CN103747614B - Plate and its production technology are merged based on several samples - Google Patents
Plate and its production technology are merged based on several samples Download PDFInfo
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- CN103747614B CN103747614B CN201410050330.1A CN201410050330A CN103747614B CN 103747614 B CN103747614 B CN 103747614B CN 201410050330 A CN201410050330 A CN 201410050330A CN 103747614 B CN103747614 B CN 103747614B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 30
- 238000005516 engineering process Methods 0.000 title claims abstract description 11
- 239000000039 congener Substances 0.000 claims abstract description 10
- 239000000758 substrate Substances 0.000 claims description 48
- 238000005530 etching Methods 0.000 claims description 35
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 27
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 26
- 239000010949 copper Substances 0.000 claims description 26
- 229910052802 copper Inorganic materials 0.000 claims description 26
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 20
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 16
- 238000013461 design Methods 0.000 claims description 12
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 10
- 229910001431 copper ion Inorganic materials 0.000 claims description 10
- 238000012545 processing Methods 0.000 claims description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 6
- 238000005553 drilling Methods 0.000 claims description 5
- 238000007747 plating Methods 0.000 claims description 5
- 238000012546 transfer Methods 0.000 claims description 5
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims 2
- 239000000460 chlorine Substances 0.000 claims 2
- 229910052801 chlorine Inorganic materials 0.000 claims 2
- 150000002500 ions Chemical class 0.000 claims 2
- 239000000463 material Substances 0.000 abstract description 3
- 241000370738 Chlorion Species 0.000 description 8
- 230000009977 dual effect Effects 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 241000894007 species Species 0.000 description 1
Abstract
Based on several samples plate and its production technology are merged the invention discloses a kind of, it includes concatenation unit of at least two splicings in the same variety classes model being merged on plate（1）, concatenation unit（1）Remain with interval；Described concatenation unit（1）By at least two splicing subelements（11）Constitute, splice subelement（11）It is made up of at least one congener model, splices subelement（11）Between provided with interval；Described concatenation unit（1）Splicing is in line areas, described nonconductive regions（2）For the region not comprising any conducting wire；Described nonconductive regions（2）Surface be covered with ink.The present invention is by sheet material is identical, structure identical same class plate is combined into one big plate to produce, and to meet the requirement of pcb board production equipment and instrument, so as to reduce the production cost of PCB models, improves throughput rate, shortens manufacturing schedule.
Description
Technical field
Field is made the present invention relates to pcb board, it is more particularly to a kind of to be merged plate and its production work based on several samples
Skill.
Background technology
Printed circuit board abbreviation pcb board, using on the insulating material by advance schematic diagram design be made printed wiring,
The conductive pattern combined the referred to as printed circuit of printed element or both, and on insulating substrate between offer component
Electrical connection conductive pattern, above-mentioned printed circuit or printed wiring be fabricated to production board and be referred to as printing by referred to as printed wiring
Wiring board, or be printed board or printed circuit board.It by circuit and drawing, dielectric layer and can mainly make more than two layers
The hole that circuit is turned on each other is constituted, in addition, and the thing that one layer of isolation copper face eats tin can be also printed for some printed circuit boards
Matter, it is to avoid short-circuit anti-solder ink and some title, position frames for being used to recognize each part between the non-circuit for eating tin, in order to
Postorder assembling and the silk-screen of maintenance identification.
Before pcb board batch input makes processing, specimen need to be carried out to every kind of pcb board, when sample product into
The production of small lot is just carried out after work(, is tested and on probation, treats that the sample of small lot all meets institute of businessman during on probation
Just produced in batches after defined standard.With the development of electronic technology, the continuous upgrading of electronic product, new product
Continually develop, manufacture experimently, the demand to PCB models is more and more.In order to adapt to the demand of electronic product trial-production, pcb board manufacture
Business carries out model production to PCB models using jigsaw mode, so as to improve the throughput rate of PCB models.At present, PCB makes factory
The board joint method that uses of family for：It will be produced per a model as a single item number on normal production line, such as Fig. 1 institutes
Show, sample is just subjected to a point plate after the completion of production.Model need to be combined into using above-mentioned board joint method by big plate, to meet pcb board
The requirement of production equipment and instrument, will be combined into big plate to meet the requirement of pcb board production equipment and instrument, so per a model
The processing cost and reduction production efficiency of PCB models will be increased.
The content of the invention
It is an object of the invention to overcome the deficiencies of the prior art and provide one kind by sheet material is identical, structure identical is same
Class plate is combined into one big plate to produce, to meet the requirement of pcb board production equipment and instrument, so as to reduce the production of PCB models
Cost, improves throughput rate, shortens manufacturing schedule and based on Multi-example be merged plate and its production technology.
