CN104281309B - The induction module of touch-screen, thin-film type capacitance touch-screen and hand-hold communication device using the induction module - Google Patents

Abstract

A kind of induction module of touch-screen, it includes：Transparency carrier, with first surface and the second surface relative with first surface；Conducting film, is fitted on the second surface of transparency carrier, and the middle part of conducting film is viewing area, and edge is non-visible area domain, and the non-visible area domain of conducting film offers pass through aperture；Flexible PCB, located at a wherein edge for transparency carrier, and flexible PCB has the connecting portion electrically connected with conducting film；Connecting portion is passed through after the through hole of conducting film, is bound and is electrically connected with the side conducting wire of conducting film towards transparency carrier, makes the binding position marginal existence spacing corresponding with conducting film of the conducting wire of connecting portion and transparency carrier.The corrosion resistance of the binding region of the induction module of above-mentioned touch-screen is higher.The present invention also provides a kind of thin-film type capacitance touch-screen and hand-hold communication device using the induction module.

Description

A sensing module of a touch screen, a thin-film capacitive touch screen using the sensing module and handheld communication device

【Technical field】

The invention relates to a touch screen, in particular to a sensing module of the touch screen, a thin-film capacitive touch screen using the sensing module and a handheld communication device.

【Background technique】

Please refer to Fig. 1 to Fig. 4, the sensing module 10 of traditional thin-film capacitive screen generally comprises cover plate glass 11, the ITO flexible conductive film 12 that is bonded to cover plate glass 11 and binds and electrically connects ITO flexible conductive film 12 Flexible printed circuit board 13 (FPC). The flexible circuit board 13 is used to connect internal circuits of electronic devices such as mobile phones to transmit touch signals. In order to reduce the impedance, the non-visible area 12a of the ITO flexible conductive film 12 is provided with metal wires (not shown), and the connection of the flexible circuit board 13 is also provided with exposed metal pins (not shown). Salt spray experiments and actual use have shown that the joint between the flexible circuit board 13 and the ITO flexible conductive film 12 is most likely to be corroded and cause poor contact. In the existing technology, the binding place between the flexible circuit board 13 and the ITO flexible conductive film 12 is usually close to the edge of the ITO flexible conductive film 12, so that external moisture can easily enter the binding place between the flexible circuit board 13 and the ITO flexible conductive film 12, making this area more susceptible to corrosion.

【Content of invention】

In view of the above situation, it is necessary to provide a sensing module of a touch screen with strong corrosion resistance.

A sensing module of a touch screen, comprising:

a transparent substrate having a first surface and a second surface opposite to the first surface;

A conductive film attached to the second surface of the transparent substrate, the middle part of the conductive film is a visible area, and the edge is a non-visible area, and a through hole is opened in the non-visible area of the conductive film; and

The flexible circuit board is arranged at one edge of the transparent substrate, and the flexible circuit board has a connecting portion electrically connected to the conductive film; after the connecting portion passes through the through hole of the conductive film, it is connected to the conductive film. The conductive lines on the side of the conductive film facing the transparent substrate are bound and electrically connected, so that there is a distance between the connecting part and the binding part of the conductive lines and the corresponding edge of the conductive film.

Since there is a through hole in the non-visible area of the conductive film, the connecting part of the flexible circuit board is bound to the inner wire line of the conductive film after passing through the through hole, so that the connecting part of the flexible circuit board and the conductive film are bound as much as possible. Keeping away from the edge of the conductive film makes it difficult for external moisture to enter the bonding area between the flexible circuit board and the conductive film, and the bonding area is less likely to be corroded, thereby improving the corrosion resistance of the sensing module of the touch screen.

In one of the embodiments, the connection part is provided with exposed metal pins, and the side of the non-visible area of the conductive film facing the transparent substrate is provided with metal wires electrically connected to the metal pins .

In one embodiment, the conductive film is a flexible conductive film.

In one embodiment, the conductive film is an ITO film.

In one of the embodiments, the distance between the connecting part and the bonding part of the wire circuit inside the conductive film and the corresponding edge of the conductive film is greater than or equal to 4 millimeters.

In one embodiment, the corresponding edges of the conductive film board are flush with the edges of the transparent substrate adjacent to the flexible circuit board.

In one embodiment, the periphery of the conductive film completely coincides with the periphery of the transparent substrate.

In one embodiment, the connection portion is rectangular, the through hole is a rectangular hole, and the width of the connection portion is substantially equal to the width of the through hole.

In one of the embodiments, it also includes a sealant for fixing the connection part of the flexible circuit board to the conductive film, and the sealant is bonded between the connection part of the flexible circuit board and the conductive film between the perimeters of the through-holes.

In one of the embodiments, it also includes an optical adhesive layer, the optical adhesive layer is laminated between the transparent substrate and the conductive film, and the connecting part is bound between the optical adhesive layer and the conductive film between.

At the same time, the invention provides a thin film capacitive touch screen.

A thin-film capacitive touch screen is characterized in that it includes the above-mentioned sensing module and a drive circuit module electrically connected to the flexible circuit board, and the first surface of the transparent substrate is the touch front of the thin-film capacitive touch screen.

