CN104281309B - The induction module of touch-screen, thin-film type capacitance touch-screen and hand-hold communication device using the induction module - Google Patents
The induction module of touch-screen, thin-film type capacitance touch-screen and hand-hold communication device using the induction module Download PDFInfo
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- CN104281309B CN104281309B CN201310293484.9A CN201310293484A CN104281309B CN 104281309 B CN104281309 B CN 104281309B CN 201310293484 A CN201310293484 A CN 201310293484A CN 104281309 B CN104281309 B CN 104281309B
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- conducting film
- induction module
- connecting portion
- screen
- film
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- 230000006698 induction Effects 0.000 title claims abstract description 34
- 239000010409 thin film Substances 0.000 title claims abstract description 24
- 238000004891 communication Methods 0.000 title claims abstract description 9
- 239000010408 film Substances 0.000 claims abstract description 92
- 239000004568 cement Substances 0.000 claims description 8
- 239000012530 fluid Substances 0.000 claims description 8
- 230000003287 optical effect Effects 0.000 claims description 8
- 239000000565 sealant Substances 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 7
- 239000004020 conductor Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 3
- 238000005260 corrosion Methods 0.000 abstract description 7
- 230000007797 corrosion Effects 0.000 abstract description 7
- XBBRGUHRZBZMPP-UHFFFAOYSA-N 1,2,3-trichloro-4-(2,4,6-trichlorophenyl)benzene Chemical compound ClC1=CC(Cl)=CC(Cl)=C1C1=CC=C(Cl)C(Cl)=C1Cl XBBRGUHRZBZMPP-UHFFFAOYSA-N 0.000 description 16
- CJDNEKOMKXLSBN-UHFFFAOYSA-N 1-chloro-3-(4-chlorophenyl)benzene Chemical compound C1=CC(Cl)=CC=C1C1=CC=CC(Cl)=C1 CJDNEKOMKXLSBN-UHFFFAOYSA-N 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 2
- 239000005357 flat glass Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012788 optical film Substances 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Position Input By Displaying (AREA)
- Push-Button Switches (AREA)
Abstract
A kind of induction module of touch-screen, it includes：Transparency carrier, with first surface and the second surface relative with first surface；Conducting film, is fitted on the second surface of transparency carrier, and the middle part of conducting film is viewing area, and edge is non-visible area domain, and the non-visible area domain of conducting film offers pass through aperture；Flexible PCB, located at a wherein edge for transparency carrier, and flexible PCB has the connecting portion electrically connected with conducting film；Connecting portion is passed through after the through hole of conducting film, is bound and is electrically connected with the side conducting wire of conducting film towards transparency carrier, makes the binding position marginal existence spacing corresponding with conducting film of the conducting wire of connecting portion and transparency carrier.The corrosion resistance of the binding region of the induction module of above-mentioned touch-screen is higher.The present invention also provides a kind of thin-film type capacitance touch-screen and hand-hold communication device using the induction module.
Description
【Technical field】
The present invention relates to a kind of touch-screen, more particularly to a kind of induction module of touch-screen, using the induction module
Thin-film type capacitance touch-screen and hand-hold communication device.
【Background technology】
Fig. 1 to Fig. 4 is referred to, the induction module 10 of traditional thin-film type capacitance screen generally includes cover-plate glass 11, laminating
In cover-plate glass 11 ITO flexible conductive films 12 and bind and electrically connect the flexible PCBs 13 of ITO flexible conductive films 12
（FPC）.Connect the internal circuit of the electronic equipments such as mobile phone to transmit touching signals using flexible PCB 13.In order to reduce resistance
Anti-, the non-visible area domain 12a of ITO flexible conductive films 12 sets plain conductor（It is not shown）, and the connection of flexible PCB 13
Place also is provided with exposed metal pins（It is not shown）.Salt mist experiment and actual use show that flexible PCB 13 and ITO flexibilities are led
It is easiest to occur corrosion and cause loose contact at the binding of conductive film 12.In existing process, flexible PCB 13 and ITO is flexible
The edge of ITO flexible conductive films 12 is generally proximal at the binding of conductive film 12 so that outside aqueous vapor is easily accessible flexible electrical
At the binding of road plate 13 and ITO flexible conductive films 12 so that this region is easier to be corroded.
