CN105578718B - Flexible PCB, circuit connection structure and mobile terminal - Google Patents
Flexible PCB, circuit connection structure and mobile terminal Download PDFInfo
- Publication number
- CN105578718B CN105578718B CN201511025697.9A CN201511025697A CN105578718B CN 105578718 B CN105578718 B CN 105578718B CN 201511025697 A CN201511025697 A CN 201511025697A CN 105578718 B CN105578718 B CN 105578718B
- Authority
- CN
- China
- Prior art keywords
- pad
- flexible pcb
- line
- layer
- cover layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0108—Transparent
Abstract
The invention discloses a kind of flexible PCBs, including the first cover layer being cascading, first line layer, transparent flexible substrate, second line layer and the second cover layer, the transparent flexible substrate includes line areas and bonding pad, the position hollow out of bonding pad described in the first cover layer face, the first line layer includes the pad positioned at the circuit of the line areas and positioned at the bonding pad, the circuit and pad electrical connection, the position hollow out of bonding pad described in the second line layer face, the location transparency of bonding pad described in the second cover layer face is arranged.Flexible PCB welding contraposition easy to implement of the present invention.The invention also discloses a kind of circuit connection structures and a kind of mobile terminal.
Description
Technical field
The present invention relates to circuit interconnection technique field more particularly to a kind of flexible PCB, a kind of circuit connection structure with
And a kind of mobile terminal.
Background technology
With the fast development of electronics technology, the electronic product of the various different demands according to consumer is also followed constantly
It weeds out the old and bring forth the new.Consumption market makes various individualized electronic products be in great demand, wherein with the electronic equipment of portable product, it is such as mobile
The products such as phone, PDA (personal digital assistant), digital camera, Liquid Crystal Module are even more mainstream.Also, above-mentioned electronic product is set
Meter trend is simultaneously used as the main inducing that stimulation consumer buys with lighting, slimming, low priceization, high-quality, high-precision densification.
In addition, general electronic products are to make the function of itself more tend to become strong greatly, and further attract consumer's desire to purchase,
Therefore it can increase a variety of different functions in conjunction with more modules, so generally in addition to display, main circuit board, memory is added
Outside, camera module or network operation module are additionally added to make the function more diversification of its electronic product.
Generally require to connect by circuit in above-mentioned different intermodule, thus in connection usually using cable or
Flexible circuit board connects these modules by welding.But since modern electronic product is got over towards light and shortization,
Welding structure is caused to more they tend to finely.So in order to realize the installation of high-density line, shape in than narrow small product size
At in the weld pad on circuit board, other than with finer size, arrangement is also more intensive.
It obtains it is noted that when the pad on circuit board tends to high-density array, in the welding process, often occurs because of between
Pad solder inconsistent phenomenon is generated away from too small, leads to that short circuit problem occurs between pad.It is such to be made since pad solder misplaces
At short circuit problem, it has also become the raised principal element of circuit board fraction defective.
Invention content
Technical problem to be solved by the present invention lies in a kind of flexible PCB of easy exactitude position pad of offer, one kind
Circuit connection structure using the flexible PCB and a kind of mobile terminal using the flexible PCB.
To achieve the goals above, embodiment of the present invention adopts the following technical scheme that：
On the one hand, a kind of flexible PCB is provided, including be cascading the first cover layer, first line layer,
Transparent flexible substrate, the second line layer and the second cover layer, the transparent flexible substrate include line areas and bonding pad, described
The position hollow out of bonding pad described in first cover layer face, the first line layer include positioned at the line areas circuit and
Pad positioned at the bonding pad, the circuit and the pad are electrically connected, bonding pad described in the second line layer face
Position hollow out, the location transparency setting of bonding pad described in the second cover layer face.
Preferably, the position hollow out of bonding pad described in the second cover layer face.
Preferably, the line areas of the transparent flexible substrate is formed with a boundary line with the bonding pad intersection,
The first spacing, shape between second line layer and the boundary line are formed between second cover layer and the boundary line
At the second spacing, second spacing is more than first spacing.
Preferably, first cover layer and second cover layer are transparent film layer.
Preferably, second cover layer uses transparent material and covers the bonding pad of the flexible PCB.
Preferably, the line areas of the transparent flexible substrate is formed with a boundary line with the bonding pad intersection,
The second spacing is formed between second line layer and the boundary line.
Preferably, first cover layer is transparent film layer.
Preferably, the transparent flexible substrate material is polyimides.
On the other hand, a kind of circuit connection structure is also provided, including flexible PCB as described in any one of the above embodiments, transparent
Anisotropic conductive film and with connection pad device, the pad and the connection pad are arranged in a one-to-one correspondence, described
Anisotropic conductive film is placed between the pad and the connection pad to realize electrical connection.
Preferably, the bonding area of the pad is less than the bonding area of the connection pad.
In another aspect, a kind of mobile terminal is additionally provided, including flexible PCB as described in any one of the above embodiments.
Compared to the prior art, the invention has the advantages that：
Flexible PCB of the present invention is due to the position hollow out of bonding pad described in the first cover layer face, described
Flexible base board is transparent substrate, the position hollow out of bonding pad described in the second line layer face, second cover layer just
Location transparency setting to the bonding pad, therefore around the pad in the bonding pad of the flexible PCB
In pellucidity.When the flexible PCB to be connected on the connection pad of other devices, can be intuitive to see described
Pad whether with connection pad accurate contraposition correspondingly, it is simple, intuitive, efficient, improve welding yield.
When circuit connection structure of the present invention is attached, first the connection pad of described device one side is put upward
It sets, the anisotropic conductive film is placed on the connection pad, then again by the pad one of the flexible PCB
It is aligned down with the connection pad Chong Die.Due to around the pad of the flexible PCB be in pellucidity,
The anisotropic conductive film is transparent, therefore the connection pad of the pad alignment described device of the flexible PCB
When, can be intuitive to see between the pad and the connection pad whether be directed at placement, simple, intuitive, effect correspondingly
Rate is high, improves welding yield.
Description of the drawings
In order to illustrate more clearly of technical scheme of the present invention, attached drawing needed in embodiment will be made below
Simply introduce, it should be apparent that, the accompanying drawings in the following description is only some embodiments of the present invention, general for this field
For logical technical staff, without creative efforts, other attached drawings can also be obtained such as these attached drawings.
Fig. 1 is a kind of schematic cross-sectional view of flexible PCB provided in an embodiment of the present invention.
Fig. 2 is a kind of schematic top plan view of flexible PCB provided in an embodiment of the present invention.
Fig. 3 is the schematic cross-sectional view of another flexible PCB provided in an embodiment of the present invention.
Fig. 4 is a kind of schematic cross-sectional view of circuit connection structure provided in an embodiment of the present invention.
Specific implementation mode
Below in conjunction with the attached drawing in embodiment of the present invention, the technical solution in embodiment of the present invention is carried out clear
Chu is fully described by.
It please refers to Fig.1 and Fig. 2, Fig. 1 is a kind of schematic cross-sectional view of flexible PCB provided in an embodiment of the present invention,
Fig. 2 is a kind of schematic top plan view of flexible PCB provided in an embodiment of the present invention.Flexible PCB described in the embodiment of the present invention,
The first cover layer 1, first line layer 2, transparent flexible substrate 3, the second line layer 4 and second including being cascading cover
Epiphragma layer 5, the transparent flexible substrate 3 include line areas 100 and bonding pad 200, are connected described in 1 face of the first cover layer
The position hollow out in area 200 is connect, the first line layer 2 includes electrical connection positioned at the circuit of the line areas 100 and positioned at institute
State the pad 21 of bonding pad 200, the position hollow out of bonding pad 200, second cover film described in 4 face of the second line layer
The location transparency setting of bonding pad described in 5 face of layer.
In the present embodiment, bonding pad 200 described in 1 face of the first cover layer due to the flexible PCB
Position hollow out, the flexible base board 3 be transparent substrate, the position hollow out of bonding pad 200 described in 4 face of the second line layer,
The location transparency of bonding pad described in second cover layer, 5 face is arranged, therefore the bonding pad of the flexible PCB
Pellucidity is in around the pad 21 in 200.In the connection weldering that the flexible PCB is connected to other devices
When on disk, can be intuitive to see the pad 21 whether with connection pad accurate contraposition correspondingly, simple, intuitive,
It is efficient, improve welding yield.
As a preferred embodiment of the present invention, as shown in Figure 1, bonding pad described in second cover film, 5 layers of face
200 position hollow out, therefore the location transparency of bonding pad 200 described in 5 face of the second cover film is visual.
Further, the line areas 100 of the transparent flexible substrate 3 is formed with 200 intersection of the bonding pad
One boundary line A, second cover layer 5 and the boundary line A form the first interval S 1, second line layer 4 with it is described
Boundary line A forms the second interval S 2, and second interval S 2 is more than first interval S 1.Namely second line layer 4 with
The bonding pad 200 forms a determining deviation, protects the circuit in the line layer 4 not in the connecting welding of the flexible PCB
In be damaged, while second cover layer 5 completely covers second line layer 4 to play a protective role.
Further, first cover layer 1 and second cover layer 5 may be used transparent material and be made, with
Realize that the circuit of the flexible PCB is completely visual.Certainly, first cover layer 1 and second cover layer 5
It can be opaque, can be arranged according to specific requirements.
Further, 3 material of the transparent flexible substrate is polyimides.
As another preferred embodiment of the present invention, referring to Fig. 3, second cover layer 5 uses transparent material
And the bonding pad 200 of the flexible PCB is covered, therefore the position of bonding pad 200 described in 5 face of the second cover film
Set transparent visual.
Further, the line areas 100 of the transparent flexible substrate 3 is formed with 200 intersection of the bonding pad
One boundary line A, the second line layer 4 and boundary line A form the second interval S 2 namely second line layer 4 and institute
It states bonding pad 200 and forms a determining deviation, protect the circuit in the line layer 4 not in the connecting welding of the flexible PCB
It is damaged.
Further, first cover layer 1 may be used transparent material and be made, to realize the flexible PCB
Circuit is completely visual.Certainly, first cover layer 1 can also be opaque, can be arranged according to specific requirements.
Further, 3 material of the transparent flexible substrate is polyimides.
Referring to Fig. 4, the embodiment of the present invention also provides a kind of circuit connection structure, include soft as described in embodiment above
Property circuit board, transparent anisotropic conductive film 7 and the device 6 with connection pad 61, the pad 21 and the connection are welded
Disk 61 is arranged in a one-to-one correspondence, and the anisotropic conductive film 7 is placed between the pad 21 and the connection pad 61 to reality
Now it is electrically connected.
When the circuit connection structure is attached, first 61 one side of the connection pad of described device 6 is placed upward,
The anisotropic conductive film 7 is placed on the connection pad 61, then again by the pad 21 of the flexible PCB
One be aligned down with the connection pad 61 it is Chong Die.Due to being in transparent around the pad 61 of the flexible PCB
State, the anisotropic conductive film 7 are transparent, therefore the pad 21 of the flexible PCB is aligned the institute of described device 6
When stating connection pad 61, it can be intuitive to see between the pad 21 and the connection pad 61 whether be aligned correspondingly
It places, it is simple, intuitive, efficient, improve welding yield.
Further, the bonding area of the pad is less than the bonding area of the connection pad, further decreases described
Pad 21 generates the risk of dislocation when being aligned the connection pad 61, improve welding yield.
The embodiment of the present invention additionally provides a kind of mobile terminal, including flexible PCB as described above.The mobile terminal
Refer to the computer equipment that can be used on the move, including but not limited to mobile phone, notebook, tablet computer, POS machine, vehicle mounted electric
Brain, camera etc..
The above is the preferred embodiment of the present invention, it is noted that for those skilled in the art
For, various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications are also considered as
Protection scope of the present invention.
Claims (10)
1. a kind of flexible PCB, which is characterized in that including be cascading the first cover layer, first line layer, thoroughly
Bright flexible base board, the second line layer and the second cover layer, the transparent flexible substrate include line areas and bonding pad, and described
The position hollow out of bonding pad described in one cover layer face, the first line layer include the circuit and position positioned at the line areas
Pad in the bonding pad, the circuit and the pad are electrically connected, the position of bonding pad described in the second line layer face
Set hollow out, the location transparency setting of bonding pad described in the second cover layer face is in pellucidity around the pad,
So that during the flexible PCB is connected with the device with connection pad, pair of the pad and the connection pad
Position is intuitive visual.
2. flexible PCB as described in claim 1, which is characterized in that bonding pad described in the second cover layer face
Position hollow out.
3. flexible PCB as claimed in claim 2, which is characterized in that the line areas of the transparent flexible substrate and institute
It states bonding pad intersection and is formed with a boundary line, form the first spacing, institute between second cover layer and the boundary line
It states and forms the second spacing between the second line layer and the boundary line, second spacing is more than first spacing.
4. flexible PCB as claimed in claim 3, which is characterized in that first cover layer and second cover film
Layer is transparent film layer.
5. flexible PCB as described in claim 1, which is characterized in that second cover layer is using transparent material and covers
Cover the bonding pad of the flexible PCB.
6. flexible PCB as claimed in claim 5, which is characterized in that the line areas of the transparent flexible substrate and institute
It states bonding pad intersection and is formed with a boundary line, the second spacing is formed between second line layer and the boundary line.
7. flexible PCB as claimed in claim 6, which is characterized in that first cover layer is transparent film layer.
8. a kind of circuit connection structure, which is characterized in that including such as claim 1-7 any one of them flexible PCB, thoroughly
Bright anisotropic conductive film and the device with connection pad, the pad and the connection pad are arranged in a one-to-one correspondence, institute
Anisotropic conductive film is stated to be placed between the pad and the connection pad to realize electrical connection.
9. circuit connection structure as claimed in claim 8, which is characterized in that the bonding area of the pad is less than the connection
The bonding area of pad.
10. a kind of mobile terminal, which is characterized in that including such as claim 1-7 any one of them flexible PCB.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511025697.9A CN105578718B (en) | 2015-12-29 | 2015-12-29 | Flexible PCB, circuit connection structure and mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511025697.9A CN105578718B (en) | 2015-12-29 | 2015-12-29 | Flexible PCB, circuit connection structure and mobile terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105578718A CN105578718A (en) | 2016-05-11 |
| CN105578718B true CN105578718B (en) | 2018-09-04 |
Family
ID=55888223
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201511025697.9A Active CN105578718B (en) | 2015-12-29 | 2015-12-29 | Flexible PCB, circuit connection structure and mobile terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105578718B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109068478B (en) * | 2018-11-01 | 2020-04-07 | 武汉天马微电子有限公司 | Flexible circuit board and display device |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005234335A (en) * | 2004-02-20 | 2005-09-02 | Advanced Display Inc | Liquid crystal display device |
| WO2008109412A1 (en) * | 2007-03-02 | 2008-09-12 | Raytheon Company | Method for fabricating electrical circuitry on ultra-thin plastic films |
| KR100968972B1 (en) * | 2008-05-15 | 2010-07-14 | 삼성전기주식회사 | The method of fabricating circuit board |
| CN202310283U (en) * | 2011-10-28 | 2012-07-04 | 惠州Tcl移动通信有限公司 | Hard fold flexible printed circuit board |
| CN203399392U (en) * | 2013-07-01 | 2014-01-15 | 宸鸿科技(厦门)有限公司 | Flexible printed circuit board and touch-controlled panel using same |
| CN104362449A (en) * | 2014-11-03 | 2015-02-18 | 业成光电（深圳）有限公司 | Conductive jointing structure with anisotropic conductive particle aggregation improved |
-
2015
- 2015-12-29 CN CN201511025697.9A patent/CN105578718B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN105578718A (en) | 2016-05-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101951956B1 (en) | Flexible printed circuit board for packaging semiconductor device | |
| CN105404063B (en) | For the driving printed circuit board of display device and with its display device | |
| CN107247373A (en) | Display panel and display device | |
| US9349683B2 (en) | Chip-on-film package having bending part | |
| CN104698636A (en) | Display panel and electronic device | |
| US10314172B2 (en) | Flexible substrate and display device | |
| CN1963600A (en) | Liquid crystal display panel | |
| KR102251684B1 (en) | Chip on film package and display apparatus having the same | |
| CN109491122B (en) | Anti-static display panel and preparation method thereof | |
| CN103336597A (en) | Touch display module | |
| US20200133047A1 (en) | Display module | |
| US20150262916A1 (en) | Flexible package-to-socket interposer | |
| TW201447674A (en) | Touch panel and electronic device with the touch panel | |
| US10178771B2 (en) | Circuit board, manufacturing method thereof and display apparatus | |
| CN105578718B (en) | Flexible PCB, circuit connection structure and mobile terminal | |
| WO2020156595A9 (en) | Flexible circuit board and manufacturing method, display device, circuit board structure and display panel thereof | |
| CN109559643A (en) | A kind of display panel | |
| CN105116578A (en) | Drive chip structure and liquid crystal display device | |
| WO2022166296A1 (en) | Display panel and display apparatus | |
| US20160286651A1 (en) | Circuit board, manufacturing method thereof, and display device | |
| CN207968671U (en) | A kind of mobile phone camera module group FPCB flatness improvement structure | |
| CN103118483B (en) | Electronic assembly | |
| CN101546054B (en) | Active component array substrate | |
| TW201205520A (en) | Display device | |
| WO2018219128A1 (en) | Array substrate and display device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Patentee after: OPPO Guangdong Mobile Communications Co., Ltd. Address before: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Patentee before: Guangdong OPPO Mobile Communications Co., Ltd. |
|
| CP01 | Change in the name or title of a patent holder |