the connecting hole and is connected with the substrate at the bottom of the connecting hole.
In one embodiment, the cross section of the connecting hole extends in a strip shape, and the extending direction of the connecting hole is the same as the extending direction of the first conductive part; the connecting holes are arranged at intervals and in parallel.
In one embodiment, the extending end of the connecting hole extends to the end face of the extending end of the first conductive part, so that the connecting hole forms an open mouth at the end face of the extending end of the first conductive part.
In one embodiment, the cross-section outline shape of the connecting hole is circular, elliptical or polygonal.
In one embodiment, the second lamination area is provided with a second hollow structure, and the second hollow structure is located at one side of the second lamination area, which is away from the first lamination area.
In one embodiment, the conductive laminated structure further includes an insulating layer formed on a side of the first conductive layer facing away from the substrate and capable of being formed between the first conductive layer and the second conductive layer; the insulating layer is arranged at an electric connection part of the first lamination area and the second lamination area.
A second object of the present application is to provide a control panel, which includes a circuit board and the conductive laminated structure as described in any one of the above, wherein the circuit board is laminated on the second conductive layer.
A third object of the present application is to provide a display device comprising a control panel as described above.
The conductive laminated structure, the control panel and the display device of the application have the beneficial effects compared with the prior art that: compared with the prior art, in the conductive laminated structure, the control panel and the display device, the first conductive layer and the second conductive layer are formed on the substrate, the first conductive layer and the second conductive layer are connected through the lap joint of the first laminated area and the second laminated area, so that electrical conduction is realized, and other parts of the first conductive layer and the second conductive layer can be arranged in an insulating way through the insulating layer, so that short circuits of the first conductive layer and the second conductive layer at other parts are avoided; the second conducting layer is partially filled in the first hollow structure, and the second laminating area is directly connected with the substrate at the bottom of the first hollow structure, so that the adhesive force between the second laminating area and the substrate is enhanced, the stress between the first laminating area and the second laminating area is reduced, the overall strength of the conducting laminating structure is enhanced, when the second conducting layer is bound with an FPC (flexible circuit board), the first laminating area and the second laminating area are not easy to separate, the tensile property of the FPC is enhanced, the FPC is not easy to separate and fall off, and the reliability of a product is enhanced.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings used in the embodiments of the present application or the description of the prior art will be briefly described below, and it is obvious that the drawings described below are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a conductive laminated structure according to an embodiment of the present application;
FIG. 2 is a perspective view of FIG. 1;
FIG. 3 is a partial cross-sectional view of a conductive laminate structure provided in an embodiment of the present application;
FIG. 4 is a cross-sectional view A-A of FIG. 3;
fig. 5 is a schematic diagram of a structure in which a substrate is connected to a first conductive layer in a conductive laminated structure according to an embodiment of the present application;
FIG. 6 is a sectional view B-B in FIG. 5;
FIG. 7 is a schematic view of the structure of FIG. 6 after the addition of an insulating layer;
fig. 8 is a schematic diagram of a second structure in which a substrate is connected to a first conductive layer in a conductive laminated structure according to an embodiment of the present application.
Reference numerals illustrate: 1. a substrate; 2. a first conductive layer; 21. a first lamination region; 22. a first conductive portion; 23. a first hollow structure; 3. a second conductive layer; 31. a second lamination region; 32. a second hollow structure; 33. a second conductive portion; 4. an insulating layer.
Detailed Description
Embodiments of the present application are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and intended for the purpose of explaining the present application and are not to be construed as limiting the present application.
In the description of the present application, it should be understood that the terms "length," "width," "upper," "lower," "upward," "vertical," "horizontal," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate description of the present application and simplify description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be configured and operated in a particular orientation, and therefore should not be construed as limiting the present application.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
In this application, unless specifically stated and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application will be further described in detail with reference to the accompanying drawings and examples.
Referring to fig. 1 to 4, an embodiment of the present application provides a conductive laminated structure, which includes a substrate 1, a first conductive layer 2 and a second conductive layer 3; wherein the first conductive layer 2 is formed on the substrate 1; the first conductive layer 2 has a first lamination area 21, and the first lamination area 21 is provided with a first hollowed-out structure 23 exposed to the substrate 1; the second conductive layer 3 is formed on the substrate 1, and the second conductive layer 3 has a second lamination area 31, where the second lamination area 31 is laminated and covered on the first lamination area 21 and is electrically connected with the first lamination area 21, and the second lamination area 31 is partially filled in the first hollow structure 23 and is connected to the substrate 1 at the first hollow structure 23.