【The content of the invention】
In view of above-mentioned condition, it is necessary to provide a kind of induction module of the stronger touch-screen of corrosion resistance.
A kind of induction module of touch-screen, it includes：
Transparency carrier, with first surface and the second surface relative with the first surface；
On conducting film, the second surface for fitting in the transparency carrier, the middle part of the conducting film is viewing area, edge
For non-visible area domain, the non-visible area domain of the conducting film offers pass through aperture；And
Flexible PCB, located at a wherein edge for the transparency carrier, and the flexible PCB has and institute
State the connecting portion of conducting film electrical connection；The connecting portion is through after the through hole of the conducting film, with the conducting film towards institute
The conducting wire for stating the side of transparency carrier is bound and electrically connected, make the binding position of the connecting portion and the conducting wire with
The corresponding marginal existence spacing of conducting film.
Because the non-visible area domain of conducting film offers pass through aperture, the connecting portion of flexible PCB is passed through after the through hole
With the inboard wire line bonding of conducting film, make flexible PCB connecting portion and conducting film binding at as far as possible away from conducting film
Edge, and then outside aqueous vapor is not easily accessed at the binding of flexible PCB and conducting film, binding region is more difficult
It is corroded, so as to improve the corrosion resistance of the induction module of above-mentioned touch-screen.
In one of the embodiments, the connecting portion is provided with exposed metal pins, the non-visible area of the conducting film
The side of the direction transparency carrier in domain is provided with the plain conductor electrically connected with the metal pins.
In one of the embodiments, the conducting film is flexible conductive film.
In one of the embodiments, the conducting film is ito thin film.
In one of the embodiments, the binding position of the wire line on the inside of the connecting portion and the conducting film and institute
The spacing for stating the corresponding edge of conducting film is more than or equal to 4 millimeters.
In one of the embodiments, the corresponding edge of conductive diaphragm plate and the transparency carrier are adjacent to the flexible electrical
The edge of road plate is concordant.
In one of the embodiments, the periphery of the periphery of the conducting film and the transparency carrier is completely superposed.
In one of the embodiments, the connecting portion is rectangle, and the through hole is rectangular opening, and the connecting portion
Width be substantially equal to the width of the through hole.
In one of the embodiments, in addition to for the connecting portion of the flexible PCB to be fixed on into the conducting film
Fluid sealant, the fluid sealant be bonded in the connecting portion of the flexible PCB and the through hole of the conducting film periphery it
Between.
In one of the embodiments, in addition to optical cement layer, the optical cement layer is layered in the transparency carrier and institute
State between conducting film, and the connecting portion is bundled between the optical cement layer and the conducting film.
Meanwhile, the present invention provides a kind of thin-film type capacitance touch-screen.
A kind of thin-film type capacitance touch-screen, it is characterised in that including above-mentioned induction module and with the flexible PCB
The drive circuit module of electrical connection, the first surface of the transparency carrier is positive for the touch of the thin-film type capacitance touch-screen.
In addition, the present invention also provides a kind of hand-hold communication device.
A kind of hand-hold communication device, it is characterised in that including above-mentioned thin-film type capacitance touch-screen and with the diaphragm type
The processor of capacitance touch screen electrical connection.
【Brief description of the drawings】
Fig. 1 is the side view of the induction module of traditional touch-screen；
Fig. 2 is the enlarged drawing of II parts in Fig. 1；
Fig. 3 is the top view of the induction module of the touch-screen shown in Fig. 1；
Fig. 4 is the enlarged drawing of IV parts in Fig. 3；
Fig. 5 is the side view of the induction module of the touch-screen of embodiment of the present invention；
Fig. 6 is the enlarged drawing of VI parts in Fig. 5；
Fig. 7 is the top view of the induction module of the touch-screen shown in Fig. 5；
Fig. 8 is the enlarged drawing of VIII parts in Fig. 7.
