CN104281309A - Sensing module of touch screen, film-type capacitance touch screen adopting sensing module and handheld communication device - Google Patents

Sensing module of touch screen, film-type capacitance touch screen adopting sensing module and handheld communication device Download PDF

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Publication number
CN104281309A
CN104281309A CN201310293484.9A CN201310293484A CN104281309A CN 104281309 A CN104281309 A CN 104281309A CN 201310293484 A CN201310293484 A CN 201310293484A CN 104281309 A CN104281309 A CN 104281309A
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China
Prior art keywords
conducting film
film
connecting portion
induction module
transparency carrier
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CN201310293484.9A
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CN104281309B (en
Inventor
蔡锦伟
徐炫
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Nanchang OFilm Tech Co Ltd
Suzhou OFilm Tech Co Ltd
OFilm Group Co Ltd
Anhui Jingzhuo Optical Display Technology Co Ltd
Original Assignee
Nanchang OFilm Tech Co Ltd
Suzhou OFilm Tech Co Ltd
Shenzhen OFilm Tech Co Ltd
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Priority to CN201310293484.9A priority Critical patent/CN104281309B/en
Publication of CN104281309A publication Critical patent/CN104281309A/en
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412Digitisers structurally integrated in a display
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Position Input By Displaying (AREA)
  • Push-Button Switches (AREA)

Abstract

The invention relates to a sensing module of a touch screen. The sensing module comprises a transparent substrate, a conductive film and a flexible circuit board, wherein the transparent substrate is provided with a first surface and a second surface corresponding to the first surface; the conductive film is attached to the second surface of the transparent substrate, the middle part of the conductive film is a visible area, the margin of the conductive film is a non-visible area, and a through hole is formed on the non-visible area of the conductive film; the flexible circuit board is arranged on one edge of the transparent substrate, and the flexible circuit board is provided with a connecting part which is electrically connected with the conductive film; after the connecting part penetrates through the through hole of the conductive film, the connecting part is bond with a conductive circuit, facing one side of the transparent circuit board, of the conductive film, and a bond part of the connecting part and the conductive circuit of the transparent substrate is spaced apart from the corresponding edge of the conductive film. The corrosion resistance of the bond area of the sensing module of the touch screen is relatively high. The invention also provides a film-type capacitance touch screen adopting the sensing module and a handheld communication device.

