CN108718481A - A kind of binding structure of pin configuration and display panel - Google Patents
A kind of binding structure of pin configuration and display panel Download PDFInfo
- Publication number
- CN108718481A CN108718481A CN201810352156.4A CN201810352156A CN108718481A CN 108718481 A CN108718481 A CN 108718481A CN 201810352156 A CN201810352156 A CN 201810352156A CN 108718481 A CN108718481 A CN 108718481A
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- pin
- edge
- binding
- length
- group
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09427—Special relation between the location or dimension of a pad or land and the location or dimension of a terminal
Abstract
The present invention provides a kind of pin configuration and the binding structure of display panel, pin configuration include：The multigroup pin set being arranged on circuit carrier, multigroup pin set are arranged side by side, and include first pin and a second pin in each group of pin set, and the first pin and second pin include the first pin edge and second pin side；In each group of pin set, first pin edge of the first pin and the first pin edge of second pin are parallel and in the same plane, and first pin the first pin edge and the second pin side of second pin between be up and down be oppositely arranged, be between the first pin edge of second pin and the second pin side of the first pin up and down be oppositely arranged；Circuit carrier is chip on film or flexible PCB.When the present invention can bind to avoid the binding terminal on the pin and glass substrate in chip on film, risk short-circuit between pin and adjacent binding terminal is reduced, and reduces pin and binds the requirement of aligning accuracy between terminal.
Description
Technical field
The present invention relates to display technology field more particularly to a kind of pin configuration and the binding structures of display panel.
Background technology
With the development of display technology, especially hand-held display devices such as mobile phone/tablet computer is universal, and user is to production
Product high-res demand is higher and higher；High-res mean under identical size that wiring is closeer, and (thin space designs, i.e. Fine-
Pitch is designed), processing procedure required precision is bound with regard to higher to module.
Binding terminal uses dual-row design as shown in Figure 1, binding terminal 10 on glass substrate in existing display panel, right
The pin (pin feet) for the chip on film circuit answered is single layer designs, by the binding terminal of the pin of chip on film and glass substrate
When carrying out binding fitting, corresponding structural schematic diagram is as shown in Figure 2.The width d1 of binding terminal 10 on glass substrate is 12 micro-
Rice, the two neighboring spacing d3 bound between terminal 10 of same row is 16 microns.The width d2 of single pin 20 in chip on film
Be 10 microns, pin 20 and positioned at 20 both sides of pin first row it is two neighboring binding terminal 10 between spacing be 3 micro-
Rice.
Therefore, circuit not short circuit is bound between chip on film and glass substrate in order to realize, then corresponding binding contraposition essence
Degree requires within positive and negative 3 microns, binds circuit if aligning accuracy is more than 3 microns, between chip on film and glass substrate and deposits
In short-circuit abnormal risk.
Invention content
In order to solve the above technical problems, the present invention provides a kind of pin configuration and the binding structure of display panel, can keep away
When exempting from the binding terminal on pin and glass substrate in chip on film and being bound, reduce between pin and adjacent binding terminal
The risk of short circuit, and reduce pin and bind the requirement of aligning accuracy between terminal.
A kind of pin configuration provided by the invention, including：The multigroup pin set being arranged on circuit carrier, it is described multigroup to draw
Foot group is arranged side by side, and includes first pin and a second pin, first pin and institute in each group of pin set
It includes the first pin edge and second pin side to state second pin；
In each group of pin set, the first pin edge of first pin and the first pin edge phase of the second pin
It is parallel and in the same plane, and between the first pin edge of first pin and the second pin side of the second pin
It is phase up and down to be oppositely arranged up and down, between the first pin edge of the second pin and the second pin side of first pin
To setting；
Wherein, first pin in each group of pin set and intersect between the second pin misaligned；The electricity
Road-load body is chip on film or flexible PCB.
Preferably, in each group of pin set, the first pin edge of first pin and the first of the second pin
Pin edge is respectively positioned at the first surface of the circuit carrier, the second pin side of first pin and the second pin
Second pin side be respectively positioned at the second surface of the circuit carrier, the first surface and second surface of the circuit carrier are
Two opposite surfaces.
Preferably, the length of the first pin edge of first pin is more than the length on the second pin side of the second pin
Degree, the length of the first pin edge of the second pin are more than the length on the second pin side of first pin；
The first via is equipped at the circuit carrier of first pin edge one end of first pin, first pin
First pin edge is conductively connected by the second pin side of first via and first pin；
The second via is equipped at the circuit carrier of first pin edge one end of the second pin, the second pin
First pin edge is conductively connected by second via and the second pin side of the second pin.
Preferably, the first pin edge of first pin, the second pin side of first pin, the second pin
The first pin edge and the second pin second pin side length be not less than glass substrate on pin length；And
The length of first pin edge of first pin is identical as the length of the first pin edge of the second pin, and described first draws
The second pin of foot while length it is identical as the length when second pin of the second pin.
Preferably, the first pin edge of first pin, the second pin side of first pin, the second pin
The first pin edge and the second pin second pin side width all same；
Spacing between first pin edge of first pin and the second pin side of first pin is set as first
Spacing, the spacing between the first pin edge of the second pin and the second pin side of the second pin are set as between second
Away from first spacing is identical as second spacing.
Preferably, it is equidistantly arranged side by side between multigroup pin set.
Preferably, first pin and the second pin are that copper product is made.
Include two rows of binding terminals on glass substrate the present invention also provides a kind of binding structure of display panel
Group and above-mentioned pin configuration；
In two rows of binding terminal groups on the glass substrate, it includes multiple mutually flat that each row, which binds terminal group,
Row and the binding terminal equidistantly arranged；Wherein, first row binding terminal group is mutually staggered with second row binding terminal group, and institute
It is straight not in same to state the binding terminal that the binding terminal in first row binding terminal group is bound with the second row in terminal group
On line；
First pin edge of multiple first pins corresponding to multigroup pin set on circuit carrier and multiple second draw
First pin edge of foot, corresponding binding is bonded respectively with two rows of binding terminal groups on the glass substrate.
Preferably, the width of the first pin edge of the width and second pin of the first pin edge of first pin
Degree is less than the width that terminal is bound on the glass substrate.
Preferably, the connection between the first pin edge of first pin and the second pin side of first pin
Connector between the second pin side of the first pin edge and the second pin of body and the second pin, and institute
The region stated between two rows of binding terminal groups on glass substrate is opposite.
Implement the present invention, has the advantages that：Pin configuration provided by the invention, the design side intersected using bilayer
Formula, each group of pin set is comprising two misaligned pins that intersect, wherein the first pin edge and second of the first pin
First pin edge of pin is mutually staggered and is arranged in parallel, for carrying out being bonded binding with the binding terminal on glass substrate, and
The second pin of first pin while and second pin second pin while be then not used in binding terminal be bonded.
The second pin side of second pin and the first pin edge of the first pin are oppositely arranged up and down, and first is drawn
The second pin side of foot and the first pin edge of second pin are oppositely arranged up and down, will the pin configuration on glass substrate
When binding terminal carries out binding fitting, the second pin of the first pin while and second pin second pin while be respectively positioned on binding
The top of terminal, rather than between same row and adjacent two bindings terminals, in this way can be to avoid the of the first pin
The second pin side of two pin edges and second pin with binding terminal contact by mistake and cause binding circuit short circuit situation, will
Adjacent lines is completely isolated, effectively prevents the short circuit risk of adjacent lines.At the same time it can also reduce between pin and binding terminal
The requirement of aligning accuracy, aligning accuracy maximum can require to be no more than 16 microns.
Description of the drawings
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
Obtain other attached drawings according to these attached drawings.
Fig. 1 is the schematic diagram of the binding terminal on glass substrate provided by the invention.
Fig. 2 is that the binding terminal on pin and glass substrate in background technology provided by the invention in chip on film carries out
Bind the schematic diagram of fitting.
Fig. 3 is the structural representation provided by the invention with the first pin and second pin of group pin set on circuit carrier
Figure.
Fig. 4 is the structure chart of the first pin provided by the invention.
Fig. 5 is the structure chart of second pin provided by the invention.
Fig. 6 is the sectional view provided by the invention with the first pin and second pin of group pin set on circuit carrier.
Fig. 7 is the schematic diagram of the first via on circuit carrier provided by the invention.
Fig. 8 is the schematic diagram of the second via on circuit carrier provided by the invention.
Fig. 9 be the first pin on circuit carrier provided by the invention and second pin with binding terminal on glass substrate into
The side view of row binding fitting.
Figure 10 is to bind terminal on the first pin on circuit carrier provided by the invention and second pin and glass substrate
Carry out the vertical view of binding fitting.
Specific implementation mode
The present invention provides a kind of pin configuration, as shown in figure 3, the pin configuration includes：It is arranged more on circuit carrier 3
Group pin set 100, multigroup pin set 100 are equidistantly arranged side by side, and include first pin 1 in each group of pin set 100
With a second pin 2, the first pin 1 and second pin 2 include the first pin edge and second pin side.As shown in figure 4, the
One pin 1 include the first pin edge 11, second pin while 12 and first pin edge 11 and 12 when second pin between connection
Body 13.As shown in figure 5, second pin 2 is drawn comprising the first pin edge 21, second pin side 22 and the first pin edge 21 and second
Collective of company 23 between foot side 22.
In each group of pin set 100, as shown in fig. 6, the of the first pin edge 11 of the first pin 1 and second pin 2
One pin edge 21 is parallel and in the same plane, and the first pin edge 11 of the first pin 1 is drawn with the second of second pin 2
It is to be oppositely arranged up and down between foot side 22, between the first pin edge 21 and the second pin side 12 of the first pin 1 of second pin 2
To be oppositely arranged up and down.
Wherein, the first pin 1 in each group of pin set 100 and intersect between second pin 2 misaligned；Circuit carrier 3
For chip on film or flexible PCB.
Further, in each group of pin set 100, the first pin edge 11 of the first pin 1 and the first of second pin 2
Pin edge 21 is respectively positioned at the first surface (such as lower surface of circuit carrier 3) of circuit carrier 3, and the second of the first pin 1 draws
Foot while 12 and second pin 2 second pin while 22 second surfaces for being respectively positioned on circuit carrier 3 (such as circuit carrier 3 is upper
Surface) at, the first surface and second surface of circuit carrier 3 are two opposite surfaces.
Further, the length of the first pin edge 11 of the first pin 1 is more than the length on the second pin side 22 of second pin 2
Degree, the length of the first pin edge 21 of second pin 2 are more than the length on the second pin side 12 of the first pin 1.
As shown in fig. 7, the first via 31 is equipped at the circuit carrier 3 of 11 one end of the first pin edge of the first pin 1, the
First pin edge 11 of one pin 1 is conductively connected by the second pin side 12 of the first via 31 and the first pin 1.
As shown in figure 8, the second via 32 is equipped at the circuit carrier 3 of 21 one end of the first pin edge of second pin 2, the
First pin edge 21 of two pins 2 is conductively connected by the second via 32 and the second pin side 22 of second pin 2.
Further, the first pin edge 11 of the first pin 1, the second pin side 12 of the first pin 1, second pin 2
The length on the second pin side 22 of the first pin edge 21 and second pin 2 is not less than the length of pin on glass substrate；And
The length of first pin edge 11 of the first pin 1 is identical as the length of the first pin edge 21 of second pin 2, the first pin 1
Second pin is identical as when the second pin of second pin 2 22 length in 12 length.It that is to say, the first of the first pin 1
Pin edge 11, the second pin side 12 of the first pin 1, the first pin edge 21 of second pin 2 and second pin 2 second are drawn
The length all same that foot side 22 projects on circuit carrier 3.
Further, the first pin edge 11 of the first pin 1, the second pin side 12 of the first pin 1, second pin 2
The width all same on the second pin side 22 of the first pin edge 21 and second pin 2.It that is to say, the first of the first pin 1 draws
Foot 12, the first pin edge 21 of second pin 2 and second pin of second pin 2 in the second pin of the 11, first pin 1
The width all same that side 22 projects on circuit carrier 3.
Spacing between the first pin edge 11 and the second pin side 12 of the first pin 1 of first pin 1 is set as between first
Away from, the spacing between the first pin edge 21 and the second pin side 22 of second pin 2 of second pin 2 is set as the second spacing, the
One spacing is identical as the second spacing.
Further, the first pin 1 and second pin 2 are that copper product is made.
The present invention also provides a kind of binding structures of display panel, and as shown in Figure 9 and Figure 10, which includes being located at
Two rows of binding terminal groups on glass substrate 30 and above-mentioned pin configuration.
In two rows of binding terminal groups on glass substrate 30, it includes multiple be mutually parallel that each row, which binds terminal group,
And the binding terminal 10 equidistantly arranged；Wherein, first row binding terminal group is mutually staggered with second row binding terminal group, and the
One row binds the binding terminal 10 in terminal group and is not arranged on the same straight line with the binding terminal 10 in second row binding terminal group.
The binding terminal that first row is bound in the extended line for binding terminal 10 and second row binding terminal group in terminal group is misaligned.When
So, binding terminal 10 that is to say a kind of pin feet.
First pin edge 11 of multiple first pins 1 corresponding to multigroup pin set 100 on circuit carrier 3 and multiple
First pin edge 21 of second pin 2, corresponding binding is bonded respectively with two rows of binding terminal groups on glass substrate 30.
Here it is possible to pass through ACF (Anisotropic Conductive Film, anisotropic conductive film) hot pressing mode
Binding fitting is carried out, realize the first pin 1, second pin 2 and binds signal conduction between terminal 10.
Preferably, the second pin of multiple first pins 1 while 12 and multiple second pins 2 second pin while 22 use
In the test electric signal of access test device output.
Further, the width of the first pin edge 21 of the width and second pin 2 of the first pin edge 11 of the first pin 1
Degree is less than the width that terminal 10 is bound on glass substrate 30.
It should be noted that the width of the first pin edge and binding the width of terminal 10 here, draw in Figure 10 first
Width observed by foot 1 and the depression angle of second pin 2, the length of certain first pin edge, the length on second pin side
And the length of binding terminal 10 is also the length in Figure 10 observed by the first pin 1 and the depression angle of second pin 2.
It that is to say, the length and width of the first pin edge is the length and width that the first pin edge projects on circuit carrier, and second draws
Foot while length and width be second pin while the length and width that is projected on circuit carrier.Bind the length and width of terminal 10
The length and width that degree projects on the glass substrate for binding terminal 10.
In general, the width of the first pin edge and the width range on second pin side are 7~9 microns, preferably 8 is micro-
The width range of rice, binding terminal 10 is 9~11 microns, is selected as 10 microns.
In Figure 10, it can be seen that the first pin edge, second pin side and the binding terminal 10 observed from depression angle
Shape be rectangle, be mutually parallel between same row and adjacent binding terminal 10.
Further, as shown in Figure 10, the second pin side 12 of the first pin edge 11 and the first pin 1 of the first pin 1
Between connector 13 and second pin 2 the first pin edge 21 and the second pin side 22 of second pin 2 between connection
Body 23, the region 101 between two rows of binding terminal groups on glass substrate 30 are opposite.
In conclusion pin configuration provided by the invention, the design method intersected using bilayer, each group of pin set are wrapped
Containing two misaligned pins that intersect, wherein the first pin edge phase of the first pin edge of the first pin and second pin
Mutually it is staggered and is arranged in parallel, for be bonded binding with the binding terminal on glass substrate, and the second pin of the first pin
While and second pin second pin while be then not used in binding terminal be bonded.
The second pin side of second pin and the first pin edge of the first pin are oppositely arranged up and down, and first is drawn
The second pin side of foot and the first pin edge of second pin are oppositely arranged up and down, will the pin configuration on glass substrate
When binding terminal carries out binding fitting, the second pin of the first pin while and second pin second pin while be respectively positioned on binding
The top of terminal, rather than between same row and adjacent two bindings terminals, in this way can be to avoid the of the first pin
The second pin side of two pin edges and second pin with binding terminal contact by mistake and cause binding circuit short circuit situation, will
Adjacent lines is completely isolated, effectively prevents the short circuit risk of adjacent lines.Therefore, the present invention can be very good to be applied to high parsing
In the display panel of degree.
At the same time it can also reduce pin and bind the requirement of aligning accuracy between terminal, aligning accuracy maximum can require
No more than 16 microns.
Moreover, first of connector and second pin between the first pin edge and second pin side of the first pin
Connector between pin edge and second pin side, the two connectors can make glass base using the design method intersected
White space on plate between two rows of binding terminals reveals, and is conducive to the transmission of back light under microscope, convenient for personnel in board
Pin is identified under microscope and binds the contraposition situation between terminal.
The above content is a further detailed description of the present invention in conjunction with specific preferred embodiments, and it cannot be said that
The specific implementation of the present invention is confined to these explanations.For those of ordinary skill in the art to which the present invention belongs, exist
Under the premise of not departing from present inventive concept, a number of simple deductions or replacements can also be made, all shall be regarded as belonging to the present invention's
Protection domain.
Claims (10)
1. a kind of pin configuration, which is characterized in that including：The multigroup pin set being arranged on circuit carrier, multigroup pin
Group is arranged side by side, and includes first pin and a second pin, first pin and described in each group of pin set
Second pin includes the first pin edge and second pin side；
In each group of pin set, the first pin edge of first pin and the first pin edge of the second pin are parallel
And it is in the same plane, and between the first pin edge of first pin and the second pin side of the second pin being
Under be oppositely arranged, be opposite up and down set between the first pin edge of the second pin and the second pin side of first pin
It sets；
Wherein, first pin in each group of pin set and intersect between the second pin misaligned；The circuit carries
Body is chip on film or flexible PCB.
2. pin configuration according to claim 1, which is characterized in that in each group of pin set, the of first pin
First pin edge of one pin edge and the second pin is respectively positioned at the first surface of the circuit carrier, and described first draws
The second pin of foot while and the second pin second pin while be respectively positioned at the second surface of the circuit carrier, it is described
The first surface and second surface of circuit carrier are two opposite surfaces.
3. pin configuration according to claim 2, which is characterized in that the length of the first pin edge of first pin is big
The length of length in the second pin side of the second pin, the first pin edge of the second pin is drawn more than described first
The length on the second pin side of foot；
At the circuit carrier of first pin edge one end of first pin be equipped with the first via, the first of first pin
Pin edge is conductively connected by the second pin side of first via and first pin；
At the circuit carrier of first pin edge one end of the second pin be equipped with the second via, the first of the second pin
Pin edge is conductively connected by second via and the second pin side of the second pin.
4. pin configuration according to claim 1, which is characterized in that the first pin edge of first pin, described
Length of the second pin of one pin in the second pin of, the first pin edge of the second pin and the second pin
It is not less than the length of pin on glass substrate；And the length of the first pin edge of first pin and the second pin
The length of first pin edge is identical, the second pin of first pin while length and the second pin second pin while
Length it is identical.
5. pin configuration according to claim 1, which is characterized in that the first pin edge of first pin, described
Width of the second pin of one pin in the second pin of, the first pin edge of the second pin and the second pin
All same；
Spacing between first pin edge of first pin and the second pin side of first pin is set as the first spacing,
Spacing between first pin edge of the second pin and the second pin side of the second pin is set as the second spacing, described
First spacing is identical as second spacing.
6. pin configuration according to claim 1, which is characterized in that equidistantly set side by side between multigroup pin set
It sets.
7. pin configuration according to claim 1, which is characterized in that first pin and the second pin are copper
Material is made.
8. a kind of binding structure of display panel, which is characterized in that include two rows of binding terminal groups on glass substrate, with
And claim 1 ~ 7 any one of them pin configuration；
In two rows of binding terminal groups on the glass substrate, each row bind terminal group include it is multiple be mutually parallel and
The binding terminal equidistantly arranged；Wherein, first row binding terminal group and second row are bound terminal group and are mutually staggered, and described the
One row binds the binding terminal in terminal group and is not arranged on the same straight line with the binding terminal in second row binding terminal group；
First pin edge of multiple first pins corresponding to multigroup pin set on circuit carrier and multiple second pins
First pin edge, corresponding binding is bonded respectively with two rows of binding terminal groups on the glass substrate.
9. the binding structure of display panel according to claim 8, which is characterized in that the first pin of first pin
The width of first pin edge of the width on side and the second pin is less than the width that terminal is bound on the glass substrate.
10. the binding structure of display panel according to claim 8, which is characterized in that the first of first pin is drawn
Foot in the second pin of first pin between connector and the second pin the first pin edge with it is described
Connector between the second pin side of second pin, the region between two rows of binding terminal groups on the glass substrate
Relatively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810352156.4A CN108718481B (en) | 2018-04-19 | 2018-04-19 | Pin structure and binding structure of display panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810352156.4A CN108718481B (en) | 2018-04-19 | 2018-04-19 | Pin structure and binding structure of display panel |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108718481A true CN108718481A (en) | 2018-10-30 |
| CN108718481B CN108718481B (en) | 2020-06-09 |
Family
ID=63899212
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810352156.4A Active CN108718481B (en) | 2018-04-19 | 2018-04-19 | Pin structure and binding structure of display panel |
Country Status (1)
| Country | Link |
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| CN (1) | CN108718481B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111951682A (en) * | 2020-08-24 | 2020-11-17 | 厦门天马微电子有限公司 | Display panel and display device |
| CN114373390A (en) * | 2022-01-06 | 2022-04-19 | 武汉华星光电半导体显示技术有限公司 | Display panel and driving chip |
| WO2022155965A1 (en) * | 2021-01-25 | 2022-07-28 | 京东方科技集团股份有限公司 | Bearer substrate, and binding assembly and binding method therefor |
| CN116976272A (en) * | 2023-09-21 | 2023-10-31 | 华芯巨数(杭州)微电子有限公司 | Integrated circuit design optimization wiring method, electronic equipment and storage medium |
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| JP3300164B2 (en) * | 1994-06-28 | 2002-07-08 | エスエムケイ株式会社 | Jack board |
| CN1413072A (en) * | 2002-03-07 | 2003-04-23 | 富士康(昆山)电脑接插件有限公司 | Circuit board for cross-connected electric connector and its production method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111951682A (en) * | 2020-08-24 | 2020-11-17 | 厦门天马微电子有限公司 | Display panel and display device |
| WO2022155965A1 (en) * | 2021-01-25 | 2022-07-28 | 京东方科技集团股份有限公司 | Bearer substrate, and binding assembly and binding method therefor |
| CN114373390A (en) * | 2022-01-06 | 2022-04-19 | 武汉华星光电半导体显示技术有限公司 | Display panel and driving chip |
| CN114373390B (en) * | 2022-01-06 | 2023-06-02 | 武汉华星光电半导体显示技术有限公司 | Display panel and driving chip |
| CN116976272A (en) * | 2023-09-21 | 2023-10-31 | 华芯巨数(杭州)微电子有限公司 | Integrated circuit design optimization wiring method, electronic equipment and storage medium |
| CN116976272B (en) * | 2023-09-21 | 2023-12-22 | 华芯巨数(杭州)微电子有限公司 | Integrated circuit design optimization wiring method, electronic equipment and storage medium |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108718481B (en) | 2020-06-09 |
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