In addition, the invention also provides a handheld communication device.

A handheld communication device, characterized by comprising the above-mentioned thin-film capacitive touch screen and a processor electrically connected to the thin-film capacitive touch screen.

【Description of drawings】

1 is a side view of a sensing module of a traditional touch screen;

Figure 2 is an enlarged view of part II in Figure 1;

Fig. 3 is a top view of the sensing module of the touch screen shown in Fig. 1;

Figure 4 is an enlarged view of part IV in Figure 3;

5 is a side view of a sensing module of a touch screen according to an embodiment of the present invention;

Fig. 6 is the enlarged view of part VI in Fig. 5;

Fig. 7 is a top view of the sensing module of the touch screen shown in Fig. 5;

FIG. 8 is an enlarged view of part VIII in FIG. 7 .

【detailed description】

In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the understanding of the disclosure of the present invention more thorough and comprehensive.

It should be noted that the terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Please refer to FIG. 5 , the sensing module 100 of the touch screen according to the embodiment of the present invention includes a transparent substrate 110 , a conductive film 120 and a flexible circuit board 140 . The sensing module 100 can be applied to different touch screens, for example, a thin-film capacitive touch screen, a thin-film resistive touch screen, etc. In the illustrated embodiment, a thin-film capacitive touch screen is used as an example for illustration. Thin-film capacitive touch screens can be divided into single-layer inductive capacitive touch screens, double-layer inductive capacitive touch screens, and the like.

The transparent substrate 110 has a first surface 111 and a second surface 113 opposite to the first surface 111 . The transparent substrate 110 may be a transparent glass plate, a transparent resin plate, or the like. Specifically, in the illustrated embodiment, the transparent substrate 110 is a transparent glass plate.

Please refer to FIG. 6 and FIG. 7 together, the conductive film 120 is pasted on the second surface 113 of the transparent substrate 110 . The middle part of the conductive film 120 is a visible area 121 , and the edge is a non-visible area 123 . The non-visible area 123 of the conductive film 120 defines a through hole 125 . Specifically, in the illustrated embodiment, the conductive film 120 is a flexible conductive film, for example, the conductive film 120 is an ITO film.

The shape of the conductive film 120 may be different from, partially or completely the same as that of the substrate. Specifically, in the illustrated embodiment, the top sides of the conductive film 120 and the flexible circuit board 140 are flush with the top sides of the transparent substrate 110 and the flexible circuit board 140 . What's more, the peripheral edge of the conductive film 120 completely coincides with the peripheral edge of the transparent substrate 110 .

Please also refer to FIG. 8 , the flexible circuit board 140 is disposed on one edge of the transparent substrate 110 , for example, the flexible circuit board 140 is disposed on the top of the transparent substrate 110 . In addition, one end of the flexible circuit board 140 is provided with a connecting portion 141 electrically connected to the conductive film 120 . The flexible circuit board 140 passes through the through hole 125 , so that the connecting portion 141 and the conductive film 120 face the side of the transparent substrate 110 , and the conductive circuit under the through hole 125 is bound and electrically connected. Therefore, there is a distance between the connecting portion 141 and the bonding portion 121 of the conductive circuit of the conductive film 120 and the top edge of the conductive film 120 . In other words, after the connecting portion 141 of the flexible circuit board 140 passes through the through hole 125 of the conductive film 120 from the side of the conductive film 120 facing away from the transparent substrate 110 , it is connected to the wire circuit on the side of the conductive film 120 facing the transparent substrate 110 . The binding part 121 is bound together so that the conductive lines of the flexible circuit board 140 and the conductive film 120 are conducted, and the binding part 121 is away from the top edges of the conductive film 120 and the flexible circuit board 140 .

Specifically, in the illustrated embodiment, the connection portion 141 of the flexible circuit board 140 is rectangular, the through hole 125 is a rectangular hole, and the width of the connection portion 141 is substantially equal to the width of the through hole 125 . The connecting portion 141 is provided with exposed metal pins (not shown), and the inner side of the non-visible area 123 of the conductive film 120 is provided with metal wires (not shown) electrically connected to the metal pins of the connecting portion 141 .

The distance between the binding part 121 of the conductive film 120 and the top edge of the conductive film 120 can be set according to actual needs. Preferably, the distance between the binding part and the top edge of the conductive film 120 is greater than or equal to 4 mm.

Further, a sealant 150 is further included, and the sealant 150 is bonded between the connection portion 141 of the flexible circuit board 140 and the periphery of the through hole 125 of the conductive film 120 to fix the connection portion 141 of the flexible circuit board 140 . Since the sealant 150 bonds the connecting portion 141 of the flexible circuit board 140 and the conductive film 120 together, it can prevent the connecting portion 141 of the flexible circuit board 140 and the binding part 121 of the wire circuit inside the conductive film 120 from loosening, thereby playing a role Preload. Moreover, the sealant 150 can be bonded between the connection portion 141 of the flexible circuit board 140 and the periphery of the through hole 125 of the conductive film 120 to seal the through hole 125, which can further improve the connection between the connection portion 141 of the flexible circuit board 140 and the conductive film 120. The tightness of the binding area of the inner wire circuit further improves the corrosion resistance of the binding area.