【Embodiment】
For the ease of understanding the present invention, the present invention is described more fully below with reference to relevant drawings.In accompanying drawing
Give the preferred embodiment of the present invention.But, the present invention can be realized in many different forms, however it is not limited to herein
Described embodiment.On the contrary, the purpose for providing these embodiments is to make the understanding to the disclosure more saturating
It is thorough comprehensive.
It should be noted that term as used herein " vertically ", " level ", "left", "right" and similar table
State for illustrative purposes only.
Unless otherwise defined, all of technologies and scientific terms used here by the article is with belonging to technical field of the invention
The implication that technical staff is generally understood that is identical.Term used in the description of the invention herein is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term as used herein " and/or " include one or more phases
The arbitrary and all combination of the Listed Items of pass.
Referring to Fig. 5, the induction module 100 of the touch-screen of embodiment of the present invention, including transparency carrier 110, conducting film
120 and flexible PCB 140.The induction module 100 can apply to different touch-screens, for example, thin-film type capacitance touch-screen,
Diaphragm type touch screens etc., specifically in the illustrated embodiment, are illustrated by taking thin-film type capacitance touch-screen as an example.Thin-film type capacitance
Touch-screen can be divided into individual layer inductance capacitance touch-screen, double-deck inductance capacitance touch-screen etc..
Transparency carrier 110 has first surface 111 and the second surface 113 relative with first surface 111.Transparency carrier
110 can be transparency glass plate, transparent resin plate etc..Specifically in the illustrated embodiment, transparency carrier 110 is clear glass
Plate.
Also referring to Fig. 6 and Fig. 7, conducting film 120 is fitted on the second surface 113 of transparency carrier 110.Conducting film
120 middle part is viewing area 121, and edge is non-visible area domain 123, and the non-visible area domain 123 of conducting film 120 is offered always
Perforation 125.Specifically in the illustrated embodiment, conducting film 120 is flexible conductive film, for example, conducting film 120 is ito thin film.
The shape of conducting film 120 can, part different from the shape of substrate it is identical or identical.Specifically in diagram
In embodiment, conducting film 120 is concordant with the top margin of flexible PCB 140 with the top margin of flexible PCB 140 with transparency carrier 110.Very
Person, the periphery of the periphery and transparency carrier 110 of conducting film 120 is completely superposed.
Also referring to Fig. 8, flexible PCB 140 is located at a wherein edge for transparency carrier 110, for example, flexible circuit
Plate 140 is located at the top of transparency carrier 110.Also, one end of flexible PCB 140 is provided with the company electrically connected with conducting film 120
Socket part 141.The flexible PCB 140 is arranged in the through hole 125 so that connecting portion 141 and conducting film 120 are towards transparency carrier
110 side, and conducting wire positioned at the lower section of the through hole 125 binds and electrically connects.Therefore, the connecting portion 141 and institute
There is spacing with the top margin of conducting film 120 in the binding position 121 for stating the conducting wire of conducting film 120.In other words, flexible electrical
The connecting portion 141 of road plate 140 from conducting film 120 dorsad transparency carrier 110 side through conducting film 120 through hole 125 after,
Bound together with the binding position 121 of conducting film 120 towards the wire line of the side of transparency carrier 110, so that soft
Property circuit board 140 and conducting film 120 conducting wire turn on, and bind position 121 away from conducting film 120 and flexible PCB
140 apical margin.
Specifically in the illustrated embodiment, the connecting portion 141 of flexible PCB 140 is rectangle, and through hole 125 is rectangle
Hole, and the width of connecting portion 141 is substantially equal to the width of through hole 125.Connecting portion 141 is provided with exposed metal pins（Figure
Do not show）, the inner side in the non-visible area domain 123 of conducting film 120 is provided with the plain conductor electrically connected with the metal pins of connecting portion 141
（It is not shown）.
The binding position 121 of conducting film 120 and the spacing of the top margin of conducting film 120 can be set according to actual needs, excellent
Selection of land, binding position and the spacing of the top margin of conducting film 120 are more than or equal to 4 millimeters.
