CN107820364A - Flexible PCB - Google Patents
Flexible PCB Download PDFInfo
- Publication number
- CN107820364A CN107820364A CN201711304482.XA CN201711304482A CN107820364A CN 107820364 A CN107820364 A CN 107820364A CN 201711304482 A CN201711304482 A CN 201711304482A CN 107820364 A CN107820364 A CN 107820364A
- Authority
- CN
- China
- Prior art keywords
- golden finger
- flexible pcb
- crimping
- present
- mark point
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002788 crimping Methods 0.000 claims abstract description 16
- 239000004020 conductor Substances 0.000 claims abstract description 14
- 239000000758 substrate Substances 0.000 claims abstract description 8
- 230000000694 effects Effects 0.000 abstract description 7
- 238000005520 cutting process Methods 0.000 abstract description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13454—Drivers integrated on the active matrix substrate
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The present invention relates to a kind of flexible PCB, the flexible PCB includes flexible substrate diaphragm, several plain conductors being arranged on the substrate diaphragm, the cover layer for covering a part of plain conductor and the edge part i.e. golden finger for exposing the plain conductor；Wherein, the side of the golden finger is provided with for crimping the mark point pointed to.The present invention is provided with mark point by the side in golden finger, has reached the effect of the accuracy for improving contraposition and the success rate of crimping；By cutting groove so that each golden finger is independent, is reached during crimping, the effect that golden finger can fully with not destroying panel while plate contact.
Description
Technical field
The present invention relates to a kind of flexible PCB, belongs to circuit board making technical field.
Background technology
FPC is a kind of printed circuit board (PCB) of high reliability and pliability, and abbreviation soft board, it has Distribution density
The characteristics of high, in light weight, thickness of thin, it is mainly used in mobile phone, notebook computer, palm PC PDA, digital camera, liquid crystal
Show in the products such as module LCM.In liquid crystal panel industry now, the crimping of liquid crystal panel, use flexible PCB and panel more
Contact crimping, but in existing technology, crimping success rate is low.
The content of the invention
It is an object of the invention to provide one kind can improve crimping success rate, it is simple in construction, protect during crimping
The flexible PCB of panel.
To reach above-mentioned purpose, the present invention provides following technical scheme：A kind of flexible PCB, the flexible PCB bag
The substrate diaphragm for including flexibility, several plain conductors being arranged on the substrate diaphragm, cover a part of plain conductor
Cover layer and the edge part i.e. golden finger for exposing the plain conductor；Wherein, the side of the golden finger is provided with for crimping
The mark point of sensing.
Further, the mark point is cross structure.
Further, it is additionally provided between the golden finger and becomes independent for the golden finger to be separated and cut groove.
The beneficial effects of the present invention are：Mark point is provided with by the side in golden finger, has reached and has improved contraposition
The effect of accuracy and the success rate of crimping；
By cutting groove so that each golden finger is independent, is reached during crimping, and golden finger can fully and face
Plate does not destroy the effect of panel while contact.
Described above is only the general introduction of technical solution of the present invention, in order to better understand the technological means of the present invention,
And can be practiced according to the content of specification, below with presently preferred embodiments of the present invention and coordinate accompanying drawing describe in detail as after.
Brief description of the drawings
Fig. 1 is the single unit system structure chart of the flexible PCB of the present invention.
Fig. 2 is the part-structure schematic diagram in Fig. 1.
Embodiment
With reference to the accompanying drawings and examples, the embodiment of the present invention is described in further detail.Implement below
Example is used to illustrate the present invention, but is not limited to the scope of the present invention.
Fig. 1 is referred to, the flexible PCB in a preferred embodiment of the invention includes flexible substrate diaphragm 1, set
Several plain conductors (not shown), the cover layer of a part of plain conductor of covering on the substrate diaphragm 1 (are not schemed
Show) and expose the edge part i.e. golden finger 3 of the plain conductor.In the present embodiment, the golden finger 3 is distributed in the flexibility
One lateral edges of circuit board, the both ends at the edge of the flexible PCB are all provided with golden finger 3.Really, in other embodiment
In, the golden finger 3 can also be distributed in the other positions of the flexible PCB, depending on actual conditions.
Fig. 2 is referred to, is provided with the side of the golden finger 3 for crimping the mark point 2 pointed to, the mark point 2
For cross structure, the mark point 2 will not have an impact away from the golden finger 3 to the function of the golden finger 3.The mark
Note point 2 is cross structure, all has sense of touch up and down, improves the degree of accuracy of crimping.Use is additionally provided between the golden finger 3
Become independent in the golden finger 3 is separated and cut groove 31, after cutting groove 31, each golden finger 3 is independent, in the mistake of crimping
Cheng Zhong, deformation that can be independent as probe, sufficiently and plate contact, but panel table will not be broken as probe
Face, serve the effect of protection panels.
The preparation method of the flexible PCB of the present embodiment is as follows：
Continuous metal carbonyl conducting layer is deposited on the substrate diaphragm 1, and on continuous metal line layer after resist coating,
Several plain conductors separated are exposed, develop and etched successively, and a part of plain conductor is covered with mask.