Specifically, the base 1 may be a substrate, which is also called a substrate, and has at least one side for connecting or disposing the first conductive layer 2. The substrate 1 may also be made of an organic material; the substrate may also be made of glass, PC board, acryl board, PET board or other flexible PI board.
The first conductive layer 2 is formed on the substrate 1, that is, the first conductive layer 2 is disposed or connected and fixed on one side surface of the substrate 1; the first conductive layer 2 is made of metal, and the first conductive layer 2 is subjected to development etching to form a conductive circuit, namely, the lower metal layer.
The first conductive layer 2 has a first lamination area 21, the first lamination area 21 being a part of the first conductive layer 2, the first lamination area 21 being mainly used for overlapping with a second lamination area 31 on the second conductive layer 3.
The second conductive layer 3 is also formed on the substrate 1, that is, the second conductive layer 3 is disposed or connected and fixed on the same side of the substrate 1; the second conductive layer 3 is made of metal, and the second conductive layer 3 is subjected to development etching to form a conductive circuit.
The second lamination area 31 is formed by the lamination of the second conductive layer 3 covering (or overlapping) the upper part of the first lamination area 21, the second lamination area is connected to the side of the first lamination area 21 facing away from the substrate 1, and the upper metal is formed by the second lamination area 31 above the first lamination area 21; the contact part of the first lamination area 21 and the second lamination area 31 is a conducting area, and the first conductive layer 2 and the second conductive layer 3 can be electrically connected and conducted in the conducting area; the first conductive layer 2 and the second conductive layer 3 may be made of metal materials, and the metal materials include conductive materials such as molybdenum, aluminum, gold, silver, copper, and the like, or may be other composite conductive materials, and are prepared by a sputtering or printing scheme.
A first hollow structure 23 exposed to the substrate 1 is formed in the first lamination area 21 of the first conductive layer 2, that is, by forming the first hollow structure 23 in the first lamination area 21, a part of the substrate 1 overlapped under the first lamination area 21 can be exposed through the first hollow structure 23; the first hollow structure 23 may adopt a through hole structure.
When the second lamination area 31 is manufactured, the second lamination area 31 can be filled in the first hollow structure 23 at the position of the first hollow structure 23 and connected with the substrate 1 exposed at the bottom of the first hollow structure 23, so that the second lamination area 31 can be connected with the first lamination area 21 and also can be connected with the substrate 1, the connection strength between the second lamination area 31 and the first lamination area 21 and the connection strength between the second lamination area 31 and the substrate 1 are enhanced, and the adhesion between the second lamination area 31 and the substrate 1 is improved; in addition, by providing the first hollowed-out structure 23, the second laminated region 31 is connected with the first laminated region 21 and is also connected with the substrate 1 through the first hollowed-out structure 23, so that stress between the first laminated region 21 and the second laminated region 31 is relieved, and stress concentration is reduced.
In this embodiment, the first conductive layer 2 and the second conductive layer 3 are both formed on the substrate 1, and the first conductive layer 2 and the second conductive layer 3 are electrically connected through overlapping of the first lamination area 21 and the second lamination area 31, so as to form a stacked conductive line; other parts of the first conductive layer 2 and the second conductive layer 3 can be arranged in an insulating way through the insulating layer 4 so as to avoid short circuit of the first conductive layer 2 and the second conductive layer 3 at other parts; the second conductive layer 3 fills the second lamination area 31 in the first hollow structure 23, and the second lamination area 31 is directly connected with the substrate 1 at the bottom of the first hollow structure 23, so that the adhesive force between the second lamination area 31 and the substrate 1 is enhanced, the stress between the first lamination area 21 and the second lamination area 31 is reduced, the overall strength of the conductive lamination structure is enhanced, the first lamination area 21 and the second lamination area 31 are not easy to separate when the second conductive layer 3 is bound with the FPC, the tensile property of the FPC is enhanced, the FPC is not easy to separate and fall off, and the reliability of the product is enhanced.
