CN104023483A - Gold finger three-surface plating method - Google Patents
Gold finger three-surface plating method Download PDFInfo
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- CN104023483A CN104023483A CN201410259484.1A CN201410259484A CN104023483A CN 104023483 A CN104023483 A CN 104023483A CN 201410259484 A CN201410259484 A CN 201410259484A CN 104023483 A CN104023483 A CN 104023483A
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- golden finger
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Abstract
The invention relates to the technical field of fold finger manufacturing, in particular to a gold finger three-surface plating method. A gold finger body, an in-board circuit, a conducting position and an in-board lead are manufactured on a PCB. The fold finger body is connected with the in-board lead through the in-board circuit and the conducting position, and therefore electroplating can be conducted to form a gold finger with three surfaces plated. According to the method, the in-board lead and the conducting position are manufactured on the PCB, circuits, which do not need to be connected directly, in the board are connected through the conducting position, and therefore electroplating can be conducted on the gold finger body through connection of the in-board circuit and the in-board lead. Due to the fact that the gold finger body does not need to be directly connected with a single-ended lead, the situation that copper is directly exposed at the connecting end of the gold finger body after the single-ended lead is etched does not exist, and three-surface plating of the gold finger is achieved. In addition, when the method is used for manufacturing long gold fingers and short gold fingers, screen printing antistatic gold ink is not needed, production processes can be reduced, materials can also be saved, and therefore the production cost is lowered. Each gold finger manufactured through the method is plated in three surfaces, and the product quality can be improved.
Description
Technical field
The present invention relates to golden finger manufacture technology field, relate in particular to a kind of three gold-plated methods of golden finger.
Background technology
Golden finger is the position contacting with other substrate for relevant devices such as computer display card, memory bar, USB interface, and tool has good wearability and low contact resistance, can meet the repeatedly requirement of plug.In prior art, the making flow process of long and short golden finger is as follows: operation → electric plating of whole board before normal → make on circuit board by figure transfer process line pattern and the anti-electric bronze ink of single-ended gold finger lead → graphic plating → outer etching → welding resistance → silk-screen are to hide gold finger lead → with anti-plate dry film covering board and to expose electric carat (measure of the purity of gold) → electrogilding and point → move back film → with anti-etching dry film covering board and expose gold finger lead → etching and remove gold finger lead → move back film → silk-screen character → normally rear operation.In the manufacturing process of existing long and short golden finger, carry out conducting golden finger and prevent gold finger lead plated with gold by adding the anti-electric bronze ink of single-ended gold finger lead silk-screen.The not plated with gold of end face that this method makes golden finger be connected with gold finger lead, by after gold finger lead etching, this end face can directly expose copper, cannot meet the existing production requirement more and more higher to golden finger.In addition anti-electric bronze ink is expensive, must use anti-electric bronze ink to prevent plated with gold on gold finger lead in the technology of preparing of existing long and short golden finger, is unfavorable for reducing the production cost of circuit board.
Summary of the invention
The technical problem to be solved in the present invention be to provide a kind of make three of golden fingers gold-plated and while making long and short golden finger without three gold plating methods of golden finger that use anti-electric bronze ink.
For achieving the above object, by the following technical solutions, three gold plating methods of a kind of golden finger, comprise the following steps in the present invention:
S1, preparation one PCB make circuit-line on PCB; Described circuit-line comprises circuit and plate lead in golden finger body, plate; In circuit, be provided with in described plate for by the conducting position of line conduction in plate, described golden finger body is by circuit in plate and the conducting of plate lead.Described PCB is multi-layer PCB.Described golden finger body comprises long golden finger body and short golden finger body.
S2, at the enterprising electroplating of golden finger body, form golden finger.Preferably, on PCB, except this external whole covering anti-plate materials of golden finger, make to form golden finger at the golden finger body plating nickel gold that powers on.Preferred, first on PCB, cover anti-plate dry film, anti-plate dry film is provided with first windowing of coordinating with golden finger body, and described first windows exposes golden finger body; Then at the golden finger body plating nickel gold that powers on, the anti-plate dry film of then decorporating.