In summary：By being provided with mark point 2 in the side of golden finger 3, the accuracy and pressure for improving contraposition are reached
The effect of the success rate connect；
By cutting groove 31 so that each golden finger 3 is independent, is reached during crimping, golden finger 3 can be abundant
Effect with not destroying panel while plate contact.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
Apply all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, the scope that this specification is recorded all is considered to be.
Embodiment described above only expresses the several embodiments of the present invention, and its description is more specific and detailed, but simultaneously
Can not therefore it be construed as limiting the scope of the patent.It should be pointed out that come for one of ordinary skill in the art
Say, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (3)
1. a kind of flexible PCB, it is characterised in that the flexible PCB includes flexible substrate diaphragm, is arranged on the base
The cover layer of several plain conductors, a part of plain conductor of covering on bottom diaphragm and the edge for exposing the plain conductor
Portion is golden finger；Wherein, the side of the golden finger is provided with for crimping the mark point pointed to.
2. flexible PCB as claimed in claim 1, it is characterised in that the mark point is cross structure.
3. flexible PCB as claimed in claim 1, it is characterised in that be additionally provided between the golden finger for by described in
Golden finger, which separates, to be become independent and cuts groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711304482.XA CN107820364A (en) | 2017-12-11 | 2017-12-11 | Flexible PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711304482.XA CN107820364A (en) | 2017-12-11 | 2017-12-11 | Flexible PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107820364A true CN107820364A (en) | 2018-03-20 |
Family
ID=61605790
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711304482.XA Pending CN107820364A (en) | 2017-12-11 | 2017-12-11 | Flexible PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107820364A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111478076A (en) * | 2020-04-22 | 2020-07-31 | 江苏哈哈社信息科技有限公司 | Flexible circuit board |
| CN112055468A (en) * | 2020-09-14 | 2020-12-08 | 珠海市晶昊电子科技有限公司 | Processing method of covering film on circuit board |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101917824A (en) * | 2010-08-26 | 2010-12-15 | 厦门弘信电子科技有限公司 | Manufacture method of single-sided flexible circuit board |
| CN202335060U (en) * | 2011-09-29 | 2012-07-11 | 温州银河电子有限公司 | Single-faced double-contact flexible circuit board |
| KR20120139305A (en) * | 2011-06-17 | 2012-12-27 | 엘지디스플레이 주식회사 | Flexible printed circuit board and liquid crystal display device including thereof |
| CN205305224U (en) * | 2016-01-13 | 2016-06-08 | 昆山龙腾光电有限公司 | Flexible circuit board |
| CN105979701A (en) * | 2016-07-07 | 2016-09-28 | 上达电子（深圳）股份有限公司 | Flexible printed circuit |
| CN206470723U (en) * | 2017-02-28 | 2017-09-05 | 上海天马微电子有限公司 | Display panel and display device |
| CN207927018U (en) * | 2017-12-11 | 2018-09-28 | 苏州广林达电子科技有限公司 | Flexible PCB |
-
2017
- 2017-12-11 CN CN201711304482.XA patent/CN107820364A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101917824A (en) * | 2010-08-26 | 2010-12-15 | 厦门弘信电子科技有限公司 | Manufacture method of single-sided flexible circuit board |
| KR20120139305A (en) * | 2011-06-17 | 2012-12-27 | 엘지디스플레이 주식회사 | Flexible printed circuit board and liquid crystal display device including thereof |
| CN202335060U (en) * | 2011-09-29 | 2012-07-11 | 温州银河电子有限公司 | Single-faced double-contact flexible circuit board |
| CN205305224U (en) * | 2016-01-13 | 2016-06-08 | 昆山龙腾光电有限公司 | Flexible circuit board |
| CN105979701A (en) * | 2016-07-07 | 2016-09-28 | 上达电子（深圳）股份有限公司 | Flexible printed circuit |
| CN206470723U (en) * | 2017-02-28 | 2017-09-05 | 上海天马微电子有限公司 | Display panel and display device |
| CN207927018U (en) * | 2017-12-11 | 2018-09-28 | 苏州广林达电子科技有限公司 | Flexible PCB |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111478076A (en) * | 2020-04-22 | 2020-07-31 | 江苏哈哈社信息科技有限公司 | Flexible circuit board |
| CN111478076B (en) * | 2020-04-22 | 2021-10-26 | 江苏哈哈社信息科技有限公司 | Flexible circuit board |
| CN112055468A (en) * | 2020-09-14 | 2020-12-08 | 珠海市晶昊电子科技有限公司 | Processing method of covering film on circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB03 | Change of inventor or designer information |
Inventor after: Liang Xianguang Inventor after: Qian Taiyu Inventor after: Zheng Changping Inventor after: Xie Yong Inventor before: Sun Yinglong Inventor before: Lin Yutang Inventor before: Zheng Changping Inventor before: Kong Shuangquan Inventor before: Niu Chengjie |
|
| CB03 | Change of inventor or designer information |