The purpose of the present invention is achieved through the following technical solutions：Plate is merged based on several samples, it is included extremely
Lack concatenation unit of two splicings in the same variety classes model being merged on plate, concatenation unit remains with interval.
It is preferred that, described concatenation unit is made up of at least two splicing subelements, and splicing subelement is same by least one
The model of species is constituted, provided with interval between splicing subelement.
It is preferred that, described is merged plate provided with line areas and nonconductive regions, and described concatenation unit splices in line areas,
Described nonconductive regions is the region not comprising any conducting wire.
It is preferred that, the surface of described nonconductive regions is covered with ink.
The production technology for being merged plate based on several samples, it includes：
Graphic designs：The concatenation unit being made up of variety classes model design is merged on plate same, and circuit is made
The scraps of paper；
Pattern transfer：The circuit scraps of paper are covered on substrate, are exposed and are developed successively；
First etching：Plus 90%~etching solution is adjusted 100% sulfuric acid so that and the pH value of etching solution is 8.0~
9.0, the concentration of chlorion is 150g/L~190g/L, and the concentration of copper ion is 130g/L~170g/L, and substrate is lost
Carve, make to expose copper face on substrate；
Move back film：Concentration is used to carry out moving back at film to substrate for the sodium hydroxide solution that 3%~5%, temperature is 45 DEG C~55 DEG C
Reason, it is to avoid because naoh concentration not enough or excessive concentration and caused by substrate can not move back film completely or to move back film-strength excessive
Situation；
Drilling；
Plating：Copper facing makes the conductive portion on hole wall be metallized, and the copper thickeied in circuit and hole is thick, and
One layer of tin is plated on substrate after copper facing；
Second etching：Plus 90%~etching solution is adjusted 100% sulfuric acid so that and the pH value of etching solution is 8.0~
9.0, the concentration of chlorion is 150g/L~190g/L, and the concentration of copper ion is 130g/L~170g/L, and substrate is etched,
Logicalnot circuit bottom copper on substrate is etched away, final line pattern is formed.
It is preferred that, in graphic designs, provided with interval between each concatenation unit, each concatenation unit is at least by two spellings
Subelement composition is connect, splicing subelement is made up of at least one congener model, provided with interval between splicing subelement.
It is preferred that, described is merged plate provided with line areas and nonconductive regions, and described concatenation unit splices in line areas,
Described nonconductive regions is the region not comprising any conducting wire, after second etching step is completed, to it is non-conductive enter
The processing of row ink, makes the surface of nonconductive regions cover ink.
It is preferred that, it also includes one before completing to drill after moving back film, the step of carrying out patch aluminium flake to substrate.
The beneficial effects of the invention are as follows：
1）The same class plate that sheet material is identical, structure is the same is combined into one big plate to produce, to meet pcb board production equipment
With the requirement of instrument, so as to reduce the production cost of PCB models, improve throughput rate, shorten manufacturing schedule；
2）The nonconductive regions for being covered with ink is set between concatenation unit, therefore, there is no need to electroplate it, so as to subtract
Low gold-plated area, reduce further processing cost.
Brief description of the drawings
Fig. 1 is existing PCB jigsaw structural representation；
Fig. 2 is structural representation of the present utility model；
Fig. 3 is concatenation unit structural representation of the present utility model；
In figure, 1- concatenation units, 11- splicing subelements, 2- nonconductive regions.
Embodiment
Technical scheme is described in further detail below in conjunction with the accompanying drawings, but protection scope of the present invention is not limited to
It is as described below.
As shown in Figures 2 and 3, plate is merged based on several samples, it includes at least two splicings and is merged same on plate
Interval is remained between the concatenation unit 1 of variety classes model, two adjacent concatenation units 1.
It is preferred that, described concatenation unit 1 is made up of at least two splicing subelements 11, and splicing subelement 11 is by least one
Individual congener model is constituted, provided with interval between splicing subelement 11.
It is preferred that, described is merged plate provided with line areas and nonconductive regions 2, and described concatenation unit 11 splices in circuit
Area, described nonconductive regions 2 is the region not comprising any conducting wire.
It is preferred that, the surface of described nonconductive regions 2 is covered with ink.