Further, in addition to fluid sealant 150, fluid sealant 150 is bonded in the connecting portion 141 of flexible PCB 140 with leading
Between the periphery of the through hole 125 of electrolemma 120, with the connecting portion 141 of fixing flexible circuit board 140.Because fluid sealant 150 will be soft
Property circuit board 140 connecting portion 141 be bonded together with conducting film 120, can prevent the connecting portion 141 of flexible PCB 140 with
The binding position 121 of the wire line of the inner side of conducting film 120 is released, and plays pretension effect.Also, fluid sealant 150 is bonded in soft
It is able to can be entered with sealing through holes 125 between the periphery of the connecting portion 141 of property circuit board 140 and the through hole 125 of conducting film 120
One step improves the sealing of the binding region of the connecting portion 141 of flexible PCB 140 and the inboard wire circuit of conducting film 120,
Further improve the corrosion resistance of binding region.
Further, in addition to optical cement layer 160, optical cement layer 160 be layered in transparency carrier 110 and conducting film 120 it
Between, and connecting portion 141 is bundled between optical cement layer 160 and conducting film 120, so that optical film 120 is fixed on into transparent base
Plate 110.
Compared to the induction module of traditional touch-screen, the induction module 100 of above-mentioned touch-screen at least has advantages below：
（1）Because the non-visible area domain 123 of conducting film 120 offers pass through aperture 125, the connection of flexible PCB 140
Portion 141 passes through the inboard wire line bonding with conducting film 120 after the through hole 125, makes the connecting portion of flexible PCB 140
141 with the edge away from conducting film 120 as far as possible at the binding of conducting film 120,（It is the top of conducting film 120 in present embodiment
Side）, and then make it that outside aqueous vapor is not easily accessed flexible PCB 140 and at the binding of conducting film 120, binding region is not easy
It is corroded, so as to improve the corrosion resistance of the induction module 100 of above-mentioned touch-screen.
（2）Due to the corresponding edge of conducting film 120 and the corresponding edge of transparency carrier 110（It is transparent in present embodiment
The top margin of substrate 110）Concordantly so that the connecting portion 141 of flexible PCB 140 and the conducting wire of the conducting film 120 are tied up
The spacing for determining position 121 with the corresponding edge of the conducting film 120 is larger, further improves the induction module of above-mentioned touch-screen
100 corrosion resistance.
Meanwhile, the present invention a kind of thin-film type capacitance touch-screen is also provided, it include above-mentioned induction module 100 and with the flexibility
The drive circuit module that circuit board 140 is electrically connected, wherein, the first surface 111 of transparency carrier 110 is thin-film type capacitance touch-screen
Touch front.The drive circuit module drives the thin-film type capacitance touch-screen by the flexible PCB 140.
In addition, the present invention also provides a kind of hand-hold communication device, it includes above-mentioned thin-film type capacitance touch-screen and thin with this
The processor of membrane type capacitance touch screen electrical connection, the processor receives the touching signals of above-mentioned thin-film type capacitance touch-screen.
It should be noted that the hand-hold communication device can be the electronic installations such as mobile phone, tablet personal computer.
Embodiment described above only expresses the several embodiments of the present invention, and it describes more specific and detailed, but simultaneously
Therefore the limitation to the scope of the claims of the present invention can not be interpreted as.It should be pointed out that for one of ordinary skill in the art
For, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the guarantor of the present invention
Protect scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (11)
1. a kind of induction module of touch-screen, it is characterised in that including：
Transparency carrier, with first surface and the second surface relative with the first surface；
On conducting film, the second surface for fitting in the transparency carrier, the middle part of the conducting film is viewing area, and edge is non-
Viewing area, the non-visible area domain of the conducting film offers pass through aperture；And
Flexible PCB, located at a wherein edge for the transparency carrier, and the flexible PCB has and led with described
The connecting portion of electrolemma electrical connection；The connecting portion is through after the through hole of the conducting film, with the conducting film towards described
The conducting wire of the side of bright substrate is bound and electrically connected, make the binding position of the connecting portion and the conducting wire with it is described
The corresponding marginal existence spacing of conducting film.