In one embodiment, referring to fig. 4, the conductive laminated structure further includes an insulating layer 4, the insulating layer 4 being formed on a side of the first conductive layer 2 facing away from the substrate 1 and being capable of being formed between the first conductive layer 2 and the second conductive layer 3; the insulating layer 4 is disposed so as to avoid the electrical connection between the first laminated region 21 and the second laminated region 31.
Specifically, the insulating layer 4 may be made of a transparent organic resin adhesive or other transparent insulating materials, and after the organic resin adhesive is developed and etched, the transparent organic resin adhesive covers the surface of the first conductive layer 2 to form a protective layer on the surface of the first conductive layer 2.
The second conductive layer 3 is formed on the upper surface of the insulating layer 4, and the insulating layer 4 is away from the electrical connection portion of the first lamination region 21 and the second lamination region 31, that is, the conductive portion of the first lamination region 21 and the second lamination region 31.
In the present embodiment, the insulating layer 4 is added to insulate the first conductive layer 2 and the second conductive layer 3 from each other except for the electrical connection portion between the first laminated region 21 and the second laminated region 31, thereby protecting the surface of the first conductive layer 2.
In one embodiment, referring to fig. 3 to 5, the first conductive layer 2 includes a plurality of first conductive portions 22 extending in a stripe shape, the plurality of first conductive portions 22 are spaced apart and arranged in parallel, and the first lamination region 21 is formed at an extension end of the first conductive portion 22; the second conductive layer 3 includes a plurality of second conductive portions 33 extending in a stripe shape, the number of the second conductive portions 33 is the same as the number of the first conductive portions 22, and the plurality of second conductive portions 33 are spaced apart and arranged in parallel, and the second lamination region 31 is formed at an extending end of the second conductive portions 33; a second lamination region 31 is correspondingly laminated over a first lamination region 21.
Specifically, the first lamination area 21 is the front end of the first conductive portion 22, and the second lamination area 31 is the front end of the second conductive portion 33; a first conductive portion 22 is correspondingly overlapped with a second conductive portion 33, that is, a second lamination area 31 is correspondingly overlapped and covered on a first lamination area 21.
In this embodiment, the first conductive layer 2 and the second conductive layer 3 form a plurality of electrical connection parts (conductive connection parts), that is, a plurality of second lamination areas 31 and a plurality of first lamination areas 21 are arranged between the first conductive layer 2 and the second conductive layer 3, and one second lamination area 31 is correspondingly laminated with one first lamination area 21, so that connection and conduction reliability between the first conductive layer 2 and the second conductive layer 3 is guaranteed; in addition, each first lamination area 21 is provided with a first hollow structure 23 exposed to the substrate 1, each second lamination area 31 is correspondingly partially filled in each first hollow structure 23 and is connected to the substrate 1 at the first hollow structure 23, so that the adhesion force between each second lamination area 31 and the substrate 1 is enhanced, the stress between each first lamination area 21 and each second lamination area 31 is reduced, the overall strength of the conductive lamination structure is enhanced, separation between each first lamination area 21 and each second lamination area 31 is not easy to occur when FPC binding is performed on the second conductive layer 3, the tensile property of the FPC is enhanced, separation and falling are not easy to occur, and the reliability of the product is enhanced.
Referring to fig. 5 to 7, the manufacturing process of the conductive laminated structure is as follows: firstly, a first conductive layer 2 is made on the surface of a substrate 1, and then the first conductive layer 2 is subjected to development etching to form a conductive circuit on the surface of the first conductive layer 2, namely a lower metal layer is formed, wherein a first hollow structure 23 is formed in a first lamination area 21 of the first conductive layer 2 when the first conductive layer 2 is manufactured, so that the substrate 1 is exposed at the bottom of the first hollow structure 23; then, coating an insulating layer 4 on the first conductive layer 2, that is, coating transparent organic resin glue, and then performing development etching, wherein the transparent organic resin glue covers the surface of the first conductive layer 2 to protect the first conductive layer 2, and the organic resin glue forms a protection layer for the first conductive layer 2, wherein it should be noted that the insulating layer 4 avoids the first lamination area 21 or avoids the electrical connection part of the first lamination area 21 so as to avoid affecting the electrical connection between the first lamination area 21 and the second lamination area 31; then, the second conductive layer 3 is made on the insulating layer 4, and the second conductive layer 3 is subjected to development etching, so that a conductive circuit is formed on the surface of the second conductive layer 3, namely an upper metal layer is formed, wherein when the second conductive layer 3 is made, the second lamination area 31 in the second conductive layer 3 is filled into the first hollow structure 23 and is abutted against and connected with the substrate at the bottom of the first hollow structure 23, so that the second lamination area can be connected with the substrate 1 at the position of the first hollow structure 23 while being connected with the first lamination area, the adhesive force between the second lamination area 31 of the second conductive layer 3 and the substrate 1 can be enhanced, the adhesive force between the second lamination area 31 of the second conductive layer 3 and the first lamination area 21 of the first conductive layer 2 can be enhanced, the structural strength of the whole conductive lamination structure is improved, and the stress concentration of the first conductive layer 2 and the second conductive layer 3 at the lamination position is reduced.