The embodiment one of production technology of the invention that be merged plate based on several samples, it includes：
Graphic designs：The concatenation unit 1 being made up of variety classes model is designed and is merged same on plate, and circuit is made
The scraps of paper, wherein described different types of model refers to that the circuit theory of the model for splicing is different, such as splicing
Model is respectively LED drive circuit and sound control circuit；
Pattern transfer：The circuit scraps of paper are covered on substrate, are exposed and are developed successively；
First etching：Etching solution is adjusted the sulfuric acid for plus 90% so that the pH value of etching solution be 8.0, chlorion it is dense
Spend for 190g/L, the concentration of copper ion is 170g/L, and substrate is etched, makes to expose copper face on substrate；
Move back film：Concentration is used to carry out moving back film process to substrate for the sodium hydroxide solution that 3%, temperature is 45 DEG C, it is to avoid because of hydrogen
Oxidation na concn not enough or excessive concentration and cause substrate to move back film completely or move back the excessive situation of film-strength；
Drilling；
Plating：Copper facing makes the conductive portion on hole wall be metallized, and the copper thickeied in circuit and hole is thick, and
One layer of tin is plated on substrate after copper facing；
Second etching：Etching solution is adjusted the sulfuric acid for plus 90% so that the pH value of etching solution be 8.0, chlorion it is dense
Spend for 190g/L, the concentration of copper ion is 170g/L, and substrate is etched, logicalnot circuit bottom copper on substrate is etched away, and is formed
Final line pattern.
It is preferred that, in graphic designs, provided with interval between each concatenation unit 1, each concatenation unit 1 is at least by two
Splicing subelement 11 is constituted, and splicing subelement 11 is made up of at least one congener model, is provided between splicing subelement 11
Interval, the number of plies for the model that described congener model refers to is identical, i.e., be all single sided board, dual platen or multi-layer sheet.
It is preferred that, described is merged plate provided with line areas and nonconductive regions 2, and described concatenation unit 1 splices in circuit
Area, described nonconductive regions 2 is the region not comprising any conducting wire, after second etching step is completed, is led to non-
Electricity 2 carries out ink processing, the surface of nonconductive regions 2 is covered ink.
It is preferred that, it also includes one before completing to drill after moving back film, the step of carrying out patch aluminium flake to substrate；Aluminium flake
Size with need drill substrate size as, it is to avoid because aluminium flake is too small and caused by broken needle；To be use up when pasting aluminium flake with gummed paper
Amount is kept to the side, it is to avoid cause broken needle；Gummed paper for pasting aluminium flake need to be attached to the surrounding of aluminium flake, so as to ensure the smooth jail of aluminium flake
Gu.
The embodiment two of production technology of the invention that be merged plate based on several samples, it includes：
Graphic designs, the concatenation unit 1 being made up of variety classes model is designed and is merged same on plate, and circuit is made
The scraps of paper, wherein described different types of model refers to that the circuit theory of the model for splicing is different, such as splicing
Model is respectively LED drive circuit and sound control circuit；
Pattern transfer：The circuit scraps of paper are covered on substrate, are exposed and are developed successively；
First etching：Etching solution is adjusted the sulfuric acid for plus 100% so that the pH value of etching solution is 9.0, chlorion
Concentration is 150g/L, and the concentration of copper ion is 130g/L, and substrate is etched, makes to expose copper face on substrate；
Move back film：Concentration is used to carry out moving back film process to substrate for the sodium hydroxide solution that 5%, temperature is 55 DEG C, it is to avoid because of hydrogen
Oxidation na concn not enough or excessive concentration and cause substrate to move back film completely or move back the excessive situation of film-strength；
Drilling；
Plating：Copper facing makes the conductive portion on hole wall be metallized, and the copper thickeied in circuit and hole is thick, and
One layer of tin is plated on substrate after copper facing；
Second etching：Etching solution is adjusted the sulfuric acid for plus 100% so that the pH value of etching solution is 9.0, chlorion
Concentration is 150g/L, and the concentration of copper ion is 130g/L, and substrate is etched, etches away logicalnot circuit bottom copper on substrate, shape
Into final line pattern.
It is preferred that, in graphic designs, provided with interval between each concatenation unit 1, each concatenation unit 1 is at least by two
Splicing subelement 11 is constituted, and splicing subelement 11 is made up of at least one congener model, is provided between splicing subelement 11
Interval, the number of plies for the model that described congener model refers to is identical, i.e., be all single sided board, dual platen or multi-layer sheet.
It is preferred that, described is merged plate provided with line areas and nonconductive regions 2, and described concatenation unit 1 splices in circuit
Area, described nonconductive regions 2 is the region not comprising any conducting wire, after second etching step is completed, is led to non-
Electricity 2 carries out ink processing, the surface of nonconductive regions 2 is covered ink.