2. induction module as claimed in claim 1, it is characterised in that the connecting portion is provided with exposed metal pins, described
The side of the direction transparency carrier in the non-visible area domain of conducting film is provided with the plain conductor electrically connected with the metal pins.
3. induction module as claimed in claim 1, it is characterised in that the conducting film is flexible conductive film.
4. induction module as claimed in claim 3, it is characterised in that the conducting film is ito thin film.
5. induction module as claimed in claim 1, it is characterised in that the wire line of the connecting portion and the conducting film
The spacing for binding position edge corresponding with the conducting film is more than or equal to 4 millimeters.
6. induction module as claimed in claim 5, it is characterised in that the corresponding edge of conducting film and the transparency carrier
The edge of the neighbouring flexible PCB is concordant.
7. induction module as claimed in claim 1, it is characterised in that the connecting portion is rectangle, the through hole is rectangle
Hole, and the width of the connecting portion is substantially equal to the width of the through hole.
8. the induction module as described in claim 1~7 any one, it is characterised in that also including for by the flexible electrical
The connecting portion of road plate is fixed on the fluid sealant of the conducting film, the fluid sealant be bonded in the connecting portion of the flexible PCB with
Between the periphery of the through hole of the conducting film.
9. the induction module as described in claim 1~7 any one, it is characterised in that also including optical cement layer, the optics
Glue-line is layered between the transparency carrier and the conducting film, and the connecting portion be bundled in the optical cement layer with it is described
Between conducting film.
10. a kind of thin-film type capacitance touch-screen, it is characterised in that including sensing mould as claimed in any one of claims 1 to 9 wherein
Block and the drive circuit module electrically connected with the flexible PCB, the first surface of the transparency carrier is the thin-film electro
Hold the touch front of touch-screen.
11. a kind of hand-hold communication device, it is characterised in that including thin-film type capacitance touch-screen as claimed in claim 10 and with
The processor of the thin-film type capacitance touch-screen electrical connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310293484.9A CN104281309B (en) | 2013-07-12 | 2013-07-12 | The induction module of touch-screen, thin-film type capacitance touch-screen and hand-hold communication device using the induction module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310293484.9A CN104281309B (en) | 2013-07-12 | 2013-07-12 | The induction module of touch-screen, thin-film type capacitance touch-screen and hand-hold communication device using the induction module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104281309A CN104281309A (en) | 2015-01-14 |
| CN104281309B true CN104281309B (en) | 2017-10-27 |
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| CN201310293484.9A Active CN104281309B (en) | 2013-07-12 | 2013-07-12 | The induction module of touch-screen, thin-film type capacitance touch-screen and hand-hold communication device using the induction module |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104751135A (en) * | 2015-03-06 | 2015-07-01 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification device, touch screen and electronic equipment |
| CN106155400A (en) * | 2015-04-24 | 2016-11-23 | 南昌欧菲光科技有限公司 | Touch screen and induction module thereof |
| CN106201036B (en) * | 2015-04-29 | 2023-06-20 | 安徽精卓光显技术有限责任公司 | In-cell touch display screen and touch display screen module |
| CN105511701B (en) * | 2015-12-24 | 2019-05-17 | 昆山维信诺科技有限公司 | Touch control conductive film, touch control component, touching display screen and electronic equipment |