Description

The induction module of touch-screen, the thin-film type capacitance touch-screen adopting this induction module and hand-hold communication device
[technical field]
The present invention relates to a kind of touch-screen, the induction module particularly relating to a kind of touch-screen, the thin-film type capacitance touch-screen adopting this induction module and hand-hold communication device.
[background technology]
Refer to Fig. 1 to Fig. 4, the induction module 10 of traditional thin-film type capacitance screen generally includes cover-plate glass 11, fit in the ITO flexible conductive film 12 of cover-plate glass 11 and bind and be electrically connected the flexible PCB 13(FPC of ITO flexible conductive film 12).Flexible PCB 13 is utilized to connect the internal circuit of the electronic equipments such as mobile phone to transmit touching signals.In order to reduce impedance, the non-viewing area 12a of ITO flexible conductive film 12 arranges plain conductor (not shown), and the junction of flexible PCB 13 is also provided with exposed metal pins (not shown).Salt mist experiment and actual use show, flexible PCB 13 the most easily occurs corrode and cause loose contact with binding place of ITO flexible conductive film 12.In existing technique, flexible PCB 13 edge near ITO flexible conductive film 12 usual with binding place of ITO flexible conductive film 12, make outside aqueous vapor easily enter flexible PCB 13 and binding place of ITO flexible conductive film 12, this region is more easily corroded.
[summary of the invention]
In view of above-mentioned condition, be necessary to provide the induction module of the touch-screen that a kind of corrosion resistivity is stronger.
An induction module for touch-screen, it comprises:
Transparency carrier, has first surface and the second surface relative with described first surface;
Conducting film, fits on the second surface of described transparency carrier, and the middle part of described conducting film is viewing area, and edge is non-viewing area, and the non-viewing area of described conducting film offers pass through aperture; And
Flexible PCB, be located at a wherein edge of described transparency carrier, and described flexible PCB has the connecting portion be electrically connected with described conducting film; Described connecting portion is through after the through hole of described conducting film, bind with the conducting wire of described conducting film towards the side of described transparency carrier and be electrically connected, making the marginal existence spacing that the binding position of described connecting portion and described conducting wire is corresponding to described conducting film.
Because the non-viewing area of conducting film offers pass through aperture, the connecting portion of flexible PCB through after this through hole with the inboard wire line bonding of conducting film, the connecting portion of flexible PCB and binding place of conducting film is made to try one's best away from the edge of conducting film, and then make outside aqueous vapor be not easy to enter binding place of flexible PCB and conducting film, region is more difficult is corroded in binding, thus improves the corrosion resistivity of the induction module of above-mentioned touch-screen.
Wherein in an embodiment, described connecting portion is provided with exposed metal pins, and the side towards described transparency carrier of the non-viewing area of described conducting film is provided with the plain conductor be electrically connected with described metal pins.
Wherein in an embodiment, described conducting film is flexible conductive film.
Wherein in an embodiment, described conducting film is ito thin film.
Wherein in an embodiment, the spacing at the edge that the binding position of the wire line inside described connecting portion and described conducting film is corresponding to described conducting film is more than or equal to 4 millimeters.
Wherein in an embodiment, the described corresponding edge of conduction lamina membranacea is concordant with the edge of the contiguous described flexible PCB of described transparency carrier.
Wherein in an embodiment, the periphery of described conducting film overlaps completely with the periphery of described transparency carrier.
Wherein in an embodiment, described connecting portion is rectangle, and described through hole is rectangular opening, and the width of described connecting portion equals the width of described through hole substantially.
Wherein in an embodiment, also comprise the fluid sealant for the connecting portion of described flexible PCB being fixed on described conducting film, described fluid sealant is bonded between the periphery of the connecting portion of described flexible PCB and the through hole of described conducting film.
Wherein in an embodiment, also comprise optical cement layer, described optical cement layer is layered between described transparency carrier and described conducting film, and described connecting portion is bundled between described optical cement layer and described conducting film.
Meanwhile, the invention provides a kind of thin-film type capacitance touch-screen.
A kind of thin-film type capacitance touch-screen, it is characterized in that, the drive circuit module comprising above-mentioned induction module and be electrically connected with described flexible PCB, the first surface of described transparency carrier is the touch front of described thin-film type capacitance touch-screen.
In addition, the present invention also provides a kind of hand-hold communication device.
A kind of hand-hold communication device, is characterized in that, the processor comprising above-mentioned thin-film type capacitance touch-screen and be electrically connected with described thin-film type capacitance touch-screen.
[accompanying drawing explanation]
Fig. 1 is the side view of the induction module of traditional touch-screen;
Fig. 2 is the enlarged drawing of II part in Fig. 1;
Fig. 3 is the vertical view of the induction module of the touch-screen shown in Fig. 1;
Fig. 4 is the enlarged drawing of IV part in Fig. 3;
Fig. 5 is the side view of the induction module of the touch-screen of embodiment of the present invention;
Fig. 6 is the enlarged drawing of VI part in Fig. 5;
Fig. 7 is the vertical view of the induction module of the touch-screen shown in Fig. 5;
Fig. 8 is the enlarged drawing of VIII part in Fig. 7.
[embodiment]
For the ease of understanding the present invention, below with reference to relevant drawings, the present invention is described more fully.Preferred embodiment of the present invention is given in accompanying drawing.But the present invention can realize in many different forms, is not limited to embodiment described herein.On the contrary, provide the object of these embodiments be make the understanding of disclosure of the present invention more comprehensively thorough.
It should be noted that, term as used herein " vertical ", " level ", "left", "right" and similar statement are just for illustrative purposes.
Unless otherwise defined, all technology used herein and scientific terminology are identical with belonging to the implication that those skilled in the art of the present invention understand usually.The object of term used in the description of the invention herein just in order to describe specific embodiment, is not intended to be restriction the present invention.Term as used herein " and/or " comprise arbitrary and all combinations of one or more relevant Listed Items.