Further, an optical adhesive layer 160 is also included, the optical adhesive layer 160 is laminated between the transparent substrate 110 and the conductive film 120, and the connecting portion 141 is bound between the optical adhesive layer 160 and the conductive film 120, thereby fixing the optical film 120 on the transparent substrate 110 .

Compared with the conventional sensing module of the touch screen, the sensing module 100 of the touch screen has at least the following advantages:

(1) Since the non-visible area 123 of the conductive film 120 has a through hole 125, the connecting part 141 of the flexible circuit board 140 passes through the through hole 125 and is bound to the inner wire line of the conductive film 120, so that the flexible circuit board 140 The connecting portion 141 and the conductive film 120 are bound as far as possible from the edge of the conductive film 120 (in this embodiment, the top edge of the conductive film 120), so that external moisture is not easy to enter the flexible circuit board 140 and the conductive film 120 The binding area is not easy to be corroded, thereby improving the corrosion resistance of the sensing module 100 of the touch screen.

(2) Since the corresponding edge of the conductive film 120 is flush with the corresponding edge of the transparent substrate 110 (the top edge of the transparent substrate 110 in this embodiment), the connection portion 141 of the flexible circuit board 140 and the conductive film 120 are The distance between the binding part 121 of the circuit and the corresponding edge of the conductive film 120 is relatively large, which further improves the corrosion resistance of the sensing module 100 of the touch screen.

At the same time, the present invention also provides a thin-film capacitive touch screen, which includes the above-mentioned sensing module 100 and a drive circuit module electrically connected to the flexible circuit board 140, wherein the first surface 111 of the transparent substrate 110 is the touch screen of the thin-film capacitive touch screen. front. The driving circuit module drives the thin film capacitive touch screen through the flexible circuit board 140 .

In addition, the present invention also provides a handheld communication device, which includes the above-mentioned thin-film capacitive touch screen and a processor electrically connected to the thin-film capacitive touch screen, and the processor receives touch signals from the above-mentioned thin-film capacitive touch screen.

It should be noted that the handheld communication device may be an electronic device such as a mobile phone or a tablet computer.

The above-mentioned embodiments only express several implementation modes of the present invention, and the descriptions thereof are relatively specific and detailed, but should not be construed as limiting the patent scope of the present invention. It should be noted that those skilled in the art can make several modifications and improvements without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent for the present invention should be based on the appended claims.

Claims (11)

1. A sensing module of a touch screen, characterized in that, comprising: a transparent substrate having a first surface and a second surface opposite to the first surface; A conductive film attached to the second surface of the transparent substrate, the middle part of the conductive film is a visible area, and the edge is a non-visible area, and a through hole is opened in the non-visible area of the conductive film; and The flexible circuit board is arranged at one edge of the transparent substrate, and the flexible circuit board has a connecting portion electrically connected to the conductive film; after the connecting portion passes through the through hole of the conductive film, it is connected to the conductive film. The conductive lines on the side of the conductive film facing the transparent substrate are bound and electrically connected, so that there is a distance between the connecting part and the binding part of the conductive lines and the corresponding edge of the conductive film. 2. The sensing module according to claim 1, wherein the connecting portion is provided with a bare metal pin, and the non-visible area of the conductive film is provided with a side facing the transparent substrate that is in contact with the transparent substrate. Metal wires to which the metal pins are electrically connected. 3. The sensing module according to claim 1, wherein the conductive film is a flexible conductive film. 4. The sensing module according to claim 3, wherein the conductive film is an ITO film. 5 . The sensing module according to claim 1 , wherein a distance between the connecting portion and the bonding portion of the conductive film wire line and the corresponding edge of the conductive film is greater than or equal to 4 millimeters. 6 . 6 . The sensor module according to claim 5 , wherein the corresponding edges of the conductive film are flush with the edges of the transparent substrate adjacent to the flexible circuit board. 7. The sensor module according to claim 1, wherein the connecting portion is rectangular, the through hole is a rectangular hole, and the width of the connecting portion is substantially equal to the width of the through hole. 8. The sensing module according to any one of claims 1-7, further comprising a sealant for fixing the connecting portion of the flexible circuit board to the conductive film, the sealant is bonded Between the connecting portion of the flexible circuit board and the periphery of the through hole of the conductive film. 9. The sensing module according to any one of claims 1-7, further comprising an optical adhesive layer, the optical adhesive layer is stacked between the transparent substrate and the conductive film, and the connection The part is bound between the optical adhesive layer and the conductive film. 10. A thin-film capacitive touch screen, characterized in that it comprises the sensing module according to any one of claims 1 to 9 and a drive circuit module electrically connected to the flexible circuit board, the first surface of the transparent substrate It is the touch front of the film capacitive touch screen. 11. A handheld communication device, characterized by comprising the thin-film capacitive touch screen according to claim 10 and a processor electrically connected to the thin-film capacitive touch screen.