It is preferred that, it also includes one before completing to drill after moving back film, the step of carrying out patch aluminium flake to substrate；Aluminium flake
Size with need drill substrate size as, it is to avoid because aluminium flake is too small and caused by broken needle；To be use up when pasting aluminium flake with gummed paper
Amount is kept to the side, it is to avoid cause broken needle；Gummed paper for pasting aluminium flake need to be attached to the surrounding of aluminium flake, so as to ensure the smooth jail of aluminium flake
Gu.
The embodiment three of production technology of the invention that be merged plate based on several samples, it includes：
Graphic designs：The concatenation unit 1 being made up of variety classes model is designed and is merged same on plate, and circuit is made
The scraps of paper, wherein described different types of model refers to that the circuit theory of the model for splicing is different, such as splicing
Model is respectively LED drive circuit and sound control circuit；
Pattern transfer：The circuit scraps of paper are covered on substrate, are exposed and are developed successively；
First etching：Etching solution is adjusted the sulfuric acid for plus 95% so that the pH value of etching solution be 8.5, chlorion it is dense
Spend for 170g/L, the concentration of copper ion is 150g/L, and substrate is etched, makes to expose copper face on substrate；
Move back film：Concentration is used to carry out moving back film process to substrate for the sodium hydroxide solution that 4%, temperature is 50 DEG C, it is to avoid because of hydrogen
Oxidation na concn not enough or excessive concentration and cause substrate to move back film completely or move back the excessive situation of film-strength；
Drilling；
Plating：Copper facing makes the conductive portion on hole wall be metallized, and the copper thickeied in circuit and hole is thick, and
One layer of tin is plated on substrate after copper facing；
Second etching：Etching solution is adjusted the sulfuric acid for plus 95% so that the pH value of etching solution be 8.5, chlorion it is dense
Spend for 170g/L, the concentration of copper ion is 150g/L, and substrate is etched, logicalnot circuit bottom copper on substrate is etched away, and is formed
Final line pattern.
It is preferred that, in graphic designs, provided with interval between each concatenation unit 1, each concatenation unit 1 is at least by two
Splicing subelement 11 is constituted, and splicing subelement 11 is made up of at least one congener model, is provided between splicing subelement 11
Interval, the number of plies for the model that described congener model refers to is identical, i.e., be all single sided board, dual platen or multi-layer sheet.
It is preferred that, described is merged plate provided with line areas and nonconductive regions 2, and described concatenation unit 1 splices in circuit
Area, described nonconductive regions 2 is the region not comprising any conducting wire, after second etching step is completed, is led to non-
Electricity 2 carries out ink processing, the surface of nonconductive regions 2 is covered ink.
It is preferred that, it also includes one before completing to drill after moving back film, the step of carrying out patch aluminium flake to substrate；Aluminium flake
Size with need drill substrate size as, it is to avoid because aluminium flake is too small and caused by broken needle；To be use up when pasting aluminium flake with gummed paper
Amount is kept to the side, it is to avoid cause broken needle；Gummed paper for pasting aluminium flake need to be attached to the surrounding of aluminium flake, so as to ensure the smooth jail of aluminium flake
Gu.
Claims (4)
1. it is merged plate based on several samples, it is characterised in that：It includes at least two splicings in the same difference being merged on plate
The concatenation unit of species model（1）, concatenation unit（1）Remain with interval；
The production technology for being merged plate based on several samples, comprises the following steps：
Graphic designs：The concatenation unit that will be made up of variety classes model（1）Design is merged on plate same, and circuit paper is made
Piece；
Pattern transfer：The circuit scraps of paper are covered on substrate, are exposed and are developed successively；
First etching：Plus 90%~etching solution is adjusted 100% sulfuric acid so that and the pH value of etching solution is 8.0~9.0, chlorine
The concentration of ion is 150g/L~190g/L, and the concentration of copper ion is 130g/L~170g/L, to the logicalnot circuit scraps of paper on substrate
Region is pasted to be etched；The logicalnot circuit scraps of paper on substrate is pasted region and expose copper face；
Move back film：Concentration is used to carry out moving back film process to substrate for the sodium hydroxide solution that 3%~5%, temperature is 45 DEG C~55 DEG C；
Drilling；
Plating：Carrying out copper facing to the conductive portion on hole wall makes it metallize, and the copper thickeied in circuit and hole is thick, and
One layer of tin is plated on circuit or hole wall after copper facing；
Second etching：Plus 90%~etching solution is adjusted 100% sulfuric acid so that and the pH value of etching solution is 8.0~9.0, chlorine
The concentration of ion is 150g/L~190g/L, and the concentration of copper ion is 130g/L~170g/L, and the logicalnot circuit scraps of paper of substrate are pasted
Cover region to be etched, the bottom copper that the logicalnot circuit scraps of paper on substrate paste region is all etched away, form final line pattern,
It also includes one before completing to drill after moving back film, the step of carrying out patch aluminium flake to substrate：The size and need of aluminium flake
The size for the substrate to be drilled is the same, to be kept to the side as far as possible when pasting aluminium flake with gummed paper, the gummed paper for pasting aluminium flake need to be attached to aluminium flake
Surrounding.