Refer to Fig. 5, the induction module 100 of the touch-screen of embodiment of the present invention, comprise transparency carrier 110, conducting film 120 and flexible PCB 140.This induction module 100 can be applied to different touch-screens, and such as, thin-film type capacitance touch-screen, diaphragm type touch screens etc., specifically in the illustrated embodiment in which, be described for thin-film type capacitance touch-screen.Thin-film type capacitance touch-screen can be divided into individual layer inductance capacitance touch-screen, double-deck inductance capacitance touch-screen etc.
Transparency carrier 110 has first surface 111 and the second surface 113 relative with first surface 111.Transparency carrier 110 can be transparency glass plate, transparent resin plate etc.Specifically in the illustrated embodiment in which, transparency carrier 110 is transparency glass plate.
See also Fig. 6 and Fig. 7, conducting film 120 fits on the second surface 113 of transparency carrier 110.The middle part of conducting film 120 is viewing area 121, and edge is non-viewing area 123, and the non-viewing area 123 of conducting film 120 offers pass through aperture 125.Specifically in the illustrated embodiment in which, conducting film 120 is flexible conductive film, and such as, conducting film 120 is ito thin film.
The shape of conducting film 120 can different from the shape of substrate, part is identical or identical.Specifically in the illustrated embodiment in which, conducting film 120 is concordant with flexible PCB 140 top margin with transparency carrier 110 with flexible PCB 140 top margin.Notably, the periphery of conducting film 120 overlaps completely with the periphery of transparency carrier 110.
See also Fig. 8, flexible PCB 140 is located at a wherein edge of transparency carrier 110, and such as, flexible PCB 140 is located at the top of transparency carrier 110.Further, one end of flexible PCB 140 is provided with the connecting portion 141 be electrically connected with conducting film 120.This flexible PCB 140 is arranged in this through hole 125, make connecting portion 141 and the side of conducting film 120 towards transparency carrier 110, and the conducting wire be positioned at below this through hole 125 is bound and is electrically connected.Therefore, there is spacing with the binding position 121 of the conducting wire of described conducting film 120 with described conducting film 120 top margin in described connecting portion 141.In other words, the connecting portion 141 of flexible PCB 140 from the side of conducting film 120 transparency carrier 110 dorsad through after the through hole 125 of conducting film 120, bind together with the binding position 121 of conducting film 120 towards the wire line of the side of transparency carrier 110, thus make the conducting wire conducting of flexible PCB 140 and conducting film 120, and bind position 121 away from the apical margin of conducting film 120 with flexible PCB 140.
Specifically in the illustrated embodiment in which, the connecting portion 141 of flexible PCB 140 is rectangle, and through hole 125 is rectangular opening, and the width of connecting portion 141 equals the width of through hole 125 substantially.Connecting portion 141 is provided with exposed metal pins (not shown), and the inner side of the non-viewing area 123 of conducting film 120 is provided with the plain conductor (not shown) be electrically connected with the metal pins of connecting portion 141.
The binding position 121 of conducting film 120 can be arranged according to actual needs with the spacing of the top margin of conducting film 120, and preferably, the spacing of binding position and conducting film 120 top margin is more than or equal to 4 millimeters.
Further, also comprise fluid sealant 150, fluid sealant 150 is bonded between the periphery of the connecting portion 141 of flexible PCB 140 and the through hole 125 of conducting film 120, with the connecting portion 141 of fixing flexible circuit board 140.Because the connecting portion 141 of fluid sealant 150 by flexible PCB 140 is bonded together with conducting film 120, can prevent the binding position 121 of the wire line inside the connecting portion 141 of flexible PCB 140 and conducting film 120 from getting loose, play pretension effect.And, can sealing through holes 125 between the periphery that fluid sealant 150 is bonded in the connecting portion 141 of flexible PCB 140 and the through hole 125 of conducting film 120, can further improve the connecting portion 141 of flexible PCB 140 and the sealing in the binding region of the inboard wire circuit of conducting film 120, improve the corrosion resistivity in binding region further.
Further, also comprise optical cement layer 160, optical cement layer 160 is layered between transparency carrier 110 and conducting film 120, and connecting portion 141 is bundled between optical cement layer 160 and conducting film 120, thus blooming 120 is fixed on transparency carrier 110.
Compared to the induction module of traditional touch-screen, the induction module 100 of above-mentioned touch-screen at least has the following advantages:
(1) because the non-viewing area 123 of conducting film 120 offers pass through aperture 125, the connecting portion 141 of flexible PCB 140 is through after this through hole 125 and the inboard wire line bonding of conducting film 120, the connecting portion 141 of flexible PCB 140 is made to try one's best away from the edge of conducting film 120 with binding place of conducting film 120, (being the top margin of conducting film 120 in present embodiment), and then make outside aqueous vapor be not easy to enter binding place of flexible PCB 140 and conducting film 120, binding region is not easy to be corroded, thus improve the corrosion resistivity of the induction module 100 of above-mentioned touch-screen.
(2) because the edge (being the top margin of transparency carrier 110 in present embodiment) that the corresponding edge of conducting film 120 is corresponding to transparency carrier 110 is concordant, the spacing at the edge making the binding position 121 of the connecting portion 141 of flexible PCB 140 and the conducting wire of described conducting film 120 corresponding to described conducting film 120 is comparatively large, improves the corrosion resistivity of the induction module 100 of above-mentioned touch-screen further.
Meanwhile, the present invention also provides a kind of thin-film type capacitance touch-screen, it drive circuit module comprising above-mentioned induction module 100 and be electrically connected with this flexible PCB 140, and wherein, the first surface 111 of transparency carrier 110 is the touch front of thin-film type capacitance touch-screen.This drive circuit module drives this thin-film type capacitance touch-screen by this flexible PCB 140.
In addition, the present invention also provides a kind of hand-hold communication device, it processor comprising above-mentioned thin-film type capacitance touch-screen and be electrically connected with this thin-film type capacitance touch-screen, and this processor receives the touching signals of above-mentioned thin-film type capacitance touch-screen.
It should be noted that, this hand-hold communication device can be the electronic installation such as mobile phone, panel computer.
The above embodiment only have expressed several embodiment of the present invention, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.

