CN206470723U - Display panel and display device - Google Patents
Display panel and display device Download PDFInfo
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- CN206470723U CN206470723U CN201720182847.5U CN201720182847U CN206470723U CN 206470723 U CN206470723 U CN 206470723U CN 201720182847 U CN201720182847 U CN 201720182847U CN 206470723 U CN206470723 U CN 206470723U
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- alignment mark
- golden finger
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- flexible pcb
- display panel
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Abstract
The utility model embodiment provide a kind of display panel and display device, the display panel, including:Flexible PCB, the flexible PCB includes:Substrate layer;First side of the substrate layer is provided with conductive layer, and the conductive layer includes routing region and at least one golden finger area, and the conductive layer is provided with alignment mark structure in the golden finger area;Second side of the substrate layer is provided with supporting layer, and second side is relative with first side, on the direction perpendicular to the flexible PCB, and the projection of the supporting layer covers the golden finger area;The supporting layer includes the first void region, and first void region is correspondingly arranged with the alignment mark structure.So, during flexible PCB and connection component progress pressing are connected, the position of alignment mark structure can be more rapidly and accurately determined, so as to improve installation effectiveness and yields.
Description
【Technical field】
The utility model is related to display technology field, more particularly to a kind of display panel and display device.
【Background technology】
At present, flexible PCB (Flexible Printed Circuit, FPC) is provided with many electronic products, is led to
Flexible PCB is crossed to connect different parts, for example, need to connect by flexible PCB in display panel panel and
Drive circuit.As shown in Figure 1, Figure 2 and Figure 3, flexible PCB generally includes substrate layer 1, and the first side of substrate layer 1, which is provided with, leads
Electric layer 2, conductive layer 2 includes routing region 21 and golden finger area 22, and conductive layer 2 has golden finger in golden finger area 22,
For being attached with connection component, in order to ensure the stability of golden finger connection, the second side of substrate layer 1 is provided with support
Layer 3, the supporting layer 3 is covered in golden finger area 22, to realize the supporting role to golden finger.
During the utility model is realized, inventor has found that at least there are the following problems in the prior art:
Flexible PCB is realized by the conductive layer 2 positioned at the side golden finger area 22 of substrate layer 1 first and connection component to be connected
Connect, in order to ensure the accuracy of connection, the conductive layer 2 of golden finger area 22 has alignment mark structure, while connection component exists
Corresponding position is also equipped with alignment mark, during flexible PCB and connection component progress pressing are connected, sees
The sensing that direction is dotted line x in Fig. 3 is surveyed, supporting layer 3 can hinder observation, lead to not rapidly and accurately determine on flexible PCB
Whether the alignment mark structure of conductive layer 2 aligns with the alignment mark on connection component, so as to reduce installation effectiveness.
【Utility model content】
In view of this, the utility model embodiment provides a kind of display panel and display device, by flexible PCB
During being connected group progress pressing connection, the position of alignment mark structure can be more rapidly and accurately determined, so as to carry
High installation effectiveness.
On the one hand, a kind of display panel of the utility model embodiment, including:Flexible PCB, the flexible PCB bag
Include:
Substrate layer;
First side of the substrate layer is provided with conductive layer, and the conductive layer includes routing region and at least one golden finger
Region, the conductive layer is provided with alignment mark structure in the golden finger area;
Second side of the substrate layer is provided with supporting layer, and second side is relative with first side, perpendicular to institute
State on the direction of flexible PCB, the projection of the supporting layer covers the golden finger area;
The supporting layer includes the first void region, and first void region is corresponding with the alignment mark structure to be set
Put.
Alternatively, side of the conductive layer away from the substrate layer sets matcoveredn, perpendicular to the flexible electrical
On the direction of road plate, the projection of the protective layer covers the routing region.
Alternatively, the first glue-line, the protective layer and the conduction are provided between the supporting layer and the substrate layer
The second glue-line is provided between layer.
Alternatively, the thickness of the supporting layer and the protective layer is 12.5 microns to 25.4 microns;
The thickness of first glue-line and second glue-line is 12.5 microns to 25.4 microns;
The thickness of the substrate layer is 12 microns to 50 microns;
The thickness of the conductive layer is 4 microns to 35 microns.
Alternatively, on the direction perpendicular to the flexible PCB, the centre that is projected as of the alignment mark structure is engraved
The shape of empty and all round closure.
Alternatively, on the direction perpendicular to the flexible PCB, the projection of the alignment mark structure has rectangle
Middle void region.
Alternatively, the conductive layer has many golden fingers being set up in parallel in the golden finger area;
Outermost golden finger extends simultaneously to the direction away from other golden fingers in many golden fingers being set up in parallel
Form the alignment mark structure.
Alternatively, the substrate layer includes alignment mark region and the substrate area outside the alignment mark region
Domain;
The substrate layer thickness in the alignment mark region is less than the substrate layer thickness of the substrate regions;
On the direction perpendicular to the flexible PCB, the projection in the alignment mark region covers the alignment mark
Structure.
Alternatively, the supporting layer also includes the second void region, and second void region is to the golden finger area
Projection at least covering part golden finger area.
Alternatively, the flexible PCB includes two golden finger areas, and described two golden finger areas distinguish position
In the relative both sides in the routing region;
Each golden finger area is strip, in each golden finger area, the alignment mark structure
For two, described two alignment mark structures are located at the two ends of the golden finger area of the strip respectively.
On the other hand there is provided a kind of display device, including above-mentioned display panel.
Display panel and display device that the utility model is provided, be attached flexible PCB and connection component
During, due to being provided with the first void region on supporting course, and the first void region and the alignment mark structure on conductive layer
Correspondence, therefore the alignment mark structure on conductive layer can be observed through the first void region, so as to more quick accurate
Really determine whether the alignment mark structure of conductive layer on flexible PCB aligns with the alignment mark on connection component, so as to carry
High installation effectiveness and yields.In addition, void region is set on supporting layer in order to observe the mode of alignment mark, to existing
Some flexible PCBs change smaller, are conducive to controlling cost.
【Brief description of the drawings】
In order to illustrate more clearly of the technical scheme of the utility model embodiment, it will use below required in embodiment
Accompanying drawing be briefly described, it should be apparent that, drawings in the following description are only some embodiments of the present utility model, right
For those of ordinary skill in the art, without having to pay creative labor, it can also be obtained according to these accompanying drawings
Other accompanying drawings.
Fig. 1 is a kind of top view of flexible PCB in the prior art;
Fig. 2 is the upward view of flexible PCB in Fig. 1;
Fig. 3 be in Fig. 1 flexible PCB AA ' to cross-sectional view;
Fig. 4 is a kind of top view of flexible PCB in the utility model embodiment;
Fig. 5 is the upward view of flexible PCB in Fig. 4;
Fig. 6 be in Fig. 4 flexible PCB BB ' to cross-sectional view;
Fig. 7 is the close-up schematic view at C in Fig. 4;
Fig. 8 be in Fig. 7 DD ' to a kind of cross-sectional view;
Fig. 9 be Fig. 4 flexible PCB in conductive layer golden finger area structural representation;
Figure 10 be in Fig. 7 DD ' to another cross-sectional view;
Figure 11 is a kind of structural representation of display device in the utility model embodiment.
【Embodiment】
In order to be better understood from the technical solution of the utility model, the utility model embodiment is carried out below in conjunction with the accompanying drawings
It is described in detail.
It will be appreciated that described embodiment is only a part of embodiment of the utility model, rather than whole implementation
Example.Based on the embodiment in the utility model, those of ordinary skill in the art are obtained under the premise of creative work is not made
The all other embodiment obtained, belongs to the scope of the utility model protection.
The term used in the utility model embodiment is the purpose only merely for description specific embodiment, and is not intended to
Limit the utility model." one kind " of singulative used in the utility model embodiment and appended claims,
" described " and "the" are also intended to including most forms, unless context clearly shows that other implications.
The utility model embodiment provides a kind of display panel, including:Flexible PCB, such as Fig. 4,5,6,7 and Fig. 8 institute
Show, flexible PCB includes:Substrate layer 1;First side of substrate layer 1 is provided with conductive layer 2, and conductive layer 2 includes routing region 21
With at least one golden finger area 22, conductive layer 2 is provided with alignment mark structure 23 in golden finger area 22;The of substrate layer 1
Two sides are provided with supporting layer 3, and the second side is relative with the first side, on the direction perpendicular to flexible PCB, the projection of supporting layer 3
Cover golden finger area 22;Supporting layer 3 includes the first void region 31, and the first void region 31 is corresponding with alignment mark structure 23
Set.It should be noted that being oriented to for dotted line x is carried out by flexible PCB and connection component (not shown) in Fig. 6
Observed direction during connection.
Display panel in the present embodiment, during flexible PCB and connection component are attached, due to branch
Hold and the first void region is provided with layer, and the first void region is corresponding with the alignment mark structure on conductive layer, therefore can be with
The alignment mark structure on conductive layer is observed through the first void region, so as to more rapidly and accurately determine flexible electrical
Whether the alignment mark structure of conductive layer aligns with the alignment mark on connection component on the plate of road, thus improve installation effectiveness and
Yields.In addition, void region is set on supporting layer in order to observe the mode of alignment mark, to existing flexible PCB
Change smaller, be conducive to controlling cost.
Alternatively, side of the conductive layer 2 away from substrate layer 1 sets matcoveredn 4, in the direction perpendicular to flexible PCB
On, the projection covering routing region 21 of protective layer 4, protective layer 4 is used to protect the routing region 21 of conductive layer 2.
Alternatively, referring to Fig. 5,6, the first glue-line 51, protective layer 4 and conductive layer are provided between supporting layer 3 and substrate layer 1
The second glue-line 52 is provided between 2, the first glue-line 51 is used to be bonded supporting course 3 and substrate layer 1, and the second glue-line 52, which is used to be bonded, to be protected
Sheath 4 and conductive layer 2.
Specifically, the thickness of supporting layer 3 and protective layer is 12.5 microns to 25.4 microns;First glue-line 51 and the second glue-line
52 thickness is 12.5 microns to 25.4 microns;The thickness of substrate layer 1 is 12 microns to 50 microns;The thickness of conductive layer 2 is 4 micro-
Rice is to 35 microns.
Specifically, on the direction perpendicular to flexible PCB, alignment mark structure 23 is projected as middle hollow out and four
The shape of week closing, during flexible PCB and connection component are attached, by observing alignment mark structure 23
Space void region whether alignd with the alignment mark on connection component can determine whether flexible PCB whether with connection component
Correct contraposition.Alignment mark is set to middle hollow out and the annular of all round closure, with design is simple, difficulty of processing is low, be easy to
The effect of identification.
Specifically, referring to Fig. 7,8, on the direction perpendicular to flexible PCB, the projection of alignment mark structure 23 has
Alignment mark on the middle void region of rectangle, connection component is set to alignment mark on corresponding rectangle, connection component
The rectangular dimension of structure is less than the middle void region size of alignment mark structure 23 on flexible PCB, by flexible PCB
During being attached with connection component, the alignment mark on rectangle and connection component by observing the middle void region
Rectangle whether align and can determine whether whether flexible PCB correctly aligns with connection component.It is to be appreciated that alignment mark knot
The middle void region shape of structure 23 can be the other shapes such as circle, triangle, hexagon.
As shown in figure 9, conductive layer 2 has many golden fingers 24 being set up in parallel in golden finger area 22;It is set up in parallel
Outermost golden finger 24 extends to the direction away from other golden fingers 24 and forms alignment mark structure in many golden fingers 24
23, i.e. centre hollow out and the annular of all round closure.By the way that golden finger 24 is formed into alignment mark structure 23 to extending sideways, so that
Alignment mark is set without extra on conductive layer 2, the multiplexing of golden finger and alignment mark is realized.It is to be appreciated that except
It is multiplexed by golden finger outside alignment mark, corresponding alignment mark structure 23 can also be separately provided on conductive layer 2.
As shown in Figure 10, substrate layer 1 includes alignment mark region 11 and the substrate area outside alignment mark region 11
Domain 12;The thickness of substrate layer 1 in alignment mark region 11 is less than the thickness of substrate layer 1 of substrate regions 12;Perpendicular to flexible circuit
On the direction of plate, the projection covering alignment mark structure 23 in alignment mark region 11.By the base corresponding to alignment mark structure 23
The thickness of material layer 1 reduces, and can further enhance the translucency at alignment mark structure 23, so as to reduce the stop effect to observation
Really, more clearly can be observed by alignment mark region 11 conductive layer on flexible PCB alignment mark structure whether with
Alignment mark alignment on connection component, so as to further increase installation effectiveness.
Specifically, supporting layer 3 also includes the second void region (not shown), and the second void region is to golden finger area
22 projection at least covering part golden finger area 22.During flexible PCB and connection component are attached, remove
The alignment mark structure 23 of conductive layer 2 on flexible PCB can be observed by the first void region 31 whether with being connected group
Alignment mark alignment on part is outer, can also be by relative between the second void region auxiliary observation connection component and golden finger
Position relationship, so as to further improve installation effectiveness.
Specifically, as shown in figure 5, flexible PCB can include two golden finger areas 22, two golden finger areas 22
It is located at the relative both sides in routing region 21 respectively;Each golden finger area 22 is strip, in each golden finger area 22,
Alignment mark structure 23 can be two (an alignment mark structure 23 is only illustrated in Fig. 5), two alignment mark structures 23
It is located at the two ends of the golden finger area 22 of strip respectively.
Specifically, above-mentioned substrate layer 1 can be made up of polyimides, and polyimides has that cost is low, density is low, intensity is high
The features such as.Supporting layer 3 and protective layer 4 can be made up of polyimides or polyester.Conductive layer 2 can be made of copper, and copper has into
The features such as this is low, conductance is high.
As shown in figure 11, the utility model embodiment also provides a kind of display device, including above-mentioned display panel 400.
The concrete structure and principle of the display panel 400 are same as the previously described embodiments, will not be repeated here.Display device can
To be any such as touch-screen, mobile phone, tablet PC, notebook computer, electric paper book or television set there is liquid crystal display work(
The electronic equipment of energy.
Display device in the present embodiment, during flexible PCB and connection component are attached, due to branch
Hold and the first void region is provided with layer, and the first void region is corresponding with the alignment mark structure on conductive layer, therefore can be with
The alignment mark structure on conductive layer is observed through the first void region, so as to more rapidly and accurately determine flexible electrical
Whether the alignment mark structure of conductive layer aligns with the alignment mark on connection component on the plate of road, thus improve installation effectiveness and
Yields.In addition, void region is set on supporting layer in order to observe the mode of alignment mark, to existing flexible PCB
Change smaller, be conducive to controlling cost.
Preferred embodiment of the present utility model is the foregoing is only, it is all at this not to limit the utility model
Within the spirit and principle of utility model, any modification, equivalent substitution and improvements done etc. should be included in the utility model
Within the scope of protection.
Claims (11)
1. a kind of display panel, it is characterised in that including:Flexible PCB, the flexible PCB includes:
Substrate layer;
First side of the substrate layer is provided with conductive layer, and the conductive layer includes routing region and at least one golden finger area
Domain, the conductive layer is provided with alignment mark structure in the golden finger area;
Second side of the substrate layer is provided with supporting layer, and second side is relative with first side, perpendicular to described soft
Property circuit board direction on, the projection of the supporting layer covers the golden finger area;
The supporting layer includes the first void region, and first void region is correspondingly arranged with the alignment mark structure.
2. display panel according to claim 1, it is characterised in that
Side of the conductive layer away from the substrate layer sets matcoveredn, in the direction perpendicular to the flexible PCB
On, the projection of the protective layer covers the routing region.
3. display panel according to claim 2, it is characterised in that
The first glue-line is provided between the supporting layer and the substrate layer, is provided between the protective layer and the conductive layer
Second glue-line.
4. display panel according to claim 3, it is characterised in that
The thickness of the supporting layer and the protective layer is 12.5 microns to 25.4 microns;
The thickness of first glue-line and second glue-line is 12.5 microns to 25.4 microns;
The thickness of the substrate layer is 12 microns to 50 microns;
The thickness of the conductive layer is 4 microns to 35 microns.
5. display panel according to claim 1, it is characterised in that
On the direction perpendicular to the flexible PCB, the alignment mark structure is projected as middle hollow out and all round closure
Shape.
6. display panel according to claim 5, it is characterised in that
On the direction perpendicular to the flexible PCB, middle vacancy section of the projection with rectangle of the alignment mark structure
Domain.
7. display panel according to claim 5, it is characterised in that
The conductive layer has many golden fingers being set up in parallel in the golden finger area;
Outermost golden finger extends and formed to the direction away from other golden fingers in many golden fingers being set up in parallel
The alignment mark structure.
8. display panel according to claim 1, it is characterised in that
The substrate layer includes alignment mark region and the substrate regions outside the alignment mark region;
The substrate layer thickness in the alignment mark region is less than the substrate layer thickness of the substrate regions;
On the direction perpendicular to the flexible PCB, the projection in the alignment mark region covers the alignment mark knot
Structure.
9. display panel according to claim 1, it is characterised in that
The supporting layer also includes the second void region, and second void region is at least covered to the projection of the golden finger area
Cover golden finger area.
10. display panel as claimed in any of claims 1 to 9, it is characterised in that
The flexible PCB includes two golden finger areas, and described two golden finger areas are located at the cabling area respectively
The relative both sides in domain;
Each golden finger area is strip, in each golden finger area, and the alignment mark structure is two
Individual, described two alignment mark structures are located at the two ends of the golden finger area of the strip respectively.
11. a kind of display device, it is characterised in that including the display panel as described in any one in claim 1 to 10.
Priority Applications (1)
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CN201720182847.5U CN206470723U (en) | 2017-02-28 | 2017-02-28 | Display panel and display device |
Applications Claiming Priority (1)
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CN201720182847.5U CN206470723U (en) | 2017-02-28 | 2017-02-28 | Display panel and display device |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107820364A (en) * | 2017-12-11 | 2018-03-20 | 苏州广林达电子科技有限公司 | Flexible PCB |
CN108877545A (en) * | 2018-06-29 | 2018-11-23 | 上海天马有机发光显示技术有限公司 | Display device |
CN109068478A (en) * | 2018-11-01 | 2018-12-21 | 武汉天马微电子有限公司 | Flexible circuit board and display device |
CN112885241A (en) * | 2021-02-07 | 2021-06-01 | 业成科技(成都)有限公司 | Frame and manufacturing method thereof, display module and measuring method thereof and electronic equipment |
CN113655695A (en) * | 2021-09-02 | 2021-11-16 | 西华大学 | Composite photoetching alignment system and method based on medium microsphere super-resolution imaging |
-
2017
- 2017-02-28 CN CN201720182847.5U patent/CN206470723U/en active Active
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107820364A (en) * | 2017-12-11 | 2018-03-20 | 苏州广林达电子科技有限公司 | Flexible PCB |
CN108877545A (en) * | 2018-06-29 | 2018-11-23 | 上海天马有机发光显示技术有限公司 | Display device |
CN109068478A (en) * | 2018-11-01 | 2018-12-21 | 武汉天马微电子有限公司 | Flexible circuit board and display device |
CN112885241A (en) * | 2021-02-07 | 2021-06-01 | 业成科技(成都)有限公司 | Frame and manufacturing method thereof, display module and measuring method thereof and electronic equipment |
CN113655695A (en) * | 2021-09-02 | 2021-11-16 | 西华大学 | Composite photoetching alignment system and method based on medium microsphere super-resolution imaging |
CN113655695B (en) * | 2021-09-02 | 2023-11-07 | 西华大学 | Composite photoetching alignment system and method based on medium microsphere super-resolution imaging |
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