S3, remove plate lead and conducting position.Preferably, all cover anti-etching material on PCB except plate lead and conducting position, then plate lead and conducting position are removed in etching.Preferred, first on PCB, cover anti-etching dry film, anti-etching dry film is provided with the second three-way window of windowing and coordinating with conducting position coordinating with plate lead, and described second windows exposes plate lead, and described three-way window exposes conducting position; Then plate lead and conducting position are removed in etching; And then the anti-etching dry film of decorporating.
S4, PCB is carried out to surface treatment and moulding.
Compared with prior art, the invention has the beneficial effects as follows: the present invention by making plate lead and conducting position on PCB, by conducting position will be in plate this do not need the line conduction of direct conducting, golden finger body therefore can be in plate circuit and the conducting of plate lead and electroplate.Because golden finger body is without being directly connected with single-ended lead-in wire, make the connecting end surface of golden finger directly expose copper after there is not single-ended lead-in wire etching, thereby it is gold-plated to realize three of golden fingers.In addition, while making long and short golden finger by the inventive method, without the anti-electric bronze ink of silk-screen, not only can reduce production process, also can save material, reduce production costs.And three of the golden fingers of being prepared by the inventive method are gold-plated, can improve the quality of products.
Brief description of the drawings
Fig. 1 is the PCB schematic diagram of making in embodiment after circuit-line;
Fig. 2 is provided with the first anti-plate dry film schematic diagram of windowing;
Fig. 3 is the schematic diagram after anti-plate dry film and PCB laminating;
Fig. 4 is the schematic diagram after the golden finger body electrogilding on PCB;
Fig. 5 is provided with second to window and the anti-etching dry film schematic diagram of three-way window;
Fig. 6 is the schematic diagram after anti-etching dry film and PCB laminating;
Fig. 7 is the schematic diagram after conducting position and the etching of plate lead on PCB.
Embodiment
In order to more fully understand technology contents of the present invention, below in conjunction with specific embodiment, technical scheme of the present invention is described further and is illustrated.
Embodiment
With reference to Fig. 1-7, three gold-plated methods of a kind of long and short golden finger provided by the invention, comprise the following steps:
First as the board production process of prior art, each layer circuit board raw material is carried out to sawing sheet, then each inner layer circuit board is carried out to inner figure transfer to form internal layer circuit circuit, then each layer circuit board is carried out to lamination to form multilayer circuit board 1, then multilayer circuit board 1 is holed, after boring, multilayer circuit board is put into electroplating bath and sunk copper, electric plating of whole board.Then carry out successively outer graphics transfer, graphic plating, move back film and first etching, make to form on multilayer circuit board 1 outer circuit circuit, as shown in Figure 1, outer circuit circuit comprises circuit 3, conducting position 4 and plate lead 5 in golden finger body 2, plate, and golden finger body 2 is made up of long golden finger body and short golden finger body.By arrange conducting position 4 can will be in plate this do not need the line conduction of direct conducting, golden finger body 2 therefore can be in plate circuit 3 and 5 conductings of plate lead, electroplate.
After etching, on multilayer circuit board 1, be coated with one deck welding resisting layer, and golden finger body 2 to be produced, and conducting position 4 and plate lead 5 do not apply welding resisting layer.Apply welding resisting layer and can be used for protecting the circuit-line on multilayer circuit board 1, avoid because scratch causes short circuit or the phenomenon such as open circuit, and can reach anti-welding function.