Claims (11)

1. an induction module for touch-screen, is characterized in that, comprising:
Transparency carrier, has first surface and the second surface relative with described first surface;
Conducting film, fits on the second surface of described transparency carrier, and the middle part of described conducting film is viewing area, and edge is non-viewing area, and the non-viewing area of described conducting film offers pass through aperture; And
Flexible PCB, be located at a wherein edge of described transparency carrier, and described flexible PCB has the connecting portion be electrically connected with described conducting film; Described connecting portion is through after the through hole of described conducting film, bind with the conducting wire of described conducting film towards the side of described transparency carrier and be electrically connected, making the marginal existence spacing that the binding position of described connecting portion and described conducting wire is corresponding to described conducting film.
2. induction module as claimed in claim 1, it is characterized in that, described connecting portion is provided with exposed metal pins, and the side towards described transparency carrier of the non-viewing area of described conducting film is provided with the plain conductor be electrically connected with described metal pins.
3. induction module as claimed in claim 1, it is characterized in that, described conducting film is flexible conductive film.
4. induction module as claimed in claim 3, it is characterized in that, described conducting film is ito thin film.
5. induction module as claimed in claim 1, is characterized in that, the spacing at the edge that the binding position of the wire line of described connecting portion and described conducting film is corresponding to described conducting film is more than or equal to 4 millimeters.
6. induction module as claimed in claim 5, is characterized in that, the corresponding edge of described conducting film is concordant with the edge of the contiguous described flexible PCB of described transparency carrier.
7. induction module as claimed in claim 1, it is characterized in that, described connecting portion is rectangle, and described through hole is rectangular opening, and the width of described connecting portion equals the width of described through hole substantially.
8. the induction module as described in claim 1 ~ 7 any one, it is characterized in that, also comprise the fluid sealant for the connecting portion of described flexible PCB being fixed on described conducting film, described fluid sealant is bonded between the periphery of the connecting portion of described flexible PCB and the through hole of described conducting film.
9. the induction module as described in claim 1 ~ 7 any one, it is characterized in that, also comprise optical cement layer, described optical cement layer is layered between described transparency carrier and described conducting film, and described connecting portion is bundled between described optical cement layer and described conducting film.
10. a thin-film type capacitance touch-screen, it is characterized in that, the drive circuit module comprising induction module as claimed in any one of claims 1 to 9 wherein and be electrically connected with described flexible PCB, the first surface of described transparency carrier is the touch front of described thin-film type capacitance touch-screen.
11. 1 kinds of hand-hold communication devices, is characterized in that, the processor comprising thin-film type capacitance touch-screen as claimed in claim 10 and be electrically connected with described thin-film type capacitance touch-screen.
CN201310293484.9A 2013-07-12 2013-07-12 The induction module of touch-screen, thin-film type capacitance touch-screen and hand-hold communication device using the induction module Active CN104281309B (en)

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Cited By (5)

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CN104751135A (en) * 2015-03-06 2015-07-01 南昌欧菲生物识别技术有限公司 Fingerprint identification device, touch screen and electronic equipment
CN105511701A (en) * 2015-12-24 2016-04-20 昆山维信诺科技有限公司 Touch control conductive membrane, touch control module, touch control display screen and electronic equipment
CN106155400A (en) * 2015-04-24 2016-11-23 南昌欧菲光科技有限公司 Touch screen and induction module thereof
CN106201036A (en) * 2015-04-29 2016-12-07 南昌欧菲光科技有限公司 Built-in type touch display screen and touch display screen module
CN106919282A (en) * 2017-02-10 2017-07-04 南昌欧菲显示科技有限公司 Tactile feedback display screen

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CN103034387A (en) * 2013-01-12 2013-04-10 深圳市中显微电子有限公司 Single substrate type capacitive touch screen and manufacture method thereof
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CN203350830U (en) * 2013-07-12 2013-12-18 南昌欧菲光科技有限公司 Sensing module of touch screen, thin-film type capacitive touch screen adopting sensing module and handheld communication device

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JP2001168546A (en) * 1999-12-03 2001-06-22 Denso Corp Portable information terminal
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CN102981677A (en) * 2012-12-13 2013-03-20 意力(广州)电子科技有限公司 Touch screen preventing water vapor penetration and manufacturing method thereof
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CN104751135A (en) * 2015-03-06 2015-07-01 南昌欧菲生物识别技术有限公司 Fingerprint identification device, touch screen and electronic equipment
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CN106919282A (en) * 2017-02-10 2017-07-04 南昌欧菲显示科技有限公司 Tactile feedback display screen

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