In one embodiment, referring to fig. 5 and 8, the first hollow structure 23 includes a plurality of connection holes, and the plurality of connection holes are spaced apart and arranged in an array; the second lamination region 31 fills the connection hole and is connected to the substrate 1 at the bottom of the connection hole.
Specifically, the front end of each first conductive portion 22 is the first lamination area 21, that is, the front end of each first conductive portion 22 is provided with a plurality of connection holes, and the connection holes extend from the upper surface to the lower surface of the first conductive portion 22 and can expose the substrate 1 at the bottom of the holes; when the second conductive layer 3 is manufactured, the front end of the second conductive part 33 is overlapped with the front end of the first conductive part 22 to form a second lamination area 31, the second lamination area 31 can be filled in the connecting hole and extends to the bottom of the connecting hole to be fixedly connected with the substrate 1, the second lamination area 31 can be partially connected with the substrate 1, and the adhesion force between the second lamination area 31 and the substrate 1 is enhanced.
In the present embodiment, the larger the number of connection holes, the greater the adhesion of the second lamination region 31 to the substrate 1, and the more firmly the first conductive layer 2 and the second conductive layer 3 are connected to the substrate 1.
In one embodiment, referring to fig. 5, the cross-sectional shape of the connection hole extends in a stripe shape, and the extending direction of the connection hole is the same as the extending direction of the first conductive portion 22; the plurality of connecting holes are arranged at intervals and in parallel.
In this embodiment, the connection hole is elongated and extends in the same direction as the extending direction of the first conductive portion 22 or the first lamination area 21, and the plurality of connection holes are spaced and arranged in parallel, and the second lamination area 31 is filled into the elongated connection hole, so that a strip-shaped splicing fusion structure is formed between the first lamination area 21 and the second lamination area 31, which is beneficial to enhancing the connection strength between the first lamination area 21 and the second lamination area 31, and enhancing the connection area between the first lamination area 21 and the substrate 1, so as to enhance the adhesion between the first lamination area 21 and the substrate 1.
In one embodiment, referring to fig. 5, the extension end of the connection hole extends to the end face of the extension end of the first conductive part 22, so that the connection hole forms an open mouth at the end face of the extension end of the first conductive part 22.
Specifically, the connection holes are formed on the first conductive part 22, extend from the middle area of the first conductive part 22 to the end of the first conductive part 22, and extend to form an open mouth, and a plurality of connection holes are arranged at intervals and in parallel, so that the first lamination area 21 forms a fork shape; therefore, when the second conductive layer 3 (specifically, the second conductive portion 33) is formed, the second conductive layer 3 inside the connection hole and the second conductive layer 3 outside the connection hole can be integrated into a single structure.
In this embodiment, the connecting hole extends to the end of the first conductive portion 22 to form an open opening, which is beneficial to enhancing the connection strength between the second conductive layer 3 and the external second conductive layer 3 in the connecting hole and improving the overall structural strength of the second conductive layer 3.
In one embodiment, referring to fig. 8, the cross-section outline shape of the connecting hole is circular, elliptical or polygonal, and the plurality of connecting holes are arranged in rows at intervals, and the connecting holes in two adjacent rows are arranged in a staggered manner, so that stress balance between the second lamination area 31 and the first lamination area 21 is facilitated, and stress is reduced.
In one embodiment, referring to fig. 3 and 4, the second lamination area 31 is provided with a second hollowed-out structure 32, and the second hollowed-out structure 32 is located on a side of the second lamination area 31 facing away from the first lamination area 21.