2. according to claim 1 be merged plate based on several samples, it is characterised in that：Described concatenation unit（1）By
At least two splicing subelements（11）Constitute, splice subelement（11）It is made up of at least one congener model, described is same
The number of plies for the model that the model of species refers to is identical, splices subelement（11）Between provided with interval.
3. according to claim 1 be merged plate based on several samples, it is characterised in that：Described is merged plate provided with line
Road area and nonconductive regions（2）, described concatenation unit（1）Splicing is in line areas, described nonconductive regions（2）For not comprising any
The region of conducting wire.
4. according to claim 1 be merged plate based on several samples, it is characterised in that：Described is merged plate provided with line
Road area and nonconductive regions（2）, described concatenation unit（1）Splicing is in line areas, described nonconductive regions（2）For not comprising any
The region of conducting wire, after second etching step is completed, to non-conductive（2）Ink processing is carried out, makes nonconductive regions（2）
Surface cover ink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410050330.1A CN103747614B (en) | 2014-02-13 | 2014-02-13 | Plate and its production technology are merged based on several samples |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410050330.1A CN103747614B (en) | 2014-02-13 | 2014-02-13 | Plate and its production technology are merged based on several samples |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103747614A CN103747614A (en) | 2014-04-23 |
| CN103747614B true CN103747614B (en) | 2017-10-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410050330.1A Active CN103747614B (en) | 2014-02-13 | 2014-02-13 | Plate and its production technology are merged based on several samples |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105208800B (en) * | 2015-08-10 | 2018-07-20 | 广州兴森快捷电路科技有限公司 | A kind of method that the pcb board of difference laminated construction is merged making |
| CN105430918A (en) * | 2015-12-07 | 2016-03-23 | 惠州Tcl移动通信有限公司 | Manufacturing method of PCB |
| CN105678408A (en) | 2015-12-30 | 2016-06-15 | 广州兴森快捷电路科技有限公司 | Printed circuit board (PCB) combining and joining method and system |
| CN109729645A (en) * | 2019-01-21 | 2019-05-07 | 宁波舜宇光电信息有限公司 | Circuit board, circuit boards half-finished product, electronic device, circuit board preparation method |
| CN111918486A (en) * | 2020-09-21 | 2020-11-10 | 惠州市捷玛科技有限公司 | Splicing sample plate and production method |
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| CN201491381U (en) * | 2009-07-22 | 2010-05-26 | 广州兴森快捷电路科技有限公司 | High-density build-up printed board with V-shaped groove structure |
| CN101951728A (en) * | 2010-09-10 | 2011-01-19 | 广东依顿电子科技股份有限公司 | Production method for replacing flexible circuit board with rigid circuit board |
| CN201797652U (en) * | 2010-09-21 | 2011-04-13 | 磊鑫达电子(深圳)有限公司 | Structure for splicing multiple different types of PCB boards |
| CN102281716A (en) * | 2011-05-31 | 2011-12-14 | 蔡新民 | Manufacturing method for high frequency super-thick circuit board |
| CN202652686U (en) * | 2012-05-25 | 2013-01-02 | 苏州优尔嘉电子有限公司 | Low-cost PCB jointed board |
| CN203691754U (en) * | 2014-02-13 | 2014-07-02 | 遂宁市广天电子有限公司 | Combined and jointed board based on various kinds of samples |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201491381U (en) * | 2009-07-22 | 2010-05-26 | 广州兴森快捷电路科技有限公司 | High-density build-up printed board with V-shaped groove structure |
| CN101951728A (en) * | 2010-09-10 | 2011-01-19 | 广东依顿电子科技股份有限公司 | Production method for replacing flexible circuit board with rigid circuit board |
| CN201797652U (en) * | 2010-09-21 | 2011-04-13 | 磊鑫达电子(深圳)有限公司 | Structure for splicing multiple different types of PCB boards |
| CN102281716A (en) * | 2011-05-31 | 2011-12-14 | 蔡新民 | Manufacturing method for high frequency super-thick circuit board |
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| CN203691754U (en) * | 2014-02-13 | 2014-07-02 | 遂宁市广天电子有限公司 | Combined and jointed board based on various kinds of samples |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103747614A (en) | 2014-04-23 |
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