Then on multilayer circuit board 1, cover one deck anti-plate dry film 6, and first 61, the first window 61 the shape sizes of windowing are set on anti-plate dry film 6 match with golden finger body 2 on multilayer circuit board 1, as shown in Figure 2.Multilayer circuit board 1 sticks after anti-plate dry film 61, and golden finger body 2 is windowed and 61 exposed by first, treats follow-up plating processing, as shown in Figure 3.The first window size of 61 also can be set and slightly be greater than the size of golden finger body 2, avoid first to window and 61 affect the gold-plated scope on golden finger body 2 with 2 misalignments of golden finger body.Then according to prior art, at first plating nickel gold on the 61 golden finger bodies 2 that come out of windowing, form golden finger 7, the golden finger 7 forming comprises long golden finger and short golden finger.Then, remove anti-plate dry film 6 according to prior art.In other embodiments, other anti-plate material of one deck can be on multilayer circuit board 1, covered, gold on the circuit degree beyond golden finger body 2 can be prevented.
On multilayer circuit board 1, cover the anti-etching dry film 8 of one deck, on anti-etching dry film 8, arrange second and window 82 and three-way window 81, the second window shape size of 82 coordinates with plate lead 5, and the shape size of three-way window 81 coordinates with conducting position 4, as shown in Figure 4.Multilayer circuit board 1 sticks after anti-etching dry film 8, plate lead 5 and conducting position 4 by second window 82 and three-way window 81 expose, treat subsequent etch processing, as shown in Figure 5.Then according to prior art, plate lead 5 and 4 etchings of conducting position are removed with etching solution.After etching, continue to remove anti-etching dry film 8 according to prior art, obtain having the multilayer circuit board 1 of three gold-plated long and short golden fingers, as shown in Figure 6.In other embodiments, can on multilayer circuit board 1, cover other anti-etching material of one deck, can protect the circuit outside conducting position 4 and plate lead 5 not to be subject to etching.
Remove after anti-etching dry film 8, can get back to the flow process of prior art, as process adhesive tape, for the protection of golden finger 7; Multilayer circuit board 1 is carried out to surface treatment, excision forming; Multilayer circuit board 1 is carried out to the rear operations such as quality test.
More than make the method for three gold-plated golden fingers, by make plate lead 5 and conducting position 4 on multilayer circuit board 1, by conducting position 4, by plate, this does not need the line conduction of direct conducting, therefore golden finger body 2 can be electroplated with 5 conductings of plate lead by circuit 3 in plate.Because golden finger body 2 is without being directly connected with single-ended lead-in wire, make the connecting end surface of golden finger directly expose copper after there is not single-ended lead-in wire etching, thereby it is gold-plated to realize three of golden fingers.In addition, while making long and short golden finger by the inventive method, without the anti-electric bronze ink of silk-screen, not only simplified technological process, also can save material, reduced production costs.And three of the golden fingers of being prepared by the inventive method are gold-plated, can improve the quality of products.
The above only further illustrates technology contents of the present invention with embodiment, so that reader is easier to understand, but does not represent that embodiments of the present invention only limit to this, and any technology of doing according to the present invention is extended or recreation, is all subject to protection of the present invention.
Claims (8)
1. three gold-plated methods of golden finger, is characterized in that, comprise the following steps:
S1, preparation one PCB make circuit-line on PCB; Described circuit-line comprises circuit and plate lead in golden finger body, plate; In circuit, be provided with in described plate for by the conducting position of line conduction in plate, described golden finger body is by circuit in plate and the conducting of plate lead;
S2, at the enterprising electroplating of golden finger body, form golden finger;
S3, remove plate lead and conducting position.
2. a kind of three gold-plated methods of golden finger according to claim 1, is characterized in that, in step S2, on PCB, except these external whole covering anti-plate materials of golden finger, at the golden finger body plating nickel gold that powers on, form golden finger.
3. a kind of three gold-plated methods of golden finger according to claim 2, it is characterized in that, in step S2, first on PCB, cover anti-plate dry film, anti-plate dry film is provided with first windowing of coordinating with golden finger body, and described first windows exposes golden finger body; Then at the golden finger body plating nickel gold that powers on, the anti-plate dry film of then decorporating.