Specifically, the second hollow structure 32 is a connection groove or a communication hole formed on the upper surface of the second lamination area 31, and the connection groove or the communication hole may be provided with a plurality of connection grooves or a plurality of communication holes arranged in an array.
In this embodiment, the second hollow structure 32 is used for filling an adhesive material when the second conductive layer 3 is bound to the FPC, so as to enhance the connection strength between the FPC and the second hollow structure 32.
In one embodiment, the second lamination area 31 is provided with a third hollow structure, the third hollow structure is arranged on one side of the second lamination area 31 facing the first lamination area 21, and the third hollow structure avoids the first hollow structure 23; the first lamination area 21 is partially filled in the third hollow structure; specifically, the third hollow structure may be a communication hole or a connection groove.
That is, the surface of the first lamination area 21 facing the second lamination area 31 is provided with a protruding structure protruding toward the second lamination area 31, and the protruding structure can be inserted or filled in the third hollow structure, so that the first lamination area 21 and the second lamination area 31 are inserted and fused with each other, and the connection strength between the first lamination area 21 and the second lamination area 31 is increased.
When the first conductive layer 2 is manufactured, a first hollow structure 23 needs to be formed in the first lamination area 21 of the first conductive layer 2, and a convex structure is manufactured at a position dislocated or avoided from the first hollow structure 23, and the convex structure extends outwards along the direction facing the second lamination area 31; when the second lamination area 31 in the second conductive layer 3 is manufactured, the second lamination area 31 is partially filled into the first hollow structure 23 and is wrapped and surrounded by the convex structure, a third hollow structure is formed at the position, connected with the convex structure, of the second lamination area 31, and the convex structure of the first lamination area 21 is fused with the second lamination area 31 at the position of the third hollow structure to form an integrated structure, so that the connection strength between the first lamination area 21 and the second lamination area 31 is improved.
In one embodiment, the conductive laminate structure further includes an adhesive layer formed between the substrate 1 and the first conductive layer 2.
In this embodiment, the adhesive layer is mainly used to improve the connection strength between the first conductive layer 2 and the substrate 1, which is beneficial to reducing the risk of delamination between the first conductive layer 2 and the substrate 1 when FPC binding is performed, and improving the overall structural strength of the conductive laminated structure.
The embodiment of the application also provides a control panel, which comprises a circuit board and the conductive laminated structure in the embodiment, wherein the circuit board is laminated and connected to the second conductive layer 3.
Specifically, the control panel may be a touch panel, and the control panel is further provided with electronic components, supporting components, and the like, and the touch panel may be applied to various electronic devices, such as a display device.
In the conductive laminated structure in the control panel of the present embodiment, the second conductive layer 3 fills the second laminated region 31 partially in the first hollowed-out structure 23, and connects the second laminated region 31 directly with the substrate 1 at the bottom of the first hollowed-out structure 23, so as to enhance the adhesion between the second laminated region 31 and the substrate 1, and facilitate reducing the stress between the first laminated region 21 and the second laminated region 31, so as to enhance the overall strength of the conductive laminated structure.
The embodiment of the application also provides a display device, which comprises the control panel in the embodiment.
In the present embodiment, a touch panel is used as the control panel, and in the display device, the control panel is attached to a flat display panel such as a liquid crystal panel or an organic EL panel, and the touch panel is attached to the display panel so that characters, patterns, and the like can be input by handwriting and the input contents can be displayed on the display panel.
The foregoing description of the preferred embodiments of the present application has been provided for the purpose of illustrating the general principles of the present application and is not meant to limit the scope of the present application in any way. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application, and other embodiments of the present application, which may occur to those skilled in the art without the exercise of inventive faculty, are intended to be included within the scope of the present application, based on the teachings herein.
Claims (10)
1. A conductive laminate structure, comprising:
a substrate;
a first conductive layer formed on the substrate; the first conductive layer is provided with a first lamination area, and the first lamination area is provided with a first hollowed-out structure exposed to the substrate; a kind of electronic device with high-pressure air-conditioning system
The second conductive layer is formed on the substrate and is provided with a second lamination area, the second lamination area is overlapped and covered on the first lamination area and is electrically connected with the first lamination area, and the second lamination area is partially filled in the first hollow structure and is connected with the substrate at the first hollow structure.