| CN106919282A (en) * | 2017-02-10 | 2017-07-04 | 南昌欧菲显示科技有限公司 | Tactile feedback display screen |
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| JP2001168546A (en) * | 1999-12-03 | 2001-06-22 | Denso Corp | Portable information terminal |
| CN102981677A (en) * | 2012-12-13 | 2013-03-20 | 意力(广州)电子科技有限公司 | Touch screen preventing water vapor penetration and manufacturing method thereof |
| CN103034387A (en) * | 2013-01-12 | 2013-04-10 | 深圳市中显微电子有限公司 | Single substrate type capacitive touch screen and manufacture method thereof |
| CN103034361A (en) * | 2011-09-30 | 2013-04-10 | 株式会社和冠 | Position detection sensor unit and position detection apparatus |
| CN203350830U (en) * | 2013-07-12 | 2013-12-18 | 南昌欧菲光科技有限公司 | Sensing module of touch screen, thin-film type capacitive touch screen adopting sensing module and handheld communication device |
-
2013
- 2013-07-12 CN CN201310293484.9A patent/CN104281309B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001168546A (en) * | 1999-12-03 | 2001-06-22 | Denso Corp | Portable information terminal |
| CN103034361A (en) * | 2011-09-30 | 2013-04-10 | 株式会社和冠 | Position detection sensor unit and position detection apparatus |
| CN102981677A (en) * | 2012-12-13 | 2013-03-20 | 意力(广州)电子科技有限公司 | Touch screen preventing water vapor penetration and manufacturing method thereof |
| CN103034387A (en) * | 2013-01-12 | 2013-04-10 | 深圳市中显微电子有限公司 | Single substrate type capacitive touch screen and manufacture method thereof |
| CN203350830U (en) * | 2013-07-12 | 2013-12-18 | 南昌欧菲光科技有限公司 | Sensing module of touch screen, thin-film type capacitive touch screen adopting sensing module and handheld communication device |
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| CN104281309A (en) | 2015-01-14 |
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Address after: 330000 Huang Jia Hu Road, Nanchang economic and Technological Development Zone, Nanchang, Jiangxi Co-patentee after: OFilm Tech Co.,Ltd. Patentee after: Nanchang OFilm Tech. Co.,Ltd. Co-patentee after: SUZHOU OFILM TECH Co.,Ltd. Address before: 330000 Huang Jia Hu Road, Nanchang economic and Technological Development Zone, Nanchang, Jiangxi Co-patentee before: Shenzhen OFilm Tech Co.,Ltd. Patentee before: Nanchang OFilm Tech. Co.,Ltd. Co-patentee before: SUZHOU OFILM TECH Co.,Ltd. |
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Address after: 215143 No. 233 Kangyang Road, Huangdi Town, Xiangcheng District, Suzhou City, Jiangsu Province Co-patentee after: Nanchang OFilm Tech. Co.,Ltd. Patentee after: SUZHOU OFILM TECH Co.,Ltd. Co-patentee after: OFilm Tech Co.,Ltd. Address before: 330000 Huang Jia Hu Road, Nanchang economic and Technological Development Zone, Nanchang, Jiangxi Co-patentee before: OFilm Tech Co.,Ltd. Patentee before: Nanchang OFilm Tech. Co.,Ltd. Co-patentee before: SUZHOU OFILM TECH Co.,Ltd. |
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Address after: 215143 No. 233 Kangyang Road, Huangdi Town, Xiangcheng District, Suzhou City, Jiangsu Province Patentee after: SUZHOU OFILM TECH Co.,Ltd. Patentee after: Nanchang OFilm Tech. Co.,Ltd. Patentee after: Ophiguang Group Co.,Ltd. Address before: 215143 No. 233 Kangyang Road, Huangdi Town, Xiangcheng District, Suzhou City, Jiangsu Province Patentee before: SUZHOU OFILM TECH Co.,Ltd. Patentee before: Nanchang OFilm Tech. Co.,Ltd. Patentee before: OFilm Tech Co.,Ltd. |
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Effective date of registration: 20210301 Address after: 231323 Building 1, precision electronics industrial park, Hangbu Town, Shucheng County, Lu'an City, Anhui Province Patentee after: Anhui jingzhuo optical display technology Co.,Ltd. Address before: 215143 No. 233 Kangyang Road, Huangdi Town, Xiangcheng District, Suzhou City, Jiangsu Province Patentee before: SUZHOU OFILM TECH Co.,Ltd. Patentee before: Nanchang OFilm Tech. Co.,Ltd. Patentee before: Ophiguang Group Co.,Ltd. |
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