4. a kind of three gold-plated methods of golden finger according to claim 2, is characterized in that, in step S3, all cover anti-etching material on PCB except plate lead and conducting position, and then plate lead and conducting position are removed in etching.
5. a kind of three gold-plated methods of golden finger according to claim 4, it is characterized in that, in step S3, first on PCB, cover anti-etching dry film, anti-etching dry film is provided with the second three-way window of windowing and coordinating with conducting position coordinating with plate lead, described second windows exposes plate lead, and described three-way window exposes conducting position; Then plate lead and conducting position are removed in etching; And then the anti-etching dry film of decorporating.
6. a kind of three gold-plated methods of golden finger according to claim 4, is characterized in that, PCB described in step S1 is multi-layer PCB.
7. a kind of three gold-plated methods of golden finger according to claim 6, is characterized in that: also comprise step S4, PCB is carried out to surface treatment and moulding.
8. according to a kind of three gold-plated methods of golden finger described in claim 1-7 any one, it is characterized in that: described golden finger body comprises long golden finger body and short golden finger body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410259484.1A CN104023483A (en) | 2014-06-12 | 2014-06-12 | Gold finger three-surface plating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410259484.1A CN104023483A (en) | 2014-06-12 | 2014-06-12 | Gold finger three-surface plating method |
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| CN104023483A true CN104023483A (en) | 2014-09-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410259484.1A Pending CN104023483A (en) | 2014-06-12 | 2014-06-12 | Gold finger three-surface plating method |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105282983A (en) * | 2015-10-14 | 2016-01-27 | 深圳崇达多层线路板有限公司 | Lead wire etching technology with gold fingers with three surfaces wrapped by gold |
| CN106455346A (en) * | 2016-09-06 | 2017-02-22 | 深圳崇达多层线路板有限公司 | Method for improving corrosion of non-plated PAD in lead etching |
| CN106937491A (en) * | 2017-04-05 | 2017-07-07 | 广东浪潮大数据研究有限公司 | One kind is based on pcb board card gold finger galvanizing nickel and plating gold process and its application |
| CN109788662A (en) * | 2019-02-26 | 2019-05-21 | 江门崇达电路技术有限公司 | A kind of production method of golden finger circuit board |
| CN112822872A (en) * | 2021-01-31 | 2021-05-18 | 惠州中京电子科技有限公司 | Manufacturing method of lead-free residual golden finger |
-
2014
- 2014-06-12 CN CN201410259484.1A patent/CN104023483A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105282983A (en) * | 2015-10-14 | 2016-01-27 | 深圳崇达多层线路板有限公司 | Lead wire etching technology with gold fingers with three surfaces wrapped by gold |
| CN105282983B (en) * | 2015-10-14 | 2018-04-24 | 深圳崇达多层线路板有限公司 | A kind of lead etch process of three bread gold golden finger |
| CN106455346A (en) * | 2016-09-06 | 2017-02-22 | 深圳崇达多层线路板有限公司 | Method for improving corrosion of non-plated PAD in lead etching |
| CN106455346B (en) * | 2016-09-06 | 2020-01-14 | 深圳崇达多层线路板有限公司 | Method for improving biting of non-electric gold PAD during lead etching |
| CN106937491A (en) * | 2017-04-05 | 2017-07-07 | 广东浪潮大数据研究有限公司 | One kind is based on pcb board card gold finger galvanizing nickel and plating gold process and its application |
| CN109788662A (en) * | 2019-02-26 | 2019-05-21 | 江门崇达电路技术有限公司 | A kind of production method of golden finger circuit board |
| CN109788662B (en) * | 2019-02-26 | 2021-06-04 | 江门崇达电路技术有限公司 | Manufacturing method of golden finger circuit board |
| CN112822872A (en) * | 2021-01-31 | 2021-05-18 | 惠州中京电子科技有限公司 | Manufacturing method of lead-free residual golden finger |
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Application publication date: 20140903 |
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