2. The conductive laminate structure of claim 1, wherein the first conductive layer includes a plurality of first conductive portions extending in a stripe shape, the plurality of first conductive portions being spaced apart and arranged in parallel, the first laminate region being formed at an extension end of the first conductive portions; the second conductive layer comprises a plurality of second conductive parts which extend in a strip shape, the number of the second conductive parts is the same as that of the first conductive parts, the second conductive parts are arranged at intervals and in parallel, and the second lamination area is formed at the extending end of the second conductive parts; one of the second lamination areas corresponds to and overlaps one of the first lamination areas.
3. The conductive laminate structure of claim 2, wherein the first hollowed-out structure comprises a plurality of connection holes, the plurality of connection holes being spaced apart and arranged in an array; the second lamination area is filled into the connecting hole and is connected with the substrate at the bottom of the connecting hole.
4. The conductive laminated structure according to claim 3, wherein the cross-sectional shape of the connection hole extends in a stripe shape, and the extending direction of the connection hole is in the same direction as the extending direction of the first conductive portion; the connecting holes are arranged at intervals and in parallel.
5. The conductive laminate structure of claim 4, wherein the extended end of the connection hole extends to an end face of the extended end of the first conductive portion such that the connection hole forms an open mouth at the end face of the extended end of the first conductive portion.
6. A conductive laminate structure as claimed in claim 3, wherein the cross-sectional outer profile of the connection hole is circular, elliptical or polygonal.
7. The conductive laminate structure of any one of claims 1-6, wherein the second laminate region is provided with a second hollowed-out structure, the second hollowed-out structure being located on a side of the second laminate region facing away from the first laminate region.
8. The conductive laminate structure of any one of claims 1-6, further comprising an insulating layer formed on a side of the first conductive layer facing away from the substrate and capable of being formed between the first conductive layer and the second conductive layer; the insulating layer is arranged at an electric connection part of the first lamination area and the second lamination area.
9. A control panel comprising a circuit board and a conductive laminate structure as claimed in any one of claims 1 to 8, the circuit board being laminated to the second conductive layer.
10. A display device comprising the control panel of claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222715221.XU CN219421141U (en) | 2022-10-11 | 2022-10-11 | Conductive laminated structure, control panel and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222715221.XU CN219421141U (en) | 2022-10-11 | 2022-10-11 | Conductive laminated structure, control panel and display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219421141U true CN219421141U (en) | 2023-07-25 |
Family
ID=87235456
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222715221.XU Active CN219421141U (en) | 2022-10-11 | 2022-10-11 | Conductive laminated structure, control panel and display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219421141U (en) |
-
2022
- 2022-10-11 CN CN202222715221.XU patent/CN219421141U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101610634B (en) | Flexible printed circuit board, touch panel, display panel and display | |
| EP2851769B1 (en) | Touch panel | |
| US8947399B2 (en) | Dual-substrate capacitive touch panel | |
| US20150342048A1 (en) | Circuit board | |
| CN111128022B (en) | Display panel, preparation method thereof and display device | |
| US20070139393A1 (en) | Touch Panel | |
| CN110825268B (en) | Touch module, touch display device and electronic equipment | |
| US11163415B2 (en) | Touch display module, touch display device and electronic device | |
| CN100458508C (en) | Signal transmission assembly and display using same | |
| CN104571682A (en) | Touch panel | |
| TWI469009B (en) | Touch screen, touch-control display device | |
| JP2007200177A (en) | Electronic device | |
| US6969264B2 (en) | Transparent touch panel | |
| CN110943110A (en) | Display device | |
| CN112533367B (en) | Flexible circuit board, display screen and electronic equipment | |
| CN219421141U (en) | Conductive laminated structure, control panel and display device | |
| US7679608B2 (en) | Touch panel | |
| TWI656468B (en) | Wiring body assembly, wiring substrate, and touch detector | |
| CN114245568A (en) | Flexible circuit board, display module and display device | |
| CN213814635U (en) | Touch panel, display panel and display device | |
| CN210840204U (en) | Flexible circuit board and electronic equipment | |
| CN109669569B (en) | Touch display screen, manufacturing method thereof and electronic equipment | |
| CN112181200A (en) | Touch display module and touch display device | |
| TW201512939A (en) | Touch panel sensor sheet module and method for manufacturing touch panel system module | |
| KR100822196B1 (en) | Touch panel |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |